Document No.001-89446 Rev. *A ECN # 4517626 Cypress Semiconductor Package Qualification Report QTP# 040606 VERSION*A September 2014 16/20/28-Lead SSOP Pb-Free, MSL3, 260°C Reflow Amkor-Anam Philippines (PHIL-M) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 6 Document No.001-89446 Rev. *A ECN # 4517626 PACKAGE QUALIFICATION HISTORY QUAL REPORT 040606 040606 DESCRIPTION OF QUALIFICATION PURPOSE 16/20/28-Lead SSOP, 209mils, Pb-Free, MSL1, 260C Reflow using G600, 8290 Epoxy, 100% Matte Sn Plating with Annealing Process (150C, 1hr) assembled @ Amkor-Anam Cypress established policy requiring MSL and Reflow Peak Temperature alignment for Cypress and its Assembly Subcontractors. Downgrade from MSL1 to MSL3. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 6 DATE COMP. Feb 05 Dec 06 Document No.001-89446 Rev. *A ECN # 4517626 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: SP28 28-Small Shrunk Outline Package (SSOP) Sumitomo G600 V-O UL-94 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: 100% Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Sawing Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Wire Bond Method: Thermosonic Thermal Resistance Theta JA °C/W: 131°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-14999 Name/Location of Assembly (prime) facility: Amkor-Anam Philippines (PHIL-M) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 6 Document No.001-89446 Rev. *A ECN # 4517626 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test Test Condition (Temp/Bias) 130°C, 3.63V, 85%RH Result P/F P Precondition: JESD22 Moisture Sensitivity MSL 1 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0°, -5°C High Temperature Operating Life Early Failure Rate Dynamic Operating Condition, Vcc Max = 2.25V, 150°C P High Temperature Operating Life Latent Failure Rate Dynamic Operating Condition, Vcc Max=2.25V, 150°C P Pressure Cooker 121°C, 100%RH, 15 Psig P Precondition: JESD22 Moisture Sensitivity MSL 1 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0°, -5°C Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C P Precondition: JESD22 Moisture Sensitivity MSL 1 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0°, -5°C Acoustic Microscopy Test J-STD-020 P Adhesion to Lead Finish MIL-STD-883, Method 2025 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009, P Solderability J-STD-002, JESD22-B102 P X-Ray MIL-STD-883 - 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 6 Document No.001-89446 Rev. *A ECN # 4517626 Reliability Test Data QTP #:040606 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY198OXCT (W198B) 8348507 610406788 PHIL-M COMP 15 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M COMP 15 0 CY40S11OXC (W40S111D) 8145366 610417776 PHIL-M COMP 15 0 STRESS: ADHESION TO LEAD FINISH CY198OXCT (W198B) 8348507 610406788 PHIL-M COMP 3 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M COMP 3 0 CY198OXCT (W198B) 8348507 610406788 PHIL-M COMP 15 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M COMP 15 0 STRESS: STRESS: Failure Mechanism ACOUSTIC - MICROSCOPE, MSL1 EXERNAL VISUAL HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 168 HR 85C/85%RH, MSL1 CY198OXCT (W198B) 8348507 610406788 PHIL-M 128 50 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M 128 50 0 STRESS: PRESSURE COOKER TEST, 121C and 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 CY198OXCT (W198B) 8348507 610406788 PHIL-M 168 50 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M 168 48 0 8145366 610417776 PHIL-M COMP 8 0 STRESS: SOLDERABILITY CY40S11OXC (W40S111D) STRESS: TC COND. C -65C TO 150C, PRE COND 168 HR 85C/85%RH, MSL1 CY198OXCT (W198B) 8348507 610406788 PHIL-M 300 50 0 CY198OXCT (W198B) 8348507 610406788 PHIL-M 500 50 0 CY198OXCT (W198B) 8348507 610406788 PHIL-M 1000 50 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M 300 49 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M 500 43 0 CY198OXCT (W198B) 8348507 610406788M PHIL-M 1000 43 0 CY40S11OXC (W40S111D) 8145366 610417776 PHIL-M 300 50 0 CY40S11OXC (W40S111D) 8145366 610417776 PHIL-M 500 47 0 CY198OXCT (W198B) 8348507 610406788 PHIL-M COMP 15 0 CY40S11OXC (W40S111D) 8145366 610417776 PHIL-M COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 6 Document No.001-89446 Rev. *A ECN # 4517626 Document History Page Document Title:QTP#040606: 16/20/28-Lead SSOP Pb-Free, MSL3, 260C Reflow Amkor-Anam Philippines (PHIL-M) Document Number:001-89446 Rev. ECN Orig. of No. Change ** 4140910 HSTO *A 4517626 HSTO Distribution: WEB Posting: Description of Change Initial spec release Initiate report as per memo LGQ-642 Align qualification report based on the new template in the front page None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 6