STMICROELECTRONICS TDA9106

TDA9106
LOW COST DEFLECTION PROCESSOR
FOR MULTISYNC MONITORS
PRELIMINARY DATA
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VERTICAL
VERTICAL RAMP GENERATOR
50 TO 165Hz AGC LOOP
GEOMETRY TRACKING WITH V-POS & AMP
I2C CONTROLS :
V-AMP, V-POS, S-CORR, C-CORR
2
I C GEOMETRY CORRECTIONS
VERTICAL PARABOLA GENERATOR
(Pincushion, Keystone, Corner Correction,
Top/bottom Corner Correction Balance)
HORIZONTAL DYNAMIC PHASE
(Side Pin Balance & Parallelogram)
HORIZONTAL AND VERTICAL DYNAMIC FOCUS (Horizontal Focus Amplitude, Horizontal
Focus Symmetry)
GENERAL
SYNC PROCESSOR
HOR. & VERT. SYNC OUTPUT FOR MCU
HOR. & VERT. BLANKING OUTPUTS
12V SUPPLY VOLTAGE
8V REFERENCE VOLTAGE
HOR. & VERT. LOCK UNLOCK OUTPUTS
READ/WRITE I 2C INTERFACE
HORIZONTAL MOIRE OR DAC OUTPUT
DESCRIPTION
The TDA9106 is a monolithic integrated circuit assembled in 42 pins shrunk dual in line plastic package. This IC controls all the functions related to the
horizontal and vertical deflection in multimodes or
multi-frequency computer display monitors.
The internal sync processor, combinedwith thevery
powerful geometry correction block are making the
TDA9106 suitable for very high performance monitors with very few external components.
It is particularly well suited for high-end 15” and 17”
monitors.
Combined with ST7275 Microcontroller family,
TDA9206 (Video preamplifier) and STV942x
(On-Screen Display controller) the TDA9106
allows to built fully I2 C bus controlled computer
display monitors, thus reducing the number of
external components to a minimum value.
SHRINK42
(Plastic Package)
ORDER CODE : TDA9106
PIN CONNECTIONS
S/G
1
42
GND
MOIRE
2
41
SDA
PLL1INHIB
3
40
SCL
PLL2C
4
39
5V
HREF
5
38
H/HVIN
HFLY
6
37
HLOCKOUT
HGND
7
36
HOUT
FC2
8
35
VSYNCOUT
FC1
9
34
TEST
C0
10
33
VSYNCIN
R0
11
32
VFOCUS
PLL1F
12
31
EWOUT
HLOCKCAP
13
30
VFLY
HPOS
14
29
VOUT
XRAY
15
28
VDCOUT
HFOCUSCAP
16
27
VCAP
HFOCUS
17
26
VREF
V CC
18
25
VAGCCAP
GND
19
24
VGND
HOUTEM
20
23
VBLKOUT
HOUTCOL
21
22
HBLKOUT
November 1997
This is advance information on a new product now in development or undergoing evaluatio n. Details are subject to change without notice.
9106-01.EPS
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HORIZONTAL
SELF-ADAPTATIVE
DUAL PLL CONCEPT
150kHz MAXIMUM FREQUENCY
X-RAY PROTECTION INPUT
I2C CONTROLS : HORIZONTAL DUTY-CYCLE,
H-POSITION, FREE RUNNING FREQUENCY,
FREQUENCY GENERATOR FOR BURN-IN
MODE
1/30
TDA9106
PIN CONNECTIONS
Name
1
S/G
Function
Sync on green input
2
MOIRE
3
PLL1 INHIB
Moire output
4
PLL2C
Second PLL Loop Filter
5
HREF
Horizontal Section Reference Voltage (to filter)
6
HFLY
Horizontal Flyback Input (positive polarity)
7
HGND
Horizontal Section Ground
8
FC2
VCO Low Threshold filtering Capacitor
9
FC1
VCO High Threshold filtering Capacitor
10
C0
Horizontal Oscillator Capacitor
TTL-Compatible input for PLL1 inhibition
11
R0
12
PLL1F
Horizontal Oscillator Resistor
13
HLOCKCAP
14
HPOS
Horizontal Centering Output (to filter)
15
XRAY
X-RAY protection input (with internal latch function)
16
HFOCUSCAP
17
HFOCUS
18
VCC
First PLL Loop Filter
First PLL Lock/Unlock Time Constant Capacitor
Horizontal Dynamic Focus Oscillator Capacitor
Horizontal Dynamic Focus Output
Supply Voltage (12V Typ)
General Ground (related to VCC)
19
GND
20
HOUTEM
Horizontal Drive Output (internal transistor emitter)
21
HOUTCOL
Horizontal Drive Output (int. trans. open collector)
22
HBLKOUT
Horizontal Blanking Output (see activation table)
23
VBLKOUT
Vertical Blanking Output (see activation table)
24
VGND
25
VAGCCAP
26
VREF
Vertical Section Reference Voltage (to filter)
27
VCAP
Vertical Sawtooth Generator Capacitor
28
VDCOUT
Vertical Position Reference Voltage Output
29
VOUT
Vertical Ramp Output (with frequency independant amplitude and S or C Corrections if any)
30
VFLY
Vertical Flyback Input (positive polarity)
31
EWOUT
East/West Pincushion Correction Parabola Output (with Corner corrections if any)
32
VFOCUS
Vertical Dynamic Focus Output
33
VSYNCIN
TTL-compatible Vertical Sync Input (for separated H&V)
34
TEST
35
VSYNCOUT
36
HOUT
37
HLOCKOUT
38
H/HVIN
Vertical Section Ground
Memory Capacitor for Automatic Gain Control Loop in Vertical Ramp Generator
Not to be used - Test pin
TTL Vertical Sync Output (Extracted VSYNC in case of S/G or TTL Composite HV Inputs)
TTL Horizontal Sync Output (To be used for frequency measurement)
First PLL Lock/Unlock Output (5V unlocked - 0V locked)
TTL-compatible Horizontal Sync Input
39
5V
40
SCL
I2C-Clock input
41
SDA
I C-Data input
42
GND
Ground (Related to 5V)
2/30
Supply Voltage (5V Typ.)
2
9106-01.TBL
Pin
TDA9106
QUICK REFERENCE DATA
Autosynch Frequency (for given R0 and C0)
Value
Unit
15 to 150
kHz
1 to 4.5
FH
± Horizontal Sync Polarity Input
YES
Polarity Detection (on both Horizontal and Vertical Sections)
YES
TTL Composite Synch or Sync on Green
YES
Lock/Unlock Identification (on both Horizontal 1st PLL and Vertical Section)
YES
2
I C Control for H-Position
XRay Protection
I2C Horizontal Duty Adjust
2
I C Free Running Adjustment
± 10
%
YES
30 to 60
%
0.8 to 1.3
F0
Stand-by Function
YES
Two Polarities H-Drive Outputs
YES
Supply Voltage Monitoring
YES
PLL1 Inhibition Possibility
YES
Blanking Outputs (both Horizontal and Vertical)
YES
Vertical Frequency
35 to 200
Hz
Vertical Autosync (for 150nF)
50 to 165
Hz
Vertical S-Correction
YES
Vertical C-Correction
YES
Vertical Amplitude Adjustment
YES
Vertical Position Adjustment
YES
East/West Parabola Output
YES
Pin Cushion Correction Amplitude Adjustment
YES
Keystone Adjustment
YES
Corner and Corner Balance Adjustments
YES
Internal Dynamic Horizontal Phase Control
YES
Side Pin Balance Amplitude Adjustment
YES
Parallelogram Adjustment
YES
Tracking of Geometric Corrections
YES
Reference Voltage (both on Horizontal and Vertical)
YES
Dynamic Focus (both Horizontal and Vertical)
YES
2
YES
2
YES
I C Horizontal Dynamic Focus Amplitude Adjustment
I C Horizontal Dynamic Focus Keystone Adjustment
Type of Input Sync Detection (supplied by 5V Digital Supply)
YES
Horizontal Moiré Output
YES
I2C Controlled H-Moiré Amplitude
YES
Frequency Generator for Burn-in
YES
Fast I2C Read/Write
400
kHz
3/30
9106-02.TBL
Parameter
Horizontal Frequency
7
HGND
1
9106-02.EPS
GND 42
SCL 40
SDA 41
5V 39
TEST 34
VGND 24
V REF 26
VSYNCIN 33
H/HVIN 38
S/G
HOUT 36
VSYNCOUT 35
VBLKOUT 23
HBLKOUT 22
VFLY 30
5
HREF
GND 19
VREF
HFLY
PLL1INHIB
VFLY
PLL1F
I2C INTERFACE
RESET GENERATOR
VREF
BLANKING
GENERATOR
HPOSFILTER
11
S AND C
CORRECTION
9
8
H-SAWTOOTH
GENERATOR
PHASE
SHIFTER
32
29
28
X2
X
Key Bal
6 bits
X2
Spin Bal
6 bits
4
25
VAMP
7 bits
GEOMETRY
TRACKING
PHASE
COMPARATOR
6
27
VERTICAL
OSCILLATOR
RAMP GENERATOR
VPOS
7 bits
Free Running
5 bits
Safe Freq.
