NXP Semiconductors Data Sheet: Technical Data KS22P100M120SF0 Rev. 3, 04/2016 KS22/KS20 Microcontroller 120 MHz ARM® Cortex®-M4, with up to 256 KB Flash The KS2x product family is built on the ARM® Cortex®-M4 processor with lower power and higher memory densities in multiple packages. This device offers 120 MHz performance with an integrated single-precision floating point unit (FPU). Embedded flash memory sizes range from 128 KB to 256KB. This device also includes: • USB FS OTG 2.0 with crystal-less functionality • FlexCAN, supporting CAN protocol according to the ISO 11898-1 standard and CAN 2.0 B protocol specifications • FlexIO, a highly configurable module providing a wide range of protocols including, but not limited to UART, LPI2C, SPI, I2S, and PWM/Waveform generation. Performance • 120 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz Memories and memory interfaces • Up to 256 KB of embedded flash and 64 KB of SRAM • Preprogrammed Kinetis Flashloader for one-time, insystem factory programming MKS22FN256Vxx12 MKS22FN128Vxx12 MKS20FN256Vxx12 MKS20FN128Vxx12 100 & 64 LQFP (LL & LH) 48 QFN (FT) 14×14×1.7 mm Pitch 7×7×0.65 mm Pitch 0.5 0.5 mm; 10×10×1.6 mm mm Pitch 0.5 mm Analog modules • One 16-bit ADC module with up to 17 single-end channels and 4 differential channels, and up to 1.2 Msps at ≤ 13-bit mode • One 12-bit DAC module • One analog comparator (CMP) module Communication interfaces • USB full-speed 2.0 device controller System peripherals • One FlexIO module • Flexible low-power modes, multiple wake up sources • Three UART modules (one supporting ISO7816, • 16-channel asynchronous DMA controller and the other two operating up to 1.5 Mbit/s) • Independent external and software watchdog monitor • One LPUART module supporting asynchronous operation in low-power modes Clocks • Two LPI2C modules supporting up to 5 Mbit/s, • Two crystal oscillators: 32 kHz (RTC), and 32-40 kHz asynchronous operation in low-power modes or 3-32 MHz supported • Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz • Two 16-bit SPI modules supporting up to 30 Mbit/s • Multi-purpose clock generator (MCG) with PLL and FLL • Two FlexCAN modules for KS22, One FlexCAN for KS20 Security and integrity modules • Two I2S modules • Hardware CRC module • 128-bit unique identification (UID) number per chip Timers • Hardware random-number generator • Three 16-bit low-power timer PWM modules (TPM) • Flash access control (FAC) to protect proprietary • One low-power timer (LPTMR) software • Periodic interrupt timer (PIT) • Real time clock (RTC), with independent power Human-machine interfaces domain • Up to 66 general-purpose input/output pins (GPIO) • Programmable delay block (PDB) NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. © 2015–2016 NXP B.V. Operating characteristics • Voltage range (including flash writes): 1.71 to 3.6 V • Temperature range (ambient): –40 to 105 °C Related Resources Type Description Resource Selector Guide The Freescale Solution Advisor is a web-based tool that features interactive application wizards and a dynamic product selector. Solution Advisor Product Brief The Product Brief contains concise overview/summary information to KS22PB 1 enable quick evaluation of a device for design suitability. Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. KS22P100M120SF0RM1 Data Sheet The Data Sheet includes electrical characteristics and signal connections. This document: KS22P100M120SF01 Chip Errata The chip mask set Errata provides additional or corrective information for a particular device mask set. KINETIS_K_0N87R 1 Package drawing Package dimensions are provided in package drawings. LQFP 100-pin: 98ASS23308W LQFP 64-pin: 98ASS23234W QFN 48-pin: 98ASA00616D 1. To find the associated resource, go to http://www.freescale.com and perform a search using this term. 2 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 ARM ® Cortex™-M4 Core System eDMA (16ch) Memories and Memory Interfaces Program flash Clocks Phaselocked loop RAM DMAMUX Debug interfaces DSP Interrupt controller FPU Frequencylocked loop Flash cache Low-leakage wake-up unit Low/high frequency oscillators WDOG Internal reference clocks EWM Security Analog Timers CRC 16-bit ADC x1 TPM x1 (6ch) x2 (2ch) Randomnumber generator Comparator with 6-bit DAC x1 Flash access control and Integrity Communication Interfaces 2 LPI2C x2 I S x2 Programmable delay block UART x3 USB fullspeed OTG 12-bit DAC x1 PIT (4ch) LPUART x1 FlexIO PMC 16-bit low-power timer SPI x2 FlexCAN * Independent real-time clock Human-Machine Interface (HMI) Up to 66 GPIOs Note: for KS22, CAN x2; for KS20, CAN x1. Figure 1. Functional block diagram NOTE DAC0 and I2S1 are NOT supported in the 48-QFN package. For more details, see the "Signal Multiplexing and Pin Assignments" section. KS22/KS20 Microcontroller, Rev. 3, 04/2016 3 NXP Semiconductors Table of Contents 1 Ordering information............................................................... 5 2 Overview................................................................................. 6 2.1 System features...............................................................7 2.1.1 ARM Cortex-M4 core........................................ 7 2.1.2 NVIC..................................................................7 2.1.3 AWIC.................................................................7 2.1.4 Memory............................................................. 8 2.1.5 Reset and boot..................................................9 2.1.6 Clock options.....................................................10 2.1.7 Security............................................................. 13 2.1.8 Power management.......................................... 14 2.1.9 LLWU................................................................ 16 2.1.10 2.1.11 Debug controller................................................17 Computer operating properly (COP) watchdog timer.................................................................. 17 2.2 Peripheral features.......................................................... 17 2.2.1 eDMA and DMAMUX........................................ 18 2.2.2 TPM...................................................................18 2.2.3 ADC...................................................................19 2.2.4 DAC...................................................................19 2.2.5 CMP.................................................................. 20 2.2.6 RTC...................................................................21 2.2.7 PIT.....................................................................21 2.2.8 PDB...................................................................21 2.2.9 LPTMR.............................................................. 22 2.2.10 CRC.................................................................. 22 2.2.11 UART................................................................ 23 2.2.12 LPUART............................................................ 23 2.2.13 SPI.................................................................... 24 2.2.14 FlexCAN............................................................24 2.2.15 LPI2C................................................................ 26 2.2.16 USB...................................................................26 2.2.17 I2S.....................................................................27 2.2.18 FlexIO................................................................27 2.2.19 Port control and GPIO.......................................28 3 Memory map........................................................................... 30 4 Pinouts.................................................................................... 31 4.1 Signal Multiplexing and Pin Assignments........................ 31 4.2 Pin properties.................................................................. 34 4.3 Module Signal Description Tables................................... 39 4.3.1 Core Modules....................................................39 4.3.2 System Modules................................................40 4.3.3 Clock Modules...................................................40 4.3.4 Analog............................................................... 41 4.3.5 Timer Modules.................................................. 42 4.3.6 Communication Interfaces................................ 43 4 NXP Semiconductors 4.3.7 Human-Machine Interfaces (HMI)..................... 47 4.4 Pinouts.............................................................................47 4.5 Package dimensions....................................................... 50 5 Electrical characteristics..........................................................56 5.1 Terminology and guidelines.............................................56 5.1.1 Definitions......................................................... 56 5.1.2 Examples.......................................................... 57 5.1.3 Typical-value conditions....................................58 5.1.4 Relationship between ratings and operating requirements..................................................... 58 5.1.5 Guidelines for ratings and operating requirements..................................................... 59 5.2 Ratings............................................................................ 59 5.2.1 Thermal handling ratings...................................59 5.2.2 Moisture handling ratings.................................. 60 5.2.3 ESD handling ratings........................................ 60 5.2.4 Voltage and current operating ratings............... 60 5.3 General............................................................................ 60 5.3.1 AC electrical characteristics.............................. 61 5.3.2 Nonswitching electrical specifications............... 61 5.3.3 Switching specifications.................................... 72 5.3.4 Thermal specification........................................ 74 5.4 Peripheral operating requirements and behaviors...........75 5.4.1 Debug modules................................................. 75 5.4.2 System modules................................................80 5.4.3 Clock modules...................................................80 5.4.4 Memories and memory interfaces.....................86 5.4.5 Security and integrity modules.......................... 87 5.4.6 Analog............................................................... 87 5.4.7 Timers............................................................... 97 5.4.8 Communication interfaces.................................97 6 Design considerations.............................................................108 6.1 Hardware design considerations..................................... 108 6.1.1 Printed circuit board recommendations.............108 6.1.2 Power delivery system...................................... 108 6.1.3 Analog design................................................... 109 6.1.4 Digital design.....................................................110 6.1.5 Crystal oscillator................................................112 6.2 Software considerations.................................................. 114 7 Part identification.....................................................................114 7.1 Description.......................................................................114 7.2 Format............................................................................. 115 7.3 Fields............................................................................... 115 7.4 Example...........................................................................115 8 Revision history.......................................................................116 KS22/KS20 Microcontroller, Rev. 3, 04/2016 Ordering information 1 Ordering information The following chips are available for ordering. Table 1. Ordering information Product Part number Marking (Line1/Line2) Memory Flash (KB) SRAM (KB) Package Pin count Package IO and ADC channel GPIOs GPIOs (INT/HD) 1 Commu nication ADC channel s (SE/DP) FlexCAN 2 MKS22F MKS22FN256 / N256VLL VLL12 12 256 64 100 LQFP 66 66/8 17/4 2 MKS22F MKS22FN256 / N256VLH VLH12 12 256 64 64 LQFP 40 40/8 14/2 3 2 MKS22F MKS22FN256 / N256VFT VFT12 12 256 64 48 QFN 35 35/8 13/— 2 MKS22F MKS22FN128 / N128VLL VLL12 12 128 64 100 LQFP 66 66/8 17/4 2 MKS22F MKS22FN128 / N128VLH VLH12 12 128 64 64 LQFP 40 40/8 14/2 3 2 MKS22F MKS22FN128 / N128VFT VFT12 12 128 64 48 QFN 35 35/8 13/— 2 MKS20F MKS20FN256 / N256VLL VLL12 12 256 64 100 LQFP 66 66/8 17/4 1 MKS20F MKS20FN256 / N256VLH VLH12 12 256 64 64 LQFP 40 40/8 14/2 3 1 MKS20F MKS20FN256 / N256VFT VFT12 12 256 64 48 QFN 35 35/8 13/— 1 MKS20F MKS20FN128 / N128VLL VLL12 12 128 64 100 LQFP 66 66/8 17/4 1 MKS20F MKS20FN128 / N128VLH VLH12 12 128 64 64 LQFP 40 40/8 14/2 3 1 MKS20F MKS20FN128 / N128VFT VFT12 12 128 64 48 QFN 35 35/8 13/— 1 KS22/KS20 Microcontroller, Rev. 3, 04/2016 5 NXP Semiconductors Overview 1. INT: interrupt pin numbers; HD: high drive pin numbers 2. SE: single-ended; DP: differential pair 3. ADC0_DP1 is for single-ended (SE) mode only in 64-LQFP. 2 Overview The following figure shows the system diagram of this device. GPIOA GPIOB Slave Master Cortex M4 GPIOC GPIOD M0 code bus CM4 core NVIC M1 system bus DMA MUX eDMA M2 M4 ADC (16-bit) Flash 128-256 KB CMP (with 6-bit DAC) DAC (12-bit) S0 FMC S1 SRAM_L and _U, 64 KB in total S2 S3 MUX USB FS PDB TPM0 (6-channel) TPM1 (2-channel) TPM2 (2-channel) Low Power Timer Periodic Interrupt Timer RTC CAN x2 (KS22), x1 (KS20) UART x3 LPUART DSPI x2 LPI2C x2 FlexIO I2S x2 CRC Clock Source 4 MHz IRC Peripheral Bridge 0 (Bus Clock - Max 60 MHz) Debug (SWD/JTAG) GPIOE Crossabar Switch (Platform Clcok - Max 120 MHz) IOPORT RNG EWM FLL Watchdog (COP) 32 kHz IRC Register File (32 Bytes) PLL Low Leakage Wakeup Unit OSC LPO Reset Control Module IRC48M System Mode Control RTC Oscillator Power Management Control Figure 2. System diagram The crossbar switch connects bus masters and slaves using a crossbar switch structure. This structure allows up to four bus masters to access different bus slaves simultaneously, while providing arbitration among the bus masters when they access the same slave. 6 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview 2.1 System features The following sections describe the high-level system features. 2.1.1 ARM Cortex-M4 core The ARM Cortex-M4 is the member of the Cortex M Series of processors targeting microcontroller cores focused on very cost sensitive, deterministic, interrupt driven environments. The Cortex M4 processor is based on the ARMv7 Architecture and Thumb®-2 ISA and is upward compatible with the Cortex M3, Cortex M1, and Cortex M0 architectures. Cortex M4 improvements include an ARMv7 Thumb-2 DSP (ported from the ARMv7-A/R profile architectures) providing 32-bit instructions with SIMD (single instruction multiple data) DSP style multiply-accumulates and saturating arithmetic. 2.1.2 NVIC The Nested Vectored Interrupt Controller supports nested interrupts and 16 priority levels for interrupts. In the NVIC, each source in the IPR registers contains 4 bits. It also differs in number of interrupt sources and supports 240 interrupt vectors. The Cortex-M family uses a number of methods to improve interrupt latency . It also can be used to wake the MCU core from Wait and VLPW modes. 2.1.3 AWIC The asynchronous wake-up interrupt controller (AWIC) is used to detect asynchronous wake-up events in Stop mode and signal to clock control logic to resume system clocking. After clock restarts, the NVIC observes the pending interrupt and performs the normal interrupt or event processing. The AWIC can be used to wake MCU core from Partial Stop, Stop and VLPS modes. KS22/KS20 Microcontroller, Rev. 3, 04/2016 7 NXP Semiconductors Overview Wake-up sources for this SoC are listed as below: Table 2. AWIC Partial Stop, Stop and VLPS Wake-up Sources Wake-up source Description Available system resets RESET pin and WDOG when LPO is its clock source, and JTAG Low voltage detect Power Mode Controller Low voltage warning Power Mode Controller High voltage detect Power Mode Controller Pin interrupts Port Control Module - Any enabled pin interrupt is capable of waking the system ADC The ADC is functional when using internal clock source CMP Since no system clocks are available, functionality is limited, trigger mode provides wakeup functionality with periodic sampling LPI2C Functional when using clock source which is active in Stop and VLPS modes FlexIO Functional when using clock source which is active in Stop and VLPS modes TPM Functional when using clock source which is active in Stop and VLPS modes UART Active edge on RXD LPUART Functional when using clock source which is active in Stop and VLPS modes USB FS/LS Controller Wakeup LPTMR Functional when using clock source which is active in Stop and VLPS modes RTC Functional in Stop/VLPS modes I2S (SAI) Functional when using an external bit clock or external master clock TPM Functional when using clock source which is active in Stop and VLPS modes CAN Wakeup on edge (CANx_RX) NMI Non-maskable interrupt 2.1.4 Memory This device has the following features: • 64 KB of embedded RAM accessible (read/write) at CPU clock speed with 0 wait states. • The non-volatile memory is divided into • 128/256 KB of embedded program memory The program flash memory contains a 16-byte flash configuration field that stores default protection settings and security information. The page size of program flash is 2 KB. The protection setting can protect 32 regions of the program flash memory from unintended erase or program operations. 8 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview The security circuitry prevents unauthorized access to RAM or flash contents from debug port. • System register file This device contains a 32-byte register file that is powered in all power modes. Also, it retains contents during low power modes and is reset only during a power-on reset. 2.1.5 Reset and boot The following table lists all the reset sources supported by this device. NOTE In the following table, Y means the specific module, except for the registers, bits or conditions mentioned in the footnote, is reset by the corresponding Reset source. N means the specific module is not reset by the corresponding Reset source. Table 3. Reset source Reset sources Descriptions POR reset Power-on reset (POR) Modules PMC SIM SMC RCM LLWU Reset pin is negated RTC LPTM R Others Y Y Y Y Y Y Y Y Y Y1 Y Y Y Y Y N Y Y Low leakage wakeup (LLWU) reset N Y2 N Y N Y3 N N Y External pin reset (RESET) Y1 Y2 Y4 Y Y Y N N Y Watchdog (WDOG) reset Y1 Y2 Y4 Y5 Y Y N N Y Multipurpose clock generator loss of clock (LOC) reset Y1 Y2 Y4 Y5 Y Y N N Y Multipurpose clock generator loss of lock (LOL) reset Y1 Y2 Y4 Y5 Y Y N N Y Stop mode acknowledge error (SACKERR) Y1 Y2 Y4 Y5 Y Y N N Y Software reset (SW) Y1 Y2 Y4 Y5 Y Y N N Y Lockup reset (LOCKUP) Y1 Y2 Y4 Y5 Y Y N N Y System resets Low-voltage detect (LVD) Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 9 NXP Semiconductors Overview Table 3. Reset source (continued) Reset sources Debug reset 1. 2. 3. 4. 