ETC SUD50N02-06

SUD50N02-06
New Product
Vishay Siliconix
N-Channel 20-V (D-S), 175C MOSFET
rDS(on) ()
ID (A)a, b
0.006 @ VGS = 4.5 V
30
0.009 @ VGS = 2.5 V
25
VDS (V)
20
D
TO-252
G
Drain Connected to Tab
G
D
S
Top View
Order Number:
SUD50N02-06
S
N-Channel MOSFET
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
12
TA = 25C
Continuous Drain Currenta, b
TA = 100C
Pulsed Drain Current
21
A
Maximum Power Dissipation
100
IS
TC = 25C
TA = 25C
Operating Junction and Storage Temperature Range
V
30
ID
IDM
Continuous Source Current (Diode Conduction)a, b
Unit
30
100
PD
W
8.3a, b
TJ, Tstg
C
–55 to 175
Parameter
Maximum Junction-to-Ambient
Junction to Ambienta
Symbol
t 10 sec.
Maximum
15
18
40
50
1.2
1.5
RthJA
hJA
Steady State
Maximum Junction-to-Case
Typical
RthJC
Unit
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board
b. t 10 sec.
Document Number: 71136
S-01665—Rev. B, 31-Jul-00
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SUD50N02-06
New Product
Vishay Siliconix
_ Parameter
Typa
Symbol
Test Condition
Min
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
20
VGS(th)
VDS = VGS, ID = 250 mA
0.6
IGSS
VDS = 0 V, VGS = "12 V
"100
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 125_C
50
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
b
Drain-Source
On-State
Resistance
D i S
O S
R i
Forward Transconductanceb
IDSS
ID(on)
rDS(on)
gfs
VDS = 5 V, VGS = 4.5 V
V
50
mA
A
VGS = 4.5 V, ID = 30 A
0.006
VGS = 4.5 V, ID =30 A, TJ = 125_C
0.009
VGS = 2.5 V, ID = 20 A
0.009
VDS = 5 V, ID = 30 A
nA
20
W
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
6600
VGS = 0 V, VDS = 20 V, f = 1 MHz
pF
F
1150
600
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
Turn-On Delay Timec
td(on)
25
40
tr
120
180
80
120
100
150
Rise Timec
Turn-Off Delay Timec
Fall Timec
td(off)
65
VDS = 10 V,
4.5
V, ID = 50 A
V VGS = 4
5V
130
nC
C
13
14
VDD = 10 V
V,, RL = 0
0.2
2W
ID ^ 50 A,
A VGEN = 4
4.5
5V
V, RG = 2
2.5
5W
tf
ns
Source-Drain Diode Ratings and Characteristic (TC = 25_C)
Pulsed Current
ISM
100
A
Diode Forward Voltageb
VSD
IF = 100 A, VGS = 0 V
1.2
1.5
V
trr
IF = 50 A, di/dt = 100 A/ms
45
100
ns
Source-Drain Reverse Recovery Time
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
c. Independent of operating temperature.
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2-2
Document Number: 71136
S-01665—Rev. B, 31-Jul-00
SUD50N02-06
New Product
Vishay Siliconix
Output Characteristics
Transfer Characteristics
250
120
3.5 V
VGS = 4.5, 4 V
100
200
I D – Drain Current (A)
I D – Drain Current (A)
3V
150
2.5 V
100
2V
50
80
60
40
TC = 125C
20
1V
25C
1.5 V
–55C
0
0
0
2
4
6
8
10
0
VDS – Drain-to-Source Voltage (V)
0.5
1.0
1.5
2.0
2.5
3.0
VGS – Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
160
0.010
TC = –55C
r DS(on) – On-Resistance ( )
g fs – Transconductance (S)
25C
120
125C
80
40
0
0.008
VGS = 2.5 V
0.006
VGS = 4.5 V
0.004
0.002
0
0
20
40
60
80
0
100
20
40
ID – Drain Current (A)
80
100
120
150
ID – Drain Current (A)
Capacitance
Gate Charge
10000
V GS – Gate-to-Source Voltage (V)
12
8000
C – Capacitance (pF)
60
Ciss
6000
4000
Coss
2000
VDS = 10 V
ID = 50 A
9
6
3
Crss
0
0
0
4
8
12
16
VDS – Drain-to-Source Voltage (V)
Document Number: 71136
S-01665—Rev. B, 31-Jul-00
20
0
30
60
90
Qg – Total Gate Charge (nC)
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2-3
SUD50N02-06
New Product
Vishay Siliconix
_ On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.0
100
1.6
I S – Source Current (A)
r DS(on) – On-Resistance (W)
(Normalized)
VGS = 4.5 V
ID = 30 A
1.2
0.8
TJ = 150_C
TJ = 25_C
10
0.4
0
–50
1
–25
0
25
50
75
100
125
150
175
0
TJ – Junction Temperature (_C)
0.3
0.6
0.9
1.2
1.5
VSD – Source-to-Drain Voltage (V)
Maximum Avalanche Drain Current
vs. Ambient Temperature
Safe Operating Area
1000
40
Limited
by rDS(on)
10 ms
100 ms
100
I D – Drain Current (A)
I D – Drain Current (A)
32
24
16
8
10
10 ms
100 ms
1
1s
0.1
0
1 ms
10 s
100 s
dc
TA = 25_C
Single Pulse
0.01
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
TA – Case Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 40_C/W
0.02
3. TJM – TA = PDMZthJA(t)
Single Pulse
0.01
10–4
10–3
4. Surface Mounted
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
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2-4
Document Number: 71136
S-01665—Rev. B, 31-Jul-00