2 bits
VCO
10
R0
SYNC
PROCESSOR
6 bits
SYNC INPUT
SELECT
(2 bits)
6 bits
13
HLOCKCAP
LOCK/UNLOCK
IDENTIFICATION
PHASE/FREQUENCY
COMPARATOR
H-PHASE (7 bits)
HLOCKOUT
37
C0
VCAP
14
FC1
VAGCCAP
12
FC2
VDCOUT
VSYNC
HFLY
VOUT
LOCK
PLL2C
VFOCUS
4/30
3
HOUTCOL
HOUT
BUFFER
VSYNC
X
7 bits
X2
6 bits
X2
18 VCC
MOIRE
31 EWOUT
2
17 HFOCUS
15 X-RAY
HFOCUS
16
CAP
TDA9106
CORNER
CORRECTION
(2 x 6 bits)
H-FLY
MOIRE
PROCESSOR
5 BITS
Amp & Keyst
2 x 5 bits
SAFETY
PROCESSOR
H-DUTY
(5 bits)
HOUTEM
21 20
TDA9106
BLOCK DIAGRAM
TDA9106
ABSOLUTE MAXIMUM RATINGS
Parameter
Value
Unit
13.5
V
VCC
Supply Voltage (Pin 18)
VDD
Supply Voltage (Pin 39)
5.7
V
VIN
Max Voltage on Pin 6
Pins 15, 21, 22, 23
Pin 1
Pin 4
Pins 3, 33,34,37,38,40,41
Pin 16
Pins 8, 9, 10, 11, 12, 13, 14, 25, 27, 30
1.8
12
3.6
4
5
6
8
V
V
V
V
V
V
V
2
kV
VESD
ESD susceptibility
Human Body Model,100pF Discharge through 1.5kΩ
EIAJ Norm,200pF Discharge through 0Ω
300
V
Tstg
Storage Temperature
-40, +150
o
C
Tj
Junction Temperature
+150
o
C
0, +70
o
C
Toper
Operating Temperature
9106-03.TBL
Symbol
Symbol
Rth (j-a)
Parameter
Value
Junction-ambient Thermal Resistance
Max.
Unit
o
65
C/W
9106-04.TBL
THERMAL DATA
SYNCHRO PROCESSOR
Operating Conditions
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
5
Unit
HsVR
Horizontal Sync Input Voltage
Pin 38
0
MinD
Minimum Horizontal Input Pulses Duration
Pin 38
0.7
V
Mduty
Maximum Horizontal Input Signal Duty Cycle
Pin 38
VsVR
Vertical Sync Input Voltage
Pin 33
0
VSW
Minimum Vertical Sync Pulse Width
Pin 33
5
VSmD
Maximum Vertical Sync Input Duty Cycle
Pin 33
15
%
VextM
M a xi m um V e rt i ca l S yn c W i d th on T T L
H/Vcomposite or S/G
Pins 1, 38
750
µs
Max.
Unit
µs
25
5
%
V
µs
Electrical Characteristics (VDD = 5V, Tamb = 25oC)
Parameter
Test Conditions
Min.
Typ.
VSGDC
S/G Clamped DC Level
Pin 1, I1 = -1µA
1
V
ISGbias
Internal Diode Bias Current
Pin 1, V1 = 1.6V
10
µA
VSGTh
Slicing Level (see application design choice)
Pin 1
0.2
VINTH
H o r iz on t al a n d V ert i cal I npu t V o lta ge
(Pins 33,38)
Low Level
High Level
RIN
Horizontal and Vertical Pull-Up Resistor
Pins 33,38
200
kΩ
VOut
Output Voltage (Pins 35,36,37)
Low level
High Level
0
5
V
V
TfrOut
Falling and Rising Output CMOS Buffer
Pins 35,36,37
Cout = 20pF
100
ns
VHlock
Horizontal 1st PLL Lock Output Status (Pin 37)
Locked
Unlocked
0
5
V
V
VoutT
Extracted Vsync Integration Time (% of TH) on
H/V Composite or S/G
Pin 35, C0 = 820pF
35
%
V
0.8
2.2
26
V
V
5/30
9106-05.TBL
Symbol
TDA9106
I2C READ/WRITE
Electrical Characteristics (VDD = 5V,Tamb = 25oC)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
I2C PROCESSOR
Fscl
Maximum Clock Frequency
Pin 40
400
kHz
Tlow
Low period of the SCL Clock
Pin 40
1.3
µs
Thigh
High period of the SCL Clock
Pin 40
0.6
µs
Vinth
SDA and SCL Input Threshold
Pins 40,41
VACK
Acknowledge Output Voltage on SDA input with 3mA
Pin 41
2.2
V
0.4
V
Max.
Unit
See also I2C Table Control and I2C Sub Address Control
HORIZONTAL SECTION
Operating Conditions
Symbol
Parameter
Test Conditions
Min.
Typ.
VCO
R0(Min.)
Minimum Oscillator Resistor
Pin 11
6
C0(Min.)
Minimum Oscillator Capacitor
Pin 10
390
F(Max.)
Maximum Oscillator Frequency
kΩ
pF
150
kHz
OUTPUT SECTION
I6m
HOI1
HOI2
Maximum Input Peak Current
Pin 6
2
mA
Horizontal Drive Output Maximum Current
Pin 20
Pin 21
Sourced current
Sunk current
20
20
mA
mA
Electrical Characteristics (VCC = 12V, Tamb = 25oC)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
SUPPLY AND REFERENCE VOLTAGES
VCC
Supply Voltage
Pin 18
10.8
12
13.2
VDD
Supply Voltage
Pin 39
4.5
5
5.5
ICC
Supply Current
Pin 18
IDD
50
V
mA
Supply Current
Pin 39
VREF-H
Horizontal Reference Voltage
Pin 5, I = 5mA
7.4
8
8.6
VREF-V
Vertical Reference Voltage
Pin 5, I = 5mA
7.4
8
8.6
V
IREF-H
Max. Sourced Current on VREF-H
Pin 5
5
mA
IREF-V
Max. Sourced Current on VREF-V
Pin 26
5
mA
6/30
mA
V
9106-05.TBL
5
TDA9106
HORIZONTAL SECTION (continued)
Electrical Characteristics (VCC = 12V, Tamb = 25oC) (continued)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
1st PLL SECTION
HpolT
Polarity Integration Delay
VVCO
VCO Control Voltage (Pin12)
0.75
VREF-H = 8V
f0
fH(Max.)
ms
VREF-H / 6
6.2
V
V
Vcog
VCO Gain (Pin 12)
R0 = 6.49kΩ, C0 = 820pF,
dF/dV = 1/11R0C0
17
kHz/V
Hph
Horizontal Phase Adjustment
% of Horizontal Period
±10
%
Horizontal Phase Decoupling Output
Minimum Value
Typical Value
Maximum Value
Sub-Address 01, Pin 14
Byte x1111111
Byte x1000000
Byte x0000000
2.8
3.4
4.0
V
V
V
Free Running Frequency
R0 = 6.49kΩ, C0 = 820pF,
f0 = 0.97/8R0C 0
22.3
kHz
-150
ppm/C
0.8
1.3
F0
F0
Hphmin
Hphtyp
Hphmax
f0
dF0/dT
f0(Min.)
f0(Max.)
CR
PLLinh
SFF
FC1
FC2
Free Running Frequency Thermal Drift
(No drift on external components)
Free Running Frequency Adjustment
Minimum Value
Maximum Value
Sub-Address 02
Byte xxx11111
Byte xxx00000
PLL1 Capture Range
R0 = 6.49kΩ, C0 = 820pF,
from f0+0.5kHz to 4.5F0
fH(Min.)
fH(Max.)
