Document No.001-91243 Rev. *B ECN # 4779540 Cypress Semiconductor Product Qualification Report QTP# 121306 VERSION*B May, 2015 HX3 Device Family LL65H-25ODR Technology, UMC Fab 12A CYUSB33XX HX3 USB 3.0 HUB FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 12 Document No.001-91243 Rev. *B ECN # 4779540 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 121306 Qualification of HX3 USB3.0 HUB Device 7C07500A in LL65H-25ODR Technology at UMC-12A. Sept.2013 134101 Qualification of HX3 USB3.0 HUB Device 7C07500A Rev.*A Silicon in LL65H-25ODR Technology at UMC-12A Dec. 2013 142202 Qualification of HX3 USB3.0 HUB Device 7C07500A Rev.*C Silicon in LL65H-25ODR Technology at UMC-12A Aug.2014 151408 Qualification of HX3 USB3.0 HUB Device 7C07500A Rev.*D Silicon in LL65H-25ODR Technology at UMC-12A May 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 12 Document No.001-91243 Rev. *B ECN # 4779540 PRODUCT DESCRIPTION Qualification Purpose: Qualify HX3 USB3.0 HUB Device 7C07500A in LL65H-25ODR Technology at UMC-12A Marketing Part #: CYUSB33XX Device Description: USB HUB Controllers Cypress Division: Cypress Semiconductor Corporation – Data Communication Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: M1 : CU 1.2KA , 100%CU M2 : CU 1.75KA, 100%CU M3 : CU 1.85KA, 100%CU M4 : CU 1.85KA, 100%CU M5 : CU 3.5KA, 100%CU M6 : CU 10.1KA, 100%CU SIN 0.07 um + Oxide 1.2 um + PSG 0.4 um + SIN 0.5 um 6 Metal Composition: Passivation Type and Thickness: Generic Process Technology/Design Rule (-drawn): 65nm Gate Oxide Material/Thickness (MOS): 20 - 55 Angstrom Name/Location of Die Fab (prime) Facility: UMC Fab 12A Die Fab Line ID/Wafer Process ID: LL65H-25ODR PACKAGE AVAILABILITY PACKAGE WIRE MATERIAL ASSEMBLY FACILITY SITE QTP NUMBER 68 QFN CuPd CML-RA 124702 68 & 88 QFN CuPd ASE-G 124301 Note: Package Qualification details upon request. 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Page 3 of 12 Document No.001-91243 Rev. *B ECN # 4779540 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT68C Package Outline, Type, or Name: Quad Flat No Lead (QFN) Mold Compound Name/Manufacturer: Sumitomo / GE7470 Mold Compound Flammability Rating: V-0 UL94 Mold Compound Alpha Emission Rate: <0.1 Oxygen Rating Index: >28% 54 Lead Frame Designation: RMP Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Dexter Die Attach Material: QMI 519 Bond Diagram Designation 001-84296 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / CuPd Thermal Resistance Theta JA C/W: 15.92 Package Cross Section Yes/No: Y Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA, ASE-G Note: Please contact a Cypress Representative for other package availability. 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Page 4 of 12 Document No.001-91243 Rev. *B ECN # 4779540 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Electrostatic Discharge Charge Device Model (ESD-CDM) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) 500V/1000V/1250V JESD22-C101 Electrostatic Discharge Human Body Model (ESD-HBM) 1100V/2200V/2700V/3000V/3300V JESD22, Method A114 P High Temperature Operating Life Dynamic Operating Condition, Vcc = 3.77V, 140C JESD22-A108 P Acoustic Microscopy Early Failure Rate High Temperature Operating Life Latent Failure Rate Pressure Cooker Test Static Latch-up Temperature Cycle Dynamic Operating Condition, Vcc = 3.77V, 140C JESD22-A108 JESD22-A102, 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) 85C,+/- 