VISHAY SI3552DV_05

Si3552DV
Vishay Siliconix
N- and P-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
VDS (V)
N-Channel
30
P Channel
P-Channel
- 30
rDS(on) (W)
ID (A)
0.105 @ VGS = 10 V
2.5
0.175 @ VGS = 4.5 V
2.0
0.200 @ VGS = - 10 V
- 1.8
0.360 @ VGS = - 4.5 V
- 1.2
TSOP-6
Top View
3 mm
D TrenchFETr Power MOSFET
D 100% Rg Tested
D1
G1
1
6
D1
S2
2
5
S1
G2
3
4
D2
S2
G2
G1
2.85 mm
Ordering Information: Si3552DV-T1
S1
D2
N-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
VDS
30
- 30
Gate-Source Voltage
VGS
"20
"20
2.5
- 1.8
a b
Continuous Drain Current (TJ = 150_C)a,
TA = 25_C
TA = 70_C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a, b
TA = 25_C
a b
Maximum Power Dissipationa,
TA = 70_C
Operating Junction and Storage Temperature Range
ID
2.0
- 1.2
IDM
8
-7
IS
1.05
- 1.05
1.15
PD
V
A
W
0.73
TJ, Tstg
Unit
- 55 to 150
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Lead
Symbol
t v 5 sec
Steady State
Steady State
RthJA
RthJL
Typical
Maximum
93
110
130
150
75
90
Unit
_C/W
C/W
Notes
a. Surface Mounted on FR4 Board.
b. t v 5 sec
Document Number: 70971
S-31725—Rev. B, 18-Aug-03
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Si3552DV
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate Body Leakage
Gate-Body
Zero Gate Voltage Drain Current
On State Drain Currenta
On-State
Drain Source On-State
Drain-Source
On State Resistancea
Forward Transconductancea
Diode Forward Voltagea
VGS(th)
IGSS
IDSS
ID(on)
D( )
rDS(on)
DS( )
gfs
f
VSD
VDS = VGS, ID = 250 mA
N-Ch
1.0
VDS = VGS, ID = - 250 mA
P-Ch
- 1.0
VDS = 0 V,
V VGS = "20 V
V
N-Ch
"100
P-Ch
"100
VDS = 24 V, VGS = 0 V
N-Ch
1
VDS = - 24 V, VGS = 0 V
P-Ch
-1
VDS = 24 V, VGS = 0 V, TJ = 55_C
N-Ch
5
VDS = - 24 V, VGS = 0 V, TJ = 55_C
P-Ch
VDS = 5 V, VGS = 10 V
N-Ch
5
VDS = - 5 V, VGS = - 10 V
P-Ch
-5
nA
mA
-5
A
VGS = 10 V, ID = 2.5 A
N-Ch
0.085
0.105
VGS = - 10 V, ID = - 1.8 A
P-Ch
0.165
0.200
VGS = 4.5 V, ID = 2.0 A
N-Ch
0.140
0.175
VGS = - 4.5 V, ID = - 1.2 A
P-Ch
0.298
0.360
VDS = 10 V, ID = 2.5 A
N-Ch
4.3
VDS = - 15 V, ID = - 1.8 A
P-Ch
2.4
IS = 1.05 A, VGS = 0 V
N-Ch
0.81
1.10
IS = - 1.05 A, VGS = 0 V
P-Ch
- 0.83
- 1.10
N-Ch
2.1
3.2
3.6
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate Source Charge
Gate-Source
Qgs
Gate Drain Charge
Gate-Drain
Qgdd
Gate Resistance
Rg
Turn On Delay Time
Turn-On
Rise Time
Turn Off Delay Time
Turn-Off
N-Channel
VDS = 15 V, VGS = 5 V, ID = 1.8 A
P-Channel
VDS = - 15 V
V, VGS = - 5 V,
V ID = - 1.8
18A
td(on)
d( )
tr
td(off)
d( ff)
Fall Time
tf
Source-Drain
Reverse Recovery Time
trr
P-Ch
2.4
N-Ch
0.7
P-Ch
0.9
N-Ch
0.7
P-Ch
0.8
nC
N-Ch
0.5
2.4
P-Ch
3
11
N-Ch
7
11
P-Ch
8
12
N-Channel
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
N-Ch
9
14
P-Ch
12
18
P-Channel
P
Channel
VDD = - 15
1 V,
V RL = 1
15 W
ID ^ - 1 A, VGEN = - 10 V, RG = 6 W
N-Ch
13
20
P-Ch
12
18
N-Ch
5
8
P-Ch
7
11
IF = 1.05 A, di/dt = 100 A/ms
N-Ch
35
60
IF = - 1.05 A, di/dt = 100 A/ms
P-Ch
30
60
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 70971
S-31725—Rev. B, 18-Aug-03
Si3552DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
10
NCHANNEL
Transfer Characteristics
10
TC = - 55_C
VGS = 10 thru 5 V
25_C
8
6
I D - Drain Current (A)
I D - Drain Current (A)
8
4V
4
2
3V
2V
0
6
125_C
4
2
0
0
1
2
3
4
5
0
1
VDS - Drain-to-Source Voltage (V)
C - Capacitance (pF)
r DS(on)- On-Resistance ( W )
250
0.20
VGS = 4.5 V
0.15
VGS = 10 V
0.10
4
5
6
25
30
Capacitance
300
0.05
Ciss
200
150
100
Coss
50
0.00
Crss
0
0
1
2
3
4
5
6
7
0
5
