IXYS IXDR35N60BD1

IXDR 35N60 BD1
VCES
= 600 V
= 38 A
IC25
VCE(sat) typ = 2.2 V
IGBT
with optional Diode
High Speed,
Low Saturation Voltage
ISOPLUS 247TM
C
G
G
C
E
E
G = Gate,
C = Collector ,
Conditions
VCES
TJ = 25°C to 150°C
Maximum Ratings
600
V
VCGR
TJ = 25°C to 150°C; RGE = 20 kΩ
600
V
VGES
Continuous
±20
V
VGEM
Transient
±30
V
IC25
TC = 25°C
38
A
IC90
TC = 90°C
24
A
ICM
TC = 90°C, tp =1 ms
48
A
RBSOA
VGE = ±15 V, TJ = 125°C, RG = 10 Ω
Clamped inductive load, L = 30 µH
ICM = 110
VCEK < VCES
A
tSC
(SCSOA)
VGE = ±15 V, VCE = 600 V, TJ = 125°C
RG = 10 Ω, non repetitive
10
µs
PC
TC = 25°C
Features
●
●
●
●
●
●
●
●
●
●
125
50
W
W
TJ
-55 ... +150
°C
Tstg
-55 ... +150
°C
2500
V~
20...120
N
6
g
●
●
●
VISOL
50/60 Hz RMS; IISOL ≤ 1 mA
FC
mounting force with clip
Weight
typical
●
●
●
●
Conditions
V(BR)CES
VGE = 0 V
VGE(th)
IC
ICES
VCE = VCES
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
600
= 0.7 mA, VCE = VGE
IGES
VCE = 0 V, VGE = ± 20 V
VCE(sat)
IC
= 35 A, VGE = 15 V
IXYS reserves the right to change limits, test conditions and dimensions
© 2006 IXYS All rights reserved
●
AC motor speed control
DC servo and robot drives
DC choppers
Uninterruptible power supplies (UPS)
Switch-mode and resonant-mode
power supplies
V
3
TJ = 25°C
TJ = 125°C
DCB Isolated mounting tab
Meets TO-247AD package Outline
Package for clip or spring mounting
Space savings
High power density
Typical Applications
●
Symbol
NPT IGBT technology
low switching losses
low tail current
no latch up
short circuit capability
positive temperature coefficient for
easy paralleling
MOS input, voltage controlled
optional ultra fast diode
Epoxy meets UL 94V-0
Isolated and UL registered E153432
Advantages
●
IGBT
Diode
E = Emitter
TAB = Collector
5
1
V
0.1 mA
mA
± 500 nA
2.2
2.7
V
0644
Symbol
Isolated back surface
1-4
IXDR 35N60 BD1
Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Cies
1600
pF
150
pF
90
pF
140
nC
td(on)
30
ns
tr
45
ns
320
ns
Coes
VCE = 25 V, VGE = 0 V, f = 1 MHz
Cres
Qg
td(off)
tf
IC = 35 A, VGE = 15 V, VCE = 480V
Inductive load, TJ = 125°C
IC = 35 A, VGE = ±15 V,
VCE = 300 V, RG = 10 Ω
70
ns
Eon
1.6
mJ
Eoff
0.8
mJ
0.25
1 K/W
K/W
RthJC
RthCH
Package with heatsink compound
Reverse Diode (FRED) [D1 version only]
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Symbol
Conditions
VF
IF = 35 A, VGE = 0 V
IF = 35 A, VGE = 0 V, TJ = 125°C
IF
TC = 25°C
TC = 90°C
IRM
IF = 15 A, -diF/dt = 400 A/µs, VR = 300 V
13
A
trr
VGE = 0 V, TJ = 125°C
90
ns
trr
IF = 1 A, -diF/dt = 100 A/µs, VR = 30 V, VGE = 0 V
40
ns
RthJC
IXYS reserves the right to change limits, test conditions and dimensions
© 2006 IXYS All rights reserved
ISOPLUS247TM OUTLINE
2.1
1.6
2.3
V
V
35
18
A
A
The convex bow of substrate is typ. < 0.04 mm over plastic surface level
of device bottom side
This drawing will meet all dimensions requirement of JEDEC outline
TO-247 AD except screw hole and except Lmax.
