TI OPA378AIDBVR

OPA378
OPA2378
SBOS417 – JANUARY 2008
Low Noise, 900kHz, 50µV, Rail-to-Rail Input/Output
Precision OPERATIONAL AMPLIFIER
Zerø-Drift Series
FEATURES
1
DESCRIPTION
LOW NOISE 0.1Hz to 10Hz: 0.4µVPP
LOW OFFSET VOLTAGE: 15µV (typ)
QUIESCENT CURRENT: 100µA (typ)
OFFSET DRIFT: 0.1µV/°C (typ)
SINGLE-SUPPLY OPERATION
SUPPLY VOLTAGE: 1.8V to 5.5V
microSIZE PACKAGES: SC70 and SOT23
The OPA378 and OPA2378 represent a new
generation of micropower operational amplifiers.
Rail-to-rail input, low input offset voltage (50µV max),
low quiescent current (125µA max), and 900kHz
bandwidth make this part very attractive for
low-power precision applications. In addition, this part
has excellent PSRR, making it an outstanding choice
for applications that run directly from batteries without
regulation.
APPLICATIONS
•
•
•
•
The OPA378 (single version) is available in a
microSIZE SC70-5 and SOT23-5. The OPA2378
(dual version) is offered in s SOT23-8 package. All
versions are specified for operation from –40°C to
+125°C.
BATTERY-POWERED INSTRUMENTS
TEMPERATURE MEASUREMENT
MEDICAL INSTRUMENTATION
HANDHELD TEST EQUIPMENT
INPUT CURRENT AND VOLTAGE NOISE
SPECTRAL DENSITY vs FREQUENCY
0.1Hz TO 10Hz NOISE
100nV/div
Voltage Noise (nV/ÖHz)
100
Voltage Noise
10
0
Time (1s/div)
1
10
100
1k
10k
30k
Frequency (Hz)
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
I2C is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2008, Texas Instruments Incorporated
PRODUCT PREVIEW
•
•
•
•
•
•
•
23
OPA378
OPA2378
www.ti.com
SBOS417 – JANUARY 2008
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
OPA378
SOT23-5
DBV
OAZI
OPA378 (2)
SC70-5
DCK
BTS
SOT23-8
DCN
OCAI
OPA2378
(1)
(2)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Available 1Q08.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
OPA378, OPA2378
UNIT
+7
V
Supply Voltage
PRODUCT PREVIEW
Signal Input Terminals
Voltage (2)
–0.3 ≤ VIN ≤ (V+) + 0.3
V
Current (2)
±10
mA
Output Short-Circuit (3)
Continuous
Operating Temperature
–55 to +150
°C
Storage Temperature
–65 to +150
°C
Junction Temperature
+150
°C
Human Body Model (HBM)
4000
V
Charged Device Model (CDM)
1000
V
Machine Model (MM)
200
V
ESD Ratings
(1)
(2)
(3)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
Short-circuit to ground, one amplifier per package.