PLL1 Inhibition (Pin3)
Safe Forced Frequency
SF1 Byte 11xxxxxx
SF2 Byte 10xxxxxx
VCO Sawtooth Level
High FC1=(4.VREF-H)/5
Low FC2=(VREF-H)/5
Typ Threshold = 1.6V
PLL ON
PLL OFF
23.5
kHz
kHz
0.8
V
V
100
2
Sub-Address 02
2F0
3F0
Pin 9 To filter
Pin 8 To filter
6.4
1.6
V
V
0.75
V
TBD
ppm
30
60
%
%
FBth
Hjit
Flyback Input Threshold Voltage (Pin 6)
0.65
Horizontal Jitter (see Pins 8-9 filtering)
Sub-Address 00
HDmin
HDmax
Horizontal Drive Output Duty-Cycle
(Pin 20 or 21) (see Note 1)
Low Level
High Level (see Note 2)
XRAYth
X-RAY Protection Input Threshold Voltage
Pin 15
8
V
Vphi2
Internal Clamping Levels on 2nd PLL Loop
Filter (Pin 4)
Low Level
High Level
1.6
4.0
V
V
VSCinh
Threshold Voltage To Stop H-Out,V-Out
when V CC < VSCinh
Pin 18
7.5
V
IHblk
Maximum Horizontal Blanking Output
Current
I22
VHblk
Horizontal Blanking Output Low Level
(Blanking ON)
V22 with I22 = 10mA
HDvd
HDem
Horizontal Drive Output
Low Level (Pin 20 to GND)
High Level (Pin 21 to VCC=12V)
Byte xxx11111
Byte xxx00000
V21-V20, IOUT = 20mA
V20, IOUT = 20mA
9.5
10
mA
0.25
0.5
V
1.1
10
1.7
V
V
Notes : 1. Duty Cycle is the ratio of power transistor OFF time to period. Power transistor is OFF when output transistor is OFF.
2. Initial Condition for Safe Operation Start Up (Max. duty cycle).
7/30
9106-05.TBL
2nd PLL SECTION AND HORIZONTAL OUTPUT SECTION
TDA9106
HORIZONTAL SECTION (continued)
Electrical Characteristics (VCC = 12V, Tamb = 25oC) (continued)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
HORIZONTAL DYNAMIC FOCUS SECTION
HDFst
Horizontal Dynamic Focus Sawtooth
Minimum Level
Maximum Level
HfocusCap = C0 = 820pF,
fH = 90kHz, Pin 16
HDFdis
Horizontal Dynamic Focus Sawtooth
Discharge Width
Driven by Hfly
HDFDC
Bottom DC Output Level
RLOAD = 10kΩ, Pin 17
TDHDF
DC Output Voltage Thermal Drift
HDFamp
Horizontal Dynamic Focus Amplitude
Min Byte xxx11111
Typ Byte xxx10000
Max Byte xxx00000
Sub-Address 03, Pin 17,
fH = 90kHz, Keystone Typ
Horizontal Dynamic Focus Keystone
Sub-Address 04,
fH = 90kHz, Typ Amp
B/A
A/B
A/B
HDFKeyst
Min A/B Byte xxx11111
Typ Byte xxx10000
Max A/B Byte xxx00000
2
4.7
V
V
500
ns
2
V
200
ppm/C
1
1.5
3
VPP
VPP
VPP
3.5
1.0
3.5
MOIRE OUTPUT
Minimum Output Resistor
Pin 2
VMOIRE
Output Voltage (moire off),
Subaddress 0F
Pin 2, RMOIRE = 2kΩ
Byte 0xx00000
Byte 0xx10000
Byte 0xx11111
8/30
2
kΩ
0.2
1.1
2.0
V
V
V
9106-05.TBL
R MOIRE
TDA9106
VERTICAL SECTION
Operating Conditions
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
6.5
V
OUTPUTS SECTION
VEWM
Maximum EW Output Voltage
Pin 31
VEWm
Minimum EW Output Voltage
Pin 31
1.8
VDFm
Minimum Vertical Dynamic Focus Output Voltage
Pin 32
1.8
V
R LOAD
Minimum Load for less than 1% Vertical Amplitude Drift
Pin 25
65
MΩ
V
Electrical Characteristics (VCC = 12V, Tamb = 25oC)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VERTICAL RAMP SECTION
Voltage at Ramp Bottom Point
VREF-V=8V, Pin 27
2
V
VRT
Voltage at Ramp Top Point (with Sync) VREF-V
Pin 27
5
V
VRTF
Voltage at Ramp Top Point (without Sync)
Pin 27
VRT0.1
V
VSTD
Vertical Sawtooth Discharge Time Duration
(Pin 27)
With 150nF Cap
80
µs
VFRF
Vertical Free Running Frequency
(see Notes 3 & 4)
COSC (Pin 27) = 150nF
Measured on Pin27,
100
Hz
ASFR
AUTO-SYNC Frequency
C27 = 150nF ±5%
See Note 5
RAFD
Ramp Amplitude Drift Versus Frequency
at Maximum Vertical Amplitude
C27 = 150nF
50Hz < f and f < 165Hz
200
Rlin
Ramp Linearity on Pin 27 (see Notes 3 & 4)
2.5 < V27 and V27 < 4.5V
0.5
Vpos
Vertical Position Adjustment Voltage (Pin28)
Sub Address 06
Byte x0000000
Byte x1000000
Byte x1111111
3.2
3.5
3.8
IVPOS
Max Current on Vertical Position Output
Pin 28
VOR
Vertical Output Voltage
(peak-to-peak on Pin 29)
Sub Address 05
Byte x0000000
Byte x1000000
Byte x1111111
DC Voltage on Vertical Output
See Note 6, Pin 29
VoutDC
50
3.65
165
Hz
TBD
ppm/Hz
%
3.3
±2
3.5
2.25
3
3.75
V
V
V
mA
2.5
V
V
V
3.5
V
VOI
Vertical Output Maximum Current (Pin29)
±5
mA
dVS
Max Vertical S-Correction Amplitude
x0xxxxxx inhibits S-CORR
x1111111 gives max S-CORR
Subaddress 07
∆V/VPP at T/4
∆V/VPP at 3T/4
-4
+4
%
%
Vertical C-Corr Amplitude
x0xxxxxx inhibits C-CORR
SubAddress 08
Byte x1000000
Byte x1100000
Byte x1111111
-3
0
3
%
%
%
Ccorr
VflyTh
Vertical Flyback Threshold
Pin 30
VflyInh
Inhibition of Vertical Flyback Input
See Note 7, Pin 30
1
7.5
V
V
Notes : 3. With Register 07 at Byte x0xxxxxx (Vertical S-Correction Control) then the S correction is inhibited, consequently the sawtooth has
a linear shape.
4. With Register 08 at Byte x0xxxxxx (Vertical C - Correction Control) then the C correction is inhibited, consequently the sawtooth
has a linear shape.
5. It is the frequency range for which the VERTICAL OSCILLATOR will automatically synchronize, using a single capacitor value on
Pin 27 and with a constant ramp amplitude.
6. VOUTDC = (7/16).VREF-V. Typically 3.5V for Vertical reference voltage typical value (8V).
7. When Pin 30 ( VREF-V) - 0.5V, Vfly input is inhibited and vertical blanking on vertical blanking output is replaced by vertical sawtooth
discharge time.
9/30
9106-05.TBL
VRB
TDA9106
VERTICAL SECTION (continued)
Electrical Characteristics (VCC = 12V, Tamb = 25oC) (continued)
Symbol
Parameter
Test Conditions
Min.
Typ. Max.
