SEMICONDUCTOR TECHNICAL DATA " ! L SUFFIX CERAMIC CASE 620 The MC14521B consists of a chain of 24 flip–flops with an input circuit that allows three modes of operation. The input will function as a crystal oscillator, an RC oscillator, or as an input buffer for an external oscillator. Each flip–flop divides the frequency of the previous flip–flop by two, consequently this part will count up to 224 = 16,777,216. The count advances on the negative going edge of the clock. The outputs of the last seven–stages are available for added flexibility. P SUFFIX PLASTIC CASE 648 • All Stages are Resettable • Reset Disables the RC Oscillator for Low Standby Power Drain • RC and Crystal Oscillator Outputs Are Capable of Driving External Loads • Test Mode to Reduce Test Time • VDD′ and VSS′ Pins Brought Out on Crystal Oscillator Inverter to Allow the Connection of External Resistors for Low–Power Operation • Supply Voltage Range = 3.0 Vdc to 18 Vdc • Capable of Driving Two Low–power TTL Loads or One Low–power Schottky TTL Load over the Rated Temperature Range. D SUFFIX SOIC CASE 751B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ORDERING INFORMATION MC14XXXBCP MC14XXXBCL MC14XXXBD TA = – 55° to 125°C for all packages. MAXIMUM RATINGS* (Voltages Referenced to VSS) Symbol VDD Vin, Vout Iin, Iout PD Tstg Parameter Value Unit – 0.5 to + 18.0 V Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V Input or Output Current (DC or Transient), per Pin ± 10 mA Power Dissipation, per Package† 500 mW – 65 to + 150 _C DC Supply Voltage Storage Temperature Plastic Ceramic SOIC PIN ASSIGNMENT TL Lead Temperature (8–Second Soldering) 260 _C * Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C Q24 1 16 VDD RESET 2 15 Q23 VSS′ 3 14 Q22 OUT 2 4 13 Q21 VDD′ 5 12 Q20 IN 2 6 11 Q19 OUT 1 7 10 Q18 VSS 8 9 IN 1 BLOCK DIAGRAM RESET 2 Output 9 IN 1 STAGES 1 THRU 17 6 IN 2 7 OUT 1 5 VDD′ 4 3 OUT2 VSS′ STAGES 18 THRU 24 Q18 Q19 Q20 Q21 Q22 Q23 Q24 VDD = PIN 16 VSS = PIN 8 10 11 12 13 14 15 Q18 Q19 Q20 Q21 Q22 Q23 Q24 Count Capacity 218 = 262,144 219 = 524,288 220 = 1,048,576 221 = 2,097,152 222 = 4,194,304 223 = 8,388,608 224 = 16,777,216 1 REV 3 1/94 MOTOROLA Motorola, Inc. 1995 CMOS LOGIC DATA MC14521B 1 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) Characteristic Symbol Output Voltage Vin = VDD or 0 – 55_C 25_C 125_C VDD Vdc Min Max Min Typ # Max Min Max Unit “0” Level VOL 5.0 10 15 — — — 0.05 0.05 0.05 — — — 0 0 0 0.05 0.05 0.05 — — — 0.05 0.05 0.05 Vdc “1” Level VOH 5.0 10 15 4.95 9.95 14.95 — — — 4.95 9.95 14.95 5.0 10 15 — — — 4.95 9.95 14.95 — — — Vdc 5.0 10 15 — — — 1.5 3.0 4.0 — — — 2.25 4.50 6.75 1.5 3.0 4.0 — — — 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 — — — 3.5 7.0 11 2.75 5.50 8.25 — — — 3.5 7.0 11 — — — Source Pins 4 & 7 5.0 5.0 10 15 – 1.2 – 0.25 – 0.62 – 1.8 — — — — – 1.0 – 0.2 – 0.5 – 1.5 – 1.7 – 0.36 – 0.9 – 3.5 — — — — – 0.7 – 0.14 – 0.35 – 1.1 — — — — (VOH = 2.5 Vdc) Source (VOH = 4.6 Vdc) Pins 1, 10, (VOH = 9.5 Vdc) 11, 12, 13, 14 (VOH = 13.5 Vdc) and 15 5.0 5.0 10 15 – 3.0 – 0.64 – 1.6 – 4.2 — — — — – 2.4 – 0.51 – 1.3 – 3.4 – 4.2 – 0.88 – 2.25 – 8.8 — — — — – 1.7 – 0.36 – 0.9 – 2.4 — — — — mAdc IOL 5.0 10 15 0.64 1.6 4.2 — — — 0.51 1.3 3.4 0.88 2.25 8.8 — — — 0.36 0.9 2.4 — — — mAdc Input Current Iin 15 — ± 0.1 — ± 0.00001 ± 0.1 — ± 1.0 µAdc Input Capacitance (Vin = 0) Cin — — — — 5.0 7.5 — — pF Quiescent Current (Per Package) IDD 5.0 10 15 — — — 5.0 10 20 — — — 0.005 0.010 0.015 5.0 10 20 — — — 150 300 600 µAdc IT 5.0 10 15 Vin = 0 or VDD Input Voltage “0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) VIL “1” Level VIH (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Vdc Vdc IOH Sink Total Supply Current**† (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) mAdc IT = (0.42 µA/kHz) f + IDD IT = (0.85 µA/kHz) f + IDD IT = (1.40 µA/kHz) f + IDD µAdc #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. ** The formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.003. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. MC14521B 2 MOTOROLA CMOS LOGIC DATA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C) Symbol Characteristic Output Rise and Fall Time (Counter Outputs) tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 12.5 ns tTLH, tTHL Propagation Delay Time Clock to Q18 tPHL, tPLH = (1.7 ns/pF) CL + 4415 ns tPHL, tPLH = (0.66 ns/pF) CL + 1667 ns tPHL, tPLH = (0.5 ns/pF) CL + 1275 ns tPHL, tPLH Min Typ # Max 5.0 10 15 — — — 100 50 40 200 100 80 Unit ns µs Clock to Q24 tPHL, tPLH = (1.7 ns/pF) CL + 5915 ns tPHL, tPLH = (0.66 ns/pF) CL + 2167 ns tPHL, tPLH = (0.5 ns/pF) CL + 1675 ns Propagation Delay Time Reset to Qn tPHL = (1.7 ns/pF) CL + 1215 ns tPHL = (0.66 ns/pF) CL + 467 ns tPHL = (0.5 ns/pF) CL + 350 ns VDD Vdc 5.0 10 15 — — — 4.5 1.7 1.3 9.0 3.5 2.7 5.0 10 15 — — — 6.0 2.2 1.7 12 4.5 3.5 tPHL Clock Pulse Width 5.0 10 15 — — — 1300 500 375 2600 1000 750 tWH(cl) 5.0 10 15 385 150 120 140 55 40 — — — ns fcl 5.0 10 15 — — — 3.5 9.0 12 2.0 5.0 6.5 MHz tTLH, tTHL 5.0 10 15 — — — — — — 15 5.0 4.0 µs tWH(R) 5.0 10 15 1400 600 450 700 300 225 — — — ns trem 5.0 10 15 30 0 – 40 – 200 – 160 – 110 — — — ns Clock Pulse Frequency Clock Rise and Fall Time Reset Pulse Width Reset Removal Time ns * The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. VDD 500 µF 0.01 µF CERAMIC ID VDD PULSE GENERATOR IN 2 R VDD Q18 Q19 Q20 Q21 Q22 Q23 Q24 VSS VSS CL CL Vin CL CL 20 ns 90% 50% 10% 20 ns VDD 0V 50% DUTY CYCLE CL CL CL Figure 1. Power Dissipation Test Circuit and Waveform MOTOROLA CMOS LOGIC DATA MC14521B 3 VDD VDD′ VDD PULSE GENERATOR IN 2 R VSS 20 ns IN 2 Q18 Q19 Q20 Q21 Q22 Q23 Q24 20 ns CL CL tWL CL CL CL VSS′ Qn 90% 50% 10% CL 20 ns tWH 90% 50% 10% tPLH tTLH CL tPHL tTHL Figure 2. Switching Time Test Circuit and Waveforms 500 kHz Circuit 50 kHz Circuit Unit Crystal Characteristics Resonant Frequency Equivalent Resistance, RS 500 1.0 50 6.2 kHz kΩ External Resistor/Capacitor Values Ro CT CS 47 82 20 750 82 20 kΩ pF pF + 6.0 + 2.0 + 2.0 + 2.0 ppm ppm – 4.0 + 100 – 2.0 + 120 ppm ppm Characteristic VDD Ro 18 M CS CT VDD R* VDD′ IN 1 OUT 1 OUT 2 Q18 Q19 IN 2 Q20 Q21 Q22 Q23 R Q24 VSS VSS′ R* * Optional for low power operation, 10 kΩ ≤ R ≤ 70 kΩ. Figure 3. Crystal Oscillator Circuit MC14521B 4 Frequency Stability Frequency Change as a Function of VDD (TA = 25_C) VDD Change from 5.0 V to 10 V VDD Change from 10 V to 15 V Frequency Change as a Function of Temperature (VDD = 10 V) TA Change from – 55_C to + 25_C MC14521 only Complete Oscillator* TA Change from +25_C to + 125_C MC14521 only Complete Oscillator* ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ – 2.0 – 160 – 2.0 – 560 ppm ppm *Complete oscillator includes crystal, capacitors, and resistors. Figure 4. Typical Data for Crystal Oscillator Circuit MOTOROLA CMOS LOGIC DATA f, OSCILLATOR FREQUENCY (kHz) 100 8.0 FREQUENCY DEVIATION (%) VDD = 15 V 4.0 TEST CIRCUIT FIGURE 7 0 10 V –4.0 –8.0 5.0 V f AS A FUNCTION OF RTC (C = 1000 pF) (RS ≈ 2RTC) 20 10 5.0 2.0 1.0 TEST CIRCUIT FIGURE 7 VDD = 10 V 50 f AS A FUNCTION OF C (RTC = 56 kΩ) (RS = 120 k) 0.5 0.2 –12 RTC = 56 kΩ, C = 1000 pF –16 –55 0.1 RS = 0, f = 10.15 kHz @ VDD = 10 V, TA = 25°C RS = 120 kΩ, f = 7.8 kHz @ VDD = 10 V, TA = 25°C { 1.0 k –25 0 25 50 75 100 TA, AMBIENT TEMPERATURE (°C), DEVICE ONLY 125 0.0001 Figure 5. RC Oscillator Stability RS RTC 10 k 100 k RTC, RESISTANCE (OHMS) 0.001 0.01 C, CAPACITANCE (µF) 1.0 m 0.1 Figure 6. RC Oscillator Frequency as a Function of RTC and C VDD VDD C VDD VDD′ VDD′ IN 1 IN 1 OUT 1 OUT 2 Q18 Q19 IN 2 Q20 Q21 Q22 Q23 R Q24 Q18 Q19 Q20 Q21 IN 2 Q22 Q23 Q24 OUT 1 R OUT 2 PULSE GENERATOR ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ VSS VSS VSS′ Figure 7. RC Oscillator Circuit VSS Figure 8. Functional Test Circuit FUNCTIONAL TEST SEQUENCE Inputs A test function (see Figure 8) has been included for the reduction of test time required to exercise all 24 counter stages. This test function divides the counter into three 8–stage sections, and 255 counts are loaded in each of the 8–stage sections in parallel. All flip–flops are now at a logic “1”. The counter is now returned to the normal 24–stages in series configuration. One more pulse is entered into Input 2 (In 2) which will cause the counter to ripple from an all “1” state to an all “0” state. MOTOROLA CMOS LOGIC DATA Outputs Comments Reset In 2 Out 2 VSS′ VDD′ Q18 thru Q24 1 0 0 VDD Gnd 0 0 1 1 First “0” to “1” transition on In 2, Out 2 node. 0 1 — — — 0 1 — — — 255 “0” to “1” transitions are clocked into this In 2, Out 2 node. 1 1 0 0 0 0 1 0 1 0 1 Counter is in three 8–stage sections in parallel mode Counter is reset. In 2 and Out 2 are connected together The 255th “0” to “1” transition. 1 1 Gnd 1 Counter converted back to 24–stages in series mode. 0 1 Out 2 converts back to an output. 1 0 VDD Counter ripples from an all “1” state to an all “0” stage. MC14521B 5 LOGIC DIAGRAM VDD 5 RESET 2 9 1 2 IN 1 3 VSS 9 17 18 19 10 Q18 MC14521B 6 8 4 OUT 2 6 IN 2 7 OUT 1 STAGES 3 THRU 7 20 11 Q19 21 12 Q20 22 13 Q21 10 23 14 Q22 STAGES 11 THRU 15 16 24 15 Q23 1 Q24 VDD = PIN 16 VSS = PIN 8 MOTOROLA CMOS LOGIC DATA OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. –A– 16 9 1 8 B F C L S –T– SEATING PLANE K H G D J 16 PL 0.25 (0.010) MOTOROLA CMOS LOGIC DATA M T A M M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC14521B 7 OUTLINE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751B–05 ISSUE J –A– 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 –B– 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C –T– SEATING PLANE M D 16 PL 0.25 (0.010) M T B S A S J DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 Motorola reserves the right to make changes without further notice to any products herein. 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How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MC14521B 8 ◊ *MC14521B/D* MOTOROLA CMOS LOGIC DATA MC14521B/D