IRF IRGPC40FD2

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PD - 9.1113
IRGPC40FD2
INSULATED GATE BIPOLAR TRANSISTOR
WITH ULTRAFAST SOFT RECOVERY
DIODE
Fast CoPack IGBT
Features
C
VCES = 600V
• Switching-loss rating includes all "tail" losses
TM
• HEXFRED soft ultrafast diodes
• Optimized for medium operating frequency (1 to
10kHz) See Fig. 1 for Current vs. Frequency curve
VCE(sat) ≤ 2.0V
G
@VGE = 15V, IC = 27A
E
n-channel
Description
Co-packaged IGBTs are a natural extension of International Rectifier's well
known IGBT line. They provide the convenience of an IGBT and an ultrafast
recovery diode in one package, resulting in substantial benefits to a host of
high-voltage, high-current, motor control, UPS and power supply applications.
TO-247AC
Absolute Maximum Ratings
Parameter
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 100°C
IFM
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw.
Max.
Units
600
49
27
200
200
15
200
± 20
160
65
-55 to +150
V
A
V
W
°C
300 (0.063 in. (1.6mm) from case)
10 lbf•in (1.1 N•m)
Thermal Resistance
Parameter
RθJC
RθJC
RθCS
RθJA
Wt
Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount
Weight
C-117
To Order
Min.
Typ.
Max.
—
—
—
—
—
—
—
0.24
—
6 (0.21)
0.77
1.7
—
40
—
Units
°C/W
g (oz)
Revision 1
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IRGPC40FD2
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
VCE(on)
Parameter
Collector-to-Emitter Breakdown Voltage
Temp. Coeff. of Breakdown Voltage
Collector-to-Emitter Saturation Voltage
VGE(th)
∆VGE(th)/∆TJ
gfe
ICES
Gate Threshold Voltage
Temp. Coeff. of Threshold Voltage
Forward Transconductance
Zero Gate Voltage Collector Current
VFM
Diode Forward Voltage Drop
IGES
Gate-to-Emitter Leakage Current
V(BR)CES
∆V(BR)CES/∆TJ
Min. Typ. Max. Units
Conditions
600
—
—
V
VGE = 0V, IC = 250µA
— 0.70 —
V/°C VGE = 0V, IC = 1.0mA
—
1.7 2.0
IC = 27A
VGE = 15V
—
2.2
—
V
IC = 49A
See Fig. 2, 5
—
1.9
—
IC = 27A, T J = 150°C
3.0
—
5.5
VCE = VGE, IC = 250µA
—
-12
— mV/°C VCE = VGE, IC = 250µA
9.2
12
—
S
VCE = 100V, IC = 27A
—
— 250
µA
VGE = 0V, VCE = 600V
—
— 3500
VGE = 0V, VCE = 600V, T J = 150°C
—
1.3 1.7
V
IC = 15A
See Fig. 13
—
1.2 1.6
IC = 15A, T J = 150°C
—
— ±100 nA
VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Ets
LE
Cies
Coes
Cres
trr
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Current
Qrr
Diode Reverse Recovery Charge
di(rec)M/dt
Diode Peak Rate of Fall of Recovery
During tb
Notes:
Repetitive rating; V GE=20V, pulse width
limited by max. junction temperature.
( See fig. 20 )
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
59
8.6
25
71
76
320
210
1.3
3.2
4.5
70
73
540
480
7.8
13
1500
190
20
42
74
4.0
6.5
80
220
188
160
Max. Units
Conditions
80
IC = 27A
10
nC VCC = 400V
42
See Fig. 8
—
TJ = 25°C
—
ns
IC = 27A, VCC = 480V
480
VGE = 15V, RG = 10Ω
320
Energy losses include "tail" and
—
diode reverse recovery.
—
mJ See Fig. 9, 10, 11, 18
6.8
—
TJ = 150°C,
See Fig. 9, 10, 11, 18
—
ns
IC = 27A, VCC = 480V
—
VGE = 15V, RG = 10Ω
—
Energy losses include "tail" and
—
mJ diode reverse recovery.
—
nH Measured 5mm from package
—
VGE = 0V
—
pF
VCC = 30V
See Fig. 7
—
ƒ = 1.0MHz
60
ns
TJ = 25°C See Fig.
120
TJ = 125°C
14
IF = 15A
6.0
A
TJ = 25°C See Fig.
10
TJ = 125°C
15
V R = 200V
180
nC TJ = 25°C See Fig.
600
TJ = 125°C
16
di/dt = 200A/µs
—
A/µs TJ = 25°C See Fig.
—
TJ = 125°C
17
VCC=80%(VCES), VGE=20V, L=10µH,
RG= 10Ω, ( See fig. 19 )
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
C-118
To Order
Pulse width 5.0µs,
single shot.
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IRGPC40FD2
30
D u ty c y c le : 5 0 %
TJ = 1 2 5 ° C
T s in k = 9 0 ° C
G a te d r iv e a s s p e c ifie d
T u r n -o n lo s s e s in c lu d e
e ffe c ts o f re v e rs e re c o ve ry
P o w e r D is s ip a tio n = 3 5 W
Load Current (A)
25
20
6 0 % o f ra te d
v o lta g e
15
10
5
A
0
0.1
1
10
100
f, Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
1000
IC , C ollector-to-E mitter C urrent (A )
I C , Collector-to-E m itter C urrent (A)
1000
TJ = 25 °C
100
TJ = 15 0 °C
10
V G E = 1 5V
2 0µ s P U LS E W IDTH
1
0.1
1
100
T J = 15 0°C
10
T J = 2 5°C
1
0.1
V C C = 10 0 V
5 µs P U L S E W ID TH
0.01
10
5
V C E , C ollector-to-E m itter V oltage (V )
10
15
V G E , G ate-to -E m itter V o lta ge (V )
Fig. 3 - Typical Transfer Characteristics
Fig. 2 - Typical Output Characteristics
C-119
To Order
20
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IRGPC40FD2
3.0
V G E = 15 V
V C E , C ollector-to-E m itter V oltage (V)
M axim um D C C ollector C urrent (A )
50
40
30
20
10
VG E = 1 5 V
80 µs P UL S E W ID TH
2.5
I C = 54 A
2.0
I C = 27 A
1.5
I C = 1 4A
1.0
0
25
50
75
100
125
-60
150
-40
-20
0
20
40
60
80
1 00 120 140 160
TC , C ase Tem perature (°C )
T C , C ase Tem perature (°C )
Fig. 5 - Collector-to-Emitter Voltage vs.
Case Temperature
Fig. 4 - Maximum Collector Current vs.
Case Temperature
Therm al R esponse (Z th JC )
1
D = 0 .5 0
0.2 0
0.1
0.1 0
PD M
0 .05
0.0 2
t
SIN G LE P UL SE
(TH ER MA L R E SP O NS E )
t
N o te s:
1 . D u ty fa c to r D = t
0.0 1
0.01
0.00001
1
1
/ t
2
2
2 . P e a k TJ = P D M x Z thJ C + T C
0.0001
0.001
0.01
0.1
1
t 1 , R ectangular Pulse D uration (sec)
Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case
C-120
To Order
10
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IRGPC40FD2
3000
V G E , G ate-to-E m itter V oltage (V)
2500
C , C apacitance (pF)
20
V GE = 0V,
f = 1MHz
C ies = C ge + C gc , Cce SHORTED
C res = C gc
C oes = C ce + C gc
16
Cies
2000
V C E = 4 00 V
I C = 27A
12
Coes
1500
1000
Cres
500
8
4
0
0
1
10
0
1 00
10
V C E , C ollector-to-E m itter V oltage (V)
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
= 480V
= 15V
= 25°C
= 27A
Total Switching Losses (mJ)
Total Switching Losses (mJ)
VCC
VGE
TC
IC
4.8
4.7
4.6
A
4.5
0
10
20
30
40
50
30
40
50
60
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
100
4.9
20
Q g , Total G ate C harge (nC )
60
RG = 10Ω
V GE = 15V
V CC = 480V
I C = 54A
10
IC = 27A
IC = 14A
1
-60
A
-40
-20
0
20
40
60
80
100 120 140 160
TC , Case Temperature (°C)
RG , Gate Resistance (Ω)
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
Fig. 10 - Typical Switching Losses vs.
Case Temperature
C-121
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IRGPC40FD2
1000
16.0
I C , C ollecto r-to -E m itter C u rrent (A )
RG = 10Ω
T C = 150°C
V CC = 480V
V GE = 15V
12.0
8.0
4.0
A
0.0
0
20
40
VGGE E= 2 0V
T J = 125 °C
100
S A FE O P E RA TIN G A RE A
10
1
60
1
I C , Collector-to-Emitter Current (A)
10
100
V C E , Collecto r-to-E m itter V oltage (V )
Fig. 12 - Turn-Off SOA
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
100
Instantaneous Forward Current - I F (A)
Total Switching Losses (mJ)
20.0
10
TJ = 150°C
TJ = 125°C
TJ = 25°C
1
0.8
1.2
1.6
2.0
2.4
Forward Voltage Drop - V FM (V)
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
C-122
To Order
1000
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IRGPC40FD2
100
100
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
80
I IRRM - (A)
t rr - (ns)
I F = 30A
I F = 30A
60
I F = 15A
IF = 15A
10
I F = 5.0A
40
I F = 5.0A
20
100
1
100
1000
di f /dt - (A/µs)
di f /dt - (A/µs)
1000
Fig. 15 - Typical Recovery Current vs. dif/dt
Fig. 14 - Typical Reverse Recovery vs. dif/dt
800
1000
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
di(rec)M/dt - (A/µs)
600
Q RR - (nC)
IF = 30A
400
I F = 15A
IF = 5.0A
I F = 5.0A
I F = 15A
I F = 30A
200
0
100
1000
di f /dt - (A/µs)
Fig. 16 - Typical Stored Charge vs. dif/dt
100
100
di f /dt - (A/µs)
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
C-123
To Order
1000
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IRGPC40FD2
90% Vge
+Vge
Vce
Same type
device as
D.U.T.
Ic
90% Ic
10% Vce
Ic
5% Ic
430µF
80%
of Vce
D.U.T.
td(off)
tf
Eoff =
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t1
∫
t1+5µS
Vce ic dt
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
trr
GATE VOLTAGE D.U.T.
10% +Vg
Qrr =
Ic
∫
trr
id dt
tx
+Vg
tx
10% Vcc
10% Irr
Vcc
DUT VOLTAGE
AND CURRENT
Vce
Vpk
Irr
Vcc
10% Ic
Ipk
90% Ic
Ic
DIODE RECOVERY
WAVEFORMS
tr
td(on)
t1
5% Vce
∫
t2
Eon = Vce ie dt
t1
DIODE REVERSE
RECOVERY ENERGY
t2
t3
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
∫
t4
Erec = Vd id dt
t3
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr
Defining Erec, trr, Qrr, Irr
Refer to Section D for the following:
Appendix D: Section D - page D-6
Fig. 18e - Macro Waveforms for Test Circuit of Fig. 18a
Fig. 19 - Clamped Inductive Load Test Circuit
Fig. 20 - Pulsed Collector Current Test Circuit
Package Outline 3 - JEDEC Outline TO-247AC (TO-3P)
C-124
To Order
Section D - page D-13