5. Descriptions Modules PMC SIM SMC RCM LLWU Reset pin is negated RTC LPTM R Others MDM DAP system reset Y1 Y2 Y4 Y5 Y Y N N Y Debug reset Y1 Y2 Y4 Y5 Y Y N N Y Except PMC_LVDSC1[LVDV] and PMC_LVDSC2[LVWV] Except SIM_SOPT1 Only if RESET is used to wake from VLLS mode. Except SMC_PMCTRL, SMC_STOPCTRL, SMC_PMSTAT Except RCM_RPFC, RCM_RPFW, RCM_FM This device supports booting from: • internal flash 2.1.6 Clock options The MCG module controls which clock source is used to derive the system clocks. The clock generation logic divides the selected clock source into a variety of clock domains, including the clocks for the system bus masters, system bus slaves, and flash memory . The clock generation logic also implements module-specific clock gating to allow granular shutoff of modules. The primary clocks for the system are generated from the MCGOUTCLK clock. The clock generation circuitry provides several clock dividers that allow different portions of the device to be clocked at different frequencies. This allows for trade-offs between performance and power dissipation. Various modules, such as the USB OTG Controller, have module-specific clocks that can be generated from the IRC48MCLK or MCGPLLCLK or MCGFLLCLK clock. In addition, there are various other module-specific clocks that have other alternate sources. Clock selection for most modules is controlled by the SOPT registers in the SIM module. For more details on the clock operations and configurations, see the Clock Distribution chapter in the Reference Manual. The following figure is a high level block diagram of the clock generation. 10 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview SIM MCG 4 MHz IRC FCRDIV 32 kHz IRC Clock options for some peripherals (see note) MCGIRCLK CG MCGFFCLK FLL OUTDIV1 CG Core / system clocks OUTDIV2 CG Bus clock OUTDIV4 CG Flash clock MCGOUTCLK PLL MCGFLLCLK FRDIV MCGPLLCLK Clock options for some peripherals (see note) MCGPLLCLK/ MCGFLLCLK/ IRC48MCLK PRDIV System oscillator EXTAL0 IRC48MCLK OSCCLK OSCERCLK_UNDIV XTAL_CLK OSC logic XTAL0 OSCERCLK DIV OSC32KCLK ERCLK32K PMC RTC oscillator 32.768 kHz EXTAL32 OSC logic XTAL32 PMC logic 1 Hz RTC_CLKOUT IRC48M internal oscillator IRC48M logic LPO IRC48MCLK CG — Clock gate Note: See subsequent sections for details on where these clocks are used. Figure 3. Clock block diagram In order to provide flexibility, many peripherals can select the clock source to use for operation. This enables the peripheral to select a clock that will always be available during operation in various operational modes. The following table summarizes the clocks associated with each module. Table 4. Module clocks Module Bus interface clock Internal clocks I/O interface clocks Core modules ARM Cortex-M4 core System clock Core clock — NVIC System clock — — DAP System clock — — Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 11 NXP Semiconductors Overview Table 4. Module clocks (continued) Module Bus interface clock Internal clocks I/O interface clocks ITM System clock — — cJTAG, JTAGC — — JTAG_CLK DMA System clock — — DMA Mux Bus clock — — Port control Bus clock LPO — Crossbar Switch System clock — — Peripheral bridges System clock Bus clock, Flash clock — LLWU, PMC, SIM, RCM Flash clock LPO — Mode controller Flash clock — — System modules MCM System clock — — EWM Bus clock LPO — Watchdog timer Bus clock LPO — Clocks MCG Flash clock MCGOUTCLK, MCGPLLCLK, MCGFLLCLK, MCGIRCLK, OSCCLK, RTC OSC, IRC48MCLK — OSC Bus clock OSCERCLK, OSCCLK, OSCERCLK_UNDIV, OSC32KCLK — — IRC48MCLK — IRC48M Memory and memory interfaces Flash Controller System clock Flash clock — Flash memory Flash clock — — Security CRC Bus clock — — RNGA Bus clock — — Analog ADC Bus clock OSCERCLK , IRC48MCLK — CMP Bus clock — — DAC Bus clock — — Timers TPM Bus clock TPM clock TPM_CLKIN0, TPM_CLKIN1 PDB Bus clock — — PIT Bus clock — — LPTMR Flash clock LPO, OSCERCLK, MCGIRCLK, ERCLK32K — RTC Flash clock EXTAL32 — Communication interfaces Table continues on the next page... 12 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview Table 4. Module clocks (continued) Module Bus interface clock Internal clocks I/O interface clocks USB FS OTG System clock USB FS clock — DSPI Bus clock — DSPI_SCK LPI2C Bus clock LPI2C clock I2C_SCL UART0, UART1 System clock — — UART2 Bus clock — — LPUART0 — Bus clock LPUART0 clock I2S Bus clock I2S FlexCAN Bus clock FlexCAN clock — FlexIO Bus clock FlexIO clock — GPIO Platform clock master clock I2S_TX_BCLK, I2S_RX_BCLK Human-machine interfaces — — 2.1.7 Security Security state can be enabled via programming flash configure field (0x40e). After enabling device security, the SWD/JTAG port cannot access the memory resources of the MCU. External interface SWD/JTAG port 2.1.7.1 Security Unsecure Can't access memory source by SWD/ the debugger can write to the Flash JTAG interface Mass Erase in Progress field of the MDM-AP Control register to trigger a mass erase (Erase All Blocks) command Flash Access Control (FAC) The FAC is a native or third-party configurable memory protection scheme optimized to allow end users to utilize software libraries while offering programmable restrictions to these libraries. The flash memory is divided into equal size segments that provide protection to proprietary software libraries. The protection of these segments is controlled as the FAC provides a cycle-by-cycle evaluation of the access rights for each transaction routed to the on-chip flash memory. Configurability allows an increasing number of protected segments while supporting two levels of vendors adding their proprietary software to a device. KS22/KS20 Microcontroller, Rev. 3, 04/2016 13 NXP Semiconductors Overview 2.1.8 Power management The Power Management Controller (PMC) expands upon ARM’s operational modes of Run, Sleep, and Deep Sleep, to provide multiple configurable modes. These modes can be used to optimize current consumption for a wide range of applications. The WFI or WFE instruction invokes a Wait or a Stop mode, depending on the current configuration. For more information on ARM’s operational modes, See the ARM® Cortex® User Guide. The PMC provides High Speed Run (HSRUN), Normal Run (RUN), and Very Low Power Run (VLPR) configurations in ARM’s Run operation mode. In these modes, the MCU core is active and can access all peripherals. The difference between the modes is the maximum clock frequency of the system and therefore the power consumption. The configuration that matches the power versus performance requirements of the application can be selected. The PMC provides Wait (Wait) and Very Low Power Wait (VLPW) configurations in ARM’s Sleep operation mode. In these modes, even though the MCU core is inactive, all of the peripherals can be enabled and operate as programmed. The difference between the modes is the maximum clock frequency of the system and therefore the power consumption. The PMC provides Stop (Stop), Very Low Power Stop (VLPS), Low Leakage Stop (LLS), and Very Low Leakage Stop (VLLS) configurations in ARM’s Deep Sleep operational mode. In these modes, the MCU core and most of the peripherals are disabled. Depending on the requirements of the application, different portions of the analog, logic, and memory can be retained or disabled to conserve power. The Battery Backup mode allows the VBAT voltage domain to operate while the rest of the device is disabled to conserve power. All modules in the VBAT domain are functional in this mode of operation. The Nested Vectored Interrupt Controller (NVIC), the Asynchronous Wake-up Interrupt Controller (AWIC), and the Low Leakage Wake-Up Controller (LLWU) are used to wake up the MCU from low power states. The NVIC is used to wake up the MCU core from WAIT and VLPW modes. The AWIC is used to wake up the MCU core from STOP and VLPS modes. The LLWU is used to wake up the MCU core from LLS and VLLSx modes. For additional information regarding operational modes, power management, the NVIC, AWIC, or the LLWU, please refer to the Reference Manual. 14 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview The following table provides information about the state of the peripherals in the various operational modes and the modules that can wake MCU from low power modes. Table 6. Peripherals states in different operational modes Core mode Run mode Sleep mode Deep sleep Device mode Descriptions High Speed Run In HSRun mode, MCU is able to operate at a faster frequency, and all device modules are operational. Run In Run mode, all device modules are operational. Very Low Power Run In VLPR mode, all device modules are operational at a reduced frequency except the Low Voltage Detect (LVD) monitor, which is disabled. Wait In Wait mode, all peripheral modules are operational. The MCU core is placed into Sleep mode. Very Low Power Wait In VLPW mode, all peripheral modules are operational at a reduced frequency except the Low Voltage Detect (LVD) monitor, which is disabled. The MCU core is placed into Sleep mode. Stop In Stop mode, most peripheral clocks are disabled and placed in a static state. Stop mode retains all registers and SRAMs while maintaining Low Voltage Detection protection. In Stop mode, the ADC, DAC, CMP, LPTMR, RTC, and pin interrupts are operational. The NVIC is disabled, but the AWIC can be used to wake up from an interrupt. Very Low Power Stop In VLPS mode, the contents of the SRAM are retained. The CMP (low speed), ADC, OSC, RTC, LPTMR, TPM, FlexIO, LPUART, LPI2C,USB, and DMA are operational, LVD and NVIC are disabled, AWIC is used to wake up from interrupt. Low Leakage Stop (LLS3/LLS2) State retention power mode. Most peripherals are in state retention mode (with clocks stopped), but LLWU, LPTimer, RTC, CMP, DAC can be used. NVIC is disabled; LLWU is used to wake up. NOTE: The LLWU interrupt must not be masked by the interrupt controller to avoid a scenario where the system does not fully exit stop mode on an LLS recovery. In LLS3 mode, all SRAM is operating (content retained and I/O states held). In LLS2 mode, a portion of SRAM_U remains powered on (content retained and I/O states held). Very Low Leakage Stop Most peripherals are disabled (with clocks stopped), but LLWU, LPTimer, (VLLSx) RTC, CMP, DAC can be used. NVIC is disabled; LLWU is used to wake up. In VLLS3, SRAM_U and SRAM_L remain powered on (content retained and I/O states held). In VLLS2, SRAM_L is powered off. A portion of SRAM_U remains powered on (content retained and I/O states held). In VLLS1 and VLLS0, all of SRAM_U and SRAM_L are powered off. The 32byte system register file and 32-byte VBAT register file remain powered for customer-critical data. In VLLS0, The POR detect circuit can be optionally powered off. Powered Off Battery Backup The RTC and 32-byte VBAT register file are powered from the VBAT domain and is fully functional. The rest of the device is powered down. KS22/KS20 Microcontroller, Rev. 3, 04/2016 15 NXP Semiconductors Overview 2.1.9 LLWU The LLWU module is used to wake MCU from low leakage power mode (LLS and VLLSx) and functional only on entry into a low-leakage power mode. After recovery from LLS, the LLWU is immediately disabled. After recovery from VLLSx, the LLWU continues to detect wake-up events until the user has acknowledged the wake-up event. The following is internal peripheral and external pin inputs as wakeup sources to the LLWU module. Table 7. Wakeup sources for LLWU inputs Input Wakeup source LLWU_P0 PTE1/LLWU_P0 pin LLWU_P1 PTE2/LLWU_P1 pin LLWU_P2 PTE4/LLWU_P2 pin LLWU_P3 PTA4/LLWU_P3 pin1 LLWU_P4 PTA13/LLWU_P4 pin LLWU_P5 PTB0/LLWU_P5 pin LLWU_P6 PTC1/LLWU_P6 pin LLWU_P7 PTC3/LLWU_P7 pin LLWU_P8 PTC4/LLWU_P8 pin LLWU_P9 PTC5/LLWU_P9 pin LLWU_P10 PTC6/LLWU_P10 pin LLWU_P11 PTC11/LLWU_P11 pin LLWU_P12 PTD0/LLWU_P12 pin LLWU_P13 PTD2/LLWU_P13 pin LLWU_P14 PTD4/LLWU_P14 pin LLWU_P15 PTD6/LLWU_P15 pin LLWU_P16 Reserved LLWU_P17 Reserved LLWU_P18 Reserved LLWU_P19 Reserved LLWU_P20 Reserved LLWU_P21 Reserved LLWU_P22 Reserved LLWU_P23 Reserved LLWU_P24 Reserved LLWU_P25 Reserved LLWU_P26 USBVDD Table continues on the next page... 16 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview Table 7. Wakeup sources for LLWU inputs (continued) Input Wakeup source LLWU_P27 USB0_DP LLWU_P28 USB0_DM2 LLWU_P29 Reserved LLWU_P30 Reserved LLWU_P31 Reserved LLWU_M0IF LPTMR3 LLWU_M1IF CMP0 LLWU_M2IF Reserved LLWU_M3IF Reserved LLWU_M4IF Reserved LLWU_M5IF RTC Alarm3 LLWU_M6IF Reserved LLWU_M7IF RTC Seconds3 1. If NMI was enabled on entry to LLS/VLLS, asserting the NMI pin generates an NMI interrupt on exit from the low power mode. NMI can also be disabled via the FOPT[NMI_DIS] bit. 2. As a wakeup source of LLWU, USB0_DP and USB0_DM are only available when the chip is in USB host mode. 3. It requires the peripheral and the peripheral interrupt to be enabled. The LLWU's WUME bit enables the internal module flag as a wakeup input. After wakeup, the flags are cleared based on the peripheral clearing mechanism. 2.1.10 Debug controller This device has extensive debug capabilities including run control and tracing capabilities. The standard ARM debug port supports SWD/JTAG interface. Also the cJTAG interface is supported on this device. 2.1.11 Computer operating properly (COP) watchdog timer The computer operating properly (COP) watchdog timer (WDOG) monitors the operation of the system by expecting periodic communication from the software. This communication is generally known as servicing (or refreshing) the COP watchdog. If this periodic refreshing does not occur, the watchdog issues a system reset. 2.2 Peripheral features The following sections describe the features of each peripherals of the chip. KS22/KS20 Microcontroller, Rev. 3, 04/2016 17 NXP Semiconductors Overview 2.2.1 eDMA and DMAMUX The eDMA is a highly programmable data-transfer engine optimized to minimize any required intervention from the host processor. It is intended for use in applications where the data size to be transferred is statically known and not defined within the transferred data itself. The DMA controller in this device implements 16 channels which can be routed from up to 63 DMA request sources through DMA MUX module. Main features of eDMA are listed below: • All data movement via dual-address transfers: read from source, write to destination • 16-channel implementation that performs complex data transfers with minimal intervention from a host processor • Transfer control descriptor (TCD) organized to support two-deep, nested transfer operations • Channel activation via one of three methods • Fixed-priority and round-robin channel arbitration • Channel completion reported via programmable interrupt requests • Programmable support for scatter/gather DMA processing • Support for complex data structures 2.2.2 TPM This device contains three low power Timer/PWM Modules (TPM), one with 6 channels and the other two with 2 channels. All TPM modules are functional in Stop/ VLPS mode if the clock source is enabled. The TPM features are as follows: • TPM clock mode is selectable (can increment on every edge of the asynchronous counter clock, or only on on rising edge of an external clock input synchronized to the asynchronous counter clock) • Prescaler divide-by 1, 2, 4, 8, 16, 32, 64, or 128 • Include a 16-bit counter • Include 6 or 2 channels (1×6ch, 2×2ch) that can be configured for input capture, output compare, edge-aligned PWM mode, or center-aligned PWM mode • Support the generation of an interrupt and/or DMA request per channel or counter overflow 18 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview • Support selectable trigger input to optionally reset or cause the counter to start or stop incrementing • Support the generation of hardware triggers when the counter overflows and per channel 2.2.3 ADC This device contains one ADC module. This ADC module supports hardware triggers from TPM, LPTMR, PIT, RTC, external trigger pin and CMP output. It supports wakeup of MCU in low power mode when using internal clock source or external crystal clock. ADC module has the following features: • Linear successive approximation algorithm with up to 16-bit resolution • Up to four pairs of differential and 17 single-ended external analog inputs • Support selectable 16-bit, 13-bit, 11-bit, and 9-bit differential output mode, or 16bit, 12-bit, 10-bit, and 8-bit single-ended output modes • Single or continuous conversion • Configurable sample time and conversion speed/power • Selectable clock source up to three • Operation in low-power modes for lower noise • Asynchronous clock source for lower noise operation with option to output the clock • Selectable hardware conversion trigger • Automatic compare with interrupt for less-than, greater-than or equal-to, within range, or out-of-range, programmable value • Temperature sensor • Hardware average function up to 32× • Voltage reference: from external • Self-calibration mode 2.2.3.1 Temperature sensor This device contains one temperature sensor internally connected to the input channel of AD26, see Table 66 for details of the linearity factor. The sensor must be calibrated to gain good accuracy, so as to provide good linearity, see also AN3031. KS22/KS20 Microcontroller, Rev. 3, 04/2016 19 NXP Semiconductors Overview 2.2.4 DAC The 12-bit digital-to-analog converter (DAC) is a low-power, general-purpose DAC. The output of the DAC can be placed on an external pin or set as one of the inputs to the analog comparator, or ADC. DAC module has the following features: • On-chip programmable reference generator output. The voltage output range is from 1⁄4096 Vin to Vin, and the step is 1⁄4096 Vin, where Vin is the input voltage. • Vin can be selected from the reference source VDDA • Static operation in Normal Stop mode • 16-word data buffer supported with multiple operation modes • DMA support 2.2.5 CMP The device contains one high-speed comparator and two 8-input multiplexers for both the inverting and non-inverting inputs of the comparator. Each CMP input channel connects to both muxes. The CMP includes one 6-bit DAC, which provides a selectable voltage reference for various user application cases. Besides, the CMP also has several module-to-module interconnects in order to facilitate ADC triggering, TPM triggering, and interfaces. The CMP has the following features: • Inputs may range from rail to rail • Programmable hysteresis control • Selectable interrupt on rising-edge, falling-edge, or both rising or falling edges of the comparator output • Selectable inversion on comparator output • Capability to produce a wide range of outputs such as sampled, digitally filtered • External hysteresis can be used at the same time that the output filter is used for internal functions • Two software selectable performance levels: shorter propagation delay at the expense of higher power and Low power with longer propagation delay • DMA transfer support • Functional in all modes of operation except in VLLS0 mode • The filter functions are not available in Stop, VLPS, LLS, or VLLSx modes • Integrated 6-bit DAC with selectable supply reference source and can be power down to conserve power • Two 8-to-1 channel mux 20 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview 2.2.6 RTC The RTC is an always powered-on block that remains active in all low power modes. The time counter within the RTC is clocked by a 32.768 kHz clock sourced from an external crystal using the RTC oscillator. RTC is reset on power-on reset, and a software reset bit in RTC can also initialize all RTC registers. The RTC module has the following features • 32-bit seconds counter with roll-over protection and 32-bit alarm • 16-bit prescaler with compensation that can correct errors between 0.12 ppm and 3906 ppm • Register write protection with register lock mechanism • 1 Hz square wave or second pulse output with optional interrupt 2.2.7 PIT The Periodic Interrupt Timer (PIT) is used to generate periodic interrupt to the CPU. It has four independent channels and each channel has a 32-bit counter. Both channels can be chained together to form a 64-bit counter. Channel 0 can be used to periodically trigger DMA channel 0, and channel 1 can be used to periodically trigger DMA channel 1. Either channel can be programmed as an ADC trigger source, or TPM trigger source. Channel 0 can be programmed to trigger DAC. The PIT module has the following features: • Each 32-bit timers is able to generate DMA trigger • Each 32-bit timers is able to generate timeout interrupts • Two timers can be cascaded to form a 64-bit timer • Each timer can be programmed as ADC/TPM trigger source 2.2.8 PDB The Programmable Delay Block (PDB) provides controllable delays from either an internal or an external trigger, or a programmable interval tick, to the hardware trigger inputs of ADCs and/or generates the interval