MP4005 TOSHIBA Power Transistor Module Silicon NPN&PNP Epitaxial Type (Four Darlington Power Transistors in One) MP4005 Industrial Applications High Power Switching Applications Hammer Drive, Pulse Motor Drive and Inductive Load Switching • Small package by full molding (SIP 10 pins) • High collector power dissipation (4-device operation) • High collector current: IC (DC) = ±4 A (max) • High DC current gain: hFE = 2000 (min) (VCE = ±2 V, IC = ±1 A) Unit: mm : PT = 4 W (Ta = 25°C) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating NPN PNP Unit Collector-base voltage VCBO 100 −100 V Collector-emitter voltage VCEO 80 −80 V Emitter-base voltage VEBO 5 −5 V DC IC 4 −4 Pulse ICP 6 −6 IB 0.4 −0.4 Collector current Continuous base current Collector power dissipation (1-device operation) Collector power dissipation (4-device operation) Junction temperature Storage temperature range A JEDEC ― JEITA ― TOSHIBA A PC 2.0 W PT 4.0 W Tj 150 °C Tstg −55 to 150 °C 2-25A1B Weight: 2.1 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 1 2006-10-27 MP4005 Array Configuration 10 R1 R2 8 6 7 9 3 5 2 4 R1 R2 R1 ≈ 4.5 kΩ 1 R2 ≈ 300 Ω Thermal Characteristics Characteristics Thermal resistance from junction to ambient Symbol Max Unit ΣRth (j-a) 31.3 °C/W TL 260 °C (4-device operation, Ta = 25°C) Maximum lead temperature for soldering purposes (3.2 mm from case for 10 s) Electrical Characteristics (Ta = 25°C) (NPN transistor) Characteristics Symbol Test Condition Min Typ. Max Unit Collector cut-off current ICBO VCB = 100 V, IE = 0 A ― ― 20 μA Collector cut-off current ICEO VCE = 80 V, IB = 0 A ― ― 20 μA Emitter cut-off current IEBO VEB = 5 V, IC = 0 A 0.5 ― 2.5 mA Collector-base breakdown voltage V (BR) CBO IC = 1 mA, IE = 0 A 100 ― ― V Collector-emitter breakdown voltage V (BR) CEO IC = 10 mA, IB = 0 A 80 ― ― V hFE (1) VCE = 2 V, IC = 1 A 2000 ― ― hFE (2) VCE = 2 V, IC = 3 A 1000 ― ― Collector-emitter VCE (sat) IC = 3 A, IB = 6 mA ― ― 1.5 Base-emitter VBE (sat) IC = 3 A, IB = 6 mA ― ― 2.0 VCE = 2 V, IC = 0.5 A ― 60 ― MHz VCB = 10 V, IE = 0 A, f = 1 MHz ― 30 ― pF ― 0.2 ― ― 1.5 ― ― 0.6 ― Saturation voltage Transition frequency Collector output capacitance Turn-on time fT Cob ton Input 20 μs Storage time IB2 tstg IB2 IB1 Switching time Fall time IB1 Output 10 Ω DC current gain ― V μs VCC = 30 V tf IB1 = −IB2 = 6 mA, duty cycle ≤ 1% 2 2006-10-27 MP4005 Electrical Characteristics (Ta = 25°C) (PNP transistor) Characteristics Symbol Test Condition Min Typ. Max Unit Collector cut-off current ICBO VCB = −100 V, IE = 0 A ― ― −20 μA Collector cut-off current ICEO VCE = −80 V, IB = 0 A ― ― −20 μA Emitter cut-off current IEBO VEB = −5 V, IC = 0 A −0.5 ― −2.5 mA Collector-base breakdown voltage V (BR) CBO IC = −1 mA, IE = 0 A −100 ― ― V Collector-emitter breakdown voltage V (BR) CEO IC = −10 mA, IB = 0 A −80 ― ― V hFE (1) VCE = −2 V, IC = −1 A 2000 ― ― hFE (2) VCE = −2 V, IC = −3 A 1000 ― ― Collector-emitter VCE (sat) IC = −3 A, IB = −6 mA ― ― −1.5 Base-emitter VBE (sat) IC = −3 A, IB = −6 mA ― ― −2.0 VCE = −2 V, IC = −0.5 A ― 40 ― MHz VCB = −10 V, IE = 0 A, f = 1 MHz ― 55 ― pF ― 0.15 ― ― 0.80 ― ― 0.40 ― Transition frequency fT Collector output capacitance Cob ton IB1 Turn-on time Switching time Storage time tstg Input 20 μs IB2 Output 10 Ω Saturation voltage IB2 DC current gain IB1 ― V μs VCC = −30 V Fall time tf −IB1 = IB2 = 6 mA, duty cycle ≤ 1% Marking MP4005 JAPAN Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. 