Unit
EAST/WEST FUNCTION
EWDC
DC Output Voltage with Typ Vpos,Keystone,
Corner and Corner Balance Inhibited
Pin 31, see Figure 1
2.5
V
TDEWDC
DC Output Voltage Thermal Drift
See Note 8
100
ppm/C
EWpara
Parabola Amplitude with Vamp Max, V-Pos Typ,
Keystone, Corner and Corner Balance Inhibited
Subaddress 09
Byte 1x111111
Byte 1x100000
Byte 1x000000
2.6
1.4
0
V
V
V
Parabola Amplitude Function of V-AMP Control
(tracking between V-AMP and E/W) with Typ Vpos,
Keystone, Corner and Corner Balance Inhibited,
EW Typ Amplitude (see Note 9)
Subaddress 05
Byte 10000000
Byte 11000000
Byte 11111111
0.45
0.8
1.4
V
V
V
Keystone Adjustment Capability with Typ Vpos,
Corner and Corner Balance Inhibited, EW Inhibited
and Vertical Amplitude Max
(see Note 9 and Figure 4)
Subaddress 0A
Byte 10000000
Byte 11111111
1
1
VPP
VPP
Intrinsic Keystone Function of V-POS Control
(tracking between V-POS and EW) with Corner and
Corner Balance Inhibited, EW Max Amplitude and
Vertical Amplitude Max (see Note 9)
A/B Ratio
B/A Ratio
Subaddress 06
Max Corner Correction Amplitude with Vamp Max,
V-POS Typ, EWamp, Keystone and Corner
Balance Inhibited (see Note 9)
Subaddress 0B
∆EWout at T/6, 5T/6
Byte x1111111
Byte x1000000
+0.2
-0.2
V
V
Max Corner Balance Correction Amplitude with
Vamp Max, V-POS Typ, EWamp, Keystone and
Corner Inhibited
Subaddress 0C (see Note 9)
Byte 01111111
∆EWout at T/4
∆EWout at 3T/4
+0.2
-0.2
V
V
Byte 01000000
∆EWout at T/4
∆EWout at 3T/4
-0.2
+0.2
V
V
EWtrack
KeyAdj
KeyTrack
Corner
Max
Corner
BalMax
Byte x0000000
Byte x1111111
0.5
0.5
SPBpara
SPBtrack
ParAdj
Partrack
Side Pin Balance Parabola Amplitude (Figure 2)
with Vamp Max, V-POS Typ and Parallelogram
Inhibited (see Notes 9 & 10)
Subaddress 0D
Byte x1111111
Byte x1000000
+2.8
-2.8
%TH
%TH
Side Pin Balance Parabola Amplitude function of
Vamp Control (tracking between Vamp and SPB)
with SPB Max, V-POS Typ and Parallelogram
Inhibited (see Notes 9 & 10)
Subaddress 05
Byte 10000000
Byte 11000000
Byte 11111111
1.0
1.8
2.8
%TH
%TH
%TH
Parallelogram Adjustment Capability with Vamp
Max, V-POS Typ and SPB Inhibited
(see Notes 9, 10 & 11)
Subaddress 0E
Byte x1111111
Byte x1000000
+2.8
-2.8
%TH
%TH
Intrinsic Parallelogram Function of Vpos Control
(tracking between V-Pos and DHPC) with Vamp
Max, SPB Max and Parallelogram Inhibited
(see Notes 9 & 10)
A/B Ratio
B/A Ratio
Subaddress 06
Byte x0000000
Byte x1111111
Notes : 8. These parameters are not tested on each unit. They are measured during our internal qualification
9. Refers to Notes 3 & 4 from last section.
10.TH is the Horizontal PLL Period Duration.
11.Figure 2 is representing effect of dynamic horizontal phase control.
10/30
0.5
0.5
9106-05.TBL
INTERNAL HORIZONTAL DYNAMIC PHASE CONTROL FUNCTION
TDA9106
VERTICAL SECTION (continued)
Electrical Characteristics (VCC = 12V, Tamb = 25oC) (continued)
Symbol
Parameter
Test Conditions
Min.
Typ. Max.
Unit
VERTICAL DYNAMIC FOCUS FUNCTION
VDFDC
DC Output Voltage with V-Pos Typ
See Figure 3
6
V
DC Output Voltage Thermal Drift
See Note 12
100
ppm/C
VDFAMP
Parabola Amplitude Function of Vamp (tracking
between Vamp and VDF) with V-Pos Typ
(see Figure 3) (see Note 13)
Subaddress 05
Byte 10000000
Byte 11000000
Byte 11111111
0.9
1.6
2.5
V
V
V
Parabola Assymetry Function of VPos Control
(tracking between V-Pos and VDF) with Vamp Max.
(see Note 13)
Subaddress 06
Byte x0000000
Byte x1111111
0.5
0.5
VDFKEY
9106-05.TBL
TDVDFDC
Notes : 12. Parameter not tested on each unit but measured during our internal qualification procedure including batches coming from corners
of our process and also temperature characterization
13. S and C corrections are inhibited so the output sawtooth has a linear shape.
Figure 1 : E/W Output
Figure 2 :
Dynamic Horizontal Phase Control
Output
B
B
SPBPARA
9106-03.EPS
EWPARA
A
EWDC
Figure 3 : Vertical Dynamic Focus Function
Figure 4 :
DHPCDC
9106-04.EPS
A
Keystone Effect on E/W Output
(PCC Inhibited)
A
B
Keyadj
9106-06.EPS
VDFAMP
9106-05.EPS
VDFDC
11/30
TDA9106
TYPICAL VERTICAL OUTPUT WAVEFORMS
Function
Sub
Address
Pin
Byte
Specification
Picture Image
2.25V
10000000
Vertical Size
05
29
3.75V
11111111
Vertical
Position
DC
Control
06
28
x0000000
x1000000
x1111111
3.2V
3.5V
3.8V
x0xxxxxx
Inhibited
Vertical
S
Linearity
07
∆V
29
x1111111
VPP
x1000000
Vertical
C
Linearity
08
VPP
∆V
∆V = 3%
V PP
29
∆V
x1111111
VPP
∆V = 3%
V PP
12/30
9106-06.TBL / 9106-07.EPS TO 9106-13.EPS
∆V = 4%
V PP
TDA9106
GEOMETRY OUTPUT WAVEFORMS
Function
Sub
Address
Pin
Byte
Specification
EWamp
Typ.
3.75V
2.75V
10000000
Trapezoid
Control
0A
Picture Image
2.5V
31
3.75V
2.75V
11111111
2.5V
Keystone
Inhibited
Pin Cushion
Control
1x000000
09
2.5V
0V
31
2.5V
1x111111
SPB
Inhibited
x1000000
0E
x1111111
Parallelogram
Inhibited
Side Pin
Balance
Control
2.8% TH
3.7V
2.8% TH
3.7V
2.8% TH
X10000000
0D
Internal
2.8% TH
x1111111
Vertical
Dynamic
Focus
3.7V
Internal
9106-07.TBL / 9106-14.EPS TO 9106-22.EPS
Parrallelogram
Control
3.7V
6V
32
2.5V
13/30
TDA9106
GEOMETRY OUTPUT WAVEFORMS (continued)
Sub
Address
Pin
Byte
EWamp
Typ.
Specification
Corner
effect
without
Corner
x1111111
Corner Control
0B
31
01000000
EWamp
Typ.
10000000
Corner Balance
Control
0C
Picture Image
Corner
effect
Corner
effect
31
Corner
effect
11111111
Note : The specification of output voltage is indicated on 3.75VPP vertical sawtooth output condition.The output voltage depends on vertical
sawtooth output voltage.
14/30
9106-07.TBL / 9106-23.EPS TO 9106-30.EPS
Function
TDA9106
I2C BUS ADDRESS TABLE
Sub Address Definition
Slave Address (8C) : Write Mode
D8
D7
D6
D5
D4
D3
D2
D1
0
x
x
x
x
0
0
0
0
Horizontal Drive Selection / Horizontal Duty Cycle
1
x
x
x
x
0
0
0
1
Horizontal Position
2
x
x
x
x
0
0
1
0
Safety Frequency / Free Running Frequency
3
x
x
x
x
0
0
1
1
Synchro Priority / Horizontal Focus Amplitude
4
x
x
x
x
0
1
0
0
Refresh / Horizontal Focus Keystone
5
x
x
x
x
0
1
0
1
Vertical Ramp Amplitude
6
x
x
x
x
0
1
1
0
Vertical Position Adjustment
7
x
x
x
x
0
1
1
1
S Correction
8
x
x
x
x
1
0
0
0
C Correction
9
x
x
x
x
1
0
0
1
E/W Amplitude
A
x
x
x
x
1
0
1
0
E/W Keystone
B
x
x
x
x
1
0
1
1
Cbow Corner
C
x
x
x
x
1
1
0
0
Spin Corner
D
x
x
x
x
1
1
0
1
Side Pin Balance
E
x
x
x
x
1
1
1
0
Parallelogram
F
x
x
x
x
1
1
1
1
Moire Control Amplitude
Slave Address (8D) : Read Mode
0
D8
D7
D6
D5
D4
D3
D2
D1
x
x
x
x
0
0
0
0
Synchro and Polarity Detection
15/30
TDA9106
I2C BUS ADDRESS TABLE (continued)
Table : Register Map
D8
D7
D6
D5
D4
D3
D2
D1
[0]
[0]
[0]
[0]
[0]
[0]
WRITE MODE
00
Blk Sel
1, Blk
[0]
01
Xray
1, reset
[0]
02
Safety Frequency
1, on
1, F0 x 2
[0], off
[0], F0 x 3
03
04
05
HDrive
0, off
[1], on
[0]
Vramp
0, off
[1], on
[1]
[1]
C Select
1, on
[0]
08
[0]
[0]
[0]
[0]
[0]
Free Running Frequency
[0]
[0]
[0]
Horizontal Focus Amplitude
[1]
[0]
[0]
[0]
[0]
Horizontal Focus Keystone
[1]
[0]
[0]
[0]
[0]
Vertical Ramp Amplitude Adjustment
[1]
S Select
1, on
[0]
07
[0]
Horizontal Phase Adjustment
Sync Priority
0, Vextr
0, S/G
[1], Vin
[1], H/V
Detect
Refresh
[0], off
06
09
EW Sel
0, off
[1]
0A
EW Key
0, off
[1]
[1]
0B
Test H
1, on
[0], off
Cbow Sel
1, on
[0]
0C
Test V
1, on
[0], off
Spin Sel
1, on
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
Vertical Position Adjustment
[0]
[0]
[0]
S Correction
[0]
[0]
[1]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
[0]
C Correction
[1]
[0]
[1]
[0]
[0]
[0]
East/West Amplitude
[0]
East/West Keystone
0D
SPB Sel
0, off
[1]
0E
Parallelo
0, off
[1]
0F
Horizontal Duty Cycle
[0]
[0]
[0]
Cbow Corner
[1]
[0]
[0]
[0]
Spin Corner
[1]
[0]
[0]
[0]
Side Pin Balance
[1]
[0]
[0]
[0]
Parallelogram
[1]
Moire
1, on
[0], off
[0]
[0]
[0]
Moire Control
[0]
[0]
[0]
READ MODE
00
Hlock
0, on
[1], no
[ ] initial value
16/30
Vlock
0, on
[1], no
Xray
1, on
[0], off
Polarity Detection
H/V pol
V pol
[1], negative [1], negative
Vext det
[0], no det
Synchro Detection
H det
V det
[0], no det
[0], no det
TDA9106
OPERATING DESCRIPTION
I - GENERAL CONSIDERATIONS
I.1 - Power Supply
The typical values of the power supply voltages
VCC and VDD are respectively 12V and 5V. Perfect
operationis obtained if VCC and VDD are maintened
in the limits : 10.8 to 13.2V and 4.5 to 5.5V.