Gate Charge
10
1.8
1.6
r DS(on)- On-Resistance ( W )
(Normalized)
VDS = 15 V
ID = 1.8 A
8
6
4
2
0
0
1
2
3
Qg - Total Gate Charge (nC)
Document Number: 70971
S-31725—Rev. B, 18-Aug-03
10
15
20
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
V GS - Gate-to-Source Voltage (V)
3
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.25
2
4
1.4
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 2.5 A
1.2
1.0
0.8
0.6
0.4
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si3552DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
NCHANNEL
On-Resistance vs. Gate-to-Source Voltage
0.40
10
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
ID = 2 A
TJ = 150_C
1
TJ = 25_C
0.32
ID = 2.5 A
0.24
0.16
0.08
0.00
0.1
0.00
0.2
0.4
0.6
0.8
1.0
0
1.2
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power (Junction-to-Ambient)
0.4
8
ID = 250 mA
0.2
Power (W)
V GS(th) Variance (V)
6
- 0.0
- 0.2
4
- 0.4
2
- 0.6
- 0.8
- 50
- 25
0
25
50
75
100
125
0
150
0.1
0.01
10
1
TJ - Temperature (_C)
30
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 130_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (sec)
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Document Number: 70971
S-31725—Rev. B, 18-Aug-03
Si3552DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
1
Normalized Effective Transient
Thermal Impedance
NCHANNEL
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
10
Transfer Characteristics
8
6V
VGS = 10 thru 7 V
TC = - 55_C
8
6
I D - Drain Current (A)
I D - Drain Current (A)
PCHANNEL
5V
6
4
4V
2
2V
25_C
125_C
4
2
3V
0
0
0
1
2
3
4
0
5
1
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.6
3
C - Capacitance (pF)
240
0.4
VGS = 4.5 V
0.3
VGS = 10 V
0.2
0.1
0.0
2
3
4
5
ID - Drain Current (A)
Document Number: 70971
S-31725—Rev. B, 18-Aug-03
6
180
120
Coss
Crss
0
1
5
Ciss
60
0
4
Capacitance
300
0.5
r DS(on)- On-Resistance ( W )
2
VGS - Gate-to-Source Voltage (V)
6
7
0
6
12
18
24
30
VDS - Drain-to-Source Voltage (V)
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Si3552DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Gate Charge
VDS = 15 V
ID = 1.8 A
8
VGS = 10 V
ID = 1.8 A
1.6
6
4
2
0
0
On-Resistance vs. Junction Temperature
1.8
r DS(on)- On-Resistance ( W )
(Normalized)
V GS - Gate-to-Source Voltage (V)
10
PCHANNEL
1
2
3
4
1.4
1.2
1.0
0.8
0.6
0.4
- 50
5
- 25
Qg - Total Gate Charge (nC)
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.6
10
ID = 1.8 A
r DS(on)- On-Resistance ( W )
I S - Source Current (A)
0.5
TJ = 150_C
1
TJ = 25_C
ID = 1 A
0.4
0.3
0.2
0.1
0.0
0.1
0.00
0.3
0.6
0.9
1.2
0
1.5
2
VSD - Source-to-Drain Voltage (V)
Single Pulse Power (Junction-to-Ambient)
Power (W)
V GS(th) Variance (V)
ID = 250 mA
0.0
4
2
- 0.2
- 25
0
25
50
75
TJ - Temperature (_C)
6
10
6
0.2
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8
8
0.4
- 0.4
- 50
6
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
0.6
4
100
125
150
0
0.01
0.1
1
10
30
Time (sec)
Document Number: 70971
S-31725—Rev. B, 18-Aug-03
Si3552DV
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
PCHANNEL
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 130_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
100
10
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
Document Number: 70971
S-31725—Rev. B, 18-Aug-03
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
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Document Number: 91000
Revision: 08-Apr-05
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