REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Update electrical test limits and add life test delta limits. - jt 14-01-13 C. SAFFLE B Add radiation hardened device type 03. Add case outline X. Add paragraph 1.5 and 3.2.3. -jt 14-12-18 C. SAFFLE C Add device type 03 to appendix A. - jt 15-08-19 C. SAFFLE D Make correction to the unit of the dropout voltage test (VOUT =19.3 V) in Table I from mA to V. -rrp 16-02-04 C. SAFFLE REV SHEET REV D D D D D D D SHEET 15 16 17 18 19 20 21 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jeffery Tunstall STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY Rajesh Pithadia APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A Charles Saffle DRAWING APPROVAL DATE 13-02-11 REVISION LEVEL D MICROCIRCUIT, LINEAR, LOW-NOISE, FASTTRANSIENT-RESPONSE, 1.5A ADJUSTABLE LOW-DROPOUT VOLTAGE REGULATOR, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-12224 1 OF 21 5962-E200-16 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 12224 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q H A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 TPS7A4501M Low-noise, fast transient-response, 1.5 A adjustable low-dropout voltage regulator 02 TPS7A4501-SP Low-noise, fast transient response, 750 mA, adjustable low-dropout voltage Regulator 03 TPS7A4501-RHA Radiation hardened, low-noise, fast transient response,1.5 A adjustable low-dropout voltage regulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style H GDFP1-F10 or CDFP2-F10 10 Flat pack X See Figure 2 10 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 2 1.3 Absolute maximum ratings. 1/ Input voltage range, VIN IN .......................................................................................................... OUT .......................................................................................................... Input-to-output differential 2/ .................................................................... ADJ .......................................................................................................... SHDN ....................................................................................................... Lead temperature (10s soldering time) ......................................................... Operating junction temperature (TJ) ............................................................. Storage temperature range, T(STG) ............................................................................................... Case outline H Thermal resistance, junction-to-case (bottom) (θJC) ................................. Thermal resistance, junction-to-ambient (θJA)........................................... Case outline X Thermal resistance, junction-to-case (bottom) (θJC bot)............................ Thermal resistance, junction-to-ambient (θJA) ................................................................ - 22 V to 22 V - 22 V to 22 V - 22 V to 22 V - 7 V to 7 V - 22 V to 22 V 260°C 125°C - 65° to +150°C 10.3° C/W 86.6° C/W 6.6° C/W 51.9° C/W 1.4 Recommended operating conditions Operating temperature range (TA = TJ) ......................................................... - 55°C to +125°C 1.5 Radiation features. Maximum total dose available (dose rate = 50-300 rads(Si)/s): Device type 03 .......................................................................................... 100 krads(Si) 3/ The manufacturer supplying RHA part device type 03 has performed characterization testing in accordance with MIL-STD-883 method 1019 paragraph 3.13.1.1 to a maximum total dose of 100k rads (Si). _______ 1/ 2/ 3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Absolute maximum input-to-output differential voltage cannot be achieved with all combinations of rated IN pin and OUT pin voltages. With the IN pin at 22 V, the OUT pin may not be pulled below 0 V. The total measured voltage from IN to OUT can not exceed ± 22V. The manufacturer supplying RHA device type 03 has performed characterization testing in accordance with MIL-STD-883 method 1019 paragraph 3.13.1.1. The radiation end point limits for the conditions are as specified in MIL-STD-883, method 1019, condition A and condition D to a maximum total dose of 100 krads(Si). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein . STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Minimum input voltage 2/ 3/ VIN VADJ ADJ pin voltage Line regulation 2/ 4/ 2/ Load regulation 2/ VRLINE VRLOAD Conditions -55° ≤ TA ≤ +125°C 1/ TA=TJ unless otherwise specified Iload = 0.5 A, TA = 25°C Limits Min Unit Max 01, 02 2.3 Iload = 1.5 A 1, 2, 3 01 2.5 Iload = 750 mA 1, 2, 3 02 2.5 Iload = 1.5 A 1, 2, 3 03 2.9 1 01 1.197 1.222 1 02 1.196 1.224 VIN = 2.5 V to 20 V ILOAD = 1 mA to 1.5 A 1,2, 3 01 1.174 1.246 VIN = 2.5 V to 20 V ILOAD = 1 mA to 750 mA 1, 2, 3 02 1.174 1.246 VIN = 2.9 V to 20 V ILOAD = 1 mA to 1.5 A 1, 2, 3 03 1.174 1.246 ΔVIN = 2.21 V to 20 V, ILOAD = 1mA 1, 2, 3 01 3 1, 2, 3 02 4.5 ΔVIN = 2.9 V to 20 V, ILOAD = 1mA 1, 2, 3 03 6.5 1 01 8 VIN = 2.21 V, ILOAD = 1mA, TA = 25°C VIN = 2.5 V, ΔILOAD = 1 mA to 1.5A 2, 3 1 02 1 ILOAD = 100 mA ILOAD = 500 mA V mV 8 18 03 2, 3 ILOAD = 1 mA V 18 2, 3 VIN = 2.9 V, ΔILOAD = 1 mA to 1.5A VDO Device type 1 VIN = 2.5 V, ΔILOAD = 1 mA to 750 mA Drop out voltage VOUT = 2.4V 5/ 6/ Group A subgroups 10 18 1 01, 02 .05 2, 3 01, 02 .07 1 01, 02 .10 2, 3 01, 02 .13 1 01, 02 .21 2, 3 01, 02 .27 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Drop out voltage VOUT = 2.4V 5/ 6/ Dropout voltage VOUT = 19.3 V 5/ 7/ Symbol VDO Conditions 1/ -55° ≤ TA ≤ +125°C TA=TJ unless otherwise specified ILOAD = 750 mA ILOAD = 1.5 A VDO ILOAD = 1 mA ILOAD = 100 mA ILOAD = 500 mA ILOAD = 750 mA ILOAD = 1.0 A ILOAD = 1.25 A ILOAD = 1.5 A Group A Device subgroups type Limits Min Unit Max 1 01, 02 .27 2, 3 01, 02 .33 1 01 .50 2, 3 01 .75 1 03 .32 2, 3 03 .40 1 03 .40 2, 3 03 .58 1 03 .40 2, 3 03 .60 1 03 .40 2, 3 03 .62 1 03 .45 2, 3 03 .65 1 03 .50 2, 3 03 .68 1 03 .60 2, 3 03 .75 V V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C TA=TJ Group A subgroups Device type unless otherwise specified GND pin current VIN = 2.5 V 6/ 8/ GND pin current VIN = 2.9 V 6/ 9/ IGND IGND Output voltage noise 10/ EN IADJ pins bias current 2/ 11/ IADJ Shutdown threshold SHDN pin current ISHDN Min Unit Max ILOAD = 0 mA 1, 2, 3 01, 02 1.5 ILOAD = 1 mA 1, 2, 3 01, 02 1.6 ILOAD = 100 mA 1, 2, 3 01, 02 7.0 ILOAD = 500 mA 1, 2, 3 01, 02 30 ILOAD = 750 mA 1, 2, 3 02 45 ILOAD = 1.5 A 1, 2, 3 01 130 ILOAD = 0 mA 1, 2, 3 03 1.5 ILOAD = 1 mA 1, 2, 3 03 1.6 ILOAD = 100 mA 1, 2, 3 03 7.0 ILOAD = 500 mA 1, 2, 3 03 30 ILOAD = 750 mA 1, 2, 3 03 45 ILOAD = 1 A 1, 2, 3 03 50 ILOAD = 1.25 A 1, 2, 3 03 80 ILOAD = 1.5 A 1, 2, 3 03 105 4 01 55 µVRMS 1 01, 02, 03 7 µA 2, 3 03 15 VOUT = OFF to ON 1, 2, 3 01, 02, 03 2 V VOUT = ON to OFF 1, 2, 3 01, 02, 03 1 01, 02 1 µA 1, 2, 3 03 10 1 01, 02 20 1, 2, 3 03 20 1 01, 02 1 1, 2, 3 03 10 1 03 50 COUT = 10µF, ILOAD = 1.5A, BW = 10Hz to 100kHz TA = 25°C VSHDN = 0 V, VSHDN = 20 V, Quiescent current in shutdown Limits VIN = 6 V, VSHDN = 0V, M, D, P, L, R mA mA 0.15 µA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55° ≤ TA ≤ + 125°C TA = TJ Unless otherwise specified VIN-VOUT = 1.5 V (avg), VRIPPLE = 0.5 VP-P, FRIPPLE = 120HZ, ILOAD = 0.75 A Ripple rejection 12/ VIN-VOUT = 1.5 V (avg), VRIPPLE = 0.5 VP-P, FRIPPLE = 120HZ, ILOAD = 1.5 A Current limit 12/ ILIMIT VIN = 7 V, Vout = 0V Group A Device subgroups type Limits Min 4 01,02, 03 60 5,6 03 58 4 03 54 5, 6 03 44 1 01, 02, 1.7 1, 2, 3 03 VIN = 2.5 V, Vout = 0V 1, 2, 3 01, 02 1.6 1.6 Unit Max db db A VIN = 2.9 V, Vout = 0V 1, 2, 3 03 Input reverse leakage current IIL VIN = -20 V, Vout = 0 V 1, 2, 3 01, 02, 03 300 µA Reverse output