ETC 74LVT574MTCX

Revised November 2000
74LVT574 • 74LVTH574
Low Voltage Octal D-Type Flip-Flop
with 3-STATE Outputs
General Description
Features
The LVT574 and LVTH574 are high-speed, low-power
octal D-type flip-flop featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented applications. A buffered Clock (CP) and Output Enable (OE) are
common to all flip-flops.
■ Input and output interface capability to systems at
5V VCC
The LVTH574 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
■ Live insertion/extraction permitted
These octal flip-flops are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT574 and LVTH574
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH574),
also available without bushold feature (74LVT574).
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink −32 mA/+64 mA
■ Functionally compatible with the 74 series 574
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human-body model > 2000V
Machine model > 200V
Charged-device model > 1000V
Ordering Code:
Order Number
Package Number
74LVT574WM
Package Description
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74LVT574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74LVT574MTC
MTC20
74LVTH574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74LVTH574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74LVTH574MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbols
IEEE/IEC
© 2000 Fairchild Semiconductor Corporation
DS012451
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74LVT574 • 74LVTH574 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
March 1999
74LVT574 • 74LVTH574
Connection Diagram
Pin Descriptions
Pin Names
Description
D0–D7
Data Inputs
CP
Clock Pulse Input
OE
3-STATE Output Enable Input
O0–O7
3-STATE Outputs
Truth Table
Inputs
OE
On
L
H
L
L
X
L
L
Oo
X
X
H
Z
Dn
H
L
CP
Outputs
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
= LOW-to-HIGH Transition
Oo = Previous Oo before HIGH to LOW of CP
Functional Description
Clock (CP) transition. With the Output Enable (OE) LOW,
the contents of the eight flip-flops are available at the outputs. When the OE is HIGH, the outputs go to the high
impedance state. Operation of the OE input does not affect
the state of the flip-flops.
The LVT574 and LVTH574 consist of eight edge-triggered
flip-flops with individual D-type inputs and 3-STATE true
outputs. The buffered clock and buffered Output Enable
are common to all flip-flops. The eight flip-flops will store
the state of their individual D-type inputs that meet the
setup and hold time requirements on the LOW-to-HIGH
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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Symbol
Parameter
Value
Conditions
Units
VCC
Supply Voltage
−0.5 to +4.6
VI
DC Input Voltage
−0.5 to +7.0
VO
DC Output Voltage
−0.5 to +7.0
Output in 3-STATE
−0.5 to +7.0
Output in HIGH or LOW State (Note 2)
V
V
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
IO
DC Output Current
64
VO > VCC
Output at HIGH State
128
VO > VCC
Output at LOW State
mA
ICC
DC Supply Current per Supply Pin
±64
mA
IGND
DC Ground Current per Ground Pin
±128
mA
TSTG
Storage Temperature
−65 to +150
°C
Recommended Operating Conditions
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
IOH
HIGH-Level Output Current
IOL
LOW-Level Output Current
TA
Free-Air Operating Temperature
∆t/∆V
Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V
Min
Max
Units
2.7
3.6
V
0
5.5
V
−32
mA
64
mA
−40
85
°C
0
10
ns/V
Note 1: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
Note 2: IO Absolute Maximum Rating must be observed.
DC Electrical Characteristics
Symbol
VCC
(V)
Parameter
T A = −40°C to +85°C
Min
Typ
Max
Units
Conditions
(Note 3)
−1.2
VIK
Input Clamp Diode Voltage
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
2.7–3.6
VOH
Output HIGH Voltage
2.7–3.6
VCC − 0.2
2.7
2.4
3.0
2.0
VOL
II(HOLD)
2.7
2.7–3.6
Output LOW Voltage
Bushold Input Minimum Drive
0.8
(Note 4)
Current to Change State
II
Input Current
IOFF
Power Off Leakage Current
IPU/PD
Power Up/Down 3-STATE
Output Current
VO ≥ VCC − 0.1V
V
IOH = −8 mA
IOH = −32 mA
IOL = 100 µA
2.7
0.5
IOL = 24 mA
3.0
0.4
3.0
0.5
IOL = 32 mA
3.0
0.55
IOL = 64 mA
3.0
75
V
µA
500
µA
−500
Data Pins
V
0.2
3.0
Control Pins
II = −18 mA
VO ≤ 0.1V or
IOH = −100 µA
−75
Bushold Input Over-Drive
V
V
2.7
(Note 4)
II(OD)
2.0
3.6
10
3.6
±1
−5
3.6
±100
VI = 0.8V
VI = 2.0V
(Note 5)
(Note 6)
VI = 5.5V
µA
VI = 0V or VCC
VI = 0V
VI = VCC
1
0
IOL = 16 mA
µA
0–1.5V
±100
µA
0V ≤ VI or VO ≤ 5.5V
VO = 0.5V to 3.0V
VI = GND or VCC
IOZL
3-STATE Output Leakage Current
3.6
−5
µA
VO = 0.5V
IOZH
3-STATE Output Leakage Current
3.6
5
µA
VO = 3.0V
3
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74LVT574 • 74LVTH574
Absolute Maximum Ratings(Note 1)
74LVT574 • 74LVTH574
DC Electrical Characteristics
Symbol
Parameter
(Continued)
VCC
(V)
T A = −40°C to +85°C
Min
Typ
Max
Units
Conditions
(Note 3)
IOZH+
3-STATE Output Leakage Current
3.6
10
µA
VCC < VO ≤ 5.5V
ICCH
Power Supply Current
3.6
0.19
mA
Outputs High
ICCL
Power Supply Current
3.6
5
mA
Outputs Low
ICCZ
Power Supply Current
3.6
0.19
mA
Outputs Disabled
ICCZ+
Power Supply Current
3.6
0.19
mA
VCC ≤ VO ≤ 5.5V,
∆ICC
Increase in Power Supply Current
3.6
0.2
mA
One Input at VCC − 0.6V
Outputs Disabled
Other Inputs at VCC or GND
(Note 7)
Note 3: All typical values are at VCC = 3.3V, TA = 25°C.
Note 4: Applies to bushold versions only (74LVTH574).
Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics
Symbol
Parameter
(Note 8)
TA = 25°C
VCC
(V)
Min
Typ
Max
Conditions
Units
CL = 50 pF, RL = 500Ω
VOLP
Quiet Output Maximum Dynamic VOL
3.3
0.8
V
(Note 9)
VOLV
Quiet Output Minimum Dynamic VOL
3.3
−0.8
V
(Note 9)
Note 8: Characterized in SOIC package. Guaranteed parameter, but not tested.
Note 9: Max number of outputs defined as (n). n−1 data inputs are driven 0V to 3V. Output under test held LOW.
AC Electrical Characteristics
TA = −40°C to +85°C
CL = 50 pF, RL = 500Ω
Symbol
VCC = 3.3V ± 0.3V
Parameter
Min
Typ
(Note 10)
VCC = 2.7V
Max
Min
Max
fMAX
Maximum Clock Frequency
150
tPHL
Propagation Delay
1.8
4.6
1.8
5.3
tPLH
CP to On
1.8
4.5
1.8
5.3
tPZL
Output Enable Time
tPZH
tPLZ
Output Disable Time
tPHZ
Units
150
MHz
1.5
5.2
1.5
6.1
1.5
4.8
1.5
5.9
2.0
4.4
2.0
4.4
2.0
4.8
2.0
5.1
ns
ns
ns
tS
Setup Time
2.0
2.4
tH
Hold Time
0.3
0.0
ns
tW
Pulse Width
3.3
3.3
ns
tOSHL
Output to Output Skew (Note 11)
tOSLH
ns
1.0
1.0
1.0
1.0
ns
Note 10: All typical values are at VCC = 3.3V, TA = 25°C.
Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH to LOW (tOSHL) or LOW to HIGH (tOSLH).
Capacitance (Note 12)
Typical
Units
CIN
Symbol
Input Capacitance
Parameter
VCC = Open, VI = 0V or VCC
Conditions
4
pF
COUT
Output Capacitance
VCC = 3.0V, VO = 0V or VCC
6
pF
Note 12: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
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74LVT574 • 74LVTH574
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
5
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74LVT574 • 74LVTH574
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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74LVT574 • 74LVTH574
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
7
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74LVT574 • 74LVTH574 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
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1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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