QTP 40606 16/20/28-Lead SSOP Pb-Free, MSL3, 260°C Reflow Amkor-Anam Philippines.pdf

Document No.001-89446 Rev. *A
ECN # 4517626
Cypress Semiconductor
Package Qualification Report
QTP# 040606 VERSION*A
September 2014
16/20/28-Lead SSOP
Pb-Free, MSL3, 260°C Reflow
Amkor-Anam Philippines (PHIL-M)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 6
Document No.001-89446 Rev. *A
ECN # 4517626
PACKAGE QUALIFICATION HISTORY
QUAL
REPORT
040606
040606
DESCRIPTION OF QUALIFICATION PURPOSE
16/20/28-Lead SSOP, 209mils, Pb-Free, MSL1, 260C Reflow using G600, 8290
Epoxy, 100% Matte Sn Plating with Annealing Process (150C, 1hr) assembled @
Amkor-Anam
Cypress established policy requiring MSL and Reflow Peak Temperature alignment
for Cypress and its Assembly Subcontractors. Downgrade from MSL1 to MSL3.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 6
DATE
COMP.
Feb 05
Dec 06
Document No.001-89446 Rev. *A
ECN # 4517626
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
SP28
28-Small Shrunk Outline Package (SSOP)
Sumitomo G600
V-O UL-94
Oxygen Rating Index:
N/A
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
100% Sn
Die Backside Preparation Method/Metallization:
Grinding
Die Separation Method:
Sawing
Die Attach Supplier:
Ablestik
Die Attach Material:
8290
Die Attach Method:
Epoxy
Wire Bond Method:
Thermosonic
Thermal Resistance Theta JA °C/W:
131°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
49-14999
Name/Location of Assembly (prime) facility:
Amkor-Anam Philippines (PHIL-M)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
Cypress Philippines (CML-R)
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 6
Document No.001-89446 Rev. *A
ECN # 4517626
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Accelerated Saturation Test
Test Condition
(Temp/Bias)
130°C, 3.63V, 85%RH
Result
P/F
P
Precondition: JESD22 Moisture Sensitivity MSL 1
168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0°, -5°C
High Temperature Operating Life
Early Failure Rate
Dynamic Operating Condition, Vcc Max = 2.25V, 150°C
P
High Temperature Operating Life
Latent Failure Rate
Dynamic Operating Condition, Vcc Max=2.25V, 150°C
P
Pressure Cooker
121°C, 100%RH, 15 Psig
P
Precondition: JESD22 Moisture Sensitivity MSL 1
168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0°, -5°C
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C
P
Precondition: JESD22 Moisture Sensitivity MSL 1
168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0°, -5°C
Acoustic Microscopy Test
J-STD-020
P
Adhesion to Lead Finish
MIL-STD-883, Method 2025
P
External Visual
MIL-PRF-38535, MILSTD-883, METHOD 2009,
P
Solderability
J-STD-002, JESD22-B102
P
X-Ray
MIL-STD-883 - 2012
P
Company Confidential
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Page 4 of 6
Document No.001-89446 Rev. *A
ECN # 4517626
Reliability Test Data
QTP #:040606
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
CY198OXCT (W198B)
8348507
610406788
PHIL-M
COMP
15
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
COMP
15
0
CY40S11OXC (W40S111D)
8145366
610417776
PHIL-M
COMP
15
0
STRESS:
ADHESION TO LEAD FINISH
CY198OXCT (W198B)
8348507
610406788
PHIL-M
COMP
3
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
COMP
3
0
CY198OXCT (W198B)
8348507
610406788
PHIL-M
COMP
15
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
COMP
15
0
STRESS:
STRESS:
Failure Mechanism
ACOUSTIC - MICROSCOPE, MSL1
EXERNAL VISUAL
HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 168 HR 85C/85%RH, MSL1
CY198OXCT (W198B)
8348507
610406788
PHIL-M
128
50
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
128
50
0
STRESS: PRESSURE COOKER TEST, 121C and 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1
CY198OXCT (W198B)
8348507
610406788
PHIL-M
168
50
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
168
48
0
8145366
610417776
PHIL-M
COMP
8
0
STRESS:
SOLDERABILITY
CY40S11OXC (W40S111D)
STRESS:
TC COND. C -65C TO 150C, PRE COND 168 HR 85C/85%RH, MSL1
CY198OXCT (W198B)
8348507
610406788
PHIL-M
300
50
0
CY198OXCT (W198B)
8348507
610406788
PHIL-M
500
50
0
CY198OXCT (W198B)
8348507
610406788
PHIL-M
1000
50
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
300
49
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
500
43
0
CY198OXCT (W198B)
8348507
610406788M
PHIL-M
1000
43
0
CY40S11OXC (W40S111D)
8145366
610417776
PHIL-M
300
50
0
CY40S11OXC (W40S111D)
8145366
610417776
PHIL-M
500
47
0
CY198OXCT (W198B)
8348507
610406788
PHIL-M
COMP
15
0
CY40S11OXC (W40S111D)
8145366
610417776
PHIL-M
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 6
Document No.001-89446 Rev. *A
ECN # 4517626
Document History Page
Document Title:QTP#040606: 16/20/28-Lead SSOP Pb-Free, MSL3, 260C Reflow Amkor-Anam Philippines (PHIL-M)
Document Number:001-89446
Rev. ECN
Orig. of
No.
Change
**
4140910 HSTO
*A
4517626 HSTO
Distribution: WEB
Posting:
Description of Change
Initial spec release
Initiate report as per memo LGQ-642
Align qualification report based on the new template in the front page
None
Company Confidential
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Page 6 of 6
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