June/2004 MITSUBISHI SEMICONDUCTOR <GaAs FET> MGF4953A/MGF4954A SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package) DESCRIPTION Outline Drawing The MGF4953A/MGF4954A super-low noise HEMT (High Electron Mobility Transistor) is designed for use in C to K band amplifiers. The lead-less ceramic package assures minimum parasitic losses. FEATURES Low noise figure @ f=12GHz MGF4953A : NFmin. = 0.40dB (Typ.) MGF4954A : NFmin. = 0.60dB (Typ.) Fig.1 High associated gain @ f=12GHz Gs = 13.5dB (Typ.) MITSUBISHI Proprietary APPLICATION Not to be reproduced or disclosed without permission by Mitsubishi Electric C to K band low noise amplifiers QUALITY GRADE GG RECOMMENDED BIAS CONDITIONS VDS=2V , ID=10mA ORDERING INFORMATION Tape & reel 3000pcs./reel Keep Safety first in your circuit designs! ABSOLUTE MAXIMUM RATINGS Symbol VGDO (Ta=25°C ) Ratings Unit Gate to drain voltage -4 V Gate to source voltage -4 V ID Drain current 60 mA PT Tch Total power dissipation 50 mW Channel temperature 125 °C Tstg Storage temperature -65 to +125 °C VGSO Parameter ELECTRICAL CHARACTERISTICS Synbol V(BR)GDO Parameter (Ta=25°C ) Test conditions Unit TYP. MAX -3 -- -- VGS=-2V,VDS=0V -- -- 50 µA VGS=0V,VDS=2V 15 -- 60 mA -0.1 -- -1.5 V -- 70 -- mS 12.0 13.5 -- dB MGF4953A -- 0.40 0.50 dB MGF4954A -- 0.60 0.80 dB IG=-10µA IGSS Gate to source leakage current IDSS Saturated drain current Gate to source cut-off voltage VDS=2V,ID=500µA gm Transconductance VDS=2V,ID=10mA Gs Associated gain VDS=2V, Minimum noise figure ID=10mA f=12GHz NFmin. Limits MIN. Gate to drain breakdown voltage VGS(off) Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable , but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury , fire or property damage. Remember to give due consideration to safety when making your circuit designs , with appropriate measure such as (I) placement of substitutive , auxiliary circuits , (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. V MITSUBISHI (1/5) June/2004 June/2004 MITSUBISHI SEMICONDUCTOR <GaAs FET> MGF4953A/MGF4954A SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package) Fig.1 Unit : mm Top Side ➀ ➁ ➂t © s➁ s ➁ ç B 0 2EG © r ➀ r s t ➂ s ➁ Bottom ç ç ç ç Square shape electrode is Drain from "A" side view rw Gate sw Source tw Drain MITSUBISHI (2/5) June/2004 June/2004 MITSUBISHI SEMICONDUCTOR <GaAs FET> MGF4953A/MGF4954A SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package) TYPICAL CHARACTERISTICS ID V S . V GS ID vs . V DS 60 Ta=25 ` Ta=25 DRAIN CURRENT ID(mA) V GS =-0.1V /STEP ` V D S=2V §_®y ID(m A ) 50 40 y DRAIN CURRENT ID(mA) §_® w ID(m A ) (Ta=25°C) 30 20 10 0 0 1 2 3 4 Fö -1.0 5 t VOLTAGE ww V DS (V ) VDS(V) DRAIN§_®¶x· TO SOURCE %o;0n ,o -0.5 Fö 0.0 V GS(V ) VGS(V) GATE TO SOURCE VOLTAGE NF & Gs V S. ID (MGF4953A ) ` Ta=25 f =12GHz V D S=2V )U ¸ ¨ÊÑç 0( )U F$ ASSOCIATED GAIN Gs(dB) ¸ 0 NF (dB) NOISE FIGURE NF(dB) y ID (mA ) ID(mA) DRAIN CURRENT §_® MITSUBISHI (3/5) June/2004 June/2004 MITSUBISHI SEMICONDUCTOR <GaAs FET> MGF4953A/MGF4954A SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package) S PARAMETERS Freq (GHz) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 (Ta=25°C,VDS=2V,ID=10mA) S11 (mag) 0.911 0.894 0.875 0.858 0.830 0.797 0.770 0.751 0.727 0.713 0.686 0.636 0.590 0.538 0.507 0.506 0.552 0.625 0.696 0.745 0.791 0.794 0.776 0.802 0.796 0.799 S21 (ang) -12.7 -29.2 -40.7 -53.9 -66.5 -77.7 -87.0 -94.2 -103.0 -110.8 -119.9 -132.8 -146.6 -165.8 170.2 140.8 110.4 86.0 65.9 50.8 38.2 28.2 18.4 11.0 2.9 -8.5 NOISE PARAMETERS f (GHz) 4 8 12 14 18 20 (mag) 4.924 4.806 4.796 4.672 4.524 4.308 4.114 3.984 3.886 3.881 3.886 3.937 4.078 4.163 4.239 4.238 4.067 3.791 