TIPP32, TIPP32A,TIPP32B, TIPP32C PNP SILICON POWER TRANSISTORS Copyright © 1997, Power Innovations Limited, UK ● 20 W Pulsed Power Dissipation ● 100 V Capability ● 2 A Continuous Collector Current MAY 1989 - REVISED MARCH 1997 LP PACKAGE (TOP VIEW) E 1 2 3 C ● 4 A Peak Collector Current ● Customer-Specified Selections Available B MDTRAB absolute maximum ratings at 25°C case temperature (unless otherwise noted) RATING SYMBOL TIPP32 Collector-base voltage (IE = 0) TIPP32A TIPP32B VCBO TIPP32C Collector-emitter voltage (IB = 0) TIPP32B UNIT -40 -60 -80 V -100 TIPP32 TIPP32A VALUE -40 VCEO TIPP32C -60 -80 V -100 V EBO -5 V IC -2 A ICM -4 A IB -1 A Continuous device dissipation at (or below) 25°C case temperature (see Note 2) Ptot 0.8 W Pulsed power dissipation (see Note 3) PT 20 W Operating junction temperature range Tj -55 to +150 °C Tstg -55 to +150 °C TL 260 °C Emitter-base voltage Continuous collector current Peak collector current (see Note 1) Continuous base current Storage temperature range Lead temperature 3.2 mm from case for 10 seconds NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%. 2. Derate linearly to 150°C case temperature at the rate of 6.4 mW/°C. 3. VCE = 20 V, IC = 1 A, tp = 10 ms, duty cycle ≤ 2%. PRODUCT INFORMATION Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters. 1 TIPP32, TIPP32A,TIPP32B, TIPP32C PNP SILICON POWER TRANSISTORS MAY 1989 - REVISED MARCH 1997 electrical characteristics at 25°C case temperature PARAMETER V (BR)CEO ICES ICEO IEBO hFE VCE(sat) VBE hfe |hfe| TEST CONDITIONS Collector-emitter breakdown voltage IC = -5 mA IB = 0 (see Note 4) MIN TIPP32 -40 TIPP32A -60 TIPP32B -80 TIPP32C -100 TYP MAX VBE = 0 TIPP32 -0.2 Collector-emitter V CE = -60 V V BE = 0 TIPP32A -0.2 cut-off current V CE = -80 V V BE = 0 TIPP32B -0.2 V CE = -100 V V BE = 0 TIPP32C -0.2 Collector cut-off VCE = -30 V IB = 0 TIPP32/32A -0.3 current V CE = -60 V IB = 0 TIPP32B/32C -0.3 VEB = IC = 0 current -5 V mA mA -1 mA Forward current VCE = -4 V IC = -1 A transfer ratio V CE = -4 V IC = -2 A IB = -375 mA IC = -2 A (see Notes 4 and 5) -1 V VCE = IC = -2 A (see Notes 4 and 5) -1.5 V Collector-emitter saturation voltage Base-emitter voltage Small signal forward current transfer ratio Small signal forward current transfer ratio -4 V (see Notes 4 and 5) 20 10 VCE = -10 V IC = -0.5 A f = 1 kHz 20 VCE = -10 V IC = -0.5 A f = 1 MHz 3 NOTES: 4. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%. 5. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts. PRODUCT 2 V VCE = -40 V Emitter cut-off UNIT INFORMATION TIPP32, TIPP32A,TIPP32B, TIPP32C PNP SILICON POWER TRANSISTORS MAY 1989 - REVISED MARCH 1997 MECHANICAL DATA LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. LP003 Falls Within JEDEC TO-226AA Dimensions LP003 (TO-92) 5,21 4,44 4,19 3,17 3,43 MIN. 2,67 2,03 2,67 2,03 5,34 4,32 Seating Plane 1,27 (see Note A) 12,7 MIN. 0,56 0,40 1 1,40 1,14 3 2 0,41 0,35 2,67 2,41 ALL LINEAR DIMENSIONS IN MILLIMETERS NOTE A: Lead dimensions are not controlled in this area. PRODUCT MDXXAX INFORMATION 3 TIPP32, TIPP32A,TIPP32B, TIPP32C PNP SILICON POWER TRANSISTORS MAY 1989 - REVISED MARCH 1997 MECHANICAL DATA LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. LP003 (TO-92) - Formed Leads Version LP003 Falls Within JEDEC TO-226AA Dimensions 5,21 4,44 4,19 3,17 3,43 MIN. 2,67 2,03 2,67 2,03 5,34 4,32 4,00 MAX. 0,56 0,40 1 2 3 2,90 2,40 0,41 0,35 2,90 2,40 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXAR PRODUCT 4 INFORMATION TIPP32, TIPP32A,TIPP32B, TIPP32C PNP SILICON POWER TRANSISTORS MAY 1989 - REVISED MARCH 1997 MECHANICAL DATA LPR tape dimensions LP Package (TO-92) Tape (Formed Lead Version) 5,21 4,44 4,19 3,17 3,43 MIN. 2,67 2,03 2,67 2,03 5,34 4,32 4,00 MAX. 0,56 0,40 0,41 0,35 13,70 11,70 32,00 23,00 27,68 17,66 0,50 0,00 2,50 MIN. 16,50 15,50 11,00 8,50 9,75 8,50 2,90 2,40 2,90 2,40 19,00 5,50 19,00 17,50 ø 4,30 3,70 6,75 5,95 13,00 12,40 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXAS PRODUCT INFORMATION 5 TIPP32, TIPP32A,TIPP32B, TIPP32C PNP SILICON POWER TRANSISTORS MAY 1989 - REVISED MARCH 1997 IMPORTANT NOTICE Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current. PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements. PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS. Copyright © 1997, Power Innovations Limited PRODUCT 6 INFORMATION