current 13/ IRO VOUT = 1.21 V, VIN < 1.21 V 1 01, 02 500 µA 1, 2, 3 03 500 1/ Device type 03 supplied to this drawing have been characterized through all levels P, L, and R of irradiation. However, this device is only tested at the “R” level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C (see1.5 herein). The manufacturer supplying RHA device type 03 has performed characterization testing in accordance with MIL-STD-883 method 1019 paragraph 3.13.1.1. The radiation end point limits for the conditions are as specified in MIL-STD-883, method 1019, condition A and condition D to a maximum total dose of 100 krads(Si). 2/ The device is tested and specified for these condition with the ADJ pin connected to the OUT pin. 3/ Dropout voltage are limited by the minimum input voltage specification under some output voltage/load conditions. 4/ Operating conditions are limited by maximum junction temperature. The regulated output voltage specification does not apply for all possible combinations of input voltage and output current. When operating at maximum input voltage, the output current range must be limited. When operating at maximum output current, the input voltage range must be limited. 5/ Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage is equal to: VIN –VDROPOUT. 6/ To satisfy requirements for minimum input voltage, the device is tested and specified for these conditions with an external resistor divider (two 4.12kΩ resistors) for an output voltage of 2.4 V. The external resistor divider adds a 300µA DC load on the output. 7/ To satisfy requirements for minimum input voltage, the device is tested and specified for these conditions with an external resistor divider (one 4.12- kΩ resistor and one 61.9) for an output voltage of 19.3 V. The external resistor divider adds a 300µA dc load on the output. 8/ GND pin current is tested with VIN = 2.5 V and a current source load. The GND pin current decreases at higher input voltages. 9/ GND pin current is tested with VIN = 2.9 V and a current source load. The GND pin current deceases at high input voltages. 10/ Not production tested parameter, guaranteed by characterization. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 8 TABLE I. Electrical performance characteristics – Continued. 11/ ADJ pin bias current flows into the ADJ pin. 12/ Specification is guaranteed by characterization for KGD and is not tested in production. 13/ Reverse output current is tested with the IN pin grounded and the OUT pin forced to the rated output voltage. This current flows Into the OUT pin and out the GND pin. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 9 Case outline X Symbol A b c D E E1 e L Q Inches Min .0820 .0150 .0034 .2695 .2632 .1780 Millimeters Max .1021 .0190 .0066 .2833 .2770 .1921 Min 2.08 0.38 0.09 6.85 6.69 4.52 .3081 .0401 7.07 0.76 .0500 .2781 .0299 Max 2.59 0.48 0.17 7.20 7.04 4.88 1.27 7.83 1.02 FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 10 Device type 01, 02, 03 Case outline H, X Terminal number Terminal symbol 1 SHDN 2 IN 3 IN 4 IN 5 N/C 6 OUT 7 OUT 8 OUT 9 SENSE/ADJ 10 GND FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 11 PIN DESCRIPTION NO. NAME 1 SHDN 2, 3, 4 IN 5 NC 6, 7, 8 OUT 9 ADJ 10 GND Thermal Vias (Case outline X) Shutdown. SHDN is used to put the regulator into a low-power shutdown state. The output is off when SHDN is pulled low. SHDN can be driven by 5-V logic or open-collector logic with a pullup resistor. The pullup resistor is required to supply the pullup current of the open-collector gate, normally several microamperes, and SHDN current, typically 3 µA. If unused, SHDN must be connected to VIN. The device is in the low-power shutdown state if SHDN is not connected. Input. Power is supplied to the device through IN. A bypass capacitor is required on this pin if the device is more than six inches away