In order to avoid erratic operation of the circuit
during transient phase of VCC switching on, or
switching off, the value of VCC is monitored and the
outputsof the circuit are inhibited if VCC is less than
7.5V typically.
In the same manner,VDD is monitored and internal
set-up is made until VDD reaches 4V (see I2C
Control Table for power on reset).
In order to have a verygood powersupply rejection,
the circuit is internally powered by several internal
voltage references (the unique typical value of
which is 8V). Two of these voltage references are
externally accessible, one for the vertical part and
one for the horizontal one. If needed,these voltage
references can be used (until load is less than
5mA).Furthermore it is necessary to filter the a.m.
voltage references by the use of external capacitor
connectedto ground,in order to minimize the noise
and consequently the “jitter” on vertical and horizontal output signals.
I.2 - I2C Control
TDA9106 belongs to the I2C controlled device family, instead of being controlled by DC voltages on
dedicated control pins, each adjustment can be
realized through the I2C Interface.
The I2C bus is a serial bus with a clock and a data
input. Thegeneral functionand thebus protocolare
specified in the Philips-bus data sheets.
The interface (Data and Clock) is TTL-level compatible. The internal threshold level of the input
comparator is 2.2V (when VDD is 5V). Spikes of up
to 50ns are filtered by an integrator and maximum
clock speed is limited to 400kHz.
The data line (SDA) can be used in a bidirectional
way that means in read-mode the IC clocks out a
reply information (1 byte) to the micro-processor.
The bus protocol prescribes always a full-byte
transmission. The first byte after the start condition
is used to transmit the IC-address(7 bits-8C) and
the read/write bit (0 write - 1 read).
I.3 - Write Mode
In write mode the second byte sent contains the
subaddress of the selected function to adjust (or
controlsto affect)and the thirdbyte the corresponding data byte.It is possible to send more than one
data byte to the IC. If after the third byte no stop or
start condition is detected, the circuit increments
automatically the momentary subaddress in the
subaddress counter by one (auto-increment
mode). So it is possible to transmit immediately the
next data bytes without sending the IC address or
subaddress.It can be useful so as to reinitialize the
whole controls very quickly (flash manner). This
procedure can be finished by a stop condition.
The circuit has 16 adjustment capabilities: 3 for
Horizontal part, 4 for Vertical one, 2 for E/W correction, 2 for original Corner correction, 2 for the
Dynamic Horizontal phase control,1 for Moire option and 2 for Horizontal Dynamic Focus.
20 bits are also dedicated to several controls
(ON/OFF, Horizontal Safety Frequency, Synchro
Priority, Detection Refresh and Xray reset).
I.4 - Read Mode
During read mode the second byte transmits the
reply information.
The reply byte contains Horizontal and Vertical
Lock/Unlock status, Xray activated or not, the Horizontal and Vertical polarity detection. It also contains Synchro detection status that is useful for µP
to assign Sync priority.
A stop condition always stops all activities of the
bus decoder and switches the data and the clock
line (SDA and SCL) to high impedance.
2
See I C Subaddress and control tables.
I.5 - Synchro Processor
The internal Sync Processor allows the TDA9106
to accept any kind of input synchro signals :
- separated Horizontal & Vertical TTL-compatible
sync signals,
- composite Horizontal &Vertical TTL-compatible
sync signals,
- sync on green or composite video signal.
17/30
TDA9106
OPERATING DESCRIPTION (continued)
H/V det
V det
Sync priority
Subaddress 03
D8
D7
Figure 5
1.6V
R
C
S/G
1
1kΩ
IREF (Typ.)
= 10µA
Comment
TDA9106
Synchro type
Yes
Yes
1
1
Separated H & V
Yes
No
0
1
Composite TTL
H&V
No
No
0
0
Sync on Green
Of course, when choice is done, one can refresh
the synchro detections and verify that extracted
Vsync is present and that no synchro type change
occured.
Synchro processor is also giving synchro polarity
information.
I.7 - IC status
TheIC can inform the MCUeither the 1st Horizontal
PLLor Vertical sectionare locked or not, and if Xray
has been activated.
This last status permits to the MCU :
- reset the Xray internal latch decreasing the VCC
supply
- directly reset throw the I2C interface.
18/30
I.8 - Synchro Inputs
Both H/HVin and Vsyncin inputs are TTL compatible trigger with Hysterisis to avoid erratic detection.
It includes pull up resistor to VDD.
Vertical sync extractor is included for composite
sync or composite video.Applicationengineer must
adapt resistor R and capacitor C dedicated to its
application.
Resistor R is fixed by detection threshold wanted :
R < (VTHRESHOLD / IREF)
Then C is determined by maximum pulse width to
detect (in general, vertical sync width) :
RC > (max pulse width)
I.9 - Synchro Processor Outputs
Synchro processor delivers on 3 TTL-compatible
CMOS outputs the following signals :
- Hout as follow :
Sync Mode
Separated
TTL Composite
S/G
Hout Mode
Horizontal
TTL Composite
Composite
Hout Polarity
Same as Input
Same as Input
Negative
- Vsyncout is either vertical extracted pulse output
or Vsyncin input. It keeps the input polarity.
- Hlockoutis theHorizontal1st PLLstatus: 0Vwhen
locked. It permits MCU to adjust free running
frequency and optimizes the IC performance.
9106-31.EPS
I.6 - Sync Identification Status
TDA9106 is able to feed back to the MCU (thanks
to I2C) the Sync input status (sync identification) so
that the MCU can chooseSync priority throughI 2C.
As extracted Vertical sync pulse is performedwhen
choice already occured and when 12V is supplied,
we recommend to use the deviceas following :(that
means that even in Power management mode the
IC is able to inform MCU on detected synchro
signals due to its 5V supply).
First, refresh Synchrodetection by I2C. Then check
the status of H/V det and Vdet by I2C read.
Sync priority choice should be :
Table 1 : Sync Priority Choice
TDA9106
OPERATING DESCRIPTION (continued)
II - HORIZONTAL PART
II.1 - Internal Input Conditions
system when PLL1 is locked avoiding Horizontal
too fast frequency change.
The dynamic behaviour of the PLL is fixed by an
external filter which integrates the current of the
charge pump. A “CRC” filter is generally used (see
Figure 8).
Horizontal part is internally fed by synchro processor with a digital signal. corresponding to horizontal
synchro pulses or to TTL composite input.
Concerning the duty cycle of the input signal, the
following signals (positive or negative) may be
applied to the circuit.
Using internal integration, both signals are recognized on condition that Z/T < 25%. Synchronization
occurs on the leading edge of the internal sync
signal. The minimum value of Z is 0.7µs.
Figure 8
PLL1F
12
9106-32.EPS
9106-34.EPS
Figure 6
An other integration is able to extract vertical pulse
of composite synchroif duty cycle is more than 25%
(typically d = 35%).
Figure 7
TRAMEXT
d
d
The last feature performed is the equalizing pulses
removing to avoid parasitic pulses on phase comparatorinput which is intolerent to wrongor missing
pulse.
II.2 - PLL1
The PLL1 is composed of a phase comparator, an
external filter and a voltage controlled oscillator
(VCO).
