IRF IRGPC40UD2

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PD - 9.808A
IRGPC40UD2
UltraFast CoPack IGBT
INSULATED GATE BIPOLAR TRANSISTOR
WITH ULTRAFAST SOFT RECOVERY DIODE
Features
C
VCES = 600V
• Switching-loss rating includes all "tail" losses
TM
• HEXFRED soft ultrafast diodes
• Optimized for high operating frequency (over 5kHz)
See Fig. 1 for Current vs. Frequency curve
VCE(sat) ≤ 3.0V
G
@VGE = 15V, IC = 20A
E
n-channel
Description
Co-packaged IGBTs are a natural extension of International Rectifier's well
known IGBT line. They provide the convenience of an IGBT and an ultrafast
recovery diode in one package, resulting in substantial benefits to a host of
high-voltage, high-current, motor control, UPS and power supply applications.
TO-247AC
Absolute Maximum Ratings
Parameter
VCES
IC @ T C = 25°C
IC @ T C = 100°C
ICM
ILM
IF @ T C = 100°C
IFM
VGE
PD @ T C = 25°C
PD @ T C = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw.
Max.
Units
600
40
20
160
160
15
160
± 20
160
65
-55 to +150
V
A
V
W
°C
300 (0.063 in. (1.6mm) from case)
10 lbf•in (1.1 N•m)
Thermal Resistance
Parameter
RθJC
RθJC
RθCS
RθJA
Wt
Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount
Weight
C-717
To Order
Min.
Typ.
Max.
—
—
—
—
—
—
—
0.24
—
6 (0.21)
0.77
1.7
—
40
—
Units
°C/W
g (oz)
Revision 0
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IRGPC40UD2
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
VCE(on)
Parameter
Collector-to-Emitter Breakdown Voltage
Temp. Coeff. of Breakdown Voltage
Collector-to-Emitter Saturation Voltage
VGE(th)
∆VGE(th)/∆TJ
gfe
ICES
Gate Threshold Voltage
Temp. Coeff. of Threshold Voltage
Forward Transconductance
Zero Gate Voltage Collector Current
VFM
Diode Forward Voltage Drop
IGES
Gate-to-Emitter Leakage Current
V(BR)CES
∆V(BR)CES/∆TJ
Min. Typ. Max. Units
Conditions
600
—
—
V
VGE = 0V, I C = 250µA
— 0.63 —
V/°C VGE = 0V, IC = 1.0mA
—
2.2 3.0
IC = 20A
V GE = 15V
—
2.7
—
V
IC = 40A
See Fig. 2, 5
—
2.3
—
IC = 20A, T J = 150°C
3.0
—
5.5
VCE = VGE, IC = 250µA
—
-13
— mV/°C VCE = VGE, IC = 250µA
11
18
—
S
VCE = 100V, I C = 20A
—
—
250
µA
VGE = 0V, V CE = 600V
—
— 3500
VGE = 0V, V CE = 600V, T J = 150°C
—
1.3 1.7
V
IC = 15A
See Fig. 13
—
1.2 1.6
IC = 15A, T J = 150°C
—
— ±100 nA
VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Ets
LE
Cies
Coes
Cres
trr
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Current
Qrr
Diode Reverse Recovery Charge
di(rec)M/dt
Diode Peak Rate of Fall of Recovery
During t b
Notes:
Repetitive rating; V GE=20V, pulse width
limited by max. junction temperature.
( See fig. 20 )
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
51
8.9
20
63
54
160
120
0.65
1.25
1.90
65
53
280
210
3.0
13
1500
190
17
42
74
4.0
6.5
80
220
188
160
Max. Units
Conditions
67
IC = 20A
11
nC
VCC = 400V
33
See Fig. 8
—
TJ = 25°C
—
ns
IC = 20A, V CC = 480V
240
VGE = 15V, R G = 10Ω
200
Energy losses include "tail" and
—
diode reverse recovery.
