IRF IRGB420UD2

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PD - 9.1066
IRGB420UD2
INSULATED GATE BIPOLAR TRANSISTOR
WITH ULTRAFAST SOFT RECOVERY
DIODE
UltraFast CoPack IGBT
Features
C
VCES = 500V
• Switching-loss rating includes all "tail" losses
TM
• HEXFRED soft ultrafast diodes
• Optimized for high operating f requency (over 5kHz)
See Fig. 1 for Current vs. Frequency curve
VCE(sat) ≤ 2.9V
G
@VGE = 15V, IC = 7.5A
E
n-channel
Description
Co-packaged IGBTs are a natural extension of International Rectifier's well
known IGBT line. They provide the convenience of an IGBT and an ultrafast
recovery diode in one package, resulting in substantial benefits to a host of
high-voltage, high-current, motor control, UPS and power supply applications.
TO-220AB
Absolute Maximum Ratings
Parameter
VCES
IC @ T C = 25°C
IC @ T C = 100°C
ICM
ILM
IF @ T C = 100°C
IFM
VGE
PD @ T C = 25°C
PD @ T C = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw.
Max.
Units
500
14
7.5
28
28
7.0
28
± 20
60
24
-55 to +150
V
A
V
W
°C
300 (0.063 in. (1.6mm) from case)
10 lbf•in (1.1 N•m)
Thermal Resistance
Parameter
RθJC
RθJC
RθCS
RθJA
Wt
Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount
Weight
C-617
To Order
Min.
Typ.
Max.
————
—-
——0.50
—
2 (0.07)
2.1
3.5
—80
—-
Units
°C/W
g (oz)
Revision 1
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IRGB420UD2
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
VCE(on)
Parameter
Collector-to-Emitter Breakdown Voltage
Temp. Coeff. of Breakdown Voltage
Collector-to-Emitter Saturation Voltage
VGE(th)
∆VGE(th)/∆TJ
gfe
ICES
Gate Threshold Voltage
Temp. Coeff. of Threshold Voltage
Forward Transconductance
Zero Gate Voltage Collector Current
VFM
Diode Forward Voltage Drop
IGES
Gate-to-Emitter Leakage Current
V(BR)CES
∆V(BR)CES/∆TJ
Min. Typ. Max. Units
Conditions
500
—
—
V
VGE = 0V, I C = 250µA
— 0.47 —
V/°C VGE = 0V, IC = 1.0mA
—
2.4
2.9
IC = 7.5A
V GE = 15V
—
3.1
—
V
IC = 14A
See Fig. 2, 5
—
2.7
—
IC = 7.5A, T J = 150°C
3.0
—
5.5
VCE = VGE, IC = 250µA
—
-10
— mV/°C VCE = VGE, IC = 250µA
1.2 2.0
—
S
VCE = 100V, I C = 7.5A
—
—
250
µA
VGE = 0V, V CE = 500V
—
— 1700
VGE = 0V, V CE = 500V, T J = 150°C
—
1.4
1.7
V
IC = 8.0A
See Fig. 13
—
1.3
1.6
IC = 8.0A, T J = 150°C
—
— ±100 nA
VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Ets
LE
Cies
Coes
Cres
trr
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Current
Qrr
Diode Reverse Recovery Charge
di(rec)M/dt
Diode Peak Rate of Fall of Recovery
During t b
Notes:
Repetitive rating; V GE=20V, pulse width
limited by max. junction temperature.
( See fig. 20 )
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
15
3.7
6.5
65
44
140
110
0.25
0.25
0.50
60
44
230
220
0.8
7.5
330
47
5.9
37
55
3.5
4.5
65
124
240
210
Max. Units
Conditions
23
IC = 7.5A
5.6
nC
VCC = 400V
9.8
See Fig. 8
—
TJ = 25°C
—
ns
IC = 7.5A, V CC = 400V
210
VGE = 15V, R G = 50Ω
160
Energy losses include "tail" and
—
diode reverse recovery.