from the main input filter capacitor. In general, the output impedance of a battery rises with frequency, so it is advisable to include a bypass capacitor in battery-powered circuits. A bypass capacitor (ceramic) in the range of 1µF to 10µF is sufficient. The regulator is designed to withstand reverse voltage on IN with respect to ground and on OUT. In the case of a reverse input, which can happen if a battery is plugged in backwards, the device acts as if there is a diode in series with its input. There is no reverse current flow into the regulator, and no reverse voltage appears at the load. The device protects both itself and the load. Not Connected. Output. The output supplies power to the load. A minimum output capacitor (ceramic) of 10µF is required to prevent oscillations. Larger output capacitors are required for application with large transient loads to limit peak voltage transients. Adjust. This is the input to the error amplifier. ADJ is internally clamped to ± 7 V. It has a bias current of 3 µA that flows into the pin. ADJ voltage is 1.21 V references to ground, and the output voltage range is 1.21 V to 20V. Ground. The exposed thermal vias of the case outline X should be connected to a wide ground plane for effective heat dissipation. FIGURE 2. Terminal connections – Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 12 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5, 6, 7, 8, 9, 10 and 11 in table I method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 13 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Device Device class Q class V 1, 2, 3 1, 2, 3 Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) 1, 2, 3, 4 1/ 1, 2, 3, 4 1, 2, 3, 4 1, 2, 3, 4 1/ 2/ 1, 2, 3, 4 1 1, 2, 3, 4 2/ 1 1, 4 1, 4 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the previous endpoint electrical parameters. TABLE IIB. 240 burn-in and group C life test delta parameters. (TA = +25° C). 1/ Parameters Symbol Min Max Units ADJ pin voltage VADJ -0.012 +0.012 V Line Regulation VRLINE -0.24 +0.24 mV 1/ These parameters shall be recorded before and after the required burn-in and life test to determine delta limits. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 14 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, condition A, and condition D as specified herein for device type 03. 4.4.4.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level greater than 5 krads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 15 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-12224 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number (PIN). When available, a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN is as shown in the following example: 5962 - Federal stock class designator \ RHA designator (see A.1.2.1) 12224 01 Q 9 A Device type (see A.1.2.2) Device class designator (see A.1.2.3) Die code Die details (see A.1.2.4) / \/ Drawing number A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 TPS7A4501M Low-noise, fast transient-response, 1.5 A adjustable low-dropout voltage regulator 02 TPS7A4501-SP Low-noise fast transient-response 750 mA adjustable low-dropout voltage regulator 03 TPS7A4501-RHA Radiation hardened, low-noise, fast transient response, 1.5 A adjustable low-dropout voltage regulator A.1.2.3 Device class designator. Device class Q or V STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 SIZE 5962-12224 A REVISION LEVEL D SHEET 16 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-12224 A.1.2.4 Die details. The die details designation is a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. A.1.2.4.1 Die physical dimensions. Die type Figure number 01, 02, 03 A-1 A.1.2.4.2 Die bonding pad locations and electrical functions. Die type Figure number 01, 02, 03 A-1 A.1.2.4.3 Interface materials. Die type Figure number 01, 02, 03 A-1 A.1.2.4.4 Assembly related