—
mJ
See Fig. 9, 10, 11, 18
3.0
—
TJ = 150°C,
See Fig. 9, 10, 11, 18
—
ns
IC = 20A, V CC = 480V
—
VGE = 15V, R G = 10Ω
—
Energy losses include "tail" and
—
mJ
diode reverse recovery.
—
nH
Measured 5mm from package
—
VGE = 0V
—
pF
VCC = 30V
See Fig. 7
—
ƒ = 1.0MHz
60
ns
TJ = 25°C See Fig.
120
TJ = 125°C
14
I F = 15A
6.0
A
TJ = 25°C See Fig.
10
TJ = 125°C
15
V R = 200V
180
nC
TJ = 25°C See Fig.
600
TJ = 125°C
16
di/dt = 200A/µs
—
A/µs TJ = 25°C See Fig.
—
TJ = 125°C
17
VCC=80%(V CES), VGE=20V, L=10µH,
R G= 10Ω, ( See fig. 19 )
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
C-718
To Order
Pulse width 5.0µs,
single shot.
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IRGPC40UD2
Load Current (A)
30
D u ty c y c le : 5 0 %
TJ = 1 2 5 ° C
T s in k = 9 0 ° C
G a te d ri v e a s s p e c ifie d
T u rn -o n lo s s e s in c l u d e
e f fe c ts o f r e v e rs e re c o v e ry
P o w e r D is s ip a tio n = 3 5 W
20
6 0 % o f ra te d
v o lta g e
10
A
0
0.1
1
10
100
f, Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I RMS of fundamental)
1000
IC , C ollecto r-to -E m itter C u rrent (A )
I C , Collector-to-E m itter C urrent (A)
1000
TJ = 25 °C
100
T J = 1 50 °C
10
V G E = 1 5V
2 0µ s P U LS E W IDTH
1
1
100
TJ = 15 0°C
T J = 2 5°C
10
1
V C C = 1 00 V
5µ s P UL S E W ID TH
0.1
10
5
V C E , C ollector-to-E m itter V oltage (V )
10
15
V G E , G ate -to -E m itter V olta ge (V )
Fig. 3 - Typical Transfer Characteristics
Fig. 2 - Typical Output Characteristics
C-719
To Order
20
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IRGPC40UD2
3.5
VGE = 15V
V C E , C ollector-to-E m itter V oltage (V )
Maximum DC Collector Current (A)
40
30
20
10
A
0
25
50
75
100
125
V G E = 15 V
80 µs P UL S E W ID TH
I C = 40 A
3.0
2.5
I C = 20 A
2.0
I C = 1 0A
1.5
-60
150
TC , Case Temperature (°C)
-40
-20
0
20
40
60
80
100 1 20 140 160
TC , C ase Tem perature (°C )
Fig. 5 - Collector-to-Emitter Voltage vs.
Case Temperature
Fig. 4 - Maximum Collector Current vs.
Case Temperature
T herm al Response (Z th JC )
1
D = 0 .5 0
0.2 0
0.1
0.1 0
PD M
0 .05
0.0 2
t
SIN G LE P UL SE
(TH ER MA L R E SP O NS E )
t2
N o te s:
1 . D u ty fa c to r D = t
0.0 1
0.01
0.00001
1
1
/ t
2
2 . P e a k TJ = P D M x Z thJ C + T C
0.0001
0.001
0.01
0.1
1
t 1 , R ectangular Pulse D uration (sec)
Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case
C-720
To Order
10
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IRGPC40UD2
20
3 0 00
2 5 00
V G E , G a te -to -E m itte r V o lta g e (V )
V GE = 0V,
f = 1MHz
C ies = C ge + C gc , Cce SHORTED
C res = C gc
C oes = C ce + C gc
16
Cies
C , C ap ac ita nc e (pF )
V C E = 40 0V
I C = 20 A
2 0 00
12
Coes
1 5 00
1 0 00
Cres
5 00
8
4
0
0
1
10
0
10 0
10
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
VCC
VGE
TC
IC
Total Switching Losses (mJ)
2.00
1.96
1.94
1.92
1.90
50
60
I C = 40A
IC = 20A
1
I C = 10A
1.88
1.86
0.1
10
40
10
= 480V
= 15V
= 25°C
= 20A
1.98
0
30
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
Total Switching Losses (mJ)
2.02
20
Q g , T o tal G a te C h a rg e (n C )
V C E , C o lle c to r-to -E m itte r V o lta g e (V )
20
30
40
50
60
R G , Gate Resistance (Ω)
RG = 10Ω
V GE = 15V
V CC = 480V
-60
W
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
-40
-20
0
A
20
40
60
80
100 120 140 160
TC , Case Temperature (°C)
Fig. 10 - Typical Switching Losses vs.