140mA 85C,+/- 200mA 125C,+/- 140mA JESD 78 MIL-STD-883, Method 1010, Condition C, -65C to 150C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 12 P P P P P P Document No.001-91243 Rev. *B ECN # 4779540 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 1,533 0 N/A N/A 0 PPM High Temperature Operating Life Long Term Failure Rate 98,400 DHRs 0 0.7 170 85 FIT** 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. K = Boltzmann’s constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T 2 is the junction temperature of the device at use conditions. **Insufficient samples to calculate FIT Rate. 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Page 6 of 12 Document No.001-91243 Rev. *B ECN # 4779540 Reliability Test Data QTP #: 121306 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA COMP 15 0 611321399 CML-RA COMP 9 0 611321399 CML-RA COMP 3 0 611321399 CML-RA COMP 3 0 COMP 3 0 COMP 8 0 COMP 3 0 1533 0 STRESS: ESD-CHARGE DEVICE MODEL(500V) CYUSB3304 (7CP07501A) LT68C 9313002 STRESS: ESD-CHARGE DEVICE MODEL(1,000V) CYUSB3304 (7CP07501A) LT68C 9313002 STRESS: ESD-CHARGE DEVICE MODEL(1,250V) CYUSB3304 (7CP07501A) LT68C 9313002 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (1,100V) CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CYUSB3304 (7CP07501A) STRESS: LT68C 9313002 611321399 CML-RA HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (140C, 3.77V, Vcc Max) CYUSB3304 (7CP07501B) LT68C 9313002 611317473 CML-RA 72 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (140C, 3.77V, Vcc Max) CYUSB3304 (7CP07501B) LT68C 9313002 611317473 CML-RA 96 164 0 CYUSB3304 (7CP07501B) LT68C 9313002 611317473 CML-RA 500 164 0 CYUSB3304 (7CP07501B) LT68C 9313002 611317473 CML-RA 600 164 0 STRESS: PRE/POST LFR PARAMATER ASSESSMENT CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA 0 30+2 0 CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA 600 30+2 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA 168 77 0 CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA 288 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 12 Document No.001-91243 Rev. *B ECN # 4779540 Reliability Test Data QTP #: 121306 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP TESTING (85C, 1.89/5.44/7.84V, +/-140mA) CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA COMP 3 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA 500 78 0 CYUSB3304 (7CP07501A) LT68C 9313002 611321399 CML-RA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 12 Document No.001-91243 Rev. *B ECN # 4779540 Reliability Test Data QTP #: 134101 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL(500V) CYUSB3304 (7CP07501A) LT68B 9314001 611341922 CML-RA COMP 9 0 CYUSB3314 (7CP07500A) LT68B 9314001 611341921 CML-RA COMP 9 0 STRESS: ESD-CHARGE DEVICE MODEL(1,000V) CYUSB3304 (7CP07501A) LT68B 9314001 611341922 CML-RA COMP 3 0 CYUSB3314 (7CP07500A) LT68B 9314001 611341921 CML-RA COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL(1,250V) CYUSB3304 (7CP07501A) LT68B 9314001 611341922 CML-RA COMP 3 0 CYUSB3314 (7CP07500A) LT68B 9314001 611341921 CML-RA COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (1,100V) CYUSB3304 (7CP07501A) LT68B 9314001 611342152 CML-RA COMP 3 0 CYUSB3314 (7CP07500A) LT68B 9314001 611341921 CML-RA COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CYUSB3304 (7CP07501A) LT68B 9314001 611342152 CML-RA COMP 8 0 CYUSB3314 (7CP07500A) LT68B 9314001 611341921 CML-RA