The phase comparator is a “phase frequency”type
designed in CMOS technology. This kind of phase
detector avoids locking on false frequencies. It is
followed by a “charge pump”, composed of two
current sources sunk and sourced (I = 1mA Typ.
when locked, I = 140µA when unlocked). This
difference between lock/unlock permits a smooth
catching of horizontal frequency by PLL1. This
effectis reinforcedby an internal originalslow down
9106-33.EPS
C
PLL1 is internally inhibited during extractedvertical
sync (if any) to avoid taking in account missing
pulses or wrong pulses on phase comparator.The
inhibition results from the opening of a switch located between the charge pump and the filter (see
Figure 9). For particular synchro type, MCU can
drive Pin 3 to high level (TTL compatible input) to
inhibit PLL1. It can also be used to avoid PLL1
locking on synchro inputs if a “dangerous”mode is
detected by the MCU.
The VCO uses an external RC network. It delivers
a linear sawtooth obtained by charge and discharge of the capacitor, by a current proportionnal
to the current in the resistor. Typical thresholds of
sawtooth are 1.6V and 6.4V. These two levels are
accessible to be filtered as on Figure 10 to improve
jitter.
The control voltage of the VCO is typically comprised between 1.33V and 6V (see Figure 10). The
theorical frequency range of this VCO is in the ratio
1 to 4.5, the effective frequency range has to be
smaller 1 to 4.2 due to clamp intervention on filter
lowest value. To avoid spread of external components and the circuit itself, it is possible to adjust
free running frequency through I2C. This adjustment can be made automatically on the manufacturing line without manual operation by using
Hlock/unlock information. The adjustment range is
0.8 to 1.3 F0 (where 1.3 F0 is the free running
frequency at power on reset).
The synchro frequency has to be always higher
than the free running frequency. As an example for
a synchro range from 24kHz to 100kHz, the suggested free running frequency is 23kHz.
19/30
TDA9106
OPERATING DESCRIPTION (continued)
Figure 9 : PLL1 Block Diagram
H-LOCKCAP
PLL1INHIB PLL1F
LOCK/UNLOCK
STATUS
13
S/G
1
LOCKDET
VSYNCIN 33
3
12
R0
C0
11
10
TRAMEXT SMFE *
High
SYNC
PROCESSOR
H/HVIN 38
CHARGE
PUMP
COMP1
E2
PLL
INHIBITION
VCO
Low
H-POS
OSC
14
I2C
HPOS
Adj.
PHASE
ADJUST
* SMFE : Safety Frequency Mode Enable
9106-35.EPS
TRAMEXT
Figure 10 : Details of VCO
I2C Free Running
Adjustment
I0
9
2
a
6.4V
RS
FLIP FLOP
I0
Loop
Filter 12
47nF
8
1.6V
(0.80 < a < 1.30)
47nF
4 I0
11
10
6.4V
C0
9106-36.EPS
R0
1.6V
0 0.875T T
An other feature is the capability for MCU to force
horizontal frequency through I2C to 2xF0 or 3xF0
(for burn in mode or safety requirement).In this
case, inhibition switch is opened leaving PLL1 free
but voltage on PLL1 filter is forced to 2.66Vfor 2xF0
or 4.0V for 3xF0.
The PLL1 ensures the coincidence between the
leading edge of the synchro signal and a phase
reference obtained by comparison between the
sawtooth of the VCO and an internal DC voltage
I2C adjustable between 2.8V and 4.0V (corresponding to ± 10%) (see Figure 11). This voltage
has to be filtered on Pin 14 so as to optimize jitter.
The TDA9106 also includes a Lock/Unlock identification block which senses in real time wheither
PLL1 is locked on the incoming horizontal sync
signal or not. The resulting information is available
on Hlockout (see Synchro Processor). The block
function is described in Figure 12.
The NOR1 gate is receiving the phase comparator
output pulses (which also drive the charge pump).
When PLL1 is locked, on point A there is a very
small negative pulse (about 100ns) at each hori20/30
zontal cycle, so after RC filter, there is a high level
on Pin 13 which forces Hlockout to low level. Hysterisis comparator detects locking when Pin 13 is
reaching 6.5V and unlocking when Pin 13 is decreasing to 6.0V.
Figure 11 : PLL1 Timing Diagram
H Osc
Sawtooth
7/8TH
1/8TH
6.4V
2.8V<Vb<4.0V
Vb
1.6V
Phase REF1
H Synchro
Phase REF1 is obtained by comparison between the sawtooth and
a DC voltage adjustable between 2.8V and 4.0V. The PLL1 ensures the exact coincidence between the signals phase REF and
HSYNS. A ± T/10 phase adjustment is possible.
9106-37.EPS
(1.3V < V12 < 6V)
TDA9106
OPERATING DESCRIPTION (continued)
Figure 12 : LOCK/UNLOCK Block Diagram
5V
37 HLOCKOUT
From
Phase
Comparator
20kΩ H-Lock CAP
13
6.5V
220nF
NOR1
B
9106-38.EPS
A
6V
When PLL1 is unlocked, the 100ns negative pulse
on A becomes much larger and consequently the
average level on Pin 13 decreases. It forces Hlockout to go high.
The Pin 13 status is approximately the following :
- near 0V when there is no H-Sync
- between 0 and 4V with H-Sync frequency different from VCO
- between 4 to 8 V when VCO frequency reaches
H-Sync one (but not already in phase)
- near 8V when PLL1 is locked.
It is important to notice that Pin 13 is not an
output pin but is only used for filtering purpose
(see Figure 12).
The lock/unlock information is also available throw
I2C read.
The phase comparator of PLL2 (phase type comparator) is followed by a charge pump with ± 0.5mA
(typ.) output current.
The flyback input is composed of an NPN transistor. This input must be current driven. The maximum rec omma nd ed input current is 2mA
(see Figure 14).
II.3 - PLL2
The PLL2 ensures a constant position of the
shaped flyback signal in comparion with the sawtooth of the VCO (Figure 13).
The duty cycle is adjustable through I2C from 30%
to 60%. For Start Up safe operation, initial duty
cycle (after Power on reset) is 60% so as to avoid
too long conduction of BU transistor.
Maximum storage time is about 43.75% - (Tfly/2.TH).
Typically, Tfly/TH is around20% thatmeansTs max is
around 33.75%.
Figure 14 : Flyback Input Electrical Diagram
400Ω
7/8TH
9106-40.EPS
20kΩ
GND 0V
Figure 13 : PLL2 Timing Diagram
H Osc
Sawtooth
Q1
HFLY 6
1/8TH
6.4V
4.0V
1.6V
Flyback
Internally
Shaped Flyback
H Drive
Duty Cycle
The duty cycle of H-drive is adjustable between 30% and 60%.
9106-39.EPS
Ts
II.4 - Output Section
The H-drive signal is transmitted to the output
through a shaping block ensuring Ts and I2C adjustable duty cycle. In order to secure scanning
power part operation, the output is inhibited in the
following circumstances :
- VCC too low
- Xray protection activated
- During horizontal flyback
- I2C bit control (voluntary inhibition by MCU).
The output stage is composedof a NPN Darlington
bipolar transistor. Both the collector and the emittor
are accessible (see Figure 16).
Theoutput Darlington is in off-statewhen the power
scanning transistor is also in off-state.
21/30
TDA9106
OPERATING DESCRIPTION (continued)
Figure 16 : Output stage simplified diagram,
showing the two possibilities of
connection
An interfacehas to be designed between the circuit
and the power transistor which can be of bipolar or
MOS type.
21 VCC
II.5 - X-RAY Protection
The activation of the X-Ray protection is obtained
by application of a high level on the X-Ray input
(Pin 15 > 8V). The consequenciesof X-Ray protection are :
- inhibition of H-Drive output
- activation of horizontal blanking output.
- activation of vertical blanking output.
The reset of this protection is obtained either by
VCC switch off or I2C resetby MCU (see Figure 17).
H-DRIVE
20
VCC
21
9106-41.EPS
H-DRIVE
20
The maximum output current is 20mA, and the
correspondingvoltagedrop of theoutput darlington
is 1.1V typically.
It is evident that the power scanning transistor
cannot be directly driven by the integrated circuit.
II.6 - Horizontal Dynamic Focus
TDA9106 delivers an horizontal parabola wave
form on Pin 17. This parabola is performed from a
sawtoothin phase with flybackpulse.Thissawtooth
is present on Pin 16 where the horizontal focus
capacitor is the same as C0 to obtain a controlled
amplitude (from 2 to 4.7V typically).
Symmetry (keystone) and amplitude areI 2C adjustable (see Figure 18).This signal has to be connected to the CRT focusing grids and mixed with
vertical dynamic focus.