—
mJ
See Fig. 9, 10, 11, 18
0.80
—
TJ = 150°C,
See Fig. 9, 10, 11, 18
—
ns
IC = 7.5A, V CC = 480V
—
VGE = 15V, R G = 50Ω
—
Energy losses include "tail" and
—
mJ
diode reverse recovery.
—
nH
Measured 5mm from package
—
VGE = 0V
—
pF
VCC = 30V
See Fig. 7
—
ƒ = 1.0MHz
55
ns
TJ = 25°C See Fig.
90
TJ = 125°C
14
I F = 8.0A
5.0
A
TJ = 25°C See Fig.
8.0
TJ = 125°C
15
V R = 200V
138
nC
TJ = 25°C See Fig.
360
TJ = 125°C
16
di/dt = 200A/µs
—
A/µs TJ = 25°C See Fig.
—
TJ = 125°C
17
VCC=80%(V CES), VGE=20V, L=10µH,
R G= 50Ω, ( See fig. 19 )
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
C-618
To Order
Pulse width 5.0µs,
single shot.
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IRGB420UD2
10
D u ty c y cl e : 5 0 %
TJ = 1 2 5 ° C
T sin k = 9 0 ° C
G a te d riv e a s s p e c ifi e d
T u rn -o n lo s s e s in c lu d e
e ffe c ts o f re v e rs e re c o v e ry
P o w e r D iss ip a tio n = 1 3 W
Load Current (A)
8
6
6 0 % o f ra te d
vo lta g e
4
2
A
0
0.1
1
10
100
f, Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I RMS of fundamental)
100
IC , C olle ctor-to-E m itte r C urren t (A )
I C , C ollector-to-E mitter C urrent (A )
100
TJ = 2 5°C
TJ = 1 50 °C
10
V G E = 15 V
20 µs P UL S E W ID TH
1
1
10
T J = 1 5 0°C
TJ = 2 5°C
1
0 .1
V C C = 1 0 0V
5µ s P U LS E W IDTH
0.01
10
5
V C E , C o llector-to-Em itter V oltage (V)
10
15
V G E , G ate-to-E m itte r V o lta ge (V )
Fig. 3 - Typical Transfer Characteristics
Fig. 2 - Typical Output Characteristics
C-619
To Order
20
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IRGB420UD2
4.5
V G E = 15 V
V C E , C o llec to r-to-E m itter V oltage (V )
Ma xim um DC C ollector C urre nt (A )
15
12
9
6
3
0
V G E = 15 V
80 µs P UL S E W ID TH
4.0
I C = 1 5A
3.5
3.0
2.5
I C = 7.5A
2.0
I C = 4.0 A
1.5
1.0
25
50
75
100
125
150
-60
T C , C ase Tem perature (°C )
-40
-20
0
20
40
60
80
100 120 140 160
T C , C a s e Te m p e ra ture (°C )
Fig. 5 - Collector-to-Emitter Voltage vs.
Case Temperature
Fig. 4 - Maximum Collector Current vs.
Case Temperature
T herm al Response (Z th JC )
10
1
D = 0.50
0 .2 0
0 .10
PD M
0.0 5
0.1
0.0 2
0 .01
t
SIN G LE P U LS E
(TH ER M AL R E SP O N SE )
t2
N o te s :
1 . D u ty fa c to r D = t
0.01
0.00001
1
1
/ t
2
2 . P e a k TJ = P D M x Z th J C + T C
0.0001
0.001
0.01
0.1
1
t 1 , R ectangular Pulse D uration (sec)
Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case
C-620
To Order
10
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IRGB420UD2
20
700
600
V G E , G a te -to -E m itter V olta ge (V )
V GE = 0V,
f = 1MHz
C ies = C ge + C gc , Cce SHORTED
C res = C gc
C oes = C ce + C gc
16
500
C, C apacitance (pF)
V C E = 40 0V
I C = 7.5A
Cies
12
400
Coes
300
200
Cres
100
8
4
0
0
1
10
0
1 00
4
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
= 480V
= 15V
= 25°C
= 7.5A
Total Switching Losses (mJ)
Total Switching Losses (mJ)
VCC
VGE
TC
IC
0.52
0.51
A
0.50
0
10
20
30
40
12
16
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
10
0.53
8
Q G , T o tal G a te C h a rg e (n C )
V C E , C ollector-to-E m itter V oltage (V )
50
RG = 50Ω
V GE = 15V
V CC = 400V
I C = 15A
1
I C = 7.5A
I C = 4.0A
A
0.1
-60
60
-40
-20
0
20
40
60
80
100 120 140 160
TC , Case Temperature (°C)
R G , Gate Resistance (Ω)
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
Fig. 10 - Typical Switching Losses vs.