triggers to DACs, so that the precise KS22/KS20 Microcontroller, Rev. 3, 04/2016 21 NXP Semiconductors Overview timing between ADC conversions and/or DAC updates can be achieved. The PDB can optionally provide pulse outputs (Pulse-Out's) that are used as the sample window in the CMP block. The PIT module has the following features: • Up to 15 trigger input sources and one software trigger source • Up to 8 configurable PDB channels for ADC hardware trigger • Up to 8 pulse outputs (pulse-out's) 2.2.9 LPTMR The low-power timer (LPTMR) can be configured to operate as a time counter with optional prescaler, or as a pulse counter with optional glitch filter, across all power modes, including the low-leakage modes. It can also continue operating through most system reset events, allowing it to be used as a time of day counter. The LPTMR module has the following features: • 16-bit time counter or pulse counter with compare • Optional interrupt can generate asynchronous wakeup from any low-power mode • Hardware trigger output • Counter supports free-running mode or reset on compare • Configurable clock source for prescaler/glitch filter • Configurable input source for pulse counter 2.2.10 CRC This device contains one cyclic redundancy check (CRC) module which can generate 16/32-bit CRC code for error detection. The CRC module provides a programmable polynomial, WAS, and other parameters required to implement a 16-bit or 32-bit CRC standard. The CRC module has the following features: • Hardware CRC generator circuit using a 16-bit or 32-bit programmable shift register • Programmable initial seed value and polynomial • Option to transpose input data or output data (the CRC result) bitwise or bytewise. • Option for inversion of final CRC result • 32-bit CPU register programming interface 22 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview 2.2.11 UART This device contains 3 basic universal asynchronous receiver/transmitter (UART) modules with DMA function supported. Generally, this module is used in RS-232, RS-485, and other communications. It also supports LIN slave operation and ISO7816. The UART module has the following features: • Full-duplex operation • 13-bit baud rate selection with /32 fractional divide, based on the module clock frequency • Programmable 8-bit or 9-bit data format • Programmable transmitter output polarity • Programmable receive input polarity • Up to 14-bit break character transmission. • 11-bit break character detection option • Two receiver wakeup methods with idle line or address mark wakeup • Address match feature in the receiver to reduce address mark wakeup ISR overhead • Ability to select MSB or LSB to be the first bit on wire • UART0 supporting ISO-7816 protocol to interface with SIM cards and smart cards • Receiver framing error detection • Hardware parity generation and checking • 1/16 bit-time noise detection • DMA interface 2.2.12 LPUART This device contains one Low-Power UART module, and can work in Stop and VLPS modes. The module also supports 4× to 32× data oversampling rate to meet different applications. The LPUART module has the following features: • Programmable baud rates (13-bit modulo divider) with configurable oversampling ratio from 4× to 32× • Transmit and receive baud rate can operate asynchronous to the bus clock and can be configured independently of the bus clock frequency, support operation in Stop mode KS22/KS20 Microcontroller, Rev. 3, 04/2016 23 NXP Semiconductors Overview • • • • • • • • • Interrupt, DMA or polled operation Hardware parity generation and checking Programmable 8-bit, 9-bit or 10-bit character length Programmable 1-bit or 2-bit stop bits Three receiver wakeup methods • Idle line wakeup • Address mark wakeup • Receive data match Automatic address matching to reduce ISR overhead: • Address mark matching • Idle line address matching • Address match start, address match end Optional 13-bit break character generation / 11-bit break character detection Configurable idle length detection supporting 1, 2, 4, 8, 16, 32, 64 or 128 idle characters Selectable transmitter output and receiver input polarity 2.2.13 SPI This device contains two SPI modules. The SPI module provides a synchronous serial bus for communication between a chip and an external peripheral device. The SPI modules have the following features: • Full-duplex, three-wire synchronous transfers • Master mode, or slave mode • Data streaming operation in Slave mode with continuous slave selection • Buffered transmit/receive operation using the transmit/receive first in first out (TX/RX FIFO) with depth of 4 entries • Programmable transfer attributes on a per-frame basis • Multiple peripheral chip select (PCS) (6 PCS available for SPI0 and 4 PCS for SPI1), expandable to 64 with external demultiplexer • Deglitching support for up to 32 peripheral chip selects (PCSes) with external demultiplexer • DMA support for adding entries to TX FIFO and removing entries from RX FIFO • Global interrupt request line • Modified SPI transfer formats for communication with slower peripheral devices • Power-saving architectural features 24 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview 2.2.14 FlexCAN For KS22, the device contains two FlexCAN modules. For KS20, it has only one FlexCAN module. The FlexCAN module is a communication controller implementing the CAN protocol according to the ISO 11898-1 standard and CAN 2.0 B protocol specifications. The FlexCAN module contains 16 message buffers. Each message buffer is 16 bytes. The FlexCAN module has the following features: • Flexible mailboxes of zero to eight bytes data length • Each mailbox configurable as receive or transmit, all supporting standard and extended messages • Individual Rx Mask registers per mailbox • Full-featured Rx FIFO with storage capacity for up to six frames and automatic internal pointer handling with DMA support • Transmission abort capability • Programmable clock source to the CAN Protocol Interface, either peripheral clock or oscillator clock • RAM not used by reception or transmission structures can be used as general purpose RAM space • Listen-Only mode capability • Programmable Loop-Back mode supporting self-test operation • Programmable transmission priority scheme: lowest ID, lowest buffer number, or highest priority • Time stamp based on 16-bit free-running timer • Global network time, synchronized by a specific message • Maskable interrupts • Independence from the transmission medium (an external transceiver is assumed) • Short latency time due to an arbitration scheme for high-priority messages • Low power modes, with programmable wake up on bus activity • Remote request frames may be handled automatically or by software • CAN bit time settings and configuration bits can only be written in Freeze mode • Tx mailbox status (Lowest priority buffer or empty buffer) • Identifier Acceptance Filter Hit Indicator (IDHIT) register for received frames • SYNCH bit available in Error in Status 1 register to inform that the module is synchronous with CAN bus • CRC status for transmitted message • Rx FIFO Global Mask register KS22/KS20 Microcontroller, Rev. 3, 04/2016 25 NXP Semiconductors Overview • Selectable priority between mailboxes and Rx FIFO during matching process • Powerful Rx FIFO ID filtering, capable of matching incoming IDs against either 128 extended, 256 standard, or 512 partial (8 bit) IDs, with up to 32 individual masking capability 2.2.15 LPI2C This device contains two LPI2C modules. The LPI2C is a low power Inter-Integrated Circuit (I2C) module that supports an efficient interface to an I2C bus as a master and/or a slave. The LPI2C can continue operating in stop modes provided an appropriate clock is available and is designed for low CPU overhead with DMA offloading of FIFO register accesses. The LPI2C implements logic support for standardmode, fast-mode, fast-mode plus and ultra-fast modes of operation. The LPI2C module also complies with the System Management Bus (SMBus) Specification, version 2. The LPI2C modules have the following features: • Standard, Fast, Fast+ and Ultra Fast modes are supported • HS-mode supported in slave mode • Multi-master support including synchronization and arbitration • Clock stretching • General call, 7-bit and 10-bit addressing • Software reset, START byte and Device ID require software support • For master mode: • command/transmit FIFO of 4 words • receive FIFO of 4 words • For slave mode: • separate I2C slave registers to minimize software overhead due to master/slave switching • support for 7-bit or 10-bit addressing, address range, SMBus alert and general call address • transmit/receive data register supporting interrupt or DMA requests 2.2.16 USB This device contains one USB module which implements a USB2.0 full-speed compliant peripheral and interfaces to the on-chip USBFS transceiver. It enables IRC48M to allow crystal-less USB operation. The USBFS has the following features: 26 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview • • • • • USB 1.1 and 2.0 compliant full-speed device controller 16 bidirectional end points DMA or FIFO data stream interfaces Low-power consumption IRC48M with clock-recovery is supported to eliminate the 48 MHz crystal. It is used for USB device-only implementation. 2.2.17 I2S The I2S module provides a synchronous audio interface (SAI), which can be clocked by bus clock, PLL/FLL output clock or external oscillator clock. The module supports asynchronous bit clocks (BCLKs) that can be generated internally from the audio master clock or supplied externally. And also supports the option for synchronous operation between the receiver and transmitter. And it can be functional in stop or very low power mode. I2S module has the following features: • Transmitter with independent bit clock and frame sync supporting 1 data channel • Receiver with independent bit clock and frame sync supporting 1 data channel • Maximum frame size of 16 words • Word size of between 8-bits and 32-bits • Word size configured separately for first word and remaining words in frame • Asynchronous 8 × 32-bit FIFO for each transmit and receive channels • Supports graceful restart after FIFO error • Supports automatic restart after FIFO error without software intervention • Supports packing of 8-bit and 16-bit data into each 32-bit FIFO word 2.2.18 FlexIO The FlexIO is a highly configurable module providing a wide range of protocols including, but not limited to UART, I2C, SPI, I2S, and PWM/Waveform generation. The module supports programmable baud rates independent of bus clock frequency, with automatic start/stop bit generation. The FlexIO module has the following features: • Functional in VLPR/VLPW/Stop/VLPS mode provided the clock it is using remains enabled • Four 32-bit double buffered shift registers with transmit, receive, and data match modes, and continuous data transfer KS22/KS20 Microcontroller, Rev. 3, 04/2016 27 NXP Semiconductors Overview • The timing of the shifter's shift, load and store events are controlled by the highly flexible 16-bit timer assigned to the shifter • Two or more shifters can be concatenated to support large data transfer sizes • Each 16-bit timers operates independently, supports for reset, enable and disable on a variety of internal or external trigger conditions with programmable trigger polarity • Flexible pin configuration supporting output disabled, open drain, bidirectional output data and output mode • Supports interrupt, DMA or polled transmit/receive operation 2.2.19 Port control and GPIO The Port Control and Interrupt (PORT) module provides support for port control, digital filtering, and external interrupt functions. The GPIO data direction and output data registers control the direction and output data of each pin when the pin is configured for the GPIO function. The GPIO input data register displays the logic value on each pin when the pin is configured for any digital function, provided the corresponding Port Control and Interrupt module for that pin is enabled. The following figure shows the basic I/O pad structure. This diagram applies to all I/O pins except RESET_b and those configured as pseudo open-drain outputs. RESET_b is a true open-drain pin without p-channel output driver or diode to the ESD bus. Pseudo open-drain pins have the p-channel output driver disabled when configured for opendrain operation. None of the I/O pins, including open-drain and pseudo open-drain pins, are allowed to go above VDD. 28 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Overview Digital input IBE=1 whenever MUX≠000 PFE MUX IBE LPF ESD Bus VDD RPULL PE PS Analog input Digital output DSE SRE Figure 4. I/O simplified block diagram The PORT module has the following features: • all PIN support interrupt enable • Configurable edge (rising, falling, or both) or level sensitive interrupt type • Support DMA request • Asynchronous wake-up in low-power modes • Configurable pullup, pulldown, and pull-disable on select pins • Configurable high and low drive strength on selected pins • Configurable fast and slow slew rates on selected pins • Configurable passive filter on selected pins • Individual mux control field supporting analog or pin disabled, GPIO, and up to chip-specific digital functions • Pad configuration fields are functional in all digital pin muxing modes. The GPIO module has the following features: • Port Data Input register visible in all digital pin-multiplexing modes • Port Data Output register with corresponding set/clear/toggle registers KS22/KS20 Microcontroller, Rev. 3, 04/2016 29 NXP Semiconductors Memory map • Port Data Direction register • GPIO support single-cycle access via fast GPIO. 3 Memory map This device contains various memories and memory-mapped peripherals which are located in a 4 GB memory space. For more details of the system memory and peripheral locations, see the Memory Map chapter in the Reference Manual. 0x4000_0000 0x4000_8000 0x4000_9000 0x4000_A000 0x4001_F000 0x4002_0000 0x0000_0000 0x4002_1000 0x4002_2000 0x4002_4000 0x4002_5000 0x4002_6000 Flash 0x0000_0000 Code space 0x0800_0000 0x07FF_FFFF note: take 256 KB flash memory as an example 0x4002_D000 0x4002_E000 0x4002_F000 0x4003_0000 0x4003_1000 0x4003_2000 0x4003_3000 0x4003_6000 0x4003_7000 Reserved 0x1C00_0000 0x1C00_0000 SRAM_L Data space 0x2000_0000 0x2010_0000 0x4003_8000 0x4003_9000 0x4003_A000 0x4003_B000 0x4003_C000 0x4003_D000 SRAM_U Reserved * 0x200F_FFFF note: 0x2200_0000–0x23FF_FFFF: Aliased to SRAM_U bitband 0x3000_0000–0x33FF_FFF: Program Flash and read only data 0x4003_E000 0x4003_F000 0x4004_0000 0x4004_1000 0x4004_2000 0x4004_7000 0x4000_0000 Public peripherals 0x4000_0000 0x4007_FFFF 0x4008_0000 0x4010_0000 Reserved * 0xE000_0000 Private Peripheral Bus (PPB) * 0xFFFF_FFFF 0x400F_EFFF AIPS peripherals Reserved note: 0x4200_0000–0x42FF_FFFF : Aliased to peripheral bridge (AIPS-lite) bitband 0x43FE_0000–0x43FF_FFFF : Aliased to general purpose input/output(GPIO) bitband GPIO 0x4002_9000 0x4002_A000 0x4002_B000 0x4002_C000 0x400F_F000 0x400F_FFFF note: 0xE000_0000–0xE000_0FFF: Instrumentation Trace Macrocell (ITM) 0xE000_1000–0xE000_1FFF: Data Watchpoint and Trace (DWT) 0xE000_2000–0xE000_2FFF: Flash Patch and Breakpoint (FPB) 0xE000_3000–0xE000_DFFF: Reserved 0xE000_E000–0xE000_EFFF: System Control Space (SCS) (for NVIC and FPU) 0xE000_F000–0xE003_FFFF: Reserved 0xE004_0000–0xE004_0FFF: Trace Port Interface Unit (TPIU) 0xE004_1000–0xE004_1FFF: Reserved 0xE004_2000–0xE004_2FFF: Reserved 0xE004_3000–0xE004_3FFF: Reserved 0xE004_4000–0xE007_FFFF: Reserved 0xE008_0000–0xE008_0FFF: Miscellaneous Control Module (MCM) 0xE008_1000–0xE008_1FFF: Reserved 0xE008_2000–0xE00F_EFFF: Reserved 0xE00F_F000–0xE00F_FFFF: ROM Table - allows auto-detection of debug components 0xE010_0000–0xFFFF_FFFF: Reserved 0x4004_8000 0x4004_9000 0x4004_A000 0x4004_B000 0x4004_C000 0x4004_D000 0x4004_E000 0x4005_2000 0x4005_3000 0x4005_F000 0x4006_0000 0x4006_1000 0x4006_2000 0x4006_4000 0x4006_5000 0x4006_6000 0x4006_7000 0x4006_8000 0x4006_A000 0x4006_B000 0x4006_C000 0x4006_D000 0x4007_2000 0x4007_3000 0x4007_4000 0x4007_C000 0x4007_D000 0x4007_E000 0x4007_F000 0x4007_FFFF Reserved DMA controller DMA controller transfer control descriptors Reserved Flash memory controller (FMC) Flash memory DMA channel mutiplexer Reserved FlexCAN 0 FlexCAN 1 (only for KS22) Reserved Random Number Generator (RNGA) LPUART 0 Reserved SPI 0 SPI 1 Reserved I2S 0 I2S 1 Reserved CRC Reserved Programmable delay block (PDB) Periodic interrupt timers (PIT) TPM 0 TPM 1 TPM 2 ADC 0 Reserved Real-time clock (RTC) VBAT register file DAC 0 Low-power timer (LPTMR) System register file Reserved SIM low-power logic System integration module (SIM) Port A multiplexing control Port B multiplexing control Port C multiplexing control Port D multiplexing control Port E multiplexing control Reserved Software watchdog Reserved FlexIO Reserved External watchdog Reserved Multi-purpose Clock Generator (MCG) System oscillator (OSC) LPI2C 0 LPI2C 1 Reserved UART 0 UART 1 UART 2 Reserved USB Full Speed OTG Controller CMP (with 6-bit DAC) Reserved Low-leakage wakeup unit (LLWU) Power management controller (PMC) System Mode controller (SMC) Reset Control Module (RCM) Figure 5. Memory map 30 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts 4 Pinouts 4.1 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control Module is responsible for selecting which ALT functionality is available on each pin. NOTE For KS20, only CAN0 exists. For KS22, there are two instances of CAN module (CAN0 and CAN1). 