2.3 K/W
0644
Symbol
2-4
IXDR 35N60 BD1
80
A
70
IC
80
VGE= 17V
15V
13V
11V
9V
IC
60
50
40
40
30
30
20
20
10
TJ = 125°C
TJ = 25°C
0
0
1
2
3
4
0
0
7 V
5
6
VCE
1
2
3
4
5
6
Fig. 2 Typ. output characteristics
80
80
A
70
70
A
60
IF 60
50
50
40
40
30
30
20
20
TJ = 125°C
TJ = 125°C
TJ = 25°C
10
0
4
5
6
7
TJ = 25°C
10
VCE = 20V
3
7 V
VCE
Fig. 1 Typ. output characteristics
IC
9V
60
50
10
11V
VGE= 17V
15V
13V
A
70
8
0
0
9 V 10
1
VGE
Fig. 3 Typ. transfer characteristics
2
VF
V
3
Fig. 4 Typ. forward characteristics of
free wheeling diode
120
30
15
trr
V
12
25
A
ns
20
80
trr
IRM
VGE
9
15
6
40
10
3
TJ = 125°C
VR = 300V
IF = 15A
IRM
5
IXDx35N60B
0
0
0
20
40
60
80
100 120 nC
QG
Fig. 5 Typ. turn on gate charge
IXYS reserves the right to change limits, test conditions and dimensions
© 2006 IXYS All rights reserved
0
200
400
600
800
A/μs
-di/dt
0
1000
Fig. 6 Typ. turn off characteristics of
free wheeling diode
0644
VCE = 480V
IC = 30A
3-4
IXDR 35N60 BD1
4
Eon
mJ
VCE = 300V
VGE = ±15V
3
RG = 10Ω
TJ = 125°C
td(on)
80
2.0
ns
mJ
60
1.5
t
ns
td(off)
300
t
Eoff
Eon
2
Eoff
400
1.0
40
200
VCE = 300V
VGE = ±15V
tr
1
RG = 10Ω
TJ = 125°C
0.5
20
tf
0
10
0.0
10
0
20
30
40
60 A
50
0
20
30
40
IC
2.0
mJ
ns
45
Eon
Eon 1.5
tr
1.0
VCE = 300V
VGE = ±15V
IC = 35A
TJ = 125°C
0.0
5
10
15
20
25 30
RG
mJ
t
Eoff 1.5
30
1.0
15
0.5
0
35 Ω 40
800
VCE = 300V
VGE = ±15V
IC = 35A
TJ = 125°C
120
A
100
td(off)
ns
600
Eoff
t
400
200
tf
0.0
0
Fig. 9 Typ. turn on energy and switching
times versus gate resistor
ICM
A
2.0
60
0
60
Fig. 8 Typ. turn off energy and switching
times versus collector current
td(on)
0.5
50
IC
Fig. 7 Typ. turn on energy and switching
times versus collector current
100
5
10
15
20
25 30
RG
0
35 Ω 40
Fig.10 Typ. turn off energy and switching
times versus gate resistor
10
diode
K/W
1
IGBT
ZthJC
80
0.1
60
single pulse
0.01
40
RG = 10Ω
TJ = 125°C
0.001
0
0
100
200
300
400
500
600
700 V
VCE
Fig. 11 Reverse biased safe operating area
RBSOA
IXYS reserves the right to change limits, test conditions and dimensions
© 2006 IXYS All rights reserved
0.0001
10-5
IXDR30N60BD1
10-4
10-3
10-2
10-1
100 s 101
t
Fig. 12 Typ. transient thermal impedance
0644
20
4-4