ETC H5N3004P

H5N3004P
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-1523 (Z)
Rev.0
Apr. 2002
Features
• Low on-resistance
• Low leakage current
• High speed switching
• Low gate charge (Qg)
• Avalanche ratings
Outline
TO-3P
D
G
1
S
2
3
1. Gate
2. Drain (Flange)
3. Source
H5N3004P
Absolute Maximum Ratings
(Ta=25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDSS
300
V
Gate to source voltage
VGSS
±30
V
Drain current
ID
25
A
100
A
25
A
100
A
25
A
150
W
Drain peak current
ID (pulse)
Note1
Body-drain diode reverse drain current
IDR
Body-drain diode reverse drain peak
current
IDR (pulse) Note
Avalanche current
IAPNote
1
3
Note2
Channel dissipation
Pch
Channel to case Thermal impedance
θch-c
0.833
°C/W
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at Tc = 25°C
3. Tch ≤ 150°C
Rev.0, Apr. 2002, page 2 of 10
H5N3004P
Electrical Characteristics
(Ta=25°C)
Item
Drain to source breakdown voltage
Symbol Min
Typ
Max
Unit
Test Conditions
V(BR)DSS
300
•
—
V
ID = 10 mA, VGS = 0
Zero gate voltage drain current
IDSS
—
•
1
µA
VDS = 300 V, VGS = 0
Gate to source leak current
IGSS
—
•
±0.1
µA
VGS = ±30 V, VDS = 0
Gate to source cutoff voltage
VGS(off)
3.0
•
4.0
V
VDS = 10 V, ID = 1 mA
Forward transfer admittance
|yfs|
15
25
—
S
ID = 12.5 A, VDS = 10 VNote
RDS(on)
—
0.076
0. 093
Ω
ID = 12.5 A, VGS= 10 VNote
Static drain to source on state
resistance
4
4
Input capacitance
Ciss
—
3600
•
pF
VDS = 25 V
Output capacitance
Coss
—
400
•
pF
VGS = 0
Reverse transfer capacitance
Crss
—
100
•
pF
f = 1 MHz
Turn-on delay time
td(on)
—
50
•
ns
ID= 12.5 A
tr
—
120
—
ns
RL = 12 Ω
td(off)
—
180
•
ns
VGS = 10 V
tf
—
90
—
ns
Rg = 10 Ω
Qg
—
110
—
nC
VDD = 240 V
Gate to source charge
Qgs
—
18
—
nC
VGS = 10 V
Gate to drain charge
Qgd
—
55
—
nC
ID = 25 A
Body-drain diode forward voltage
VDF
—
0.9
1.35
V
IF = 25 A, VGS = 0
Body-drain diode reverse recovery
time
trr
—
250
—
ns
IF = 25 A, VGS = 0
diF/dt = 100 A/µs
Body-drain diode reverse recovery
charge
Qrr
—
2.3
—
µC
Rise time
Turn-off delay time
Fall time
Total gate charge
Notes: 4. Pulse test
Rev.0, Apr. 2002, page 3 of 10
H5N3004P
Main Characteristics
Power vs. Temperature Derating
300
Drain Current ID (A)
Channel Dissipation Pch (W)
Maximum Safe Operation Area
1000
200
150
100
50
100
PW
30
DC
10
er
100
150
by RDS(on)
1
Typical Output Characteristics
t)
25
°C
)
30
3
10
100 300 1000
Drain to Source Voltage VDS (V)
100
10 V
8V
V DS = 10 V
Pulse Test
80
80
7V
6.5 V
60
6V
40
5.5 V
20
Drain Current ID (A)
Drain Current ID (A)
ho
Typical Transfer Characteristics
100
60
40
Tc = 75°C
20
VGS = 5 V
0
c=
Ta = 25°C
Case Temperature Tc (°C)
Pulse Test
1s
(T
Operation in
200
m
s(
1 this area is limited
0.1
50
ion
µs
s
s
10
at
3
0.3
0
Op
0µ
1m
=
10
10
4
8
12
16
20
Drain to Source Voltage VDS (V)
Rev.0, Apr. 2002, page 4 of 10
25°C
−25°C
0
2
4
6
8
10
Gate to Source Voltage VGS (V)
5
Pulse Test
4
3
I D = 25 A
2
15 A
1
5A
0
12
4
8
Gate to Source Voltage
16
VGS
20
Static Drain to Source on State Resistance
vs. Drain Current
200
Pulse Test
VGS = 10 V, 15 V
100
50
20
10
1
(V)
Static Drain to Source on State Resistance
vs. Temperature
200
Pulse Test
I D = 25 A
V GS = 10 V
160
15 A
120
5A
80
40
0
−40
Drain to Source on State Resistance
RDS(on) (mΩ)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
0
40
80
120
160
Case Temperature Tc (°C)
2
5
10 20
50
Drain Current ID (A)
100
Forward Transfer Admittance vs.