100 64 48 LQFP LQFP QFN Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 1 1 1 PTE0/ CLKOUT32K ADC0_SE4a ADC0_SE4a PTE0/ CLKOUT32K SPI1_PCS1 UART1_TX LPI2C1_SDA RTC_ CLKOUT 2 2 2 PTE1/ LLWU_P0 ADC0_SE5a ADC0_SE5a PTE1/ LLWU_P0 SPI1_SOUT UART1_RX LPI2C1_SCL 3 — 3 PTE2/ LLWU_P1 ADC0_SE6a ADC0_SE6a PTE2/ LLWU_P1 SPI1_SCK UART1_ CTS_b 4 — 4 PTE3 ADC0_SE7a ADC0_SE7a PTE3 SPI1_SIN UART1_ RTS_b SPI1_SOUT 5 — 5 PTE4/ LLWU_P2 DISABLED PTE4/ LLWU_P2 SPI1_PCS0 LPUART0_ TX LPI2C1_SDA 6 — 6 PTE5 DISABLED PTE5 SPI1_PCS2 LPUART0_ RX LPI2C1_SCL 7 — — PTE6 DISABLED PTE6 SPI1_PCS3 LPUART0_ CTS_b 8 3 7 VDD VDD VDD 9 4 8 VSS VSS VSS 10 5 9 USB0_DP USB0_DP USB0_DP 11 6 10 USB0_DM USB0_DM USB0_DM 12 7 11 USBVDD USBVDD USBVDD 13 — — NC NC NC 14 8 — ADC0_DP1 ADC0_DP1 ADC0_DP1 15 — — ADC0_DM1 ADC0_DM1 ADC0_DM1 16 — — ADC0_DP2 ADC0_DP2 ADC0_DP2 17 — — ADC0_DM2 ADC0_DM2 ADC0_DM2 18 9 — ADC0_DP0 ADC0_DP0 ADC0_DP0 19 10 — ADC0_DM0 ADC0_DM0 ADC0_DM0 20 11 — ADC0_DP3 ADC0_DP3 ADC0_DP3 KS22/KS20 Microcontroller, Rev. 3, 04/2016 I2S0_MCLK SPI1_SIN USB_SOF_ OUT 31 NXP Semiconductors Pinouts 100 64 48 LQFP LQFP QFN Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 EWM_OUT_b 21 12 — ADC0_DM3 ADC0_DM3 ADC0_DM3 22 13 12 VDDA VDDA VDDA 23 14 12 VREFH VREFH VREFH 24 15 13 VREFL VREFL VREFL 25 16 13 VSSA VSSA VSSA 26 17 — CMP0_IN5 CMP0_IN5 CMP0_IN5 27 18 — DAC0_OUT/ ADC0_SE23 DAC0_OUT/ ADC0_SE23 DAC0_OUT/ ADC0_SE23 28 19 14 XTAL32 XTAL32 XTAL32 29 20 15 EXTAL32 EXTAL32 EXTAL32 30 21 16 VBAT VBAT VBAT 31 — — PTE24 ADC0_SE17 ADC0_SE17 PTE24 CAN1_TX TPM0_CH0 I2S1_TX_FS LPI2C0_SCL 32 — — PTE25 ADC0_SE18 ADC0_SE18 PTE25 CAN1_RX TPM0_CH1 I2S1_TX_ BCLK LPI2C0_SDA EWM_IN 33 — — PTE26/ CLKOUT32K DISABLED PTE26/ CLKOUT32K 34 22 17 PTA0 JTAG_TCLK/ SWD_CLK PTA0 UART0_ CTS_b 35 23 18 PTA1 JTAG_TDI PTA1 UART0_RX 36 24 19 PTA2 JTAG_TDO/ TRACE_ SWO PTA2 UART0_TX 37 25 20 PTA3 JTAG_TMS/ SWD_DIO PTA3 UART0_ RTS_b 38 26 21 PTA4/ LLWU_P3 NMI_b PTA4/ LLWU_P3 39 27 — PTA5 DISABLED PTA5 40 — — VDD VDD VDD 41 — — VSS VSS VSS 42 28 — PTA12 DISABLED 43 29 — PTA13/ LLWU_P4 DISABLED 44 — — PTA14 45 — — 46 — 47 I2S1_TXD0 TPM0_CH5 RTC_ CLKOUT EWM_IN CMP0_OUT TPM0_CH0 LPI2C1_ HREQ ALT7 USB_CLKIN JTAG_TCLK/ SWD_CLK TPM1_CH1 JTAG_TDI TPM1_CH0 JTAG_TDO/ TRACE_ SWO EWM_OUT_b JTAG_TMS/ SWD_DIO TPM0_CH1 I2S0_MCLK NMI_b USB_CLKIN TPM0_CH2 I2S0_TX_ BCLK JTAG_TRST_ b PTA12 CAN0_TX TPM1_CH0 I2S0_TXD0 PTA13/ LLWU_P4 CAN0_RX TPM1_CH1 I2S0_TX_FS DISABLED PTA14 SPI0_PCS0 UART0_TX I2S0_RX_ BCLK PTA15 DISABLED PTA15 SPI0_SCK UART0_RX I2S0_RXD0 — PTA16 DISABLED PTA16 SPI0_SOUT UART0_ CTS_b I2S0_RX_FS — — PTA17 DISABLED PTA17 SPI0_SIN UART0_ RTS_b I2S0_MCLK 48 30 22 VDD VDD VDD 49 31 23 VSS VSS VSS 50 32 24 PTA18 EXTAL0 EXTAL0 32 NXP Semiconductors PTA18 TPM_CLKIN0 KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts 100 64 48 LQFP LQFP QFN Pin Name Default ALT0 ALT1 ALT2 ALT3 51 33 25 PTA19 XTAL0 XTAL0 PTA19 52 34 26 RESET_b RESET_b RESET_b 53 35 27 PTB0/ LLWU_P5 ADC0_SE8 ADC0_SE8 PTB0/ LLWU_P5 LPI2C0_SCL 54 36 28 PTB1 ADC0_SE9 ADC0_SE9 PTB1 LPI2C0_SDA TPM1_CH1 55 37 29 PTB2 ADC0_SE12 ADC0_SE12 PTB2 LPI2C0_SCL 56 38 30 PTB3 ADC0_SE13 ADC0_SE13 57 — — PTB9 58 — — 59 — 60 ALT4 ALT5 TPM_CLKIN1 ALT6 ALT7 LPTMR0_ ALT1 FXIO0_D4 UART0_RX FXIO0_D5 UART0_TX UART0_ RTS_b FXIO0_D6 CAN1_RX PTB3 LPI2C0_SDA UART0_ CTS_b FXIO0_D7 CAN1_TX DISABLED PTB9 SPI1_PCS1 LPUART0_ CTS_b PTB10 DISABLED PTB10 SPI1_PCS0 LPUART0_ RX I2S1_TX_ BCLK — PTB11 DISABLED PTB11 SPI1_SCK LPUART0_ TX I2S1_TX_FS — — VSS VSS VSS 61 — — VDD VDD VDD 62 39 31 PTB16 DISABLED PTB16 SPI1_SOUT UART0_RX TPM_CLKIN0 EWM_IN I2S1_TXD0 (Note: 100LQFP only) 63 40 — PTB17 DISABLED PTB17 SPI1_SIN UART0_TX TPM_CLKIN1 EWM_OUT_b FXIO0_D0 64 41 32 PTB18 DISABLED PTB18 CAN0_TX TPM2_CH0 I2S0_TX_ BCLK FXIO0_D1 65 42 33 PTB19 DISABLED PTB19 CAN0_RX TPM2_CH1 I2S0_TX_FS FXIO0_D2 66 — — PTB20 DISABLED PTB20 CMP0_OUT 67 — — PTB21 DISABLED PTB21 FXIO0_D5 68 — — PTB22 DISABLED PTB22 FXIO0_D6 69 — — PTB23 DISABLED PTB23 70 43 — PTC0 ADC0_SE14 ADC0_SE14 PTC0 SPI0_PCS4 PDB0_ EXTRG USB_SOF_ OUT FXIO0_D3 SPI0_PCS0 71 44 34 PTC1/ LLWU_P6 ADC0_SE15 ADC0_SE15 PTC1/ LLWU_P6 SPI0_PCS3 UART1_ RTS_b TPM0_CH0 I2S0_TXD0 LPUART0_ RTS_b 72 45 35 PTC2 ADC0_SE4b ADC0_SE4b PTC2 SPI0_PCS2 UART1_ CTS_b TPM0_CH1 I2S0_TX_FS LPUART0_ CTS_b 73 46 36 PTC3/ LLWU_P7 DISABLED PTC3/ LLWU_P7 SPI0_PCS1 UART1_RX TPM0_CH2 I2S0_TX_ BCLK LPUART0_ RX 74 47 — VSS VSS VSS 75 48 — VDD VDD VDD 76 49 37 PTC4/ LLWU_P8 DISABLED PTC4/ LLWU_P8 SPI0_PCS0 UART1_TX TPM0_CH3 LPI2C0_ HREQ LPUART0_ TX 77 50 38 PTC5/ LLWU_P9 DISABLED PTC5/ LLWU_P9 SPI0_SCK LPTMR0_ ALT2 I2S0_RXD0 CMP0_OUT TPM0_CH2 KS22/KS20 Microcontroller, Rev. 3, 04/2016 TPM1_CH0 EWM_IN SPI0_PCS5 FXIO0_D4 FXIO0_D7 CLKOUT 33 NXP Semiconductors Pinouts 100 64 48 LQFP LQFP QFN Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 I2S0_MCLK LPI2C0_SCL 78 51 39 PTC6/ LLWU_P10 CMP0_IN0 CMP0_IN0 PTC6/ LLWU_P10 SPI0_SOUT PDB0_ EXTRG I2S0_RX_ BCLK 79 52 40 PTC7 CMP0_IN1 CMP0_IN1 PTC7 SPI0_SIN USB_SOF_ OUT I2S0_RX_FS 80 53 — PTC8 CMP0_IN2 CMP0_IN2 PTC8 LPI2C0_ SCLS I2S0_MCLK FXIO0_D0 I2S1_RXD0 81 54 — PTC9 CMP0_IN3 CMP0_IN3 PTC9 LPI2C0_ SDAS I2S0_RX_ BCLK FXIO0_D1 I2S1_RX_ BCLK 82 55 — PTC10 DISABLED PTC10 LPI2C1_SCL I2S0_RX_FS FXIO0_D2 I2S1_RX_FS 83 56 — PTC11/ LLWU_P11 DISABLED PTC11/ LLWU_P11 LPI2C1_SDA FXIO0_D3 I2S1_MCLK 84 — — PTC12 DISABLED PTC12 LPI2C1_ SCLS TPM_CLKIN0 FXIO0_D0 85 — — PTC13 DISABLED PTC13 LPI2C1_ SDAS TPM_CLKIN1 FXIO0_D1 86 — — PTC14 DISABLED PTC14 LPUART0_ RTS_b FXIO0_D2 87 — — PTC15 DISABLED PTC15 LPUART0_ CTS_b FXIO0_D3 88 — — VSS VSS VSS 89 — — VDD VDD VDD 90 — — PTC16 DISABLED PTC16 CAN1_RX LPUART0_ RX FXIO0_D4 91 — — PTC17 DISABLED PTC17 CAN1_TX LPUART0_ TX FXIO0_D5 92 — — PTC18 DISABLED PTC18 93 57 41 PTD0/ LLWU_P12 DISABLED PTD0/ LLWU_P12 SPI0_PCS0 UART2_ RTS_b LPUART0_ RTS_b FXIO0_D6 94 58 42 PTD1 ADC0_SE5b PTD1 SPI0_SCK UART2_ CTS_b LPUART0_ CTS_b FXIO0_D7 95 59 43 PTD2/ LLWU_P13 DISABLED PTD2/ LLWU_P13 SPI0_SOUT UART2_RX LPUART0_ RX LPI2C0_SCL 96 60 44 PTD3 DISABLED PTD3 SPI0_SIN UART2_TX LPUART0_ TX LPI2C0_SDA 97 61 45 PTD4/ LLWU_P14 DISABLED PTD4/ LLWU_P14 SPI0_PCS1 UART0_ RTS_b TPM0_CH4 EWM_IN SPI1_PCS0 98 62 46 PTD5 ADC0_SE6b ADC0_SE6b PTD5 SPI0_PCS2 UART0_ CTS_b TPM0_CH5 EWM_OUT_b SPI1_SCK 99 63 47 PTD6/ LLWU_P15 ADC0_SE7b ADC0_SE7b PTD6/ LLWU_P15 SPI0_PCS3 UART0_RX SPI1_SOUT 100 64 48 PTD7 DISABLED UART0_TX SPI1_SIN 34 NXP Semiconductors ADC0_SE5b PTD7 LPI2C0_SDA LPUART0_ RTS_b KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts 4.2 Pin properties The following table lists the pin properties. 100LQF P 64LQFP 48QFN Pin Name Driver Strength Default Status after POR Pull-up/ pulldown Setting after POR Slew Rate after POR Passive Pin Filter after POR Open Drain Pin Interrupt 1 1 1 PTE0/ ND CLKOUT 32K Hi-Z - FS N N Y 2 2 2 PTE1/ ND LLWU_P 0 Hi-Z - FS N N Y 3 3 PTE2/ ND LLWU_P 1 Hi-Z - FS N N Y 4 4 PTE3 ND Hi-Z - FS N N Y 5 5 PTE4/ ND LLWU_P 2 Hi-Z - FS N N Y 6 6 PTE5 ND Hi-Z - FS N N Y PTE6 ND Hi-Z - FS N N Y 7 8 3 7 VDD - - - - - - - 9 4 8 VSS - - - - - - - 9 4 9 VSS - - - - - - - 10 5 10 USB0_D P - Hi-Z - - - - - 11 6 11 USB0_D M - Hi-Z - - - - - 12 7 USBVDD - - - - - - - NC - - - - - - ADC0_D P1 Hi-Z - - - - - 15 ADC0_D M1 Hi-Z - - - - - 16 ADC0_D P2 Hi-Z - - - - - 17 ADC0_D M2 Hi-Z - - - - - 13 14 8 - 18 9 ADC0_D P0 Hi-Z - - - - - 19 10 ADC0_D M0 Hi-Z - - - - - Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 35 NXP Semiconductors Pinouts 100LQF P 64LQFP 48QFN Pin Name Driver Strength Default Status after POR Pull-up/ pulldown Setting after POR Slew Rate after POR Passive Pin Filter after POR Open Drain Pin Interrupt 20 11 ADC0_D P3 Hi-Z - - - - - 21 12 ADC0_D M3 Hi-Z - - - - - 22 13 12 VDDA - - - - - - - 23 14 12 VREFH - Hi-Z - - - - - 24 15 13 VREFL - Hi-Z - - - - - 25 16 13 VSSA - Hi-Z - - - - - 26 17 CMP0_IN 5 Hi-Z - - - - - 27 18 DAC0_O UT/ ADC0_S E23 Hi-Z - - - - - 28 19 14 XTAL32 - Hi-Z - - - - - 29 20 15 EXTAL32 - Hi-Z - - - - - 30 21 16 VBAT - - - - - - - 31 PTE24 ND Hi-Z - FS N N Y 32 PTE25 ND Hi-Z - FS N N Y 33 PTE26/ ND CLKOUT 32K Hi-Z - FS N N Y 34 22 17 PTA0 ND L PD FS N N Y 35 23 18 PTA1 ND H PU FS N N Y 36 24 19 PTA2 ND H PU FS N N Y 37 25 20 PTA3 ND H PU FS N N Y 38 26 21 PTA4/ ND LLWU_P 3 H PU FS N N Y 39 27 PTA5 ND Hi-Z - FS N N Y 40 VDD - - - - - - - 41 VSS - - - - - - - 42 28 PTA12 ND Hi-Z - FS N N Y 43 29 PTA13/ ND LLWU_P 4 Hi-Z - FS N N Y 44 PTA14 ND Hi-Z - FS N N Y 45 PTA15 ND Hi-Z - FS N N Y 46 PTA16 ND Hi-Z - FS N N Y Table continues on the next page... 36 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts 100LQF P 64LQFP 48QFN 47 Pin Name Driver Strength Default Status after POR Pull-up/ pulldown Setting after POR Slew Rate after POR Passive Pin Filter after POR Open Drain Pin Interrupt PTA17 ND Hi-Z - FS N N Y 48 30 22 VDD - - - - - - - 49 31 23 VSS - - - - - - - 50 32 24 PTA18 ND Hi-Z - FS N N Y 51 33 25 PTA19 ND Hi-Z - FS N N Y 52 34 26 RESET_ b - H PU - Y N - 53 35 27 PTB0/ HD LLWU_P 5 Hi-Z - FS N N Y 54 36 28 PTB1 HD Hi-Z - FS N N Y 55 37 29 PTB2 ND Hi-Z - FS N N Y 56 38 30 PTB3 ND Hi-Z - FS N N Y 57 PTB9 ND Hi-Z - FS N N Y 58 PTB10 ND Hi-Z - FS N N Y 59 PTB11 ND Hi-Z - FS N N Y 60 VSS - - - - - - - 61 VDD - - - - - - - PTB16 ND Hi-Z - FS N N Y PTB17 ND Hi-Z - FS N N Y 62 39 31 63 40 64 41 32 PTB18 ND Hi-Z - FS N N Y 65 42 33 PTB19 ND Hi-Z - FS N N Y 66 PTB20 ND Hi-Z - FS N N Y 67 PTB21 ND Hi-Z - FS N N Y 68 PTB22 ND Hi-Z - FS N N Y 69 PTB23 ND Hi-Z - FS N N Y PTC0 ND Hi-Z - FS N N Y 70 43 71 44 34 PTC1/ ND LLWU_P 6 Hi-Z - FS N N Y 72 45 35 PTC2 ND Hi-Z - FS N N Y 73 46 36 PTC3/ HD LLWU_P 7 Hi-Z - FS N N Y 74 47 VSS - - - - - - - 75 48 VDD - - - - - - - Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 37 NXP Semiconductors Pinouts 100LQF P 64LQFP 48QFN Pin Name Driver Strength Default Status after POR Pull-up/ pulldown Setting after POR Slew Rate after POR Passive Pin Filter after POR Open Drain Pin Interrupt 76 49 37 PTC4/ HD LLWU_P 8 Hi-Z - FS N N Y 77 50 38 PTC5/ ND LLWU_P 9 Hi-Z - FS N N Y 78 51 39 PTC6/ ND LLWU_P 10 Hi-Z - FS N N Y 79 52 40 PTC7 ND Hi-Z - FS N N Y 80 53 PTC8 ND Hi-Z - FS N N Y 81 54 PTC9 ND Hi-Z - FS N N Y 82 55 PTC10 ND Hi-Z - FS N N Y 83 56 PTC11/ ND LLWU_P 11 Hi-Z - FS N N Y 84 PTC12 ND Hi-Z - FS N N Y 85 PTC13 ND Hi-Z - FS N N Y 86 PTC14 ND Hi-Z - FS N N Y 87 PTC15 ND Hi-Z - FS N N Y 88 VSS - - - - - - - 89 VDD - - - - - - - 90 PTC16 ND Hi-Z - FS N N Y 91 PTC17 ND Hi-Z - FS N N Y 92 PTC18 ND Hi-Z - FS N N Y 93 57 41 PTD0/ ND LLWU_P 12 Hi-Z - FS N N Y 94 58 42 PTD1 ND Hi-Z - FS N N Y 95 59 43 PTD2/ ND LLWU_P 13 Hi-Z - FS N N Y 96 60 44 PTD3 ND Hi-Z - FS N N Y 97 61 45 PTD4/ HD LLWU_P 14 Hi-Z - FS N N Y 98 62 46 PTD5 HD Hi-Z - FS N N Y 99 63 47 PTD6/ HD LLWU_P 15 Hi-Z - FS N N Y Table continues on the next page... 38 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts 100LQF P 100 64LQFP 64 48QFN 48 Properties Driver strength Default status after POR Pin Name Driver Strength PTD7 HD Abbreviation Default Status after POR Hi-Z - Slew Rate after POR FS Passive Pin Filter after POR N Open Drain N Pin Interrupt Y Descriptions ND Normal drive HD High drive Hi-Z High impendence H High level L Low level Pull-up/pull-down setting after POR PU Pull-up PD Pull-down Slew rate after POR FS Fast slew rate SS Slow slew rate Passive Pin Filter after POR N Disabled Y Enabled Open drain N Disabled1 Y Enabled Y Yes Pin interrupt Pull-up/ pulldown Setting after POR 1. When UART or LPUART module is enabled and a pin is functional for UART or LPUART, this pin is (pseudo-) open drain configurable. 4.3 Module Signal Description Tables The following sections correlate the chip-level signal name with the signal name used in the module's chapter. They also briefly describe the signal function and direction. 4.3.1 Core Modules Table 9. JTAG Signal Descriptions Chip signal name Module signal name JTAG_TMS JTAG_TMS/ SWD_DIO Description JTAG Test Mode Selection I/O I Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 39 NXP Semiconductors Pinouts Table 9. JTAG Signal Descriptions (continued) Chip signal name Module signal name Description I/O JTAG_TCLK JTAG_TCLK/ SWD_CLK JTAG Test Clock I JTAG_TDI JTAG_TDI JTAG Test Data Input I JTAG_TDO JTAG_TDO/ TRACE_SWO JTAG Test Data Output O JTAG_TRST JTAG_TRST_b JTAG Reset I Table 10. SWD Signal Descriptions Chip signal name Module signal name Description I/O SWD_DIO JTAG_TMS/ SWD_DIO Serial Wire Data I SWD_CLK JTAG_TCLK/ SWD_CLK Serial Wire Clock I Table 11. TPIU Signal Descriptions Chip signal name Module signal name Description I/O TRACE_SWO JTAG_TDO/ TRACE_SWO Trace output data from the ARM CoreSight debug block over a single pin O 4.3.2 System Modules Table 12. EWM Signal Descriptions Chip signal name Module signal name EWM_IN EWM_in EWM_OUT EWM_out 40 NXP Semiconductors Description I/O EWM input for safety status of external safety circuits. The polarity of EWM_in is programmable using the EWM_CTRL[ASSIN] bit. The default polarity is active-low. I EWM reset out signal O KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts 4.3.3 Clock Modules Table 13. OSC Signal Descriptions Chip signal name Module signal name EXTAL0 EXTAL XTAL0 XTAL Description I/O External clock/Oscillator input I Oscillator output O Table 14. RTC OSC Signal Descriptions Chip signal name Module signal name EXTAL32 EXTAL32 XTAL32 XTAL32 Description I/O 32.768 kHz oscillator input I 32.768 kHz oscillator output O 4.3.4 Analog Table 15. ADC 0 Signal Descriptions Chip signal name Module signal name Description I/O ADC0_DP[3:0] DADP3–DADP0 Differential Analog Channel Inputs I ADC0_DM[3:0] DADM3–DADM0 Differential Analog Channel Inputs I ADC0_SEn ADn Single-Ended Analog Channel Inputs I VREFH VREFSH Voltage Reference Select High I VREFL VREFSL Voltage Reference Select Low I VDDA VDDA Analog Power Supply I VSSA VSSA Analog Ground I Table 16. CMP 0 Signal Descriptions Chip signal name Module signal name Description I/O CMP0_IN[5:0] IN[5:0] Analog voltage inputs I CMP0_OUT CMPO Comparator output O Table 17. DAC 0 Signal Descriptions Chip signal name Module signal name DAC0_OUT — KS22/KS20 Microcontroller, Rev. 3, 04/2016 Description I/O DAC output O 41 NXP Semiconductors Pinouts 4.3.5 Timer Modules Table 18. PDB 0 Signal Descriptions Chip signal name Module signal name PDB0_EXTRG EXTRG Description I/O External Trigger Input Source I If the PDB is enabled and external trigger input source is selected, a positive edge on the EXTRG signal resets and starts the counter. Table 19. LPTMR 0 Signal Descriptions Chip signal name Module signal name Description LPTMR0_ALT[2:1] LPTMR0_ALTn Pulse Counter Input pin I/O I Table 20. RTC Signal Descriptions Chip signal name Module signal name VBAT — RTC_CLKOUT RTC_CLKOUT Description I/O Backup battery supply for RTC and VBAT register file I 1 Hz square-wave output or OSCERCLK O Table 21. TPM 0 Signal Descriptions Chip signal name Module signal name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock. TPM external clock can be selected to increment the TPM counter on every rising edge synchronized to the counter clock. I TPM0_CH[5:0] TPM_CHn TPM channel (n = 5 to 0). A TPM channel pin is configured as output when configured in an output compare or PWM mode and the TPM counter is enabled, otherwise the TPM channel pin is an input. I/O Table 22. TPM 1 Signal Descriptions Chip signal name Module signal name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock. TPM external clock can be selected to increment the TPM counter on every rising edge synchronized to the counter clock. I Table continues on the next page... 42 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts Table 22. TPM 1 Signal Descriptions (continued) Chip signal name Module signal name TPM1_CH[1:0] TPM_CHn Description I/O TPM channel (n = 5 to 0). A TPM channel pin is configured as output when configured in an output compare or PWM mode and the TPM counter is enabled, otherwise the TPM channel pin is an input. I/O Table 23. TPM 2 Signal Descriptions Chip signal name Module signal name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock. TPM external clock can be selected to increment the TPM counter on every rising edge synchronized to the counter clock. I TPM2_CH[1:0] TPM_CHn TPM channel (n = 5 to 0). A TPM channel pin is configured as output when configured in an output compare or PWM mode and the TPM counter is enabled, otherwise the TPM channel pin is an input. I/O 4.3.6 Communication Interfaces Table 24. USB FS OTG Signal Descriptions Chip signal name Module signal name Description I/O USB0_DM usb_dm USB D- analog data signal on the USB bus. I/O USB0_DP usb_dp USB D+ analog data signal on the USB bus. I/O USB_CLKIN — Alternate USB clock input I USB_SOF_OUT — USB start of frame signal. Can be used to make the USB start of frame available for external synchronization. O Table 25. CAN 0 Signal Descriptions Chip signal name Module signal name CAN0_RX CAN Rx CAN Receive Pin Input CAN0_TX CAN Tx CAN Transmit Pin Output KS22/KS20 Microcontroller, Rev. 3, 04/2016 Description I/O 43 NXP Semiconductors Pinouts Table 26. CAN 1 (for KS22 only) Signal Descriptions Chip signal name Module signal name Description I/O CAN1_RX CAN Rx CAN Receive Pin Input CAN1_TX CAN Tx CAN Transmit Pin Output Table 27. SPI 0 Signal Descriptions Chip signal name Module signal name Description I/O SPI0_PCS0 PCS0/SS Peripheral Chip Select 0 (O) I/O SPI0_PCS[3:1] PCS[1:3] Peripheral Chip Selects 1–3 O SPI0_PCS4 PCS4 Peripheral Chip Select 4 O SPI0_PCS5 PCS5/ PCSS Peripheral Chip Select 5 /Peripheral Chip Select Strobe O SPI0_SIN SIN Serial Data In I SPI0_SOUT SOUT Serial Data Out O SPI0_SCK SCK Serial Clock (O) I/O Table 28. SPI 1 Signal Descriptions Chip signal name Module signal name Description I/O SPI1_PCS0 PCS0/SS Peripheral Chip Select 0 (O) I/O SPI1_PCS[3:1] PCS[1:3] Peripheral Chip Selects 1–3 O SPI1_SIN SIN Serial Data In I SPI1_SOUT SOUT Serial Data Out O SPI1_SCK SCK Serial Clock (O) I/O Table 29. LPI2C 0 Signal Descriptions Chip signal name Module signal name Description I/O LPI2C0_SCL SCL LPI2C clock line. I/O LPI2C0_SDA SDA LPI2C data line. I/O LPI2C0_HREQ HREQ Host request, can initiate an LPI2C master transfer if asserted and the I2C bus is idle. I LPI2C0_SCLS SCLS Secondary I2C clock line. If LPI2C master/slave are configured to use separate pins, this the LPI2C slave SCL pin. I/O LPI2C0_SDAS SDAS Secondary I2C data line. If LPI2C master/slave are configured to use separate pins, this the LPI2C slave SDA pin. I/O 44 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts Table 30. LPI2C 1 Signal Descriptions Chip signal name Module signal name Description I/O LPI2C1_SCL SCL LPI2C clock line. I/O LPI2C data line. I/O LPI2C1_SDA SDA LPI2C1_HREQ HREQ Host request, can initiate an LPI2C master transfer if asserted and the I2C bus is idle. LPI2C1_SCLS SCLS Secondary I2C clock line. If LPI2C master/slave are configured to use separate pins, this the LPI2C slave SCL pin. I/O LPI2C1_SDAS SDAS Secondary I2C data line. If LPI2C master/slave are configured to use separate pins, this the LPI2C slave SDA pin. I/O I Table 31. LPUART Signal Descriptions Chip signal name Module signal name Description I/O LPUART0_TX LPUART_TX Transmit data. This pin is normally an output, but is an input (tristated) in single wire mode whenever the transmitter is disabled or transmit direction is configured for receive data. O/I LPUART0_RX LPUART_RX Receive data I LPUART0_CTS LPUART_CTS Clear to send I LPUART0_CTS LPUART_RTS Request to send I Table 32. UART 0 Signal Descriptions Chip signal name Module signal name Description I/O UART0_CTS CTS Clear to send I UART0_RTS RTS Request to send O UART0_TX TXD Transmit data O UART0_RX RXD Receive data I Table 33. UART 1 Signal Descriptions Chip signal name Module signal name Description I/O UART1_CTS CTS Clear to send I UART1_RTS RTS Request to send O UART1_TX TXD Transmit data O UART1_RX RXD Receive data I KS22/KS20 Microcontroller, Rev. 3, 04/2016 45 NXP Semiconductors Pinouts Table 34. UART 2 Signal Descriptions Chip signal name Module signal name Description I/O UART2_CTS CTS Clear to send I UART2_RTS RTS Request to send O UART2_TX TXD Transmit data O UART2_RX RXD Receive data I Table 35. I2S0 Signal Descriptions Chip signal name Module signal name Description I/O I2S0_MCLK SAI_MCLK Audio Master Clock. The master clock is an input when externally generated and an output when internally generated. I/O I2S0_RX_BCLK SAI_RX_BCLK Receive Bit Clock. The bit clock is an input when externally generated and an output when internally generated. I/O I2S0_RX_FS SAI_RX_SYNC Receive Frame Sync. The frame sync is an input sampled synchronously by the bit clock when externally generated and an output generated synchronously by the bit clock when internally generated. I/O I2S0_RXD SAI_RX_DATA Receive Data. The receive data is sampled synchronously by the bit clock. I I2S0_TX_BCLK SAI_TX_BCLK Transmit Bit Clock. The bit clock is an input when externally generated and an output when internally generated. I/O I2S0_TX_FS SAI_TX_SYNC Transmit Frame Sync. The frame sync is an input sampled synchronously by the bit clock when externally generated and an output generated synchronously by the bit clock when internally generated. I/O I2S0_TXD SAI_TX_DATA Transmit Data. The transmit data is generated synchronously by the bit clock and is tristated whenever not transmitting a word. O Table 36. I2S1 Signal Descriptions Chip signal name Module signal name Description I/O I2S1_MCLK SAI_MCLK Audio Master Clock. The master clock is an input when externally generated and an output when internally generated. I/O I2S1_RX_BCLK SAI_RX_BCLK Receive Bit Clock. The bit clock is an input when externally generated and an output when internally generated. I/O I2S1_RX_FS SAI_RX_SYNC Receive Frame Sync. The frame sync is an input sampled synchronously by the bit clock when externally generated and an output generated synchronously by the bit clock when internally generated. I/O I2S1_RXD SAI_RX_DATA Receive Data. The receive data is sampled synchronously by the bit clock. I Table continues on the next page... 46 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts Table 36. I2S1 Signal Descriptions (continued) Chip signal name Module signal name Description I/O I2S1_TX_BCLK SAI_TX_BCLK Transmit Bit Clock. The bit clock is an input when externally generated and an output when internally generated. I/O I2S1_TX_FS SAI_TX_SYNC Transmit Frame Sync. The frame sync is an input sampled synchronously by the bit clock when externally generated and an output generated synchronously by the bit clock when internally generated. I/O I2S1_TXD SAI_TX_DATA Transmit Data. The transmit data is generated synchronously by the bit clock and is tristated whenever not transmitting a word. O Table 37. FlexIO Signal Descriptions Chip signal name Module signal name FXIO0_Dn FXIO_Dn (n=0...7) Description I/O Bidirectional FlexIO Shifter and Timer pin inputs/outputs I/O 4.3.7 Human-Machine Interfaces (HMI) Table 38. GPIO Signal Descriptions Chip signal name Module signal name Description I/O PTA[31:0]1 PORTA31–PORTA0 General-purpose input/output I/O PTB[31:0]1 PORTB31–PORTB0 General-purpose input/output I/O PTC[31:0]1 PORTC31–PORTC0 General-purpose input/output I/O PTD[31:0]1 PORTD31–PORTD0 General-purpose input/output I/O PTE[31:0]1 PORTE31–PORTE0 General-purpose input/output I/O 1. The available GPIO pins depends on the specific package. See the signal multiplexing section for which exact GPIO signals are available. 4.4 Pinouts The following figure shows the pinout diagram for the devices supported by this document. Many signals may be multiplexed onto a single pin. To determine what signals can be used on which pin, see the previous "signal multiplexing and pin assignments" section. KS22/KS20 Microcontroller, Rev. 3, 04/2016 47 NXP Semiconductors PTC16 VDD VSS PTC15 PTC14 PTC13 PTC12 PTC11/LLWU_P11 PTC10 PTC9 PTC8 90 89 88 87 86 85 84 83 82 81 80 PTC4/LLWU_P8 PTC17 91 PTC5/LLWU_P9 PTC18 92 76 PTD0/LLWU_P12 93 77 PTD1 94 PTC7 PTD2/LLWU_P13 95 PTC6/LLWU_P10 PTD3 96 79 PTD4/LLWU_P14 97 78 PTD5 98 PTD7 PTD6/LLWU_P15 100 99 Pinouts PTE0/CLKOUT32K 1 75 VDD PTE1/LLWU_P0 2 74 VSS PTE2/LLWU_P1 3 73 PTC3/LLWU_P7 PTE3 4 72 PTC2 PTE4/LLWU_P2 5 71 PTC1/LLWU_P6 PTE5 6 70 PTC0 PTE6 7 69 PTB23 VDD 8 68 PTB22 9 67 PTB21 USB0_DP 10 66 PTB20 USB0_DM 11 65 PTB19 USBVDD 12 64 PTB18 NC 13 63 PTB17 VSS 44 45 46 47 48 49 50 PTA14 PTA15 PTA16 PTA17 VDD VSS PTA18 PTA19 43 51 42 25 PTA12 VSSA PTA13/LLWU_P4 RESET_b VSS VREFL 41 PTB0/LLWU_P5 52 40 53 24 VDD 23 39 VREFH PTA5 PTB1 38 54 PTA4/LLWU_P3 22 37 PTB2 VDDA 36 55 PTA3 21 PTA2 PTB3 ADC0_DM3 35 56 PTA1 20 34 PTB9 ADC0_DP3 PTA0 57 33 19 PTE26/CLKOUT32K ADC0_DM0 32 PTB10 31 58 PTE25 18 PTE24 PTB11 ADC0_DP0 VBAT 59 30 17 29 VSS ADC0_DM2 28 60 XTAL32 16 EXTAL32 VDD ADC0_DP2 27 PTB16 61 26 62 15 CMP0_IN5 14 DAC0_OUT/ADC0_SE23 ADC0_DP1 ADC0_DM1 Figure 6. 100 LQFP Pinout Diagram 48 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 PTD7 PTD6/LLWU_P15 PTD5 PTD4/LLWU_P14 PTD3 PTD2/LLWU_P13 PTD1 PTD0/LLWU_P12 PTC11/LLWU_P11 PTC10 PTC9 PTC8 PTC7 PTC6/LLWU_P10 PTC5/LLWU_P9 PTC4/LLWU_P8 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 Pinouts ADC0_DP0 9 40 PTB17 ADC0_DM0 10 39 PTB16 ADC0_DP3 11 38 PTB3 ADC0_DM3 12 37 PTB2 VDDA 13 36 PTB1 VREFH 14 35 PTB0/LLWU_P5 VREFL 15 34 RESET_b VSSA 16 33 PTA19 32 PTB18 PTA18 41 31 8 VSS ADC0_DP1 30 PTB19 VDD 42 29 7 PTA13/LLWU_P4 USBVDD 28 PTC0 PTA12 43 27 6 PTA5 USB0_DM 26 PTC1/LLWU_P6 PTA4/LLWU_P3 44 25 5 PTA3 USB0_DP 24 PTC2 PTA2 45 23 4 PTA1 VSS 22 PTC3/LLWU_P7 PTA0 46 21 3 VBAT VDD 20 VSS EXTAL32 47 19 2 XTAL32 PTE1/LLWU_P0 18 VDD DAC0_OUT/ADC0_SE23 48 17 1 CMP0_IN5 PTE0/CLKOUT32K Figure 7. 64 LQFP Pinout Diagram KS22/KS20 Microcontroller, Rev. 3, 04/2016 49 NXP Semiconductors PTD7 PTD6/LLWU_P15 PTD5 PTD4/LLWU_P14 PTD3 PTD2/LLWU_P13 PTD1 PTD0/LLWU_P12 PTC7 PTC6/LLWU_P10 PTC5/LLWU_P9 PTC4/LLWU_P8 48 47 46 45 44 43 42 41 40 39 38 37 Pinouts VDD 7 30 PTB3 VSS 8 29 PTB2 USB0_DP 9 28 PTB1 USB0_DM 10 27 PTB0/LLWU_P5 USBVDD 11 26 RESET_b VDDA VREFH 12 25 PTA19 24 PTB16 PTA18 31 23 6 VSS PTE5 22 PTB18 VDD 32 21 5 PTA4/LLWU_P3 PTE4/LLWU_P2 20 PTB19 PTA3 33 19 4 PTA2 PTE3 18 PTC1/LLWU_P6 PTA1 34 17 3 PTA0 PTE2/LLWU_P1 16 PTC2 VBAT 35 15 2 EXTAL32 PTE1/LLWU_P0 14 PTC3/LLWU_P7 XTAL32 36 13 1 VREFL VSSA PTE0/CLKOUT32K Figure 8. 48 QFN Pinout Diagram 4.5 Package dimensions The following figures show the dimensions of the package options for the devices supported by this document. 50 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts Figure 9. 100-pin LQFP package dimensions 1 KS22/KS20 Microcontroller, Rev. 3, 04/2016 51 NXP Semiconductors Pinouts Figure 10. 100-pin LQFP package dimensions 2 52 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts Figure 11. 64-pin LQFP package dimensions 1 KS22/KS20 Microcontroller, Rev. 3, 04/2016 53 NXP Semiconductors Pinouts Figure 12. 64-pin LQFP package dimensions 2 54 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Pinouts Figure 13. 48-pin QFN package dimension 1 KS22/KS20 Microcontroller, Rev. 3, 04/2016 55 NXP Semiconductors Electrical characteristics 45° 0.25 (0.05) 0.95 1.13 DETAIL F // 0.1 C 48X 0.65 0.50 0.08 C 0.05 0.00 (0.2) 4 C SEATING PLANE (0.5) DETAIL G VIEW ROTATED 90℃W NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. THIS IS A NON-JEDEC REGISTERED PACKAGE. 4. COPLANARITY APPLIES TO LEADS AND DIE ATTACH FLAG. 5. MIN. METAL GAP SHOULD BE 0.2 MM. Figure 14. 48-pin QFN package dimension 2 5 Electrical characteristics 5.1 Terminology and guidelines 56 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 5.1.1 Definitions Key terms are defined in the following table: Term Rating Definition A minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: • Operating ratings apply during operation of the chip. • Handling ratings apply when the chip is not powered. NOTE: The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. Operating requirement A specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip Operating behavior A specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions Typical value A specified value for a technical characteristic that: • Lies within the range of values specified by the operating behavior • Is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions NOTE: Typical values are provided as design guidelines and are neither tested nor guaranteed. KS22/KS20 Microcontroller, Rev. 3, 04/2016 57 NXP Semiconductors Electrical characteristics 5.1.2 Examples EX AM PL E Operating rating: EX AM PL E Operating requirement: EX AM PL E Operating behavior that includes a typical value: 5.1.3 Typical-value conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol Description Value Unit TA Ambient temperature 25 °C VDD Supply voltage 3.3 V 58 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 5.1.4 Relationship between ratings and operating requirements .) ) ) ing rat e Op in. (m g tin ra in. t (m ax t (m n me rat e Op ing ire qu re ing rat e Op .) en rem re i qu rat e Op ing g tin ra ax (m Fatal range Degraded operating range Normal operating range Degraded operating range Fatal range Expected permanent failure - No permanent failure - Possible decreased life - Possible incorrect operation - No permanent failure - Correct operation - No permanent failure - Possible decreased life - Possible incorrect operation Expected permanent failure –∞ ∞ Operating (power on) g lin nd Ha n.) mi g( in rat g( ng li nd Ha in rat .) x ma Fatal range Handling range Fatal range Expected permanent failure No permanent failure Expected permanent failure –∞ ∞ Handling (power off) 5.1.5 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: • Never exceed any of the chip’s ratings. • During normal operation, don’t exceed any of the chip’s operating requirements. • If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 5.2 Ratings 5.2.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. KS22/KS20 Microcontroller, Rev. 3, 04/2016 59 NXP Semiconductors Electrical characteristics 5.2.2 Moisture handling ratings Symbol MSL Description Min. Max. Unit Notes — 3 — 1 Moisture sensitivity level 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 5.2.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 105°C -100 +100 mA 3 ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test. 5.2.4 Voltage and current operating ratings Table 39. Voltage and current operating ratings Symbol Description Min. Max. Unit VDD Digital supply voltage –0.3 3.8 V IDD Digital supply current — 120 mA VIO IO pin input voltage –0.3 VDD + 0.3 V Instantaneous maximum current single pin limit (applies to all port pins) –25 25 mA ID VDDA Analog supply voltage VDD – 0.3 VDD + 0.3 V VUSB_DP USB_DP input voltage –0.3 3.63 V VUSB_DM USB_DM input voltage –0.3 3.63 V RTC battery supply voltage –0.3 3.8 V VBAT 5.3 General 60 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 5.3.1 AC electrical characteristics Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured at the 20% and 80% points, as shown in the following figure. Input Signal High Low VIH 80% 50% 20% Midpoint1 VIL Fall Time Rise Time The midpoint is VIL + (VIH - VIL) / 2 Figure 15. Input signal measurement reference All digital I/O switching characteristics, unless otherwise specified, assume that the output pins have the following characteristics. • CL=30 pF loads • Slew rate disabled • Normal drive strength 5.3.2 Nonswitching electrical specifications 5.3.2.1 Voltage and current operating requirements Table 40. Voltage and current operating requirements Symbol Description Min. Max. Unit VDD Supply voltage 1.71 3.6 V VDDA Analog supply voltage 1.71 3.6 V VDD – VDDA VDD-to-VDDA differential voltage –0.1 0.1 V VSS – VSSA VSS-to-VSSA differential voltage –0.1 0.1 V RTC battery supply voltage 1.71 3.6 V USB Transceiver supply voltage 3.0 3.6 V 0.7 × VDD — V 0.75 × VDD — V VBAT USBVDD VIH Input high voltage • 2.7 V ≤ VDD ≤ 3.6 V Notes 1 • 1.7 V ≤ VDD ≤ 2.7 V Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 61 NXP Semiconductors Electrical characteristics Table 40. Voltage and current operating requirements (continued) Symbol VIL Description Min. Max. Unit — 0.35 × VDD V — 0.3 × VDD V 0.06 × VDD — V Input low voltage • 2.7 V ≤ VDD ≤ 3.6 V Notes • 1.7 V ≤ VDD ≤ 2.7 V VHYS Input hysteresis IICIO Analog and I/O pin DC injection current — single pin 2 • VIN < VSS-0.3V (Negative current injection) IICcont Contiguous pin DC injection current —regional limit, includes sum of negative injection currents or sum of positive injection currents of 16 contiguous pins • Negative current injection -3 — mA -25 — mA VODPU Open drain pullup voltage level VDD VDD V VRAM VDD voltage required to retain RAM 1.2 — V VPOR_VBAT — V VRFVBAT VBAT voltage required to retain the VBAT register file 3 1. USB nominal operating voltage is 3.3 V. 2. All analog and I/O pins are internally clamped to VSS through ESD protection diodes. If VIN is less than VIO_MIN or greater than VIO_MAX, a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R=(VIO_MIN-VIN)/|IICIO|. 3. Open drain outputs must be pulled to VDD. 5.3.2.2 HVD, LVD and POR operating requirements Table 41. VDD supply HVD, LVD and POR operating requirements Symbol Description Min. Typ. Max. Unit VHVDH High Voltage Detect (High Trip Point) — 3.72 — V VHVDL High Voltage Detect (Low Trip Point) — 3.46 — V VPOR Falling VDD POR detect voltage 0.8 1.1 1.5 V VLVDH Falling low-voltage detect threshold — high range (LVDV=01) 2.48 2.56 2.64 V Low-voltage warning thresholds — high range 1 VLVW1H • Level 1 falling (LVWV=00) 2.62 2.70 2.78 V VLVW2H • Level 2 falling (LVWV=01) 2.72 2.80 2.88 V VLVW3H • Level 3 falling (LVWV=10) 2.82 2.90 2.98 V VLVW4H • Level 4 falling (LVWV=11) 2.92 3.00 3.08 V — 80 — mV 1.54 1.60 1.66 V VHYSH Low-voltage inhibit reset/recover hysteresis — high range VLVDL Falling low-voltage detect threshold — low range (LVDV=00) Notes Low-voltage warning thresholds — low range 1 Table continues on the next page... 62 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 41. VDD supply HVD, LVD and POR operating requirements (continued) Symbol Min. Typ. Max. Unit VLVW1L • Level 1 falling (LVWV=00) 1.74 1.80 1.86 V VLVW2L • Level 2 falling (LVWV=01) 1.84 1.90 1.96 V VLVW3L • Level 3 falling (LVWV=10) 1.94 2.00 2.06 V VLVW4L • Level 4 falling (LVWV=11) 2.04 2.10 2.16 V — 60 — mV VHYSL Description Low-voltage inhibit reset/recover hysteresis — low range VBG Bandgap voltage reference 0.97 1.00 1.03 V tLPO Internal low power oscillator period — factory trimmed 900 1000 1100 μs Notes 1. Rising threshold is the sum of falling threshold and hysteresis voltage Table 42. VBAT power operating requirements Symbol Description VPOR_VBAT Falling VBAT supply POR detect voltage 5.3.2.3 Symbol Min. Typ. Max. Unit 0.8 1.1 1.5 V Notes Voltage and current operating behaviors Table 43. Voltage and current operating behaviors Min. Typ. Max. Unit Notes 2.7 V ≤ VDD ≤ 3.6 V, IOH = -5 mA VDD – 0.5 — — V 1 1.71 V ≤ VDD ≤ 2.7 V, IOH = -2.5 mA VDD – 0.5 — — V 2.7 V ≤ VDD ≤ 3.6 V, IOH = -20 mA VDD – 0.5 — — V 1.71 V ≤ VDD ≤ 2.7 V, IOH = -10 mA VDD – 0.5 — — V IOHT Output high current total for all ports — — 100 mA VOL Output low voltage — Normal drive pad except RESET_B 2.7 V ≤ VDD ≤ 3.6 V, IOL = 5 mA — — 0.5 V 1.71 V ≤ VDD ≤ 2.7 V, IOL = 2.5 mA — — 0.5 V 2.7 V ≤ VDD ≤ 3.6 V, IOL = 20 mA — — 0.5 V 1.71 V ≤ VDD ≤ 2.7 V, IOL = 10 mA — — 0.5 V — — 0.5 V VOH VOH VOL VOL Description Output high voltage — Normal drive pad except RESET_B Output high voltage — High drive pad except RESET_B 1 1 Output low voltage — High drive pad except RESET_B 1 Output low voltage — RESET_B 2.7 V ≤ VDD ≤ 3.6 V, IOL = 3 mA Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 63 NXP Semiconductors Electrical characteristics Table 43. Voltage and current operating behaviors (continued) Symbol Min. Typ. Max. Unit 1.71 V ≤ VDD ≤ 2.7 V, IOL = 1.5 mA — — 0.5 V Output low current total for all ports — — 100 mA All pins other than high drive port pins — 0.002 0.5 μA High drive port pins — 0.004 0.5 μA Input leakage current (total all pins) for full temperature range — — 1.0 μA 2 RPU Internal pullup resistors 20 — 50 kΩ 3 RPD Internal pulldown resistors 20 — 50 kΩ 4 IOLT IIN IIN Description Notes Input leakage current (per pin) for full temperature range 1, 2 1. PTB0, PTB1, PTD4, PTD5, PTD6, PTD7, PTC3, and PTC4 I/O have both high drive and normal drive capability selected by the associated PTx_PCRn[DSE] control bit. All other GPIOs are normal drive only. 2. Measured at VDD=3.6V 3. Measured at VDD supply voltage = VDD min and Vinput = VSS 4. Measured at VDD supply voltage = VDD min and Vinput = VDD 5.3.2.4 Power mode transition operating behaviors All specifications except tPOR and VLLSx → RUN recovery times in the following table assume this clock configuration: • • • • CPU and system clocks = 80 MHz Bus clock = 40 MHz Flash clock = 20 MHz MCG mode: FEI Table 44. Power mode transition operating behaviors Symbol tPOR Description After a POR event, amount of time from the point VDD reaches 1.71 V to execution of the first instruction across the operating temperature range of the chip. Min. Typ. Max. Unit Notes — — 300 μs 1 — — 140 μs — — 140 μs — — 80 μs — — 80 μs • VLLS0 → RUN • VLLS1 → RUN • VLLS2 → RUN • VLLS3 → RUN Table continues on the next page... 64 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 44. Power mode transition operating behaviors (continued) Symbol Description Min. Typ. Max. Unit — — 6 μs — — 6 μs — — 5.7 μs — — 5.7 μs Notes • LLS2 → RUN • LLS3 → RUN • VLPS → RUN • STOP → RUN 1. Normal boot (FTFA_FOPT[LPBOOT]=1) 5.3.2.5 Power consumption operating behaviors The maximum values stated in the following table represent the characterized results equivalent to the mean plus three times the standard deviation (mean + 3 sigma). NOTE The while(1) test is executed with flash cache enabled. Table 45. Power consumption operating behaviors Symbol IDDA Description Min. Typ. Max. Unit Notes — — See note mA 1 @ 1.8V — 24.17 26.215 mA 2, 3, 4 @ 3.0V — 24.20 26.292 mA @ 1.8V — 20.97 23.015 mA @ 3.0V — 20.97 23.062 mA @ 1.8V — 27.77 30.028 mA @ 3.0V — 27.79 30.083 mA @ 1.8V — 15.58 16.790 mA @ 3.0V — 16.19 17.457 mA Analog supply current IDD_HSRUN High Speed Run mode current - all peripheral clocks disabled, CoreMark benchmark code executing from flash IDD_HSRUN High Speed Run mode current - all peripheral clocks disabled, code executing from flash 2 IDD_HSRUN High Speed Run mode current — all peripheral clocks enabled, code executing from flash IDD_RUN 5 Run mode current in Compute operation — CoreMark benchmark code executing from flash 3, 4, 6 Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 65 NXP Semiconductors Electrical characteristics Table 45. Power consumption operating behaviors (continued) Symbol Description IDD_RUN Run mode current in Compute operation — code executing from flash IDD_RUN Min. Typ. Max. Unit Notes @ 1.8V — 13.38 14.590 mA 6 @ 3.0V — 13.42 14.687 mA — 13.81 15.087 mA • @ 25°C — 13.87 15.158 mA • @ -40°C — 13.72 15.050 mA • @ 70°C — 14.03 15.267 mA • @ 85°C — 14.12 15.347 mA • @ 105°C — 14.31 15.529 mA — 18.00 20.042 mA • @ 25°C — 18.08 20.145 mA • @ -40°C — 17.88 20.022 mA • @ 70°C — 18.27 20.229 mA • @ 85°C — 18.35 20.321 mA • @ 105°C — 18.55 20.544 mA — 12.68 13.763 mA • @ 25°C — 12.62 13.714 mA • @ -40°C — 12.53 13.652 mA • @ 70°C — 12.76 13.827 mA • @ 85°C — 12.84 13.895 mA • @ 105°C — 13.02 14.078 mA Run mode current — all peripheral clocks disabled, code executing from flash @ 1.8V 7 @ 3.0V IDD_RUN Run mode current — all peripheral clocks enabled, code executing from flash @ 1.8V 8 @ 3.0V IDD_RUN Run mode current — Compute operation, code executing from flash @ 1.8V 9 @ 3.0V IDD_WAIT Wait mode high frequency current at 3.0 V — all peripheral clocks disabled — 6.56 7.022 mA 7 IDD_WAIT Wait mode reduced frequency current at 3.0 V — all peripheral clocks disabled — 3.80 4.118 mA 10 Table continues on the next page... 66 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 45. Power consumption operating behaviors (continued) Symbol Description Min. Typ. Max. Unit Notes IDD_VLPR Very-low-power run mode current in Compute operation — CoreMark benchmark code executing from flash @ 1.8V — 967.09 1031.341 μA 3, 4, 11 @ 3.0V — 973.06 1040.294 μA @ 1.8V — 449.10 513.351 μA @ 3.0V — 462.61 529.844 μA IDD_VLPR Very-low-power run mode current at 3.0 V — all peripheral clocks disabled — 520.34 592.022 μA 12 IDD_VLPR Very-low-power run mode current at 3.0 V — all peripheral clocks enabled — 845.46 1005.706 μA 13 — 240.81 269.275 μA 14 @ 25°C — 269.63 292.223 μA @ -40°C — 253.73 280.001 μA @ 70°C — 309.98 346.335 μA @ 85°C — 347.88 401.693 μA @ 105°C — 450.05 565.013 μA @ 25°C — 3.48 6.005 µA @ -40°C — 2.47 3.740 µA @ 70°C — 15.20 30.384 µA @ 85°C — 28.62 52.396 µA @ 105°C — 65.48 115.129 µA @ 25°C — 2.78 3.778 µA @ -40°C — 2.14 2.881 µA @ 70°C — 7.72 12.481 µA @ 85°C — 13.30 21.607 µA @ 105°C — 29.50 47.202 µA @ 25°C — 2.56 3.293 µA @ -40°C — 2.10 2.802 µA @ 70°C — 6.14 8.758 µA @ 85°C — 10.34 15.242 µA @ 105°C — 22.68 33.393 µA — 2.01 2.769 µA IDD_VLPR Very-low-power run mode current in Compute operation, code executing from flash IDD_VLPW Very-low-power wait mode current at 3.0 V — all peripheral clocks disabled IDD_STOP IDD_VLPS IDD_LLS3 IDD_LLS2 11 Stop mode current at 3.0 V Very-low-power stop mode current at 3.0 V Low leakage stop mode 3 current at 3.0 V Low leakage stop mode 2 current at 3.0 V IDD_VLLS3 Very low-leakage stop mode 3 current at 3.0 V @ 25°C Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 67 NXP Semiconductors Electrical characteristics Table 45. Power consumption operating behaviors (continued) Symbol Description Min. Typ. Max. Unit @ -40°C — 1.55 2.485 µA @ 70°C — 5.81 9.658 µA @ 85°C — 10.06 16.695 µA @ 105°C — 22.30 35.783 µA @ 25°C — 1.76 2.298 µA @ -40°C — 1.51 1.963 µA @ 70°C — 3.73 5.221 µA @ 85°C — 6.12 8.624 µA @ 105°C — 13.22 18.408 µA @ 25°C — 0.64 0.835 µA @ -40°C — 0.55 0.795 µA @ 70°C — 1.88 2.427 µA @ 85°C — 3.52 4.640 µA @ 105°C — 8.62 11.273 µA @ 25°C — 0.36 0.525 µA @ -40°C — 0.29 0.513 µA @ 70°C — 1.58 2.108 µA @ 85°C — 3.19 4.289 µA @ 105°C — 8.20 10.838 µA @ 25°C — 0.093 0.249 µA @ -40°C — 0.016 0.145 µA @ 70°C — 1.30 1.821 µA @ 85°C — 2.91 3.994 µA @ 105°C — 7.92 10.501 µA Notes IDD_VLLS2 Very low-leakage stop mode 2 current at 3.0 V IDD_VLLS1 Very low-leakage stop mode 1 current at 3.0 V IDD_VLLS0 Very low-leakage stop mode 0 current at 3.0 V with POR detect circuit enabled IDD_VLLS0 Very low-leakage stop mode 0 current at 3.0 V with POR detect circuit disabled IDD_VBAT IDD_VBAT Average current with RTC and 32kHz disabled at 3.0 V VDD is off. @ 25°C — 0.21 0.245 µA @ -40°C — 0.14 0.163 µA @ 70°C — 1.15 1.498 µA @ 85°C — 2.44 3.596 µA @ 105°C — 6.49 9.557 µA Average current when CPU is not accessing RTC registers at 3.0 V • @ 25°C VDD is off. — 0.76 0.899 µA Table continues on the next page... 68 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 45. Power consumption operating behaviors (continued) Symbol Description Min. Typ. Max. Unit • @ -40°C — 0.63 0.745 µA • @ 70°C — 1.80 2.346 µA • @ 85°C — 3.11 4.575 µA • @ 105°C — 7.24 10.653 µA Notes 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. 