VISHAY SI4924DY

Si4924DY
Vishay Siliconix
Asymetrical Dual N-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
Channel 1
Channel-1
30
Channel 2
Channel-2
rDS(on) (W)
ID (A)
0.022 @ VGS = 10 V
6.3
0.030 @ VGS = 4.5 V
5.4
0.0105 @ VGS = 10 V
11.5
0.0145 @ VGS = 4.5 V
10
D1
SO-8
S1
1
8
D1
G1
2
7
D2
S2
3
6
D2
G2
4
5
D2
D2
G1
D2
G2
Top View
S1
Ordering Information: Si4924DY
Si4924DY-T1 (with Tape and Reel)
D2
S2
N-Channel 1
MOSFET
N-Channel 2
MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Channel-1
Parameter
Symbol
10 secs
Channel-2
Steady State
10 secs
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
ID
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
TA = 25_C
TA = 70_C
Operating Junction and Storage Temperature Range
IS
5.3
11.5
5.4
4.2
9.5
PD
30
1.3
8.6
6.9
A
40
0.9
2.2
1.15
1.4
1.0
2.4
1.25
0.9
0.64
1.5
0.80
TJ, Tstg
Unit
V
6.3
IDM
Steady State
W
_C
- 55 to 150
THERMAL RESISTANCE RATINGS
Channel-1
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady-State
Steady-State
RthJA
RthJC
Channel-2
Typ
Max
Typ
Max
72
90
43
53
100
125
82
100
51
63
25
30
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71163
S-03950—Rev. B, 26-May-03
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Si4924DY
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typa
Max
Unit
Static
Gate Threshold Voltage
Gate Body Leakage
Gate-Body
VGS(th)
GS( h)
VDS = VGS, ID = 250 mA
IGSS
VDS = 0 V,
V VGS = "20 V
VDS = 24 V,
V VGS = 0 V
Zero Gate Voltage Drain Current
IDSS
VDS = 24 V,
V VGS = 0 V,
V TJ = 85_C
On State Drain Currentb
On-State
Drain Source On-State
Drain-Source
On State Resistanceb
Forward Transconductanceb
Diode Forward Voltageb
ID(on)
D( )
rDS(on)
DS( )
gfs
f
VSD
VDS = 5 V,
V VGS = 10 V
Ch-1
Ch
1
0.8
Ch-2
0.8
V
Ch-1
Ch
1
"100
Ch-2
"100
Ch-1
Ch
1
1
Ch-2
1
Ch-1
Ch
1
15
mA
15
Ch-2
Ch-1
Ch
1
20
Ch-2
30
A
VGS = 10 V, ID = 6.3 A
Ch-1
Ch
1
0.018
0.022
VGS = 10 V, ID = 11.5 A
Ch-2
0.0088
0.0105
VGS = 4.5 V, ID = 5.4 A
Ch-1
Ch
1
0.024
0.030
VGS = 4.5 V, ID = 10 A
Ch-2
0.0115
0.0145
VDS = 15 V, ID = 6.3 A
Ch-1
Ch
1
17
VDS = 15 V, ID = 11.5 A
Ch-2
30
IS = 1.3 A, VGS = 0 V
Ch-1
Ch
1
0.7
1.1
Ch-2
0.72
1.1
Ch-1
Ch
1
8.0
12
Channel-1
VDS = 15 V, VGS = 5 V, ID = 6.3 A
Ch-2
25.5
35
Ch-1
Ch
1
1.75
Channel 2
Channel-2
VDS = 15 V, VGS = 5 V, ID = - 11.5 A
Ch-2
4.5
IS = 2.2 A, VGS = 0 V
nA
W
S
V
Dynamica
Total Gate Charge
Gate Source Charge
Gate-Source
Qg
Qgs
Gate Drain Charge
Gate-Drain
Qgdd
Gate Resistance
Rg
Turn On Delay Time
Turn-On
Rise Time
Turn Off Delay Time
Turn-Off
Fall Time
Source Drain Reverse Recovery Time
Source-Drain
td(on)
d( )
tr
td(off)
d( ff)
Channel-1
Ch
l1
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
Channel-2
Channel
2
VDD = 15 V, RL = 15 W
ID ^ 1 A,
A VGEN = 10 V,
V RG = 6 W
tf
trr
Ch-1
Ch
1
3.2
Ch-2
11.5
nC
Ch-1
Ch
1
1.5
6.1
Ch-2
0.5
2.4
Ch-1
Ch
1
10
20
Ch-2
15
30
Ch-1
Ch
1
5
10
Ch-2
11
20
Ch-1
Ch
1
26
50
Ch-2
58
100
Ch-1
Ch
1
8
16
Ch-2
53
100
IF = 1.3 A, di/dt = 100 A/ms
Ch-1
Ch
1
30
60
IF = 2.2 A, di/dt = 100 mA/ms
Ch-2
42
70
W
ns
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
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Document Number: 71163
S-03950—Rev. B, 26-May-03
Si4924DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
CHANNEL−1
Output Characteristics
Transfer Characteristics
30
30
VGS = 10 thru 4 V
24
I D - Drain Current (A)
I D - Drain Current (A)
24
3V
18
12
6
18
12
TC = 125_C
6
25_C
1V
- 55_C
2V
0
0
2
4
6
8
0
0.0
10
0.5
VDS - Drain-to-Source Voltage (V)
1.0
r
0.04
800
0.03
VGS = 4.5 V
VGS = 10 V
2.5
3.0
3.5
4.0
Ciss
600
400
Coss
Crss
200
0.01
0
0.00
0
6
12
18
24
0
30
6
ID - Drain Current (A)
12
18
24
30
VDS - Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
10
1.8
VDS = 15 V
ID = 6.3 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
2.0
Capacitance
1000
C - Capacitance (pF)
DS(on) - On-Resistance ( W )
On-Resistance vs. Drain Current
0.05
0.02
1.5
VGS - Gate-to-Source Voltage (V)
8
6
4
1.6
VGS = 10 V
ID = 6.3 A
1.4
1.2
1.0
0.8
2
0.6
0
0
3
6
9
Qg - Total Gate Charge (nC)
Document Number: 71163
S-03950—Rev. B, 26-May-03
12
15
0.4
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si4924DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
CHANNEL−1
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.10
DS(on) - On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
r
I S - Source Current (A)
40
0.08
0.06
0.04
ID = 6.3 A
0.02
0.00
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.6
100
80
ID = 250 mA
0.2
Power (W)
V GS(th) Variance (V)
0.4
- 0.0
- 0.2
60
40
- 0.4
- 0.6
20
- 0.8
- 1.0
- 50
0
- 25
0
25
50
75
100
TJ - Temperature (_C)
125
150
0.001
0.01
0.1
1
10
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 100_C/W
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
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10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71163
S-03950—Rev. B, 26-May-03
Si4924DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
CHANNEL−1
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
CHANNEL−2
Output Characteristics
Transfer Characteristics
50
50
VGS = 10 thru 4 V
40
I D - Drain Current (A)
I D - Drain Current (A)
40
3V
30
20
10
30
20
TC = 125_C
10
25_C
1, 2 V
- 55_C
0
0
0
2
4
6
8
10
0
VDS - Drain-to-Source Voltage (V)
1
2
3
4
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
0.020
3500
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
3000
0.016
VGS = 4.5 V
0.012
VGS = 10 V
0.008
2500
Ciss
2000
1500
Coss
1000
0.004
500
0.000
Crss
0
0
10
20
30
ID - Drain Current (A)
Document Number: 71163
S-03950—Rev. B, 26-May-03
40
50
0
5
10
15
20
25
30
VDS - Drain-to-Source Voltage (V)
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Si4924DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
CHANNEL−2
Gate Charge
On-Resistance vs. Junction Temperature
1.6
VDS = 15 V
ID = 11.5 A
8
6
4
2
1.2
1.0
0.8
0
0
10
20
30
40
VGS = 10 V
ID = 11.5 A
1.4
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
10
0.6
- 50
50
- 25
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
DS(on) - On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
r
I S - Source Current (A)
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.04
0.03
0.02
ID = 11.5 A
0.01
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.4
100
0.2
80
ID = 250 mA
- 0.0
Power (W)
V GS(th) Variance (V)
50
0.05
VSD - Source-to-Drain Voltage (V)
- 0.2
60
40
- 0.4
20
- 0.6
- 0.8
- 50
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6
25
TJ - Junction Temperature (_C)
50
1
0.0
0
0
- 25
0
25
50
75
100
TJ - Temperature (_C)
125
150
0.001
0.01
0.1
1
10
Time (sec)
Document Number: 71163
S-03950—Rev. B, 26-May-03
Si4924DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
CHANNEL−2
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 82_C/W
0.02
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
Document Number: 71163
S-03950—Rev. B, 26-May-03
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
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