Drain Current
Forward Transfer Admittance |yfs| (S)
Drain to source on State Resistance
RDS(on) (mΩ)
Drain to Source Saturation Voltage
VDS(on) (V)
H5N3004P
100
50
20
Tc = −25°C
10
5
2
25°C
75°C
1
0.5
0.2
0.2
V DS = 10 V
Pulse Test
0.5 1
2
5
10 20
50 100
Drain Current ID (A)
Rev.0, Apr. 2002, page 5 of 10
H5N3004P
Typical Capacitance vs.
Drain to Source Voltage
Body-Drain Diode Reverse
Recovery Time
500
20000
Capacitance C (pF)
50000
200
100
50
Coss
Crss
0
10000
VGS
16
12
VDS
200
8
100
4
V DD = 240 V
100 V
50 V
40
80
120
Gate Charge
Rev.0, Apr. 2002, page 6 of 10
160
Qg (nC)
0
200
VGS (V)
20
V DD = 50 V
100 V
240 V
25
50
75
100
125
Drain to Source Voltage VDS (V)
Gate to Source Voltage
VDS (V)
Drain to Source Voltage
500
50
I D = 25 A
0
1000
100
Dynamic Input Characteristics
300
2000
0.3
1
3
10
30
100
Reverse Drain Current IDR (A)
500
400
Ciss
Switching Characteristics
V GS = 10 V, VDD = 150 V
PW = 10 µs, duty < 1 %
R G =10 Ω
(ns)
10
0.1
5000
200
di / dt = 100 A / µs
V GS = 0, Ta = 25°C
20
VGS = 0
f = 1 MHz
10000
1000
Switching Time t
Reverse Recovery Time trr (ns)
1000
tr
t d(off)
tf
100
tf
t d(on)
tr
10
0.1
0.3
1
3
Drain Current
10
ID
30
(A)
100
H5N3004P
Gate to Source Cutoff Voltage
vs. Case Temperature
Reverse Drain Current vs.
Source to Drain Voltage
Reverse Drain Current IDR
(A)
Gate to Source Cutoff Voltage
VGS(off) (V)
100
80
V GS = 0 V
60
40
20
5V
10 V
Pulse Test
0
0.4
0.8
1.2
Source to Drain Voltage
1.6
VSD
2.0
5
V DS = 10 V
4
I D = 10 mA
3
1 mA
0.1 mA
2
1
0
-50
(V)
0
50
100
150
Case Temperature Tc (°C)
Switching Time Test Circuit
Waveform
Vout
Monitor
Vin Monitor
200
90%
D.U.T.
RL
Vin
10Ω
Vin
10 V
V DD
= 150 V
Vout
10%
10%
10%
90%
td(on)
tr
90%
td(off)
tf
Rev.0, Apr. 2002, page 7 of 10
H5N3004P
Normalized Transient Thermal Impedance γs (t)
Normalized Transient Thermal Impedance vs. Pulse Width
3
Tc = 25°C
1
D=1
0.5
0.3
0.2
qch
0.1
0.1
qch
− c(t) = gs (t) • qch − c
− c = 0.833°C/W, Tc = 25°C
0.05
PDM
0.03
0.02
1
0.0
0.01
10 µ
lse
t
ho
T
1s
1m
10 m
Pulse Width PW (S)
Rev.0, Apr. 2002, page 8 of 10
PW
T
PW
pu
100 µ
D=
100 m
1
10
H5N3004P
Package Dimensions
15.6 ± 0.3
Unit: mm
4.8 ± 0.2
1.5
0.3
19.9 ± 0.2
2.0
14.9 ± 0.2
0.5
1.0
φ3.2 ± 0.2
5.0 ± 0.3
As of July, 2001
1.6
2.0
1.4 Max
18.0 ± 0.5
2.8
1.0 ± 0.2
3.6
5.45 ± 0.5
0.6 ± 0.2
0.9
1.0
5.45 ± 0.5
Hitachi Code
JEDEC
JEITA
Mass (reference value)
TO-3P
—
Conforms
5.0 g
Rev.0, Apr. 2002, page 9 of 10
H5N3004P
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
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of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
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for maximum rating, operating supply voltage range, heat radiation characteristics, installation
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Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.0, Apr. 2002, page 10 of 10