120MHz core and system clock, 60MHz bus clock, and 24MHz flash clock. MCG configured for PEE mode. All peripheral clocks disabled. 3. Cache on and prefetch on, low compiler optimization. 4. Coremark benchmark compiled using IAR 7.2 with optimization level high. 5. 120MHz core and system clock, 60MHz bus clock, and 24MHz flash clock. MCG configured for PEE mode. All peripheral clocks enabled. 6. 80 MHz core and system clock, 40 MHz bus clock, and 26.67 MHz flash clock. MCG configured for PEE mode. Compute operation. 7. 80MHz core and system clock, 40MHz bus clock, and 26.67MHz flash clock. MCG configured for FEI mode. All peripheral clocks disabled. 8. 80MHz core and system clock, 40MHz bus clock, and 26.67MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled. 9. 80MHz core and system clock, 40MHz bus clock, and 26.67MHz flash clock. MCG configured for FEI mode. Compute operation. 10. 25MHz core and system clock, 25MHz bus clock, and 25MHz flash clock. MCG configured for FEI mode. 11. 4 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for BLPE mode. Compute operation. Code executing from flash. 12. 4 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled. Code executing from flash. 13. 4 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for BLPE mode. All peripheral clocks enabled but peripherals are not in active operation. Code executing from flash. 14. 4 MHz core, system, and bus clock and 1MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled. 5.3.2.5.1 Diagram: Typical IDD_RUN operating behavior The following data was measured under these conditions: • MCG in FBE mode for 50 MHz and lower frequencies. MCG in FEE mode at frequencies between 50 MHz and 100MHz. • No GPIOs toggled • Code execution from flash with cache enabled • For the ALLOFF curve, all peripheral clocks are disabled except FTFA KS22/KS20 Microcontroller, Rev. 3, 04/2016 69 NXP Semiconductors Electrical characteristics Figure 16. Run mode supply current vs. core frequency 70 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Figure 17. VLPR mode supply current vs. core frequency 5.3.2.6 EMC performance Electromagnetic compatibility (EMC) performance is highly dependent on the environment in which the MCU resides. Board design and layout, circuit topology choices, location and characteristics of external components, and MCU software operation play a significant role in the EMC performance. The system designer can consult the following Freescale applications notes, available on freescale.com for advice and guidance specifically targeted at optimizing EMC performance. • AN2321: Designing for Board Level Electromagnetic Compatibility • AN1050: Designing for Electromagnetic Compatibility (EMC) with HCMOS Microcontrollers • AN1263: Designing for Electromagnetic Compatibility with Single-Chip Microcontrollers KS22/KS20 Microcontroller, Rev. 3, 04/2016 71 NXP Semiconductors Electrical characteristics • AN2764: Improving the Transient Immunity Performance of MicrocontrollerBased Applications • AN1259: System Design and Layout Techniques for Noise Reduction in MCUBased Systems 5.3.2.6.1 EMC radiated emissions operating behaviors Table 46. EMC radiated emissions operating behaviors for 64 LQFP package Parame Conditions ter VEME Clocks Frequency range Level (Typ.) Unit Notes dBuV 1, 2 Device configuration, test FSYS = 120 MHz conditions and EM FBUS = 60 MHz testing per standard IEC External crystal = 8 MHz 61967-2. 150 kHz–50 MHz 14 50 MHz–150 MHz 23 150 MHz–500 MHz 23 Supply voltages: • VDD = 3.3 V 500 MHz–1000 MHz 9 IEC level L 3 Temp = 25°C 1. Measurements were made per IEC 61967-2 while the device was running typical application code. 2. The reported emission level is the value of the maximum measured emission, rounded up to the next whole number, from among the measured orientations in each frequency range. 3. IEC Level Maximums: M ≤ 18dBmV, L ≤ 24dBmV, K ≤ 30dBmV, I ≤ 36dBmV, H ≤ 42dBmV . 5.3.2.6.2 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to www.freescale.com. 2. Perform a keyword search for “EMC design.” 5.3.2.7 Symbol Capacitance attributes Table 47. Capacitance attributes Description Min. Max. Unit CIN_A Input capacitance: analog pins — 7 pF CIN_D Input capacitance: digital pins — 7 pF 5.3.3 Switching specifications 72 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 5.3.3.1 Symbol Device clock specifications Table 48. Device clock specifications Description Min. Max. Unit High Speed run mode fSYS System and core clock — 120 MHz fBUS Bus clock — 60 MHz System and core clock — 80 MHz System and core clock when Full Speed USB in operation 20 — MHz Bus clock — 50 MHz fFLASH Flash clock — 26.67 MHz fLPTMR LPTMR clock — 25 MHz Normal run mode fSYS fSYS_USB fBUS VLPR and VLPS modes1 fSYS System and core clock — 4 MHz fBUS Bus clock — 4 MHz fFLASH Flash clock — 1 MHz fERCLK External reference clock — 16 MHz LPTMR clock — 25 MHz — 16 MHz 12.5 MHz fLPTMR_pin fLPTMR_ERCLK LPTMR external reference clock fI2S_MCLK I2S master clock — fI2S_BCLK I2S bit clock — 4 MHz fFlexIO FlexIO clock — 16 MHz fLPI2C LPI2C clock — 16 MHz FlexCAN clock — 4 MHz fFlexCAN 1. The frequency limitations in VLPR and VLPS modes here override any frequency specification listed in the timing specification for any other module. These same frequency limits apply to VLPS, whether VLPS was entered from RUN or from VLPR. 5.3.3.2 General switching specifications These general purpose specifications apply to all signals configured for GPIO, UART, and timers. Table 49. General switching specifications Symbol Description Min. Max. Unit Notes GPIO pin interrupt pulse width (digital glitch filter disabled) — Synchronous path 1.5 — Bus clock cycles 1, 2 External RESET and NMI pin interrupt pulse width — Asynchronous path 100 — ns 3 Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 73 NXP Semiconductors Electrical characteristics Table 49. General switching specifications (continued) Symbol Description GPIO pin interrupt pulse width (digital glitch filter disabled, passive filter disabled) — Asynchronous path Min. Max. Unit Notes 50 — ns 4 Port rise and fall time 5 • Slew disabled — • 1.71 ≤ VDD ≤ 2.7V — • 2.7 ≤ VDD ≤ 3.6V • Slew enabled 10 ns 5 ns 30 ns 16 ns — • 1.71 ≤ VDD ≤ 2.7V — • 2.7 ≤ VDD ≤ 3.6V 1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be recognized in that case. 2. The greater of synchronous and asynchronous timing must be met. 3. These pins have a passive filter enabled on the inputs. This is the shortest pulse width that is guaranteed to be recognized. 4. These pins do not have a passive filter on the inputs. This is the shortest pulse width that is guaranteed to be recognized. 5. 25 pF load 5.3.4 Thermal specification 5.3.4.1 Symbol Thermal operating requirements Table 50. Thermal operating requirements Description Min. Max. Unit TJ Die junction temperature –40 125 °C TA Ambient temperature –40 105 °C Notes 1 1. Maximum TA can be exceeded only if the user ensures that TJ does not exceed maximum TJ. The simplest method to determine TJ is: TJ = TA + RΘJA × chip power dissipation. 5.3.4.2 Thermal attributes Table 51. Thermal attributes Board type Symbol Single-layer (1s) RθJA Description Thermal resistance, junction to ambient (natural convection) 100 LQFP 64 LQFP 48 QFN Unit Notes 58 61 81 °C/W 1, 2, 3 Table continues on the next page... 74 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 51. Thermal attributes (continued) Board type Symbol Four-layer (2s2p) RθJA Single-layer (1s) Description 100 LQFP 64 LQFP 48 QFN Unit Notes Thermal resistance, junction to ambient (natural convection) 46 43 28 °C/W 1, 2, 3,4 RθJMA Thermal resistance, junction to ambient (200 ft./min. air speed) 48 49 66 °C/W 1, 4, 5 Four-layer (2s2p) RθJMA Thermal resistance, junction to ambient (200 ft./min. air speed) 40 36 23 °C/W 1, 4, 5 — RθJB Thermal resistance, junction to board 31 25 11 °C/W 6 — RθJC Thermal resistance, junction to case 16 13 1.3 °C/W 7 — ΨJT Thermal characterization parameter, junction to package top outside center (natural convection) 2 2 2 °C/W 8 — ΨJB Thermal characterization parameter, junction to package bottom (natural convection) - - - °C/W 9 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 3. Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively. 4. Per JEDEC JESD51-6 with the board horizontal. 5. Per JEDEC JESD51-6 with forced convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively. 6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 7. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 8. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 9. Thermal characterization parameter indicating the temperature difference between package bottom center and the junction temperature per JEDEC JESD51-12. When Greek letters are not available, the thermal characterization parameter is written as Psi-JB. 5.4 Peripheral operating requirements and behaviors 5.4.1 Debug modules KS22/KS20 Microcontroller, Rev. 3, 04/2016 75 NXP Semiconductors Electrical characteristics 5.4.1.1 Symbol S1 SWD electricals Table 52. SWD full voltage range electricals Description Min. Max. Unit Operating voltage 1.71 3.6 V 0 33 MHz 1/S1 — ns 15 — ns SWD_CLK frequency of operation • Serial wire debug S2 SWD_CLK cycle period S3 SWD_CLK clock pulse width • Serial wire debug S4 SWD_CLK rise and fall times — 3 ns S9 SWD_DIO input data setup time to SWD_CLK rise 8 — ns S10 SWD_DIO input data hold time after SWD_CLK rise 1.4 — ns S11 SWD_CLK high to SWD_DIO data valid — 25 ns S12 SWD_CLK high to SWD_DIO high-Z 5 — ns S2 S3 S3 SWD_CLK (input) S4 S4 Figure 18. Serial wire clock input timing 76 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics SWD_CLK S9 SWD_DIO S10 Input data valid S11 SWD_DIO Output data valid S12 SWD_DIO S11 SWD_DIO Output data valid Figure 19. Serial wire data timing 5.4.1.2 Symbol J1 JTAG electricals Table 53. JTAG limited voltage range electricals Description Min. Max. Operating voltage 2.7 3.6 TCLK frequency of operation Unit V MHz • Boundary Scan 0 10 • JTAG and CJTAG 0 20 1/J1 — ns • Boundary Scan 50 — ns • JTAG and CJTAG 25 — ns J4 TCLK rise and fall times — 3 ns J5 Boundary scan input data setup time to TCLK rise 20 — ns J6 Boundary scan input data hold time after TCLK rise 1 — ns J7 TCLK low to boundary scan output data valid — 25 ns J8 TCLK low to boundary scan output high-Z — 25 ns J9 TMS, TDI input data setup time to TCLK rise 8 — ns J10 TMS, TDI input data hold time after TCLK rise 1 — ns J2 TCLK cycle period J3 TCLK clock pulse width Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 77 NXP Semiconductors Electrical characteristics Table 53. JTAG limited voltage range electricals (continued) Symbol Description Min. Max. Unit J11 TCLK low to TDO data valid — 19 ns J12 TCLK low to TDO high-Z — 19 ns J13 TRST assert time 100 — ns J14 TRST setup time (negation) to TCLK high 8 — ns Table 54. JTAG full voltage range electricals Symbol J1 Description Min. Max. Unit Operating voltage 1.71 3.6 V TCLK frequency of operation MHz • Boundary Scan 0 10 • JTAG and CJTAG 0 15 1/J1 — ns • Boundary Scan 50 — ns • JTAG and CJTAG 33 — ns J4 TCLK rise and fall times — 3 ns J5 Boundary scan input data setup time to TCLK rise 20 — ns J6 Boundary scan input data hold time after TCLK rise 1.4 — ns J7 TCLK low to boundary scan output data valid — 27 ns J8 TCLK low to boundary scan output high-Z — 27 ns J9 TMS, TDI input data setup time to TCLK rise 8 — ns J10 TMS, TDI input data hold time after TCLK rise 1.4 — ns J11 TCLK low to TDO data valid — 26.2 ns J12 TCLK low to TDO high-Z — 26.2 ns J13 TRST assert time 100 — ns J14 TRST setup time (negation) to TCLK high 8 — ns J2 TCLK cycle period J3 TCLK clock pulse width J2 J3 J3 TCLK (input) J4 J4 Figure 20. Test clock input timing 78 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics TCLK J5 Data inputs J6 Input data valid J7 Data outputs Output data valid J8 Data outputs J7 Data outputs Output data valid Figure 21. Boundary scan (JTAG) timing TCLK J9 TDI/TMS J10 Input data valid J11 TDO Output data valid J12 TDO J11 TDO Output data valid Figure 22. Test Access Port timing KS22/KS20 Microcontroller, Rev. 3, 04/2016 79 NXP Semiconductors Electrical characteristics TCLK J14 J13 TRST Figure 23. TRST timing 5.4.2 System modules There are no specifications necessary for the device's system modules. 5.4.3 Clock modules 5.4.3.1 Symbol MCG specifications Table 55. MCG specifications Description Min. Typ. Max. Unit Notes fints_ft Internal reference frequency (slow clock) — factory trimmed at nominal VDD and 25 °C — 32.768 — kHz Δfints_t Total deviation of internal reference frequency (slow clock) over voltage and temperature — +0.5/-0.7 ±2 % 31.25 — 39.0625 kHz — ± 0.3 ± 0.6 %fdco 1 fints_t Internal reference frequency (slow clock) — user trimmed Δfdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature — using SCTRIM and SCFTRIM Δfdco_t Total deviation of trimmed average DCO output frequency over voltage and temperature — +0.5/-0.7 ±2 %fdco 1, 2 Δfdco_t Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0–70°C — ± 0.3 ± 1.5 %fdco 1 Internal reference frequency (fast clock) — factory trimmed at nominal VDD and 25°C — 4 — MHz Δfintf_ft Frequency deviation of internal reference clock (fast clock) over temperature and voltage — factory trimmed at nominal VDD and 25 °C — +1/-2 ±5 %fintf_ft fintf_t Internal reference frequency (fast clock) — user trimmed at nominal VDD and 25 °C 3 — 5 MHz (3/5) x fints_t — — kHz fintf_ft floc_low Loss of external clock minimum frequency — RANGE = 00 Table continues on the next page... 80 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 55. MCG specifications (continued) Symbol Description floc_high Loss of external clock minimum frequency — RANGE = 01, 10, or 11 Min. Typ. Max. Unit (16/5) x fints_t — — kHz 31.25 — 39.0625 kHz 20 20.97 25 MHz 40 41.94 50 MHz 60 62.91 75 MHz 80 83.89 100 MHz — 23.99 — MHz — 47.97 — MHz — 71.99 — MHz — 95.98 — MHz Notes FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS=00) 3, 4 640 × ffll_ref Mid range (DRS=01) 1280 × ffll_ref Mid-high range (DRS=10) 1920 × ffll_ref High range (DRS=11) 2560 × ffll_ref fdco_t_DMX3 DCO output frequency 2 Low range (DRS=00) 5, 6 732 × ffll_ref Mid range (DRS=01) 1464 × ffll_ref Mid-high range (DRS=10) 2197 × ffll_ref High range (DRS=11) 2929 × ffll_ref Jcyc_fll FLL period jitter — • fVCO = 48 MHz • fVCO = 98 MHz tfll_acquire — — 180 — ps — 150 FLL target frequency acquisition time — — 1 ms 48.0 — 120 MHz — 1060 — µA — 600 — µA 2.0 — 4.0 MHz — 120 — ps — 75 — ps — 1350 — ps — 600 — ps 7 PLL fvco VCO operating frequency Ipll PLL operating current • PLL @ 96 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 48) Ipll PLL operating current • PLL @ 48 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 24) fpll_ref PLL reference frequency range Jcyc_pll PLL period jitter (RMS) • fvco = 48 MHz 8 8 9 • fvco = 100 MHz Jacc_pll PLL accumulated jitter over 1µs (RMS) 9 Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 81 NXP Semiconductors Electrical characteristics Table 55. MCG specifications (continued) Symbol Description Min. Typ. Max. Unit Notes • fvco = 48 MHz • fvco = 100 MHz Dlock Lock entry frequency tolerance ± 1.49 — ± 2.98 % Dunl Lock exit frequency tolerance ± 4.47 — ± 5.97 % tpll_lock Lock detector detection time — 10-6 — 150 × + 1075(1/ fpll_ref) s 10 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. 2.0 V <= VDD <= 3.6 V. 3. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0. 4. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation (Δfdco_t) over voltage and temperature should be considered. 5. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1. 6. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. 7. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 8. Excludes any oscillator currents that are also consuming power while PLL is in operation. 9. This specification was obtained using a NXP developed PCB. PLL jitter is dependent on the noise characteristics of each PCB and results will vary. 10. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 5.4.3.2 IRC48M specifications Table 56. IRC48M specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 — 3.6 V IDD48M Supply current — 400 500 μA firc48m Internal reference frequency — 48 — MHz — ± 0.2 ± 0.5 %firc48m 1 — ± 0.4 ± 1.0 %firc48m 1 Δfirc48m_ol_hv Open loop total deviation of IRC48M frequency at high voltage (VDD=1.89V-3.6V) over 0°C to 70°C Regulator enable (USB_CLK_RECOVER_IRC_EN[REG_EN]=1) Notes — Δfirc48m_ol_hv Open loop total deviation of IRC48M frequency at high voltage (VDD=1.89V-3.6V) over full temperature Regulator enable (USB_CLK_RECOVER_IRC_EN[REG_EN]=1) Δfirc48m_ol_lv Open loop total deviation of IRC48M frequency at low voltage (VDD=1.71V-1.89V) over full temperature Regulator disable (USB_CLK_RECOVER_IRC_EN[REG_EN]=0) 1 — ± 0.4 ± 1.0 %firc48m Table continues on the next page... 82 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 56. IRC48M specifications (continued) Symbol Min. Typ. Max. Regulator enable (USB_CLK_RECOVER_IRC_EN[REG_EN]=1) — ± 0.5 ± 1.5 Δfirc48m_cl Closed loop total deviation of IRC48M frequency over voltage and temperature — — Jcyc_irc48m Period Jitter (RMS) — Startup time — tirc48mst Description Unit Notes ± 0.1 %fhost 2 35 150 ps 2 3 μs 3 1. The maximum value represents characterized results equivalent to the mean plus or minus three times the standard deviation (mean ± 3 sigma). 2. Closed loop operation of the IRC48M is only feasible for USB device operation; it is not usable for USB host operation. It is enabled by configuring for USB Device, selecting IRC48M as USB clock source, and enabling the clock recover function (USB_CLK_RECOVER_IRC_CTRL[CLOCK_RECOVER_EN]=1, USB_CLK_RECOVER_IRC_EN[IRC_EN]=1). 3. IRC48M startup time is defined as the time between clock enablement and clock availability for system use. Enable the clock by one of the following settings: • USB_CLK_RECOVER_IRC_EN[IRC_EN]=1 or • MCG operating in an external clocking mode and MCG_C7[OSCSEL]=10 or MCG_C5[PLLCLKEN0]=1, or • SIM_SOPT2[PLLFLLSEL]=11 5.4.3.3 5.4.3.3.1 Oscillator electrical specifications Oscillator DC electrical specifications Table 57. Oscillator DC electrical specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 — 3.6 V IDDOSC IDDOSC Supply current — low-power mode (HGO=0) Notes 1 • 32 kHz — 500 — nA • 4 MHz — 200 — μA • 8 MHz (RANGE=01) — 300 — μA • 16 MHz — 950 — μA • 24 MHz — 1.2 — mA • 32 MHz — 1.5 — mA Supply current — high-gain mode (HGO=1) 1 • 32 kHz — 25 — μA • 4 MHz — 400 — μA • 8 MHz (RANGE=01) — 500 — μA • 16 MHz — 2.5 — mA — 3 — mA Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 83 NXP Semiconductors Electrical characteristics Table 57. Oscillator DC electrical specifications (continued) Symbol Description • 24 MHz Min. Typ. Max. Unit — 4 — mA Notes • 32 MHz Cx EXTAL load capacitance — — — 2, 3 Cy XTAL load capacitance — — — 2, 3 RF Feedback resistor — low-frequency, low-power mode (HGO=0) — — — MΩ Feedback resistor — low-frequency, high-gain mode (HGO=1) — 10 — MΩ Feedback resistor — high-frequency, lowpower mode (HGO=0) — — — MΩ Feedback resistor — high-frequency, high-gain mode (HGO=1) — 1 — MΩ Series resistor — low-frequency, low-power mode (HGO=0) — — — kΩ Series resistor — low-frequency, high-gain mode (HGO=1) — 200 — kΩ Series resistor — high-frequency, low-power mode (HGO=0) — — — kΩ — 0 — kΩ Peak-to-peak amplitude of oscillation (oscillator mode) — low-frequency, low-power mode (HGO=0) — 0.6 — V Peak-to-peak amplitude of oscillation (oscillator mode) — low-frequency, high-gain mode (HGO=1) — VDD — V Peak-to-peak amplitude of oscillation (oscillator mode) — high-frequency, low-power mode (HGO=0) — 0.6 — V Peak-to-peak amplitude of oscillation (oscillator mode) — high-frequency, high-gain mode (HGO=1) — VDD — V RS 2, 4 Series resistor — high-frequency, high-gain mode (HGO=1) 5 Vpp 1. 2. 3. 4. 5. VDD=3.3 V, Temperature =25 °C See crystal or resonator manufacturer's recommendation Cx and Cy can be provided by using either integrated capacitors or external components. When low-power mode is selected, RF is integrated and must not be attached externally. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any other device. 84 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 5.4.3.3.2 Symbol Oscillator frequency specifications Table 58. Oscillator frequency specifications Description Min. Typ. Max. Unit Oscillator crystal or resonator frequency — lowfrequency mode (MCG_C2[RANGE]=00) 32 — 40 kHz fosc_hi_1 Oscillator crystal or resonator frequency — high-frequency mode (low range) (MCG_C2[RANGE]=01) 3 — 8 MHz fosc_hi_2 Oscillator crystal or resonator frequency — high frequency mode (high range) (MCG_C2[RANGE]=1x) 8 — 32 MHz fec_extal Input clock frequency (external clock mode) — — 50 MHz tdc_extal Input clock duty cycle (external clock mode) 40 50 60 % Crystal startup time — 32 kHz low-frequency, low-power mode (HGO=0) — 750 — ms Crystal startup time — 32 kHz low-frequency, high-gain mode (HGO=1) — 250 — ms Crystal startup time — 8 MHz high-frequency (MCG_C2[RANGE]=01), low-power mode (HGO=0) — 0.6 — ms Crystal startup time — 8 MHz high-frequency (MCG_C2[RANGE]=01), high-gain mode (HGO=1) — 1 — ms fosc_lo tcst Notes 1, 2 3, 4 1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL. 2. When transitioning from FEI or FBI to FBE mode, restrict the frequency of the input clock so that, when it is divided by FRDIV, it remains within the limits of the DCO input clock frequency. 3. Proper PC board layout procedures must be followed to achieve specifications. 4. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register being set. 5.4.3.4 32 kHz oscillator electrical characteristics 5.4.3.4.1 32 kHz oscillator DC electrical specifications Table 59. 32kHz oscillator DC electrical specifications Symbol Description Min. VBAT Supply voltage Typ. Max. Unit 1.71 — 3.6 V Internal feedback resistor — 100 — MΩ Cpara Parasitical capacitance of EXTAL32 and XTAL32 — 5 7 pF Vpp1 Peak-to-peak amplitude of oscillation — 0.6 — V RF 1. When a crystal is being used with the 32 kHz oscillator, the EXTAL32 and XTAL32 pins should only be connected to required oscillator components and must not be connected to any other devices. KS22/KS20 Microcontroller, Rev. 3, 04/2016 85 NXP Semiconductors Electrical characteristics 5.4.3.4.2 Symbol fosc_lo tstart fec_extal32 32 kHz oscillator frequency specifications Table 60. 32 kHz oscillator frequency specifications Description Min. Typ. Max. Unit Oscillator crystal — 32.768 — kHz Crystal start-up time — 1000 — ms 1 Externally provided input clock frequency — 32.768 — kHz 2 700 — VBAT mV 2, 3 vec_extal32 Externally provided input clock amplitude Notes 1. Proper PC board layout procedures must be followed to achieve specifications. 2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The oscillator remains enabled and XTAL32 must be left unconnected. 3. The parameter specified is a peak-to-peak value and VIH and VIL specifications do not apply. The voltage of the applied clock must be within the range of VSS to VBAT. 5.4.4 Memories and memory interfaces 5.4.4.1 Flash electrical specifications This section describes the electrical characteristics of the flash memory module. 5.4.4.1.1 Flash timing specifications — program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 61. NVM program/erase timing specifications Symbol Description Min. Typ. Max. Unit Notes thvpgm4 Longword Program high-voltage time — 7.5 18 μs — thversscr Sector Erase high-voltage time — 13 113 ms 1 thversall Erase All high-voltage time — 104 904 ms 1 1. Maximum time based on expectations at cycling end-of-life. 5.4.4.1.2 Flash timing specifications — commands Table 62. Flash command timing specifications Symbol Description Min. Typ. Max. Unit Notes trd1sec2k Read 1s Section execution time (flash sector) — — 60 μs 1 tpgmchk Program Check execution time — — 45 μs 1 trdrsrc Read Resource execution time — — 30 μs 1 Table continues on the next page... 86 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 62. Flash command timing specifications (continued) Symbol Description Min. Typ. Max. Unit Notes tpgm4 Program Longword execution time — 65 145 μs — tersscr Erase Flash Sector execution time — 14 114 ms 2 trd1all Read 1s All Blocks execution time — — 1.8 ms 1 trdonce Read Once execution time — — 30 μs 1 Program Once execution time — 100 — μs — tersall Erase All Blocks execution time — 175 1300 ms 2 tvfykey Verify Backdoor Access Key execution time — — 30 μs 1 tpgmonce 1. Assumes 25 MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. 5.4.4.1.3 Flash high voltage current behaviors Table 63. Flash high voltage current behaviors Symbol Description IDD_PGM IDD_ERS 5.4.4.1.4 Symbol Min. Typ. Max. Unit Average current adder during high voltage flash programming operation — 2.5 6.0 mA Average current adder during high voltage flash erase operation — 1.5 4.0 mA Reliability specifications Table 64. NVM reliability specifications Description Min. Typ.1 Max. Unit Notes Program Flash tnvmretp10k Data retention after up to 10 K cycles 5 50 — years — tnvmretp1k Data retention after up to 1 K cycles 20 100 — years — nnvmcycp Cycling endurance 10 K 50 K — cycles 2 1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant 25 °C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering Bulletin EB619. 2. Cycling endurance represents number of program/erase cycles at –40 °C ≤ Tj ≤ 125 °C. 5.4.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. KS22/KS20 Microcontroller, Rev. 3, 04/2016 87 NXP Semiconductors Electrical characteristics 5.4.6 Analog 5.4.6.1 ADC electrical specifications The 16-bit accuracy specifications listed in Table 65 and Table 66 are achievable on the differential pins ADCx_DPx, ADCx_DMx. All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. 5.4.6.1.1 16-bit ADC operating conditions Table 65. 16-bit ADC operating conditions Symbol Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 — 3.6 V ΔVDDA Supply voltage Delta to VDD (VDD – VDDA) -100 0 +100 mV 2 ΔVSSA Ground voltage Delta to VSS (VSS – VSSA) -100 0 +100 mV 2 VREFH ADC reference voltage high 1.13 VDDA VDDA V VREFL ADC reference voltage low VSSA VSSA VSSA V VADIN Input voltage • 16-bit differential mode VREFL — 31/32 * VREFH V • All other modes VREFL — • 16-bit mode — 8 10 • 8-bit / 10-bit / 12-bit modes — 4 5 — 2 5 CADIN RADIN RAS Input capacitance Input series resistance Notes VREFH pF kΩ Analog source resistance (external) 13-bit / 12-bit modes fADCK < 4 MHz — — 5 kΩ fADCK ADC conversion clock frequency ≤ 13-bit mode 1.0 — 24.0 MHz 4 fADCK ADC conversion clock frequency 16-bit mode 2.0 — 12.0 MHz 4 Crate ADC conversion rate ≤ 13-bit modes No ADC hardware averaging 3 5 20 — 1200 Ksps Continuous conversions enabled, subsequent conversion time Crate ADC conversion rate 88 NXP Semiconductors 16-bit mode No ADC hardware averaging 5 37 — 461 Ksps KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 65. 16-bit ADC operating conditions Symbol Description Conditions Min. Typ.1 Max. Unit Notes Continuous conversions enabled, subsequent conversion time 1. Typical values assume VDDA = 3.0 V, Temp = 25 °C, fADCK = 1.0 MHz, unless otherwise stated. Typical values are for reference only, and are not tested in production. 2. DC potential difference. 3. This resistance is external to MCU. To achieve the best results, the analog source resistance must be kept as low as possible. The results in this data sheet were derived from a system that had < 8 Ω analog source resistance. The RAS/CAS time constant should be kept to < 1 ns. 4. To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set and CFG1[ADLPC] must be clear. 5. For guidelines and examples of conversion rate calculation, download the ADC calculator tool. SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Pad leakage due to input protection ZAS RAS ADC SAR ENGINE RADIN VADIN CAS VAS RADIN INPUT PIN RADIN INPUT PIN RADIN INPUT PIN CADIN Figure 24. ADC input impedance equivalency diagram 5.4.6.1.2 16-bit ADC electrical characteristics Table 66. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Symbol Description Conditions1 IDDA_ADC Supply current fADACK ADC asynchronous clock source • ADLPC = 1, ADHSC = 0 Min. Typ.2 Max. Unit Notes 0.215 — 1.7 mA 3 1.2 2.4 3.9 MHz tADACK = 1/ fADACK Table continues on the next page... KS22/KS20 Microcontroller, Rev. 3, 04/2016 89 NXP Semiconductors Electrical characteristics Table 66. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol Description Sample Time TUE DNL INL EFS EQ ENOB Conditions1 Min. Typ.2 Max. Unit • ADLPC = 1, ADHSC = 1 2.4 4.0 6.1 MHz • ADLPC = 0, ADHSC = 0 3.0 5.2 7.3 MHz • ADLPC = 0, ADHSC = 1 4.4 6.2 9.5 MHz LSB4 5 LSB4 5 LSB4 5 LSB4 VADIN = VDDA5 See Reference Manual chapter for sample times Total unadjusted error • 12-bit modes — ±4 ±6.8 • <12-bit modes — ±1.4 ±2.1 Differential nonlinearity • 12-bit modes — ±0.7 –1.1 to +1.9 • <12-bit modes — ±0.2 • 12-bit modes — ±1.0 • <12-bit modes — ±0.5 • 12-bit modes — –4 –5.4 • <12-bit modes — –1.4 –1.8 • 16-bit modes — –1 to 0 — • ≤13-bit modes — — ±0.5 Integral non-linearity Full-scale error Quantization error Effective number of bits Notes –0.3 to 0.5 –2.7 to +1.9 –0.7 to +0.5 LSB4 16-bit differential mode 6 • Avg = 32 12.8 14.5 • Avg = 4 11.9 13.8 — — bits bits 16-bit single-ended mode • Avg = 32 • Avg = 4 SINAD THD Signal-to-noise plus See ENOB distortion Total harmonic distortion 12.2 13.9 11.4 13.1 — — 6.02 × ENOB + 1.76 16-bit differential mode • Avg = 32 bits bits dB dB — -94 7 — dB 16-bit single-ended mode • Avg = 32 SFDR Spurious free dynamic range — -85 82 95 16-bit differential mode • Avg = 32 16-bit single-ended mode 78 — — dB — dB 7 90 • Avg = 32 Table continues on the next page... 90 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 66. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Conditions1 Symbol Description EIL Typ.2 Min. Input leakage error Max. IIn × RAS Unit Notes mV IIn = leakage current (refer to the MCU's voltage and current operating ratings) Temp sensor slope VTEMP25 Temp sensor voltage Across the full temperature range of the device 1.55 1.62 1.69 mV/°C 8 25 °C 706 716 726 mV 8 1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA 2. Typical values assume VDDA = 3.0 V, Temp = 25 °C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and ADC_CFG1[ADLPC] (low power). For lowest power operation, ADC_CFG1[ADLPC] must be set, the ADC_CFG2[ADHSC] bit must be clear with 1 MHz ADC conversion clock speed. 4. 1 LSB = (VREFH - VREFL)/2N 5. ADC conversion clock < 16 MHz, Max hardware averaging (AVGE = %1, AVGS = %11) 6. Input data is 100 Hz sine wave. ADC conversion clock < 12 MHz. 7. Input data is 1 kHz sine wave. ADC conversion clock < 12 MHz. 8. ADC conversion clock < 3 MHz Typical ADC 16-bit Differential ENOB vs ADC Clock 100Hz, 90% FS Sine Input 15.00 14.70 14.40 14.10 ENOB 13.80 13.50 13.20 12.90 12.60 Hardware Averaging Disabled Averaging of 4 samples Averaging of 8 samples Averaging of 32 samples 12.30 12.00 1 2 3 4 5 6 7 8 9 10 11 12 ADC Clock Frequency (MHz) Figure 25. Typical ENOB vs. ADC_CLK for 16-bit differential mode KS22/KS20 Microcontroller, Rev. 3, 04/2016 91 NXP Semiconductors Electrical characteristics Typical ADC 16-bit Single-Ended ENOB vs ADC Clock 100Hz, 90% FS Sine Input 14.00 13.75 13.50 13.25 13.00 ENOB 12.75 12.50 12.25 12.00 11.75 11.50 11.25 11.00 Averaging of 4 samples Averaging of 32 samples 1 2 3 4 5 6 7 8 9 10 11 12 ADC Clock Frequency (MHz) Figure 26. Typical ENOB vs. ADC_CLK for 16-bit single-ended mode 5.4.6.2 CMP and 6-bit DAC electrical specifications Table 67. Comparator and 6-bit DAC electrical specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 — 3.6 V IDDHS Supply current, High-speed mode (EN=1, PMODE=1) — — 200 μA IDDLS Supply current, low-speed mode (EN=1, PMODE=0) — — 20 μA VAIN Analog input voltage VSS – 0.3 — VDD V VAIO Analog input offset voltage — — 20 mV • CR0[HYSTCTR] = 00 — 5 — mV • CR0[HYSTCTR] = 01 — 10 — mV • CR0[HYSTCTR] = 10 — 20 — mV • CR0[HYSTCTR] = 11 — 30 — mV VH Analog comparator hysteresis1 VCMPOh Output high VDD – 0.5 — — V VCMPOl Output low — — 0.5 V tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 80 250 600 ns — — 40 μs — 7 — μA Analog comparator initialization IDAC6b delay2 6-bit DAC current adder (enabled) INL 6-bit DAC integral non-linearity –0.5 — 0.5 LSB3 DNL 6-bit DAC differential non-linearity –0.3 — 0.3 LSB 1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD–0.6 V. 92 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to CMP_DACCR[DACEN], CMP_DACCR[VRSEL], CMP_DACCR[VOSEL], CMP_MUXCR[PSEL], and CMP_MUXCR[MSEL]) and the comparator output settling to a stable level. 3. 1 LSB = Vreference/64 0.08 0.07 CMP Hystereris (V) 0.06 HYSTCTR Setting 0.05 00 0.04 01 10 11 0.03 0.02 0.01 0 0.1 0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1 Vin level (V) Figure 27. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 0) KS22/KS20 Microcontroller, Rev. 3, 04/2016 93 NXP Semiconductors Electrical characteristics 0.18 0.16 0.14 CMP Hysteresis (V) 0.12 HYSTCTR Setting 0.1 00 01 10 11 0.08 0.06 0.04 0.02 0 0.1 0.4 0.7 1 1.3 1.6 1.9 Vin level (V) 2.2 2.5 2.8 3.1 Figure 28. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 1) 5.4.6.3 5.4.6.3.1 Symbol 12-bit DAC electrical characteristics 12-bit DAC operating requirements Table 68. 12-bit DAC operating requirements Desciption Min. Max. Unit VDDA Supply voltage 1.71 3.6 V VDACR Reference voltage 1.13 3.6 V 1 2 CL Output load capacitance — 100 pF IL Output load current — 1 mA Notes 1. The DAC reference can be selected to be VDDA or VREFH. 2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC 94 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 5.4.6.3.2 Symbol 12-bit DAC operating behaviors Table 69. 12-bit DAC operating behaviors Description IDDA_DACL Supply current — low-power mode Min. Typ. Max. Unit — — 330 μA — — 1200 μA Notes P IDDA_DACH Supply current — high-speed mode P tDACLP Full-scale settling time (0x080 to 0xF7F) — low-power mode — 100 200 μs 1 tDACHP Full-scale settling time (0x080 to 0xF7F) — high-power mode — 15 30 μs 1 — 0.7 1 μs 1 tCCDACLP Code-to-code settling time (0xBF8 to 0xC08) — low-power mode and highspeed mode Vdacoutl DAC output voltage range low — highspeed mode, no load, DAC set to 0x000 — — 100 mV Vdacouth DAC output voltage range high — highspeed mode, no load, DAC set to 0xFFF VDACR −100 — VDACR mV INL Integral non-linearity error — high speed mode — — ±8 LSB 2 DNL Differential non-linearity error — VDACR > 2 V — — ±1 LSB 3 DNL Differential non-linearity error — VDACR = VREF_OUT — — ±1 LSB 4 — ±0.4 ±0.8 %FSR 5 Gain error — ±0.1 ±0.6 %FSR 5 Power supply rejection ratio, VDDA ≥ 2.4 V 60 — 90 dB TCO Temperature coefficient offset voltage — 3.7 — μV/C TGE Temperature coefficient gain error — 0.000421 — %FSR/C Rop Output resistance (load = 3 kΩ) — — 250 Ω SR Slew rate -80h→ F7Fh→ 80h VOFFSET Offset error EG PSRR BW 1. 2. 3. 4. 5. 6. 6 V/μs • High power (SPHP) 1.2 1.7 — • Low power (SPLP) 0.05 0.12 — 3dB bandwidth kHz • High power (SPHP) 550 — — • Low power (SPLP) 40 — — Settling within ±1 LSB The INL is measured for 0 + 100 mV to VDACR −100 mV The DNL is measured for 0 + 100 mV to VDACR −100 mV The DNL is measured for 0 + 100 mV to VDACR −100 mV with VDDA > 2.4 V Calculated by a best fit curve from VSS + 100 mV to VDACR − 100 mV VDDA = 3.0 V, reference select set for VDDA (DACx_CO:DACRFS = 1), high power mode (DACx_C0:LPEN = 0), DAC set to 0x800, temperature range is across the full range of the device KS22/KS20 Microcontroller, Rev. 3, 04/2016 95 NXP Semiconductors Electrical characteristics 8 6 4 DAC12 INL (LSB) 2 0 -2 -4 -6 -8 0 500 1000 1500 2000 2500 3000 3500 4000 Digital Code Figure 29. Typical INL error vs. digital code 96 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics 1.499 DAC12 Mid Level Code Voltage 1.4985 1.498 1.4975 1.497 1.4965 1.496 -40 55 25 85 105 125 Temperature °C Figure 30. Offset at half scale vs. temperature 5.4.7 Timers See General switching specifications. 5.4.8 Communication interfaces 5.4.8.1 USB electrical specifications The USB electricals for the USB On-the-Go module conform to the standards documented by the Universal Serial Bus Implementers Forum. For the most up-todate standards, visit usb.org. KS22/KS20 Microcontroller, Rev. 3, 04/2016 97 NXP Semiconductors Electrical characteristics NOTE The MCGPLLCLK meets the USB jitter and signaling rate specifications for certification with the use of an external clock/crystal for both Device and Host modes. The MCGFLLCLK does not meet the USB jitter or signaling rate specifications for certification. The IRC48M meets the USB jitter and signaling rate specifications for certification in Device mode when the USB clock recovery mode is enabled. It does not meet the USB signaling rate specifications for certification in Host mode operation. 5.4.8.2 DSPI switching specifications (limited voltage range) The Deserial Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. Refer to the SPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 70. Master mode DSPI timing (limited voltage range) Num Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation — 30 MHz 2 x tBUS — ns Notes DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) − 2 (tSCK/2) + 2 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) − 2 — ns 1 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) − 2 — ns 2 DS5 DSPI_SCK to DSPI_SOUT valid — 8.5 ns DS6 DSPI_SCK to DSPI_SOUT invalid -2 — ns DS7 DSPI_SIN to DSPI_SCK input setup 16.2 — ns DS8 DSPI_SCK to DSPI_SIN input hold 0 — ns 1. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 2. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. 98 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics DSPI_PCSn DS3 DS4 DS8 DS7 (CPOL=0) DS1 DS2 DSPI_SCK DSPI_SIN Data First data DSPI_SOUT Last data DS5 DS6 First data Data Last data Figure 31. DSPI classic SPI timing — master mode Table 71. Slave mode DSPI timing (limited voltage range) Num Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation — 15 MHz 4 x tBUS — ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid — 21.4 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 — ns DS13 DSPI_SIN to DSPI_SCK input setup 2.6 — ns DS14 DSPI_SCK to DSPI_SIN input hold 7 — ns DS15 DSPI_SS active to DSPI_SOUT driven — 17 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven — 17 ns (tSCK/2) − 2 (tSCK/2) + 2 Notes 1 ns 1. The maximum operating frequency is measured with noncontinuous CS and SCK. When DSPI is configured with continuous CS and SCK, the SPI clock must not be greater than 1/6 of the bus clock. For example, when the bus clock is 60 MHz, the SPI clock must not be greater than 10 MHz. DSPI_SS DS10 DS9 DSPI_SCK (CPOL=0) DS15 DSPI_SOUT DS12 First data DS13 DSPI_SIN DS16 DS11 Data Last data DS14 First data Data Last data Figure 32. DSPI classic SPI timing — slave mode KS22/KS20 Microcontroller, Rev. 3, 04/2016 99 NXP Semiconductors Electrical characteristics 5.4.8.3 DSPI switching specifications (full voltage range) The Deserial Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provides DSPI timing characteristics for classic SPI timing modes. Refer to the SPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 72. Master mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit Notes 1.71 3.6 V 1 — 15 MHz 4 x tBUS — ns DSPI_SCK output high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) − 4 — ns 2 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) − 4 — ns 3 DS5 DSPI_SCK to DSPI_SOUT valid — 10 ns DS6 DSPI_SCK to DSPI_SOUT invalid -4.5 — ns DS7 DSPI_SIN to DSPI_SCK input setup 24.6 — ns DS8 DSPI_SCK to DSPI_SIN input hold 0 — ns DS1 DSPI_SCK output cycle time DS2 1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. 2. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 3. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. DSPI_PCSn DS3 DSPI_SCK (CPOL=0) DSPI_SIN DSPI_SOUT DS7 DS1 DS2 DS4 DS8 First data First data Data Last data DS5 DS6 Data Last data Figure 33. DSPI classic SPI timing — master mode 100 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics Table 73. Slave mode DSPI timing (full voltage range) Num Description Min. Max. Unit 1.71 3.6 V — 7.5 MHz 8 x tBUS — ns Operating voltage Frequency of operation DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns DS11 DSPI_SCK to DSPI_SOUT valid — 29.5 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 — ns DS13 DSPI_SIN to DSPI_SCK input setup 3.2 — ns DS14 DSPI_SCK to DSPI_SIN input hold 7 — ns DS15 DSPI_SS active to DSPI_SOUT driven — 25 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven — 25 ns DSPI_SS DS10 DS9 DSPI_SCK DS15 (CPOL=0) DS12 DSPI_SOUT First data DS13 DS16 DS11 Last data Data DS14 DSPI_SIN First data Data Last data Figure 34. DSPI classic SPI timing — slave mode 5.4.8.4 Symbol fSCL LPI2C Table 74. LPI2C specifications Description SCL clock frequency Min. Max. Unit Notes Standard mode (Sm) 0 100 kHz 1 Fast mode (Fm) 0 400 1, 2 Fast mode Plus (Fm+) 0 1000 1, 3 Ultra Fast mode (UFm) 0 5000 1, 4 High speed mode (Hs-mode) 0 3400 1, 5 1. See General switching specifications, measured at room temperature. 2. Measured with the maximum bus loading of 400pF at 3.3V VDD with pull-up Rp = 220Ω , and at 1.8V VDD with Rp = 880Ω. For all other cases, select appropriate Rp per I2C Bus Specification and the pin drive capability. 3. Fm+ is only supported on high drive pin with high drive enabled. It is measured with the maximum bus loading of 400pF at 3.3V VDD with Rp = 220Ω. For all other cases, select appropriate Rp per I2C Bus Specification and the pin drive capability. KS22/KS20 Microcontroller, Rev. 3, 04/2016 101 NXP Semiconductors Electrical characteristics 4. UFm is only supported on high drive pin with high drive enabled and push-pull output only mode. It is measured at 3.3V VDD with the maximum bus loading of 400pF. For 1.8V VDD, the maximum speed is 4Mbps. 5. Hs-mode is only supported in slave mode and on the high drive pins with high drive enabled. 5.4.8.5 UART switching specifications See General switching specifications. 5.4.8.6 I2S/SAI switching specifications This section provides the AC timing for the I2S/SAI module in master mode (clocks are driven) and slave mode (clocks are input). All timing is given for noninverted serial clock polarity (TCR2[BCP] is 0, RCR2[BCP] is 0) and a noninverted frame sync (TCR4[FSP] is 0, RCR4[FSP] is 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the bit clock signal (BCLK) and/or the frame sync (FS) signal shown in the following figures. 5.4.8.6.1 Normal Run, Wait and Stop mode performance over a limited operating voltage range This section provides the operating performance over a limited operating voltage for the device in Normal Run, Wait and Stop modes. Table 75. I2S/SAI master mode timing in Normal Run, Wait and Stop modes (limited voltage range) Num. Characteristic Min. Max. Unit Operating voltage 2.7 3.6 V S1 I2S_MCLK cycle time 40 — ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 80 — ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid — 15 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid 0 — ns S7 I2S_TX_BCLK to I2S_TXD valid — 15 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 — ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 18 — ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 — ns 102 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S6 S5 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 35. I2S/SAI timing — master modes Table 76. I2S/SAI slave mode timing in Normal Run, Wait and Stop modes (limited voltage range) Num. Characteristic Min. Max. Unit Operating voltage 2.7 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 80 — ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 4.5 — ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 2 — ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid — 20 ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 — ns S17 I2S_RXD setup before I2S_RX_BCLK 4.5 — ns S18 I2S_RXD hold after I2S_RX_BCLK 2 — ns — 25 ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear KS22/KS20 Microcontroller, Rev. 3, 04/2016 103 NXP Semiconductors Electrical characteristics S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 36. I2S/SAI timing — slave modes 5.4.8.6.2 Normal Run, Wait and Stop mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in Normal Run, Wait and Stop modes. Table 77. I2S/SAI master mode timing in Normal Run, Wait and Stop modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 40 — ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 80 — ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid — 15 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid -1.0 — ns S7 I2S_TX_BCLK to I2S_TXD valid — 15 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 — ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 27 — ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 — ns 104 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S6 S5 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 37. I2S/SAI timing — master modes Table 78. I2S/SAI slave mode timing in Normal Run, Wait and Stop modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 80 — ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 5.8 — ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 2 — ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid — 28.5 ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 — ns S17 I2S_RXD setup before I2S_RX_BCLK 5.8 — ns S18 I2S_RXD hold after I2S_RX_BCLK 2 — ns — 26.3 ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear KS22/KS20 Microcontroller, Rev. 3, 04/2016 105 NXP Semiconductors Electrical characteristics S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 38. I2S/SAI timing — slave modes 5.4.8.6.3 VLPR, VLPW, and VLPS mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in VLPR, VLPW, and VLPS modes. Table 79. I2S/SAI master mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 62.5 — ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 250 — ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid — 45 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid -1 — ns S7 I2S_TX_BCLK to I2S_TXD valid — 45 ns S8 I2S_TX_BCLK to I2S_TXD invalid — ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK — ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 — ns 106 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Electrical characteristics S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S6 S5 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 39. I2S/SAI timing — master modes Table 80. I2S/SAI slave mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 250 — ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 30 — ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 7 — ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid — S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 — ns S17 I2S_RXD setup before I2S_RX_BCLK 30 — ns S18 I2S_RXD hold after I2S_RX_BCLK 4 — ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 — 72 ns ns 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear KS22/KS20 Microcontroller, Rev. 3, 04/2016 107 NXP Semiconductors Design considerations S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 40. I2S/SAI timing — slave modes 6 Design considerations 6.1 Hardware design considerations This device contains protective circuitry to guard against damage due to high static voltage or electric fields. However, take normal precautions to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. 6.1.1 Printed circuit board recommendations • Place connectors or cables on one edge of the board and do not place digital circuits between connectors. • Drivers and filters for I/O functions must be placed as close to the connectors as possible. Connect TVS devices at the connector to a good ground. Connect filter capacitors at the connector to a good ground. • Physically isolate analog circuits from digital circuits if possible. • Place input filter capacitors as close to the MCU as possible. • For best EMC performance, route signals as transmission lines; use a ground plane directly under LQFP packages; and solder the exposed pad (EP) to ground directly under QFN packages. 108 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Design considerations 6.1.2 Power delivery system Consider the following items in the power delivery system: • Use a plane for ground. • Use a plane for MCU VDD supply if possible. • Always route ground first, as a plane or continuous surface, and never as sequential segments. • Route power next, as a plane or traces that are parallel to ground traces. • Place bulk capacitance, 10 μF or more, at the entrance of the power plane. • Place bypass capacitors for MCU power domain as close as possible to each VDD/VSS pair, including VDDA/VSSA and VREFH/VREFL. • The minimum bypass requirement is to place 0.1 μF capacitors positioned as near as possible to the package supply pins. • The USB_VDD voltage range is 3.0 V to 3.6 V. It is recommended to include a filter circuit with one bulk capacitor (no less than 2.2 μF) and one 0.1 μF capacitor at the USB_VDD pin to improve USB performance. 6.1.3 Analog design Each ADC input must have an RC filter as shown in the following figure. The maximum value of R must be RAS max if fast sampling and high resolution are required. The value of C must be chosen to ensure that the RC time constant is very small compared to the sample period. MCU 1 2 ADCx C 2 R 1 Input signal Figure 41. RC circuit for ADC input High voltage measurement circuits require voltage division, current limiting, and over-voltage protection as shown the following figure. The voltage divider formed by R1 – R4 must yield a voltage less than or equal to VREFH. The current must be limited to less than the injection current limit. Since the ADC pins do not have diodes to VDD, external clamp diodes must be included to protect against transient overvoltages. KS22/KS20 Microcontroller, Rev. 3, 04/2016 109 NXP Semiconductors 2 ADCx 1 1 Analog input R C 2 Design considerations D OSCILL EXTAL R1 R2 1 1 2 R3 R44 2 1 ADCx 3 1 MCU 2 C OSCILLAT OSCILLATOR BAT54SW EXTAL EXTAL XTAL 1 2 1 ADCx CRYST Cx VDD 2 2 C 1 2 6.1.4 Digital design 10k VDD MCU VDD 1 R 2 1 1 1 Figure 42. High voltage measurement with an ADC input CRYSTAL Analog input CRY 2 2 R5 2 1 RF 1 1 High voltage input 2 3 1 1 MCU VDD OSCILLATOR 10k Ensure that all I/O pins cannot get pulled above VDD (Max I/O is VDD+0.3V). SWD_DIO 1 2 C 3 5 7 MCU9 EXTAL SWD_CLK 4 EXTAL XTAL RESET_b 1 1 RF 2 1 2 1 2 6 RESET_b CAUTION 8 1 2 RESET_b 10 0.1uF VDD Do not provide power to I/O pins prior to VDD, especially the 0.1uF RF HDR_5X2 RESET_b pin. 1 OSCILLAT 2 J1 1 CRYSTAL The RESET_b pin is an open-drain I/O pin that has an internal pullup resistor. An 2 C external RC circuit is recommended to filter noise as shown in the following figure. The resistor value must be in the range of 4.7 kΩ to 10 kΩ; the recommended VDD Supervisor Chip MCU BAT54SW capacitance value is 0.1 μF. The RESET_b pin also has a selectable digital filter to reject spurious noise. 1 Cx 2 2 1 1 2 R4 2 1 ADCx 3 1 2 2 • RESET_b 1pin 2 10k R5 RS 1 10k HDR_5X2 2 RESET_b RESET_b 1 MCU 10k NMI_b 1 2 10k SWD_DIO SWD_CLK RESET_bB RESET_b VDD 0.1uF 0.1uF 2 2 4 6 8 10 1 J1 RS 10k 2 Figure 43. Reset circuit Supervisor Chip MCU VDD 1 110 NXP Semiconductors 10k OUT 1 2 2 1 3 5 7 9 2 10k 2 2 1 1 Active high, MCU open drain VDD 1 1 OUT VDD 2 RESET_b KS22/KS20 Microcontroller, Rev. 3, 04/2016 2 CRYST 10k SWD_DIO SWD_CLK 10k 2 2 4 6 8 10 RESET_b 1 RESET_b RESET_b Design considerations 0.1uF When an external supervisor chip is connected to the RESET_b pin, a series 10k resistor must be used to avoid damaging the supervisor chip or the RESET_b pin, as shown in the following figure. The series resistor value (RS below) must be in the range of 100 Ω to 1 kΩ depending on the external reset chip drive strength. The supervisor chip must have an active high, open-drain output. 2 2 HDR_5X2 2 2 J1 1 1 3 5 7 9 4 3 OSCILLATOR Supervisor Chip EXTAL OSCILLATOR VDD EXTAL XTAL OSCILLATOR MCU XTAL EXTAL XTAL 1 MCU XTAL EXTAL 1 2 1 2 reset chip Figure 44. Reset signal connection to external RF RF RS XTAL 1 2 RF RS RS 2 Do not add a pull-down resistor or capacitor on the NMI_b pin, because a low 1 2 1 2 level on this pin will trigger non-maskable interrupt.1 When this pin is enabled as CRYSTAL CRYSTAL the NMI function, an external pull-up resistor Cy in the following Cx (10 kΩ) as shown figure is recommended for robustness. RESONATOR 2 2 1 2 3 1 2 DCx 2 2 2 EXTAL XTAL OSCILLATOR 1 • NMI pin OSCILLATOR 1 MCU RESET_b 1 EXTAL RESONATOR 2 OSCILLATOR Cy 0.1uF 2 RS 3 1 1 Active high, open drain 1 1 2 2 CRYSTAL Cx 1 OUT 1 10k CRYSTAL DCx 2 2 1 If the NMI_b pin is used as an I/O pin, the non-maskable interrupt handler is required to disable the NMI function by remapping to another function. The NMI function is disabled by programming the FOPT[NMI_DIS] bit to zero. MCU MCU VDD 1 1 VDD 10k RESET_b NMI_b 1 2 2 10k 2 0.1uF • Debug interface MCU VDD 1 KS22/KS20 Microcontroller, Rev. 3, 04/2016 2 1 111 NXP Semiconductors 10k 2 Figure 45. NMI pin biasing RESET_b Design considerations 1 R1 MCU VDD 2 2 2 1 3 1 R2 R5 This MCU uses the standard ARM SWD interface protocol as shown in the 1 2 1 2 ADCx High voltage input following figure. While pull-up or pull-downR4 resistors are not required (SWD_DIO 2 R3 C has an internal pull-up and SWD_CLK has an1internal pull-down), external 10 kΩ 1 2 pull resistors are recommended for system robustness. The RESET_b pin BAT54SW recommendations mentioned above must also be considered. VDD 2 4 6 8 10 10k SWD_DIO SWD_CLK 2 J1 RESET_b RESET_b 1 1 3 5 7 9 RESET_b 0.1uF 1 2 0.1uF 1 1 1 C 2 10k VDD MCU VDD 2 HDR_5X2 2 10k Figure 46. SWD debug interface Supervisor Chip MCU VDD 1 • Low leakage stop mode wakeup OUT RS 0.1uF 2 • Unused pin Active high, open drain 1 2 Select low leakage wakeup pins (LLWU_Px) to wake the MCU from one of the10k low leakage stop modes (LLS/VLLSx). See the pinout table for pin selection. 1 2 Unused GPIO pins must be left floating (no electrical connections) with the MUX field of the pin’s PORTx_PCRn register equal to 0:0:0. This disables the digital input path to the MCU. B If the USB module is not used, leave the USB data pins (USB0_DP, USB0_DM) floating. Connect USB_VDD to ground through a 10 kΩ resistor if the USB module is not used. 6.1.5 Crystal oscillator When using an external crystal or ceramic resonator as the frequency reference for the MCU clock system, refer to the following table and diagrams. The feedback resistor, RF, is incorporated internally with the low power oscillators. An external feedback is required when using high gain (HGO=1) mode. A 112 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 RESET_b Design considerations Internal load capacitors (Cx, Cy) are provided in the low frequency (32.786 kHz) mode. Use the SCxP bits in the OSC0_CR register to adjust the load capacitance for the crystal. Typically, values of 10pf to 16 pF are sufficient for 32.768 kHz crystals that have a 12.5 pF CL specification. The internal load capacitor selection must not be used for high frequency crystals and resonators. Table 81. External crystal/resonator connections Oscillator mode Oscillator mode Low frequency (32.768 kHz), low power Diagram 1 Low4 frequency (32.768 kHz), high gain Diagram 2, Diagram 4 High frequency (3-32 MHz), low power Diagram 3 High frequency (3-32 MHz), high gain Diagram 4 3 OSCILLATOR EXTAL EXTAL XTAL CRYSTAL ADCx 1 Cy 2 CRYSTAL Cx Figure 47. Crystal connection – Diagram 1 EXT CRYSTAL 2 Cx 2 1 1 2 XTAL 1 1 CRYSTAL ADCx 1 EXTAL XTAL 1 2 2 EXTAL 1 XTAL OSCILLATOR OSCILLATOR MCU OSCILLATOR Cy 2 MCU 2 4 3 C OSCILLATOR OSCILLATOR OSCILLATOR EXTAL OSCILLATOR XTAL EXTAL 2 1 1 RF RF RS OSCILLATOR EXTAL 1 1 2 CRYSTAL 2 1 RF CRYSTAL 0.1uF RESET_b RF CRYSTAL 10k 2 2 Cx 2 2 1 113 RS 1 3 NMI_b 1 RESET_b 1 2 2 RS 2 2 2 1 1 10k MCU XTAL 1 1 2 10k Microcontroller, KS22/KS20 Rev. 3, 04/2016 RF 10k VDDEXTAL XTAL 1 RS RESET_b 2 VDD 49. Crystal connection – Diagram 3 MCU OSCILLATOR OSCILLATOR EXTAL 2 RESONATOR 1 XTAL MCU EXTAL 1 1 Figure MCU OSCILLATOR Cy 1 VDD 1 VDD 3 2 Cx XTAL Cy 2 CRYSTAL EXTAL 2 2 1 1 OSCILLATOR XTAL 1 XTAL 2 Cy 1 OSCILLATOR EXTAL 2 3 2 4 2 CRYSTAL CRYSTAL Cx Cx Figure 48. Crystal connection – Diagram 2 C 12 1 CRYSTAL CRYSTAL 1 1 1 2 22 2 11 ADCx 2 ADCx RS RS 2 RS 2 RF EXT 2 1 2 RF 1 1 MCU 1 2 2 1 XTAL XTAL 1 MCU EXTAL XTAL 1 EXTAL RESONATOR NMI_b NXP Semiconductors Cy CRYSTAL 2 1 CRYSTAL Cy RESONATOR 2 2 Cx 3 2 1 1 2 1 1 Part identification OSCILLATOR EXTAL XTAL 2 1 RF 1 RF CRYSTAL 2 Cx 2 2 1 3 1 CRYSTAL 2 RS Cy RESONATOR 2 1 1 2 2 RS 2 RS 1 XTAL 2 RF EXTAL 2 1 1 XTAL 1 EXTAL OSCILLATOR 1 OSCILLATOR Figure 50. Crystal connection – Diagram 4 6.2 Software considerations VDD MCU 2 1 All Kinetis MCUs are supported by comprehensive Freescale and third-party hardware and software enablement solutions, which can reduce development costs and time to 10kFeatured software and tools are listed below. Visit http://www.freescale.com/ market. kinetis/sw for more information and supporting collateral. NMI_b Evaluation and Prototyping Hardware • MAPS Development Kit: http://www.freescale.com/KS IDEs for Kinetis MCUs • Kinetis Design Studio IDE: http://www.freescale.com/kds • Partner IDEs: http://www.freescale.com/kide Run-time Software • Kinetis SDK: http://www.freescale.com/ksdk • Kinetis Bootloader: http://www.freescale.com/kboot • ARM mbed Development Platform: http://www.freescale.com/mbed For all other partner-developed software and tools, visit http://www.freescale.com/ partners. 7 Part identification 114 NXP Semiconductors KS22/KS20 Microcontroller, Rev. 3, 04/2016 Part identification 7.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 7.2 Format Part numbers for this device have the following format: Q KS## A FFF R T PP CC N 7.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Table 82. Part number fields description Field Description Values Q Qualification status • M = Fully qualified, general market flow • P = Prequalification KS## Kinetis family • KS20 • KS22 A Key attribute • F = Cortex-M4 with DSP and FPU FFF Program flash memory size • 128 = 128 KB • 256 = 256 KB R Silicon revision • (Blank) = Main • A = Revision after main T Temperature range (°C) • V = –40 to 105 PP Package identifier • FT = 48 QFN (7 mm x 7 mm) • LH = 64 LQFP (10 mm x 10 mm) • LL = 100 LQFP (14 mm x 14 mm) CC Maximum CPU frequency (MHz) • 12 = 120 MHz N Packaging type • R = Tape and reel • (Blank) = Trays 7.4 Example This is an example part number: MKS22FN256VLL12 KS22/KS20 Microcontroller, Rev. 3, 04/2016 115 NXP Semiconductors Revision history 8 Revision history The following table provides a revision history for this document. Table 83. Revision history Rev. No. Date 2 12/2015 Initial public release. 3 04/2016 Added 48-pin QFN package. 116 NXP Semiconductors Substantial Changes KS22/KS20 Microcontroller, Rev. 3, 04/2016 How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Information in this document is provided solely to enable system and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: nxp.com/SalesTermsandConditions. NXP, the NXP logo, Freescale, the Freescale logo and Kinetis are trademarks of NXP B.V.All other product or service names are the property of their respective owners. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. ©2016 NXP B.V. Document Number KS22P100M120SF0 Revision 3, 04/2016