Figure 17 : Safety Functions Block Diagram
VCC Checking
I2C Drive on/off
HORIZONTAL
OUTPUT
INHIBITION
VCC
Ref
XRAY Protection
VCC off or I C Reset
S
R
Horizontal Flyback
I2C Blanking
0.7V
HORIZONTAL
BLANKING
OUTPUT
I2C SFME
Horizontal Unlock
Horizontal Free Running Detection
Vertical Flyback
Vertical Sync
Vertical Sawtooth Retrace
Vertical Free Running Status
Vertical Unlock
I2C Ramp on/off
22/30
VERTICAL
OUTPUT
INHIBITION
Q
LOGIC
BLOCK
VERTICAL
BLANKING
OUTPUT
9106-42.EPS
XRAY
2
I2C Ramp on/off
TDA9106
OPERATING DESCRIPTION (continued)
Figure 18
Horizontal Flyback
Internal Trigged
Horizontal Flyback
4.7V
Horizontal Focus
Cap Sawtooth
2V
Moire Output
9106-43.EPS
Horizontal Dynamic
Focus Parabola
Output
400ns
2V
II.7 - Moire Output
The moire output is intented to correct a beat
between horizontal video pixel period and actual
CRT pixel width.
of PLL2 capacitor where this “controlled jitter” frequency type will directly affect the horizontal position.The amplitude of the signal is I2C adjustable.
The moire signal is a combinationof Horizontal and
Vertical frequency signals.
One point to notice is :
- in case H-Moire is not necessary in the application, H-Moire output (Pin 2) can be turned to as a
5 bits digital to analog converter output (0.3V to
2.2V V output voltage),
- in case of no use in application, this pin must be
left high impedance(or resistor to ground).
To achieve a moire cancellation, it has to be connected to any point on the chassis controlling the
horizontalposition.We recommend to introducethis
“ Horizontal Controlled Jitter” on the relative ground
Figure 19 : Moire Function Block Diagram
H-SYNC
Ck
Q
D Rst Q
23
Monostable
Ck
D
Q
Q
9106-44.EPS
V-SYNC
Figure 20 : Moire Output Waveform
EVEN FRAME
H
V
MOIRE
ODD FRAME
H
9106-45.EPS
V
MOIRE
23/30
TDA9106
OPERATING DESCRIPTION (continued)
III - VERTICAL PART
III.1 - Geometric Corrections
The principle is represented in Figure 21.
Starting from the vertical ramp, a parabola shaped
current is generated for E/W correction, dynamic
horizontal phase control correction, and vertical
dynamic Focus correction.
The base of the parabola generator is an analog
multiplier the output current of which is equal to :
∆I = k ⋅ (VOUT - VDCOUT)2
Where Vout is the vertical output ramp, typically
comprised between 2 and 5V, Vdcout is the vertical
DC output adjustable in the range 3.2V ≥ 3.8V in
order to generatea dissymetric parabolaif required
(keystone adjustment).
Corner and Corner Balance corrections may be
added to the E/W one. These are respectively 3rd
and 2nd order waveforms.
In order to keep a good screen geometry for any
end user preferences adjustment we implemented
the “geometry tracking”.
Due to large output stages voltage range (E/W,
FOCUS), the combination of tracking function with
maximum vertical amplitude max or min vertical
position and maximum gain on the DAC control
may lead to the output stages saturation. This must
be avoided by limiting the output voltage by apropriate I2C registers values.
For E/Wpart and Dynamic Horizontal phase control
part, a sawtooth shaped differential current in the
following form is generated :
∆I’ = k’ ⋅ (VOUT - VDCOUT)2
Then ∆I and ∆I’ are added together and converted
into voltage for the E/W part.
Each of the four E/W components or the two Dynamic Horizontal phase control ones may be inhibited by their own I2C select bit.
The E/W parabolais availableon Pin 31 by the way
of an emitter follower which has to be biased by an
external resistor (10kΩ). It can be DC coupled with
external circuitry.
The output connection of the vertical Dynamic Focus is the same as the E/W one.
This reverse parabola is available on Pin 32.
Dynamic Horizontal phase control current drives
internally the H-position, moving the Hfly position
on the Horizontal sawtooth in the range ± 2.8% Th
both on SidePin Balance and Parallelogram.
Figure 21 : Geometric Corrections Principle
2
32
VDCOUT
Vertical Dynamic
Focus Output
Vertical Ramp VOUT
EW amp
VDCIN
Keystone
31
EW Output
Vertical Ramp VOSC
Corner
VMID
VDCOUT
Corner Balance
Sidepin amp
To Horizontal
Phase
Sidepin Balance
Output Current
Parallelogram
24/30
9106-46.EPS
VDCOUT
TDA9106
OPERATING DESCRIPTION (continued)
III.4 - Vertical Dynamic Focus
VFOCOUT = 6V - 0.7 (VOUT - VDCOUT)2
No adjustment is available for this part except by
means of tracking.
III.2 - EW
2
EWOUT = 2.5V + K1 (VOUT - VDCOUT)
+ K2 (VOUT - VDCOUT)
+ K3 (VOUT - VDCOUT)2 |VOSC - VMID|
+ K4 (VOUT - VDCOUT) |VOSC - VMID|
III.5 - Vertical Sawtooth Generator
The vertical part generates a fixed amplitude ramp
which can be affectedby S and C correctionshape.
Then, the amplitudeof this ramp is adjustedto drive
an external power stage (see Figure 22).
The internal reference voltage used for the vertical
part is available between Pin 26 and Pin 24. Its
typical value is :
V26 = VREF = 8V
The charge of the external capacitor on Pin 27
(VCAP) generates a fixed amplituderamp between
the internal voltages, Vl (Vl = VREF/4) and VH (VH =
5/8 x VREF).
VOSC is the ramp Pin 27 and VMID the middle of it,
typically 3.5V
K1 is adjustable by EW amplitude I2C register
K2 is adjustable by Keystone I2C register
K3 is adjustable by Cbow Corner I2C register
K4 is adjustable by Spin Corner I2C register
III.3 - Dynamic Horizontal Phase Control
IOUT = K5 (VOUT - VDCOUT)2 + K6 (VOUT - VDCOUT)
K5 is adjustable by SidePin Balance I2C register
K6 is adjustable by Parallelogram I2C register
Figure 22 : Vertical Part Block Diagram
CHARGE CURRENT
TRANSCONDUCTANCE
AMPLIFIER
REF
27
S/G 1
25
VSYNCIN 33
SYNC
PROCESSOR
SAMPLING
SAMP.
CAP
S CORRECTION
OSCILLATOR
VS_AMP
SUB07/6bits
POLARITY
COR_C
SUB08/6bits
C CORRECTION
Vlow
Corner
SUB0B/6bits
Corner Balance
SUB0C/6bits
Sawth.
Disch.
29 VERT_OUT
VERT_AMP
SUB05/7bits
CORNER
PARABOLA
GENERATOR
31 EW_OUT
EW_CENT EW_AMP
SUB0A/6bitsSUB09/6bits
SPB_OUT
Internal Signal to PLL2
PARAL
SUB0E/6bits
SPB_AMP
SUB0D/6bits
9106-47.EPS
H/HVIN 38
OSC
CAP
DISCH.
32 V_FOCUS
25/30
TDA9106
OPERATING DESCRIPTION (continued)
When the synchronization pulse is not present, an
internal current source sets the free running frequency. For an external capacitor, COSC = 150nF,
the typical free running frequency is 106Hz.
Typical free running frequency can be calculated
by :
1
f0 (Hz) = 1.6 e−5 ⋅
COSC
A negative or positive TTL level pulse applied on
Pin 33 (VSYNC) as well as a TTL composite sync
on Pin 38 or a Sync on Green signal on Pin 1 can
synchronise the ramp in the range [fmin , fmax].
This frequency range depends on the external
capacitor connected on Pin 27. A capacitor in the
range [150nF, 220nF] ± 5% is recommanded for
application in the following range : 50Hz to 120Hz.
Typical maximum and minimum frequency, at 25oC
and without any correction (S correction or C correction), can be calculated by :
f(Max.) = 2.5 x f0 and f(Min.) = 0.33 x f0
If S or C corrections are applied, these values are
slighty affected.
If a synchronization pulse is applied, the internal
oscillator is automaticaly synchronized but the amplitude is no more constant. An internal correction
is activated to adjust it in less than a half a second
: the highest point of the ramp (Pin 27) is sampled
on the sampling capacitor connected on Pin 25 at
each clock pulse and a transconductanceamplifier
generates the charge current of the capacitor. The
ramp amplitude becomes again constant and frequency independant.
The read status register enables to have the vertical Lock-Unlock and the vertical Sync Polarity informations.
It is recommandedto use a AGC capacitor with low
leakage current. A value lower than 100nA is mandatory.