3 2006-10-27 MP4005 (NPN transistor) IC – VCE IC – VBE 6 6 Common emitter 5 Common emitter 1 5 VCE = 2 V 0.5 4 0.3 3 Collector current IC Collector current IC (A) Ta = 25°C (A) 5 0.23 2 IB = 0.2 mA 1 4 3 2 Ta = 100°C 0 0 0 1 2 3 4 5 Collector-emitter voltage 6 0 0 7 0.4 VCE (V) 0.8 1.2 1.6 Base-emitter voltage hFE – IC −55 2.0 2.4 2.8 VBE (V) VCE – IB 20000 2.4 VCE (V) Common emitter 10000 VCE = 2 V 5000 3000 Collector-emitter voltage DC current gain hFE 25 1 Ta = 100°C 25 −55 1000 500 300 0.05 0.1 0.3 0.5 1 Collector current IC 3 5 2.0 5 IC = 6 A 1.6 4 3 2 1.2 1 0.8 0.3 0.4 Common emitter 10 Ta = 25°C 0 0.1 (A) 0.3 1 3 10 30 100 300 Base current IB (mA) VCE (sat) – IC VBE (sat) – IC 10 Common emitter Base-emitter saturation voltage VBE (sat) (V) Collector-emitter saturation voltage VCE (sat) (V) 10 IC/IB = 500 5 3 Ta = −55°C 1 25 0.5 100 0.3 0.1 0.3 0.5 1 Collector current IC 3 5 Common emitter 3 Ta = −55°C 25 1 (A) 100 0.5 0.3 0.1 10 IC/IB = 500 5 0.3 0.5 1 Collector current IC 4 3 5 10 (A) 2006-10-27 MP4005 (PNP transistor) IC – VCE −6 −1.5 Common −1.0 −0.7 −5 VCE = −2 V (A) −0.5 Ta = 25°C −0.4 −4 −0.3 −3 −2 −4 Collector current IC Collector current IC Common emitter emitter (A) −5 IC – VBE −6 IB = −0.2 mA −3 −1 −1 0 0 Ta = 100°C −2 0 −1 −2 −3 −4 −5 Collector-emitter voltage −6 0 0 −7 −0.4 VCE (V) −0.8 −1.2 hFE – IC −2.0 −2.4 −2.8 VBE (V) VCE – IB VCE (V) 5000 Collector-emitter voltage DC current gain hFE −1.6 −2.4 Common emitter 10000 VCE = −2 V Ta = 100°C 25 −55 1000 500 −0.1 −0.3 −0.5 −1 Collector current IC −3 −5 −10 −2.0 −1.6 IC = −6 A −5 −4 −3 −1.2 −1 −2 −0.8 −0.3 −0.4 Common emitter Ta = 25°C ) 300 −0.05 −55 Base-emitter voltage 20000 3000 25 0 −0.1 (A) −0.3 −1 −3 −10 −30 −100 −300 Base current IB (mA) VCE (sat) – IC Base-emitter saturation voltage VBE (sat) (V) Collector-emitter saturation voltage VCE (sat) (V) Common emitter IC/IB = 500 −5 −3 Ta = −55°C −1 25 −0.5 100 −0.3 −0.1 −0.3 −0.5 −1 Collector current IC VBE (sat) – IC −10 −10 −3 −5 Common emitter −3 Ta = −55°C 25 −1 (A) 100 −0.5 −0.3 −0.1 −10 IC/IB = 500 −5 −0.3 −0.5 −1 Collector current IC 5 −3 −5 −10 (A) 2006-10-27 MP4005 rth – tw Transient thermal resistance rth (°C/W) 300 Curves should be applied in thermal 100 (4) limited area. (Single nonrepetitive pulse) The figure shows thermal resistance per device versus pulse width. 10 3 -No heat sink/Attached on a circuit board(1) 1-device operation (2) 2-device operation (3) 3-device operation Circuit board (4) 4-device operation NPN PNP 1 0.3 0.001 0.01 0.1 1 Pulse width 10 100 1000 tw (s) Safe Operating Area 10 (3) (2) (1) 30 Safe Operating Area −10 IC max (pulsed)* IC max (pulsed)* −5 5 3 10 ms −3 100 μs 10 ms 100 μs (A) 1 ms 1 Collector current IC Collector current IC (A) 1 ms 0.5 0.3 0.1 −1 1 −0.5 −0.3 −0.1 −0.05 0.05 0.03 *: Single nonrepetitive pulse Ta = 25°C Curves must be derated linearly with increase in temperature. 0.01 0.5 1 3 10 −0.03 *: Single nonrepetitive pulse Ta = 25°C VCEO max 30 Curves must be derated linearly with increase in temperature. 100 −0.01 −0.5 300 −1 −3 −10 VCEO max −30 −100 −300 Collector-emitter voltage VCE (V) Collector-emitter voltage VCE (V) 6 2006-10-27 MP4005 (3) PT (W) Circuit board Attached on a circuit board (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation 1 2 3 4 Total power dissipation PT Duty cycle ≤ 1% Input 20 μs 40 (NPN) IB1 Duty cycle ≤ 1% VCC = 30 V IB2 10 1 ) 3 10 Collector current IC 200 30 Output IB1 VCC = −30 V tf ton 0.1 −0.1 100 (PNP) tstg 0.3 ton Input 20 μs 3 tf 1 160 IB2 −IB1 = IB2 = 6mA Output IB2 120 Switching 30 tstg 0.3 80 Ambient temperature Ta (°C) 1 0.1 0.1 (1) (W) 3 0.3 Circuit board (2) 2 0 0 IB1 10 (4) (3) RL IB1 = −IB2 = −6mA 4 5 Switching 30 6 IB2 0 0 Switching time (μs) Total power dissipation 80 40 (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation Attached on a circuit board (4) RL (2) 120 IB1 (1) PT – Ta Switching time (μs) Junction temperature increase ΔTj (°C) ΔTj – PT −0.3 −1 −3 −10 Collector current IC (A) 7 −30 −100 (A) 2006-10-27 MP4005 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 8 2006-10-27