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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
P
Zn
Subtotal
Ag
Item
Sn
LFCSP
6 X 6 X 0.85
40
Pb-free
Molding Compound
% of Compound
85
10
5
Weight (g)
2.90 E-02
3.41 E-03
1.71 E-03
3.41 E-02
PPM
326220
38379
19189
383788
Weight (g)
4.49 E-02
1.08 E-03
1.38 E-05
5.52 E-05
4.60 E-02
PPM
504669
12164
155
621
517610
Internal Leadframe Plating
% of Plating
Weight (g)
9.25 E-04
100
PPM
10403
External Leadframe Plating
Weight (g)
% of Plating
2.76 E-04
100
PPM
3108
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Au
Bond Wires
% of Wire
99.99
Weight (g)
9.36 E-04
PPM
10529
Si
Chip
% of Chip
100
Weight (g)
5.68 E-03
PPM
63923
Weight (g)
7.09 E-04
2.36 E-04
9.46 E-04
PPM
7979
2660
10639
Item
Ag Filler
Resin
Subtotal
Die Attach
% of Die Attach
75
25
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3060A & &196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3060A & &196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Package Totals
PPM
Weight (g)
1000000
8.89 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
AMK-CP-C
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
P
Zn
Subtotal
Ag
Item
Sn
Pb
Subtotal
Au
LFCSP
6 X 6 X0.85
40
Sn/Pb
Molding Compound
% of Compound
85
10
5
Weight (g)
2.90 E-02
3.41 E-03
1.71 E-03
3.41 E-02
PPM
326220
38379
19189
383788
Weight (g)
4.49 E-02
1.08 E-03
1.38 E-05
5.52 E-05
4.60 E-02
PPM
504669
12164
155
621
517610
Internal Leadframe Plating
% of Plating
Weight (g)
9.25 E-04
100
PPM
10403
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
External Leadframe Plating
Weight (g)
% of Plating
2.35 E-04
85
4.14 E-05
15
2.76 E-04
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3060A & &196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
3
EPA Method 3060A & &196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Not Detected EPA Method 3540C/3550C. GC/MS.
PPM
2642
466
3108
Bond Wires
% of Wire
99.99
Weight (g)
9.36 E-04
PPM
10529
% of Chip
100
Weight (g)
5.68 E-03
PPM
63923
Weight (g)
7.09 E-04
2.36 E-04
9.46 E-04
PPM
Chip
Si
Item
Ag Filler
Resin
Die Attach
% of Die Attach
75
25
7979
2660
10639
Package Totals
PPM
Weight (g)
1000000
8.89 E-02
AMK-CP-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary