Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn LFCSP 8 X 8 X 0.85 56 Pb Free Molding Compound % of Compound 85 10 5 Weight (g) 5.57 E-02 6.55 E-03 3.27 E-03 6.55 E-02 PPM 328236 38616 19308 386160 Weight (g) 8.81 E-02 2.12 E-03 1.08 E-04 2.71 E-05 9.03 E-02 PPM 519307 12517 639 160 532622 Internal Leadframe Plating % of Plating Weight (g) 1.85 E-03 100 PPM 10933 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 External Leadframe Plating % of Plating Weight (g) 3.90 E-04 100 Weight (g) 1.02 E-03 PPM Si Chip % of Chip 100 Weight (g) 9.02 E-03 PPM 53210 Weight (g) 1.12 E-03 3.72 E-04 1.49 E-03 PPM Ag Filler Resin Subtotal Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. 2297 Au Die Attach % of Die Attach 75 25 Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. PPM Bond Wires % of Wire 99.99 Item Item Pb Cd Hg Cr+6 PBB PBDE 6012 6575 2192 8766 Package Totals Weight (g) PPM 1000000 1.70 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary AMK-CP-C Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn Pb Subtotal Au LFCSP 8 X 8 X 0.85 56 Sn/Pb Molding Compound % of Compound 85 10 5 Weight (g) 5.57 E-02 6.55 E-03 3.27 E-03 6.55 E-02 PPM 328236 38616 19308 386160 Weight (g) 8.81 E-02 2.12 E-03 1.08 E-04 2.71 E-05 9.03 E-02 PPM 519307 12517 639 160 532622 Internal Leadframe Plating % of Plating Weight (g) 1.85 E-03 100 PPM 10933 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 External Leadframe Plating % of Plating Weight (g) 3.31 E-04 85 5.84 E-05 15 3.90 E-04 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. PPM 1952 345 2297 Bond Wires % of Wire 99.99 Weight (g) 1.02 E-03 PPM % of Chip 100 Weight (g) 9.02 E-03 PPM 53210 Weight (g) 1.12 E-03 3.72 E-04 1.49 E-03 PPM 6012 Chip Si Item Ag Filler Resin Subtotal Die Attach % of Die Attach 75 25 6575 2192 8766 Package Totals Weight (g) PPM 1000000 1.70 E-01 AMK-CP-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary