VISHAY SI3588DV

Si3588DV
New Product
Vishay Siliconix
N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
N-Channel
20
P-Channel
–20
rDS(on) (W)
ID (A)
0.080 @ VGS = 4.5 V
3.0
0.100 @ VGS = 2.5 V
2.6
0.128 @ VGS = 1.8 V
2.3
0.145 @ VGS = –4.5 V
–2.2
0.200 @ VGS = –2.5 V
–1.8
0.300 @ VGS = –1.8 V
–1.5
D1
S2
TSOP-6
Top View
G1
1
6
D1
G2
3 mm
S2
2
5
S1
G2
3
4
D2
G1
S1
D2
N-Channel MOSFET
P-Channel MOSFET
2.85 mm
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
N-Channel
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
TA = 70_C
Pulsed Drain Current
ID
5 secs
Steady State
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
5 secs
20
Steady State
Unit
–20
V
"8
3.0
2.5
2.3
2.0
–2.2
–0.57
–1.8
–1.5
A
"8
IDM
Continuous Source Current (Diode Conduction)a
P-Channel
1.05
0.75
–1.05
–0.75
1.15
0.83
1.15
0.083
0.73
0.53
0.73
0.53
TJ, Tstg
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 5 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
93
110
130
150
90
90
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71332
S-02383—Rev. A, 23-Oct-00
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Si3588DV
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
VSD
VDS = VGS, ID = 250 mA
N-Ch
0.45
VDS = VGS, ID = –250 mA
P-Ch
–0.45
VDS = 0 V, VGS = "8 V
N-Ch
"100
VDS = 0 V, VGS = "8 V
P-Ch
"100
V
VDS = 16 V, VGS = 0 V
N-Ch
1
VDS = –16 V, VGS = 0 V
P-Ch
–1
VDS = 16 V, VGS = 0 V, TJ = 85_C
N-Ch
10
VDS = –16 V, VGS = 0 V, TJ = 85_C
P-Ch
VDS w 5 V, VGS = 4.5 V
N-Ch
5
VDS p –5 V, VGS = –4.5 V
P-Ch
–5
nA
m
mA
–10
A
VGS = 4.5 V, ID = 3 A
N-Ch
0.064
0.080
VGS = –4.5 V, ID = –2.2 A
P-Ch
0.115
0.145
VGS = 2.5 V, ID = 2.6 A
N-Ch
0.080
0.100
VGS = –2.5 V, ID = –1.8 A
P-Ch
0.163
0.200
VGS = 1.8 V, ID = 2.3 A
N-Ch
0.104
0.128
VGS = –1.8 V, ID = –1.0 A
P-Ch
0.240
0.300
VDS = 5 V, ID = 3 A
N-Ch
9
VDS = –5 V, ID = –2.2 A
P-Ch
5
IS = 1.05 A, VGS = 0 V
N-Ch
0.8
1.1
IS = –1.05 A, VGS = 0 V
P-Ch
–0.8
–1.1
N-Ch
5
7.5
7.5
W
S
V
Dynamicb
Total Gate Charge
Qg
N-Channel
VDS = 10 V, VGS = 4.5 V, ID = 3 A
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain
Reverse Recovery Time
Qgs
td(on)
td(off)
P-Ch
1.0
N-Ch
0.9
P-Ch
0.9
N-Ch
12
20
P-Ch
12
20
N-Channel
VDD = 10 V, RL = 10 W
ID ^ 1 A, VGEN = 4.5 V, RG = 6 W
N-Ch
30
50
P-Ch
29
50
P-Channel
VDD = –4 V, RL = 8 W
ID ^ –1 A, VGEN = –4.5 V, RG = 6 W
N-Ch
28
50
P-Ch
24
45
N-Ch
12
20
P-Ch
30
50
IF = 1.05 A, di/dt = 100 A/ms
N-Ch
20
40
IF = –1.05 A, di/dt = 100 A/ms
P-Ch
20
40
tf
trr
5
0.65
nC
P-Channel
VDS = –10 V, VGS = –4.5 V, ID = –2.2 A
Qgd
tr
P-Ch
N-Ch
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 71332
S-02383—Rev. A, 23-Oct-00
Si3588DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
N-CHANNEL
Output Characteristics
Transfer Characteristics
10
8
TC = –55_C
VGS = 4.5 thru 2 V
25_C
8
I D – Drain Current (A)
I D – Drain Current (A)
6
4
1.5 V
2
0
0
1
2
3
4
6
125_C
4
2
0
0.0
5
0.5
1.0
2.5
Capacitance
On-Resistance vs. Drain Current
0.5
600
500
0.4
C – Capacitance (pF)
r DS(on)– On-Resistance ( W )
2.0
VGS – Gate-to-Source Voltage (V)
VDS – Drain-to-Source Voltage (V)
0.3
0.2
VGS = 1.8 V
VGS = 2.5 V
0.1
400
Ciss
300
200
Coss
100
VGS = 4.5 V
0.0
Crss
0
0
2
4
6
8
10
0
4
8
12
16
20
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
On-Resistance vs. Junction Temperature
Gate Charge
5
1.8
1.6
VDS = 10 V
ID = 3.0 A
4
r DS(on)– On-Resistance ( W )
(Normalized)
V GS – Gate-to-Source Voltage (V)
1.5
3
2
1
0
0
1
2
3
Qg – Total Gate Charge (nC)
Document Number: 71332
S-02383—Rev. A, 23-Oct-00
4
5
VGS = 4.5 V
ID = 3.0 A
1.4
1.2
1.0
0.8
0.6
0.4
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (_C)
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Si3588DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
N-CHANNEL
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.30
10
r DS(on) – On-Resistance ( W )
I S – Source Current (A)
0.25
TJ = 150_C
1
TJ = 25_C
0.20
ID = 3.0 A
0.15
0.10
0.05
0.00
0.1
0.00
0.2
0.4
0.6
0.8
1.0
0
1.2
1
VSD – Source-to-Drain Voltage (V)
2
3
4
5
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power (Junction-to-Ambient)
0.2
8
ID = 250 mA
0.1
Power (W)
V GS(th) Variance (V)
6
–0.0
–0.1
4
–0.2
2
–0.3
–0.4
–50
0
–25
0
25
50
75
100
125
150
0.1
0.01
10
1
TJ – Temperature (_C)
30
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 130_C/W
3. TJM – TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
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Document Number: 71332
S-02383—Rev. A, 23-Oct-00
Si3588DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
N-CHANNEL
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
10–3
10–2
10–1
Square Wave Pulse Duration (sec)
1
10
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
P-CHANNEL
Output Characteristics
Transfer Characteristics
10
8
TC = –55_C
VGS = 4.5 thru 2.5 V
8
I D – Drain Current (A)
I D – Drain Current (A)
6
2V
4
2
1.5 V
0
0
1
2
3
4
25_C
6
125_C
4
2
0
0.0
5
VDS – Drain-to-Source Voltage (V)
0.5
1.0
On-Resistance vs. Drain Current
2.0
2.5
3.0
3.5
Capacitance
0.75
600
500
0.60
C – Capacitance (pF)
r DS(on)– On-Resistance ( W )
1.5
VGS – Gate-to-Source Voltage (V)
0.45
VGS = 1.8 V
0.30
VGS = 2.5 V
VGS = 4.5 V
0.15
Ciss
400
300
200
Coss
Crss
100
0.00
0
0
2
4
ID – Drain Current (A)
Document Number: 71332
S-02383—Rev. A, 23-Oct-00
6
8
0
4
8
12
16
20
VDS – Drain-to-Source Voltage (V)
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Si3588DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Gate Charge
VDS = 10 V
ID = 2.2 A
VGS = 4.5 V
ID = 2.2 A
1.6
4
3
2
1
0
0
On-Resistance vs. Junction Temperature
1.8
r DS(on)– On-Resistance ( W )
(Normalized)
V GS – Gate-to-Source Voltage (V)
5
P-CHANNEL
1
2
3
4
1.4
1.2
1.0
0.8
0.6
–50
5
–25
Qg – Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
25
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.5
r DS(on)– On-Resistance ( W )
10
I S – Source Current (A)
0
TJ – Junction Temperature (_C)
TJ = 150_C
1
TJ = 25_C
0.4
0.3
ID = 2.2 A
0.2
0.1
0.0
0.1
0.00
0.3
0.6
0.9
1.2
0
1.5
1
VSD – Source-to-Drain Voltage (V)
2
3
4
5
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power (Junction-to-Ambient)
0.4
8
0.3
Power (W)
V GS(th) Variance (V)
6
0.2
ID = 250 mA
0.1
4
0.0
2
–0.1
–0.2
–50
0
–25
0
25
50
75
TJ – Temperature (_C)
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6
100
125
150
0.01
0.1
1
10
30
Time (sec)
Document Number: 71332
S-02383—Rev. A, 23-Oct-00
Si3588DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
P-CHANNEL
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 130_C/W
3. TJM – TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
Document Number: 71332
S-02383—Rev. A, 23-Oct-00
10–3
10–2
10–1
Square Wave Pulse Duration (sec)
1
10
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