DIODES DMG4511SK4-7

DMG4511SK4
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
V(BR)DSS
RDS(ON)
ID
TA = 25°C
35V
35mΩ @ VGS = 10V
13A
-35V
45mΩ @ VGS = -10V
-12A
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•
•
•
Description and Applications
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
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•
•
Backlighting
DC-DC Converters
Power management functions
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Complementary Pair MOSFET
Lead Free/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
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Case: TO252-4L
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram Below
Terminals: Finish – Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.328 grams (approximate)
D2
G2
G1
S2
Top View
Bottom View
D1
N-Channel MOSFET
S1
P-Channel MOSFET
Ordering Information (Note 3)
Part Number
DMG4511SK4-7
Notes:
Case
TO252-4L
Packaging
3000 / Tape & Reel
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
G4511S
YYWW
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
= Manufacturer’s Marking
G4511S = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01 – 53)
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DMG4511SK4
Maximum Ratings – N-CHANNEL, Q1 @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 4) VGS = 10V
Steady
State
Continuous Drain Current (Note 5) VGS = 10V
Steady
State
Continuous Drain Current (Note 5) VGS = 10V
t ≤ 10s
Continuous Drain Current (Note 5) VGS = 4.5V
Steady
State
Continuous Drain Current (Note 5) VGS = 4.5V
t ≤ 10s
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
ID
Value
35
±20
5.3
4.2
ID
8.6
6.8
A
ID
13
11
A
ID
6.3
5.0
A
ID
Pulsed Drain Current (Note 6)
IDM
9.3
7.4
50
Unit
V
V
A
A
A
Maximum Ratings – P-CHANNEL, Q2 @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 4) VGS = -10V
Steady
State
Continuous Drain Current (Note 5) VGS = -10V
Steady
State
Continuous Drain Current (Note 5) VGS = -10V
t ≤ 10s
Continuous Drain Current (Note 5) VGS = -4.5V
Steady
State
Continuous Drain Current (Note 5) VGS = -4.5V
t ≤ 10s
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
Pulsed Drain Current (Note 6)
ID
Value
-35
±20
-5.0
-3.8
ID
-7.8
-6.2
A
ID
-12
-10
A
ID
-6.5
-5.2
A
IDM
-9.6
-7.7
-50
Symbol
PD
RθJA
PD
RθJA
PD
RθJA
TJ, TSTG
Value
1.54
81.3
4.1
30.8
8.9
14
-55 to +150
ID
Unit
V
V
A
A
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 4)
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 5)
Power Dissipation (Note 5) t ≤ 10s
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 5) t ≤ 10s
Operating and Storage Temperature Range
Notes:
Unit
W
°C/W
W
°C/W
W
°C/W
°C
4. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
5. Device mounted on 2” x 2” FR-4 PCB with high coverage 2 oz. Copper, single sided.
6. Repetitive rating, pulse width limited by junction temperature.
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
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DMG4511SK4
Electrical Characteristics – N-CHANNEL, Q1 @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = 25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 10V)
Total Gate Charge (VGS = 4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
35
-
-
1.0
±100
V
μA
nA
VGS = 0V, ID = 250μA
VDS = 35V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
1.0
-
3.0
V
RDS (ON)
-
25
50
35
65
mΩ
|Yfs|
VSD
-
4.5
-
1.2
S
V
VDS = VGS, ID = 250μA
VGS = 10V, ID = 8A
VGS = 4.5V, ID = 6A
VDS = 10V, ID = 8A
VGS = 0V, IS = 8A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
-
850
64.7
51.9
1.6
18.7
8.8
2.6
2.1
5.4
2.8
33.2
35.6
-
pF
pF
pF
Ω
nC
ns
ns
ns
ns
Test Condition
VDS = 25V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VGS = 10V, VDS = 28V, ID = 8A
VGS = 4.5V, VDS = 28V,
ID = 8A
VDS = 18V, VGS = 10V,
RL = 18Ω, RG = 3.3Ω,
ID = 1A
Electrical Characteristics – P-CHANNEL, Q2 @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = 25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -10V)
Total Gate Charge (VGS = -4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-35
-
-
-1.0
±100
V
μA
nA
VGS = 0V, ID = -250μA
VDS = -35V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
-1.0
-
-3.0
V
RDS (ON)
-
30
40
45
65
mΩ
|Yfs|
VSD
-
8
-
-1.2
S
V
VDS = VGS, ID = -250μA
VGS = -10V, ID = -6A
VGS = -4.5V, ID = -4A
VDS = -10V, ID = -6A
VGS = 0V, IS = -6A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
-
985.2
90.6
75.3
7.0
19.2
9.5
2.0
3.5
5.2
4.8
45.8
29.5
-
pF
pF
pF
Ω
nC
ns
ns
ns
ns
Test Condition
VDS = -25V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VGS = -10V, VDS = -28V, ID = -6A
VGS = -4.5V, VDS = -28V,
ID = -6A
VDS = -18V, VGS = -10V,
RL = 18Ω, RG = 3.3Ω,
ID = -1A
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
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DMG4511SK4
N-CHANNEL, Q1
30
30
VGS = 8.0V
VGS = 4.0V
20
VGS = 3.5V
15
VDS = 5V
25
VGS = 4.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25
10
VGS = 3.2V
20
15
10
TA = 150°C
T A = 125°C
5
5
TA = 85°C
VGS = 3.0V
VGS = 2.8V
0
0.5
1
1.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.05
0.04
0.03
VGS = 4.5V
VGS = 8.0V
0.02
0.01
0
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
30
RDSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
1.7
VGS = 10V
ID = 10A
1.5
VGS = 4.5V
ID = 5A
1.3
0
2