information. Die type Figure number 01, 02, 03 A-1 A.1.3 Absolute maximum ratings. See paragraph 1.3 herein for details. A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 17 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-12224 A.2 APPLICABLE DOCUMENTS. A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 REQUIREMENTS A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. A.3.2 Design, construction and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V. A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1. A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in A.1.2.4.2 and on figure A-1. A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1. A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and on figure A-1. A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 18 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-12224 A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. A.4 VERIFICATION A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not affect the form, fit, or function as described herein. A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum, it shall consist of: a. Wafer lot acceptance for class V product using the criteria defined in MIL-STD-883, method 5007. b. 100% wafer probe (see paragraph A.3.4 herein). c. 100% internal visual inspection to the applicable class Q or V criteria defined in MIL-STD-883, method 2010 or the alternate procedures allowed in MIL-STD-883, method 5004. A.4.3 Conformance inspection. A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified in paragraphs 4.4.4, 4.4.4.1, and 4.4.4.1.1 herein. A.5 DIE CARRIER A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. A.6 NOTES A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications, and logistics purposes. A.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime-VA, Columbus, Ohio, 432183990 or telephone (614)-692-0540. A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to DLA Land and Maritime VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 19 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-12224 Description _____ SHDN IN IN IN OUT OUT OUT SENSE/ADJ Mountpad Pad number 1 2 3 4 5 6 7 8 9 XMIN 1729.250 1037.250 1460.750 1037.750 774.250 675.250 345.500 55.500 244.000 YMIN 55.500 875.000 1255.500 1384.500 1634.750 1166.000 1299.250 213.000 17.500 XMAX 1879.250 1187.250 1610.750 1187.750 924.250 825.250 495.500 205.500 394.000 YMAX 205.500 1025.000 1405.500 1534.500 1784.750 1316.000 1449.250 363.000 167.500 Substrate is not to be connected FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 20 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-12224 Die bonding pad locations and electrical functions Die physical dimensions. Die size: 1964.00 µm x 2012.00 µm Die thickness: 15 ± 1 mils Interface materials. Top metallization: TiW/AlCu2(1627 nm) Backside metallization: None Glassivation. Type: SIN Thickness: 10 kA Substrate: P(111) 10-21 ohm-cm Assembly related information. Substrate potential: Insulated (backside of the die is left floating in factory package assembly) Special assembly instructions: None FIGURE A-1. Die bonding pad locations and electrical functions - continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12224 A REVISION LEVEL D SHEET 21 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 16-02-04 Approved sources of supply for SMD 5962-12224 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-1222401QHA 01295 TPS7A4501MUB 5962-1222401Q9A 01295 TPS7A4501MKGD1 5962-1222402VHA 01295 TPS7A4501-SP 5962-1222402V9A 01295 TPS7A4501KGD-SP 5962R1222403VXC 01295 TPS7A4501-RHA 5962R1222403V9A TPS7A4501RHAKGD 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 01295 Vendor name and address Texas Instruments, Inc. Semiconductor Group 8505 Forest Ln. P.O. Box 660199 Dallas, TX 75243 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.