SECOS SSG4410_10

SSG4410
10 A, 30V, RDS(ON) 13.5 m
N-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen free
DESCRIPTION
The SSG4410 provide the designer with the best
combination of fast switching, ruggedized device
design, low on-resistance and cost-effectiveness.
The SOP-8 package is universally preferred for
all commercial-industrial surface mount applications
and suited for low voltage applications such as
DC/DC converters.
SOP-8
B
L
D
M
FEATURES




A
Dynamic dv/dt Rating
Simple Drive Requirement
Repetitive Avalanche Rated
Fast Switching
N
J
H
MARKING

G
REF.
A
B
C
D
E
F
G
4410SC


C
= Date Code
Millimeter
Min.
Max.
5.80
6.20
4.80
5.00
3.80
4.00
0°
8°
0.40
0.90
0.19
0.25
1.27 TYP.
K
E
F
REF.
H
J
K
L
M
N
Millimeter
Min.
Max.
0.35
0.49
0.375 REF.
45°
1.35
1.75
0.10
0.25
0.25 REF.
PACKAGE INFORMATION
Package
MPQ
LeaderSize
S
D
SOP-8
3K
13’ inch
S
D
S
D
G
D
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS @ 10V
Symbol
Ratings
Unit
VDS
30
V
VGS
±20
V
ID @ TA = 25°C
10
A
ID @ TA = 70°C
8
A
Pulsed Drain Current 1
IDM
50
A
Total Power Dissipation
PD
Linear Derating Factor
Operating Junction & Storage Temperature Range
TJ, TSTG
2.5
W
0.02
W / °C
-55 ~ 150
°C
50
°C / W
Thermal Resistance Ratings
Thermal Resistance Junction-ambient (Max.)
http://www.SeCoSGmbH.com/
23-Dec-2010 Rev. B
RθJA
Any changes of specification will not be informed individually.
Page 1 of 5
SSG4410
10 A, 30V, RDS(ON) 13.5 m
N-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage
Breakdown Voltage
Temperature Coefficient
Gate Threshold Voltage
Forward Transconductance
Gate-Source Leakage Current
Drain-Source Leakage
Current(TJ=25°C)
Drain-Source Leakage
Current(TJ=55°C)
Symbol
Min.
Typ.
Max.
Unit
BVDSS
30
-
-
V
△BVDSS / △TJ
-
0.037
-
V / °C
VGS(th)
gfs
IGSS
1.0
-
20
-
3.0
±100
V
S
nA
VDS=VGS, ID =250uA
VDS=15V, ID =10A
VGS=±20V
-
-
1
μA
VDS=30V, VGS=0V
-
-
25
μA
VDS=24V, VGS=0V
mΩ
VGS=10V, ID=10A
VGS=4.5V, ID=5A
nC
VDS=15V, ID =10A, VGS=5V
nS
VDS=25V, VGS=5V
I D=1A, RD=25Ω, RG=3.3Ω
pF
VDS=15V
VGS=0V
f=1.0MHz
RDS(ON)
Total Gate Charge 2
Gate-Source Chagre
Gate-Drain (“Miller”) Change
Turn-on Delay Time 2
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Qg
Qgs
Qgd
Td(ON)
Tr
Td(OFF)
Tf
CISS
COSS
CRSS
VSD
Continuous Source
IS
Current (Body Diode)
Pulsed Source
ISM
Current (Body Diode) 1
Notes:
1. Pulse width limited by safe operating area.
2. Pulse width ≦ 300 μs, duty cycle ≦ 2%.
http://www.SeCoSGmbH.com/
23-Dec-2010 Rev. B
VGS=0V, ID =250uA
Reference to 25°C, ID=1mA
IDSS
Static Drain-Source On-Resistance
Forward On Voltage 2
Teat Conditions
11.5
13.5
16.5
20
20
3
11
7.5
10.2
29
33
955
555
204
Source-Drain Diode
-
-
1.3
V
IS=2.3A, VGS= 0V, TJ=25°C
-
-
2.3
A
VD = VG = 0V, VS= 1.3V
-
-
50
A
Any changes of specification will not be informed individually.
Page 2 of 5
SSG4410
Elektronische Bauelemente
10 A, 30V, RDS(ON) 13.5 m
N-Ch Enhancement Mode Power MOSFET
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
23-Dec-2010 Rev. B
Any changes of specification will not be informed individually.
Page 3 of 5
SSG4410
Elektronische Bauelemente
10 A, 30V, RDS(ON) 13.5 m
N-Ch Enhancement Mode Power MOSFET
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
23-Dec-2010 Rev. B
Any changes of specification will not be informed individually.
Page 4 of 5
SSG4410
Elektronische Bauelemente
10 A, 30V, RDS(ON) 13.5 m
N-Ch Enhancement Mode Power MOSFET
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
23-Dec-2010 Rev. B
Any changes of specification will not be informed individually.
Page 5 of 5