Case Temperature
C-721
To Order
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IRGPC40UD2
1000
= 10Ω
= 150°C
= 480V
= 15V
I C , C ollector-to-Em itter C urrent (A )
RG
TC
V CC
V GE
6.0
4.0
2.0
0
10
20
30
40
VGGE E= 2 0V
T J = 125 °C
100
S A FE O P E R A TIN G A R E A
10
1
A
0.0
1
50
10
100
V C E , Collecto r-to-E m itter V oltage (V )
I C , Collector-to-Emitter Current (A)
Fig. 12 - Turn-Off SOA
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
100
Instantaneous Forward Current - I F (A)
Total Switching Losses (mJ)
8.0
10
TJ = 150°C
TJ = 125°C
TJ = 25°C
1
0.8
1.2
1.6
2.0
2.4
Forward Voltage Drop - V FM (V)
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
C-722
To Order
1000
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IRGPC40UD2
100
100
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
80
I IRRM - (A)
t rr - (ns)
I F = 30A
I F = 30A
60
I F = 15A
IF = 15A
10
I F = 5.0A
40
I F = 5.0A
20
100
1
100
1000
di f /dt - (A/µs)
di f /dt - (A/µs)
1000
Fig. 15 - Typical Recovery Current vs. dif/dt
Fig. 14 - Typical Reverse Recovery vs. dif/dt
1000
800
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
di(rec)M/dt - (A/µs)
600
Q RR - (nC)
IF = 30A
400
I F = 15A
IF = 5.0A
I F = 5.0A
I F = 15A
I F = 30A
200
0
100
1000
di f /dt - (A/µs)
Fig. 16 - Typical Stored Charge vs. dif/dt
100
100
1000
di f /dt - (A/µs)
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
C-723
To Order
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IRGPC40UD2
90% Vge
+Vge
Same type
device as
D.U.T.
Vce
80%
of Vce
90% Ic
10% Vce
Ic
430µF
Ic
D.U.T.
5% Ic
td(off)
tf
Eoff =
∫
t1+5µS
Vce ic dt
t1
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode) , trr, Qrr, Irr, td(on), tr, td(off), tf
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
trr
GATE VOLTAGE D.U.T.
10% +Vg
Qrr =
Ic
∫
trr
id dt
tx
+Vg
tx
10% Vcc
10% Irr
Vcc
DUT VOLTAGE
AND CURRENT
Vce
Vpk
Irr
Vcc
10% Ic
Ipk
90% Ic
Ic
DIODE RECOVERY
WAVEFORMS
tr
td(on)
t1
5% Vce
∫
t2
Eon = Vce ie dt
t1
DIODE REVERSE
RECOVERY ENERGY
t2
t3
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining E on, td(on), tr
∫
t4
Erec = Vd id dt
t3
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining E rec, trr, Qrr, Irr
Refer to Section D for the following:
Appendix D: Section D - page D-6
Fig. 18e - Macro Waveforms for Test Circuit of Fig. 18a
Fig. 19 - Clamped Inductive Load Test Circuit
Fig. 20 - Pulsed Collector Current Test Circuit
Package Outline 3 - JEDEC Outline TO-247AC
C-724
To Order
Section D - page D-13