Case Temperature
C-621
To Order
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IRGB420UD2
2.0
1000
= 50Ω
= 150°C
= 400V
= 15V
I C , C ollec to r-to-E m itte r C urren t (A )
RG
TC
V CC
V GE
1.5
1.0
0.5
A
0.0
0
4
8
12
16
VGGE E= 20 V
T J = 12 5°C
100
10
S A FE O P E R A TIN G A R E A
1
0.1
1
20
10
100
V C E , C o lle cto r-to-E m itte r V olta g e (V )
I C , Collector-to-Emitter Current (A)
Fig. 12 - Turn-Off SOA
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
100
Instantaneous Forward Current - I F (A)
Total Switching Losses (mJ)
2.5
10
TJ = 150°C
TJ = 125°C
TJ = 25°C
1
0.1
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
Forward Voltage Drop - V FM (V)
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
C-622
To Order
1000
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IRGB420UD2
100
100
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
80
60
I IRRM - (A)
t rr - (ns)
IF = 16A
I F = 8.0A
I F = 16A
10
IF = 8.0A
40
I F = 4.0A
I F = 4.0A
20
0
100
1
100
1000
di f /dt - (A/µs)
di f /dt - (A/µs)
1000
Fig. 15 - Typical Recovery Current vs. dif/dt
Fig. 14 - Typical Reverse Recovery vs. dif/dt
500
10000
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
di(rec)M/dt - (A/µs)
Q RR - (nC)
400
300
I F = 16A
200
I F = 8.0A
IF = 4.0A
1000
IF = 8.0A
I F = 16A
100
IF = 4.0A
0
100
1000
di f /dt - (A/µs)
100
100
1000
di f /dt - (A/µs)
Fig. 16 - Typical Stored Charge vs. dif/dt
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
C-623
To Order
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IRGB420UD2
90% Vge
+Vge
Same type
device as
D.U.T.
Vce
430µF
80%
of Vce
90% Ic
10% Vce
Ic
D.U.T.
Ic
5% Ic
td(off)
tf
Eoff =
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode) , trr, Qrr, Irr, td(on), tr, td(off), tf
t1
∫
t1+5µS
Vce ic dt
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
trr
GATE VOLTAGE D.U.T.
10% +Vg
Qrr =
Ic
∫
trr
id dt
tx
+Vg
tx
10% Vcc
10% Irr
Vcc
DUT VOLTAGE
AND CURRENT
Vce
Vpk
Irr
Vcc
10% Ic
Ipk
90% Ic
Ic
DIODE RECOVERY
WAVEFORMS
tr
td(on)
t1
5% Vce
∫
t2
Eon = Vce ie dt
t1
DIODE REVERSE
RECOVERY ENERGY
t2
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
t3
Defining E on, td(on), tr
∫
t4
Erec = Vd id dt
t3
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Refer to Section D for the following:
Defining E rec, trr, Qrr, Irr
Appendix B: Section D - page D-4
Fig. 18e - Macro Waveforms for Test Circuit of Fig. 18a
Fig. 19 - Clamped Inductive Load Test Circuit
Fig. 20 - Pulsed Collector Current Test Circuit
Package Outline 1 - JEDEC Outline TO-220AB
C-624
To Order
Section D - page D-12