Good stability of the internal closed loop is reached
by a 470nF ± 5% capacitor value on Pin 25 (VAGC).
Pin 30, VFLY is the vertical flyback input used to
generate the vertical blanking signal on Pin 23. If
Vfly is not used, (VREF - 0.5), at minimum, must be
connected to this input.
In such case, the vertical blanking output will be
activated by the vertical sync input signal and re-
26/30
setted by the end of vertical sawtooth discharging
pulse.
III.6 - I2C Control Adjustments
Then, S and C correction shapes can be added to
this ramp. This frequency independent S and C
corrections are generated internally. Their amplitude are adjustable by their respective I2C register.
They can also be inhibited by their Select bit.
At the end, the amplitude of this S and C corrected
ramp can be adjusted by the vertical ramp amplitude control register.
The adjusted ramp is available on Pin 29 (VOUT) to
drive an external power stage.
The gain of this stage is typically 25% depending
on its register value.
The DC value of this ramp is kept constant in the
frequency range, for any correction applied on it.
its typical value is VMID = 7/16 ⋅ VREF.
A DC voltage is available on Pin 28 (VDCOUT). It
is driven by its own I2C register (vertical Position).
Its value is VDCOUT = 7/16 ⋅ VREF ± 300mV.
So the VDCOUT voltage is correlated with DC value
of VOUT. It increases the accuracy when temperature varies.
III.7 - Basic Equations
In first approximation,the amplitude of the ramp on
Pin 29 (Vout) is :
VOUT - VMID = (VOSC - VMID) ⋅ (1 + 0.25 (VAMP))
with VMID = 7/16 ⋅ VREF ; typically 3.5V, the middle
value of the ramp on Pin 27
VOSC = V27 , ramp with fixed amplitude
VAMP is -1 for minimum vertical amplitude register
value and +1 for maximum
On Pin 28 (VDCOUT), the voltage (in volts) is calculated by :
VDCOUT = VMID + 0.3 (VPOS)
with VPOS equals -1 for minimum vertical position
register value and +1 for maximum
The current available on Pin 27 is :
3
IOSC = ⋅ VREF ⋅ COSC ⋅ f
8
with COSC : capacitor connected on Pin 27
f : synchronization frequency
TDA9106
APPLICATION DIAGRAMS
Figure 23 : Demonstration Board
+12V
CC2
10µF
ICC1 - MC14528
CC1
100nF
J16
1
J15
+5V
CC4
V CC 16
1 TA1
47pF
+12V
2 TA2
TB1 15
3 CDA
TB2 14
4 IA
CDB 13
5 IA
IB 12
IB 11
7 QA
QB 10
8 GND
QB 9
J14
IC3 - STV9422
CC3
PC1
47kΩ
47pF
C45
10µF
24 PWM7
22pF C40
R39
4.7kΩ
+12V
+12V
C44
10pF
R22
C26
1.5kΩ
1µF
R42
100Ω
22pF
IC2
TDA9106
R41
100Ω
R49
22kΩ
+5V
1
R48
1kΩ
R29
4.7kΩ
SYNC/G
GNDD 42
R44
2
MOIRE
SDA 41
10kΩ
PWM0 1
23 PWM6
PWM1 2
22 TEST
FBLK 3
21 B
VSYNC 4
20 G
HSYNC 5
19 R
V DD 6
18 GND
PXCK 7
17 RST
CKOUT 8
16 SDA
XTALOUT 9
15 SCL
J13
10kΩ
PLLINH
SCL 40
L2 10µH
+5V
C43
47µF
C7
X1
8MHz
XTALIN 10
4
PLL2C
+5V 39
JP1
R20
C7
10Ω
22nF
14 PWM5
PWM2 11
13 PWM4
PWM3 12
1
TILT
TP9
3
C42
1µF
R43
C39
+5V
J10
6 QA
1
4
3
2
1
PC2
47kΩ
33pF
C7
33pF
L1 10µH
+5V
C30
100µF
C32
100nF
TP1
HREF
J11
R10
10kΩ
R35
10kΩ
5
C25
33pF
C33
100nF
HREF
HSYNC
H/HVIN 38
C27
47µF
TP17
6
HFLY
7
HGND
HLOCKOUT 37
TP10
HOUT 36
TP11
C16
220pF
R30
10kΩ
R31
C22
33pF
J8
R8
10kΩ
1
27kΩ
+12V
TP15
8
HFLY
C21
FC2
9
FC1
R15
1kΩ
R17
270kΩ
Q1 Q2
BC557
TEST 34
J12
10 C0
820pF
5%
R9
470Ω
R18
39kΩ
Q3
TIP122
TP16
R23
11 R0
E/W POWER STAGE
V_FOCUS
V_FOCUS 32
6.49kΩ
1%
J2
R28 10kΩ
10nF
12 PLL1F
1
D2
1N4148
EWOUT 31
C14
470µF
D1
1N4004
C31 R36 1.8kΩ
+12V
C9
100nF
-12V
R32
13 HLOCKCAP
VFLY 30
C18
100µF
36V
4.7kΩ
220nF
1
J3
TP8
4.7µF
C17
E/W
220pF
R33
4.7kΩ
TP17
VSYNCIN 33
R38
2.2Ω 1W
C11
VSYNC
C28
J1
R19
270kΩ
1
R34
1kΩ
47nF
C13
R37
27kΩ
C36
1µF
TP12
VSYNCOUT 35
C23
47nF
R16
TP7
15kΩ
1µF
J7
12kΩ
VREF
15 XRAYIN
VDCOUT 28
R45
C34
V_FOCUS
820pF
16 H_FOCUSC
17 H_FOCUS
1kΩ
150nF
VERTICAL
DEFLECTION
STAGE
C15
+12V
C5
100µF
VREF
VREF 26
R24
10kΩ
C6
100nF
18 VCC
VAGCCAP 25
470nF
19 GND
C2
100nF
R5
21 HOUTCOL
H_BLKOUT 22
+ 12V
R21
3.9kΩ
TP2
TP8
HBLK
VBLK
R27
3.9kΩ
3
5
C1
220nF
C10
-12V 470µF
C8
100nF
R11
220Ω
1/2W
R47
T1
82Ω 3W
G5676-00
L3 10µH
+12V
C20
1µF
R13
1kΩ
C35
HORIZONTAL
DRIVER
STAGE
V YOKE
R4
1Ω
1/2W
5.6kΩ
100nF
V_BLKOUT 23
IC1
TDA8172
4
R3
1.5Ω
C3
47µF
VGND 24
20 HOUTEM
6
C41
470pF
12kΩ
R25
1
1
C12
VCAP 27
33kΩ
7
R1
TP5
J18
1
2
3
2
C4
R2
5.6kΩ
100nF
33kΩ
1
DYNAMIC
FOCUS J9
R40
R7
10kΩ
TP14
XRAYIN
VOUT 29
Q5
BC547
R6
10Ω
Q4
BC557
C19
100µF
63V
+24V J17
1
2
3
HDRIVE
STD Q6
5N20
R12
560Ω
R14
22kΩ
C24
1nF
TP3 TP4
1
J6
27/30
9106-48.EPS
C29
R45
14 HPOS
TDA9106
APPLICATION DIAGRAMS (continued)
9106-49.EPS
Figure 24 : PCB Layout
28/30
TDA9106
APPLICATION DIAGRAMS (continued)
9106-50.EPS
Figure 25 : Components Layout
29/30
TDA9106
PACKAGE MECHANICAL DATA
42 PINS - PLASTIC SHRINK DIP
E
A2
A
L
A1
E1
B
B1
e
e1
e2
D
c
E
42
22
.015
0,38
e3
21
e2
SDIP42
Dimensions
A
A1
A2
B
B1
c
D
E
E1
e
e1
e2
e3
L
Min.
0.51
3.05
0.38
0.89
0.23
36.58
15.24
12.70
2.54
Millimeters
Typ.
3.81
0.46
1.02
0.25
36.83
13.72
1.778
15.24
3.30
Max.
5.08
4.57
0.56
1.14
0.38
37.08
16.00
14.48
18.54
1.52
3.56
Min.
0.020
0.120
0.0149
0.035
0.0090
1.440
0.60
0.50
0.10
Inches
Typ.
0.150
0.0181
0.040
0.0098
1.450
0.540
0.070
0.60
0.130
Max.
0.200
0.180
0.0220
0.045
0.0150
1.460
0.629
0.570
0.730
0.060
0.140
Information furni shed is believed to be accurate and reliable. However, SGS-THOMSON Micr oelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise und erany patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This pu blication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
 1997 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I 2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco
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30/30
SDIP42.TBL
1
PMSDIP42.EPS
Gage Plane