MITSUBISHI MGF1601B

< High-power GaAs FET (small signal gain stage) >
MGF1601B
S to X BAND / 0.15W
non - matched
DESCRIPTION
The MGF1601B, medium-power GaAs FET with an N-channel
Schottky gate, is designed for use in S to X band amplifiers and
oscillators. The hermetically sealed metalceramic package assures
minimum parasitic lasses, and has a configuration suitable for
microstrip circuits.
FEATURES
 High linear power gain
Glp=8.0dB @f=8GHz
 High P1dB
P1dB=21.8dBm(TYP.) @f=8GHz
APPLICATION
 S to X Band medium-power amplifiers and oscillators
QUALITY
 GG
RECOMMENDED BIAS CONDITION
 VDS=6V,Id=100mA Refer to Bias Procedure
Keep Safety first in your circuit designs!
Absolute maximum ratings
Symbol
VGDO
VGSO
ID
IGR
IGF
PT
Tch
Tstg
(Ta=25C)
Parameter
Gate to drain breakdown voltage
Gate to source breakdown voltage
Drain current
Reverse gate current
Forward gate current
Total power dissipation
Cannel temperature
Storage temperature
Electrical characteristics
Symbol
Mitsubishi Electric Corporation puts the maximum
effort into making semiconductor products better
and more reliable , but there is always the
possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal
injury , fire or property damage. Remember to give
due consideration to safety when making your
circuit designs , with appropriate measure such
as (I) placement of substitutive , auxiliary circuits ,
(ii) use of non-flammable material or (iii) prevention
against any malfunction or mishap.
Ratings
Unit
-8
-8
250
-0.6
1.5
1.2
175
-65 to +175
V
V
mA
mA
mA
W
C
C
(Ta=25C)
Parameter
Test conditions
V(BR)GDO
V(BR)GSO
Gate to drain breakdown voltage
Ig=200A
Gate to source breakdown voltage
Ig=200A
IGSS
IDSS
VGS(off)
gm
GLP
P1dB
Rth(ch-c)
Gate to source leakage current
VDS=0V,VGS=-3V
VDS=3V,VGS=0V
VDS=3V,ID=100A
VDS=3V,ID=100mA
VDS=6V,ID=100mA,f=8GHz
VDS=6V,ID=100mA,f=8GHz
ΔVf method
Saturated drain current
Gate to source cut-off voltage
Transconductance
Linear Power Gain
Output power at 1dB gain compression
Thermal resistance *1
*1:Channel to ambient
Publication Date : Apr., 2011
1
Limits
Unit
Min.
Typ.
Max.
-8
-8
150
-1.5
70
6
20.8
-
200
90
8
21.8
-
20
250
-4.5
125
V
V
A
mA
V
mS
dB
dBm
℃/W
< High-power GaAs FET (small signal gain stage) >
MGF1601B
S to X BAND / 0.15W
non - matched
MGF1601B TYPICAL CHARACTERISTICS
(Ta=25C)
Publication Date : Apr., 2011
2
< High-power GaAs FET (small signal gain stage) >
MGF1601B
S to X BAND / 0.15W
non - matched
MGF1601B
S PARAMETERS(Ta=25C,VD=6V,ID=100mA)
Publication Date : Apr., 2011
3
< High-power GaAs FET (small signal gain stage) >
MGF1601B
S to X BAND / 0.15W
non - matched
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors
may lead to personal injury, fire or property damage. Remember to give due consideration to safety when
making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
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© 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
Publication Date : Apr., 2011
4