COMP 8 0 COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CYUSB3304 (7CP07501A) LT68B 9314001 611342152 CML-RA STRESS: STATIC LATCH-UP TESTING (85C, 1.98V/5.44V/7.87V, +/-140mA) CYUSB3304 (7CP07501A) LT68B 9314001 611342152 CML-RA COMP 6 0 CYUSB3314 (7CP07500A) LT68B 9314001 611341921 CML-RA COMP 6 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 9 of 12 Document No.001-91243 Rev. *B ECN # 4779540 Reliability Test Data QTP #: 142202 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (1,100V) CYUSB3304 (7CP07501C) LT68B 9340014 611429262 CML-RA COMP 3 0 CYUSB3314 (7CP07500C) LT88B 9340014 611429086 G-Taiwan COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CYUSB3304 (7CP07501C) LT68B 9340014 611429262 CML-RA COMP 8 0 CYUSB3314 (7CP07500C) LT88B 9340014 611429086 G-Taiwan COMP 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,700V) CYUSB3304 (7CP07501C) LT68B 9340014 611429262 CML-RA COMP 3 0 CYUSB3314 (7CP07500C) LT88B 9340014 611429086 G-Taiwan COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,000V) CYUSB3304 (7CP07501C) LT68B 9340014 611429262 CML-RA COMP 3 0 CYUSB3314 (7CP07500C) LT88B 9340014 611429086 G-Taiwan COMP 3 0 COMP 6 0 COMP 3 0 3 0 STRESS: STATIC LATCH-UP TESTING (85C, 1.89V/5.44V/7.87V, +/-140mA) CYUSB3304 (7CP07501C) LT68B 9340014 611429262 CML-RA STRESS: STATIC LATCH-UP TESTING (85C, 1.89V/5.44V/7.87V, +/-200mA) CYUSB3304 (7CP07501C) LT68B 9340014 611429262 CML-RA STRESS: STATIC LATCH-UP TESTING (125C, 1.89V/5.44V/7.87V, +/-140mA) CYUSB3304 (7CP07501C) LT68B 9340014 611429262 CML-RA COMP LT68B 9314001 611342152 CML-RA COMP EQUIVALENT LT68B 9314001 611342152 CML-RA COMP EQUIVALENT YIELD: SORT CYUSB3304 (7CP07501A) YIELD: CLASS CYUSB3304 (7CP07501A) Company Confidential A printed copy of this document is considered uncontrolled. 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Page 10 of 12 Document No.001-91243 Rev. *B ECN # 4779540 Reliability Test Data QTP #: 151408 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (1,100V) CYUSB3304 (7CP07501D) LT68B 9509001 611515436 CML-RA COMP 3 0 COMP 8 0 COMP 3 0 COMP 3 0 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CYUSB3304 (7CP07501D) LT68B 9509001 611515436 CML-RA STRESS: STATIC LATCH-UP TESTING (85C, 1.89V/5.44V/7.87V, +/-140mA) CYUSB3304 (7CP07501D) LT68B 9509001 611515436 CML-RA STRESS: STATIC LATCH-UP TESTING (85C, 2.08V/5.99V/8.66V, +/-200mA) CYUSB3304 (7CP07501D) LT68B 9509001 611515436 CML-RA STRESS: STATIC LATCH-UP TESTING (125C, 1.89V/5.44V/7.87V, +/-140mA) CYUSB3304 (7CP07501D) LT68B 9509001 611515436 CML-RA COMP 3 LT68B 9509001 611515436 CML-RA COMP EQUIVALENT CYUSB3304 (7CP07501D) LT68B 9509001 611515436 CML-RA COMP EQUIVALENT CYUSB3314 (7CP07500D) LT88B 9509001 611515245 CML-RA COMP EQUIVALENT YIELD: SORT CYUSB3304 (7CP07501D) YIELD: CLASS Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 12 Document No.001-91243 Rev. *B ECN # 4779540 Document History Page Document Title: QTP#121306: HX3 DEVICE FAMILY (CYUSB33XX) LL65H-25ODR TECHNOLOGY,UMC FAB 12A QUALIFICATION REPORT 001-91243 Document Number: Rev. ECN Orig. of No. Change ** 4293693 JYF *A 4481271 JYF *B 4779540 JYF Description of Change Initial release. Updated QTP title page for template alignment. Added HX3 Rev.*C qualification data (QTP#142202). Updated reference for Reliability Director in QTP title page; Added HX3 Rev.*D qualification data (QTP#151408). Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 12