1.1
0.9
0.7
RDSON, DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
0.5
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
TA = 25°C
TA = -55°C
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0
1
2
3
4
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristic
5
0.08
0.07
VGS = 4.5V
0.06
TA = 150°C
0.05
TA = 125°C
0.04
TA = 85°C
0.03
TA = 25°C
0.02
TA = -55°C
0.01
0
0
5
10
15
20
25
ID, DRAIN CURRENT (A)
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
30
0.06
0.05
0.04
VGS = 4.5V
ID = 5A
0.03
VGS = 10V
ID = 10A
0.02
0.01
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
July 2011
© Diodes Incorporated
3.0
20
2.7
18
2.4
16
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
DMG4511SK4
2.1
1.8
ID = 250µA
1.5
1.2
0.9
0.6
TA = 25°C
12
10
8
6
4
2
0.3
0
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
0
0.2
1,400
0.4
0.6
0.8
1.0
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
1.2
10,000
1,200
f = 1MHz
IDSS, LEAKAGE CURRENT (nA)
C, CAPACITANCE (pF)
14
1,000
Ciss
800
600
400
200
1,000
TA = 150°C
TA = 125°C
100
TA = 85°C
10
TA = 25°C
Coss
Crss
0
0
1
5
10
15
20
25
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Total Capacitance
35
5
10
15
20
25
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Leakage Current
vs. Drain-Source Voltage
35
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RθJA(t) = r(t) * RθJA
RθJA = 80°C/W
D = 0.02
0.01
D = 0.01
P(pk)
D = 0.005
t2
T J - T A = P * RθJA(t)
Duty Cycle, D = t1/t2
D = Single Pulse
0.001
0.00001
0.0001
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
t1
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 11 Transient Thermal Response
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DMG4511SK4
P-CHANNEL, Q2
30
30
VGS = -8.0V
VGS = -4.5V
25
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
25
VGS = -4.0V
20
VGS = -3.5V
15
10
VGS = -3.2V
20
15
10
TA = 150°C
5
5
T A = 125°C
VGS = -3.0V
VGS = -2.8V
0
0
0.5
1
1.5
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 12 Typical Output Characteristic
2
0.08
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
0.07
0.06
0.05
VGS = -4.5V
0.04
VGS = -8.0V
0.03
0.02
0.01
0
0
5
10
15
20
25
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 14 Typical On-Resistance
vs. Drain Current and Gate Voltage
30
1.5
1.3
1.1
VGS = -10V
ID = -10A
0.9
VGS = -4.5V
ID = -5A
0.7
0.5
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 16 On-Resistance Variation with Temperature
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
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1
2
3
4
-VGS, GATE-SOURCE VOLTAGE (V)
Fig. 13 Typical Transfer Characteristic
5
0.10
0.08
TA = 150°C
0.06
TA = 125°C
TA = 85°C
0.04
TA = 25°C
T A = -55°C
0.02
0
0
RDSON, DRAIN-SOURCE ON-RESISTANCE (Ω)
RDSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
1.7
0
TA = 85°C
T A = 25°C
TA = -55°C
5
10
15
20
25
-ID, DRAIN CURRENT (A)
Fig. 15 Typical On-Resistance
vs. Drain Current and Temperature
30
0.10
0.09
0.08
0.07
0.06
VGS = -4.5V
ID = -5A
0.05
0.04
0.03
VGS = -10V
ID = -10A
0.02
0.01
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 17 On-Resistance Variation with Temperature
July 2011
© Diodes Incorporated
3.0
20
2.7
18
2.4
16
-IS, SOURCE CURRENT (A)
-VGS(TH), GATE THRESHOLD VOLTAGE (V)
DMG4511SK4
2.1
1.8
1.5
ID = -250µA
1.2
0.9
12
TA = 25°C
10
8
6
0.6
4
0.3
2
0
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 18 Gate Threshold Variation vs. Ambient Temperature
0
0.2
1,400
0.4
0.6
0.8
1.0
1.2
-VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 19 Diode Forward Voltage vs. Current
10,000
-IDSS, LEAKAGE CURRENT (nA)
f = 1MHz
1,200
CT, TOTAL CAPACITANCE (pF)
14
Ciss
1,000
800
600
400
1,000
T A = 150°C
TA = 125°C
100
TA = 85°C
10
TA = 25°C
Coss
200
Crss
0
1
0
5
10
15
20
25
30
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 20 Typical Total Capacitance
35
5
10
15
20
25
30
35
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 21 Typical Leakage Current vs. Drain-Source Voltage
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RθJA(t) = r(t) * RθJA
RθJA = 80°C/W
D = 0.02
0.01
P(pk)
D = 0.01
t1
t2
T J - T A = P * RθJA(t)
Duty Cycle, D = t1/t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 22 Transient Thermal Response
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DMG4511SK4
Package Outline Dimensions
E
A
b3
c2
L3
A2
D
E1
H
L4
A1
L
4X b2
e
5X b
a
TO252-4L
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b
0.51 0.71 0.583
b2 0.61 0.79 0.70
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
−
−
e
1.27
−
−
E 6.45 6.70 6.58
E1 4.32
−
−
H 9.40 10.41 9.91
L
1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
−
All Dimensions in mm
Suggested Pad Layout
X1
Y1
Y2
Y3
c1
Y
X (4x)
DMG4511SK4
Document number: DS32042 Rev. 4 - 2
Dimensions
c
c1
X
X1
Y
Y1
Y2
Y3
Value (in mm)
1.27
2.54
1.00
5.73
2.00
6.17
1.64
2.66
c
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DMG4511SK4
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
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noted herein may also be covered by one or more United States, international or foreign trademarks.
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
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Document number: DS32042 Rev. 4 - 2
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