3.428 3.045 2.677 2.281 1.984 1.828 1.626 1.424 S12 (ang) 168.1 155.3 142.7 131.6 121.2 109.5 101.1 90.8 81.4 75.0 66.0 54.7 45.0 31.5 18.9 4.5 -10.5 -26.5 -40.5 -54.3 -66.5 -76.2 -84.5 -93.8 -102.1 -114.5 (mag) 0.008 0.031 0.043 0.061 0.066 0.073 0.080 0.089 0.090 0.101 0.110 0.120 0.127 0.136 0.144 0.151 0.151 0.145 0.137 0.118 0.109 0.102 0.091 0.078 0.071 0.064 S22 (ang) 70.3 68.8 62.2 49.4 42.9 33.5 26.2 22.1 17.4 9.2 2.2 -4.6 -13.0 -25.2 -35.8 -48.2 -62.0 -74.0 -85.8 -97.6 -106.8 -114.0 -118.9 -127.7 -130.2 -138.3 (mag) 0.709 0.691 0.682 0.652 0.639 0.631 0.628 0.625 0.624 0.628 0.612 0.581 0.540 0.485 0.396 0.283 0.159 0.076 0.164 0.271 0.375 0.455 0.539 0.607 0.675 0.730 (ang) -10.7 -22.7 -30.1 -41.7 -49.6 -58.5 -64.4 -71.0 -76.1 -80.4 -87.5 -94.3 -101.0 -112.5 -122.4 -137.3 -162.3 120.8 54.1 31.6 20.9 14.3 8.5 5.7 2.1 0.9 (Ta=25°C,VDS=2V,ID=10mA) Gamma-opt Magn. Angle 0.64 52.7 0.61 103.5 0.55 146.4 0.51 161.9 0.41 175.3 0.35 -177.3 Rn (ohm) 0.27 0.15 0.06 0.04 0.03 0.05 NFmin. (dB) 0.22 0.28 0.35 0.39 0.48 0.55 Gs (dB) 18.3 15.9 13.5 12.5 11.0 10.5 Note) Rn is normalized by 50-ohm Gate Source Reference Point Reference Point Drain Source MITSUBISHI (4/5) June/2004 June/2004 MITSUBISHI SEMICONDUCTOR <GaAs FET> MGF4953A/MGF4954A SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package) Requests Regarding Safety Designs Mitsubishi Electric constantly strives to raise the level of its quality and reliability. Despite these concerted efforts, however, there will be occasions when our semiconductor products suffer breakdowns, malfunctions or other problems. In view of this reality, it is requested that every feasible precaution be taken in the pursuit of redundancy design, malfunction prevention design and other safety-related designs, to prevent breakdowns or malfunctions in our products from resulting in accidents involving people, fires, social losses or other problems, thereby upholding the highest levels of safety in the products when in use by customers. Matters of Importance when Using these Materials 1. These materials are designed as reference materials to ensure that all customers purchase Mitsubishi Electric semiconductors best suited to their specific use applications. Please be aware, however, that the technical information contained in these materials does not comprise consent for the execution or use of intellectual property rights or other rights owned by Mitsubishi Electric Corporation. 2. 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Accordingly these products have not been designed and manufactured with the purpose of application in machinery or systems that will be used under conditions that can affect human life, or in machinery or systems used in social infrastructure that demand a particularly high degree of reliability. When considering the use of the products described in these materials in transportation machinery (automobiles, trains, vessels), for objectives related to medical treatment, aerospace, nuclear power control, submarine repeaters or systems or other specialized applications, please consult with Mitsubishi Electric directly or an authorized dealer. 7. When considering use of products for purposes other than the specific applications described in these materials, please inquire at Mitsubishi Electric or an authorized dealer. 8. The prior consent of Mitsubishi Electric in writing is required for any reprinting or reproduction of these materials. 9. Please direct any inquiries regarding further details of these materials, or any other comments or matters of attention, to Mitsubishi Electric or an authorized dealer. MITSUBISHI (5/5) June/2004