PIN CONFIGURATIONS
+IN
V-IN
2
1
OPA378
OPA378
OPA2378
SC70-5
Top View
SOT23-5
Top View
SC70-5
Top View
5
V+
2
3
Out
V-
4
OUT
+In
1
5
V+
-In A
2
3
Out A
4
-In
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1
2
+In A
3
V-
4
A
B
8
V+
7
Out B
6
-In B
5
+In B
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OPA2378
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SBOS417 – JANUARY 2008
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OPA378, OPA2378
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
15
50
µV
0.1
0.25
µV/°C
2
5
µV/V
8
µV/V
OFFSET VOLTAGE
Input Offset Voltage
VOS
vs Temperature
dVOS/dT
vs Power Supply
PSRR
over Temperature
VCM = 0V, VS = +1.8V to +5.5V
VCM = 0V, VS = +1.8V to +5.5V
Channel Separation, dc
µV/V
0.1
INPUT BIAS CURRENT
Input Bias Current
IB
Input Offset Current
±150
IOS
±500
pA
±1000
pA
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
en
0.4
µVPP
Input Voltage Noise Density, f = 1kHz
en
20
nV/√Hz
in
200
fA/√Hz
Input Current Noise, f = 10Hz
Common-Mode Voltage Range
VCM
Common-Mode Rejection Ratio
CMRR
(V–) – 0.1
(V+) + 0.1
PRODUCT PREVIEW
INPUT VOLTAGE RANGE
V
(V–) – 0.1V < VCM < (V+) + 0.1V, VS = 5.5V
100
110
dB
(V–) – 0.1V < VCM < (V+) + 0.1V, VS = 1.8V
94
103
dB
50mV < VO < (V+) – 50mV, RL = 100kΩ
110
134
dB
100mV < VO < (V+) – 100mV, RL = 10kΩ
110
130
dB
900
kHz
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
FREQUENCY RESPONSE
CL = 100pF
Gain-Bandwidth Product
GBW
Slew Rate
SR
G = +1
0.4
V/µs
Settling Time 0.1%
tD
VS = 5.5V, 2V Step, G = +1
5
µs
Settling Time 0.01%
tD
VS = 5.5V, 2V Step, G = +1
7
µs
VIN • Gain > VS
4
µs
VS = 5.5V, VO = 3VPP, G = +1, f = 1kHz
0.0012
%
RL = 10kΩ
6
Overload Recovery Time
THD + Noise
THD + N
OUTPUT
Voltage Output Swing from Rail
over Temperature
RL = 10kΩ
Voltage Output Swing from Rail
RL = 100kΩ
over Temperature
Short-Circuit Current
Capacitive Load Drive
Open-Loop Output Resistance
0.7
RL = 100kΩ
ISC
8
mV
10
mV
1
mV
2
mV
±10
mA
CLOAD
See Typical Characteristics
RO
See Typical Characteristics
POWER SUPPLY
Specified Voltage Range
Quiescent Current (per Amplifier)
VS
IQ
1.8
IO = 0V, VS = +5.5V
over Temperature
100
5.5
V
125
µA
135
µA
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OPA2378
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SBOS417 – JANUARY 2008
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V (continued)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OPA378, OPA2378
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE RANGE
Specified Range
–40
+125
°C
Operating Range
–55
+150
°C
Storage Range
–65
+150
Thermal Resistance
θJA
°C
°C/W
SOT23-5
200
°C/W
SC70-5
250
°C/W
SOT23-8
100
°C/W
PRODUCT PREVIEW
4
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OPA2378
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SBOS417 – JANUARY 2008
TYPICAL CHARACTERISTICS
At TA = +25°C, RL = 10kΩ, VS = +5.5V and VOUT = VS/2, unless otherwise noted.
MAXIMUM OUTPUT VOLTAGE
vs FREQUENCY
6
INPUT CURRENT AND VOLTAGE NOISE
SPECTRAL DENSITY vs FREQUENCY
1k
VS = 5.5V
Current Noise
Voltage Noise (nV/ÖHz)
Current Noise (fA/ÖHz)
Output Voltage (VPP)
5
4
3
2
100
Voltage Noise
10
1
VS = 1.8V
0
10k
100k
1M
1
10M
10
100
1k
10k
30k
Frequency (Hz)
Frequency (Hz)
Figure 1.
Figure 2.
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
OPEN-LOOP GAIN AND PHASE
vs FREQUENCY
0.0050
180
0
135
-45
0.0045
0.0040
Gain (dB)
0.0030
0.0025
0.0020
Phase
90
-90
-135
45
Phase (°)
THD (%)
0.0035
Gain
0.0015
-180
0
0.0010
0.0005
-45
0
10
100
10k
1k
0.01
0.1
1
Frequency (Hz)
10
100
1k
10k
100k
1M
-225
10M
Frequency (Hz)
Figure 3.
Figure 4.
COMMON-MODE REJECTION RATIO
vs FREQUENCY
POWER-SUPPLY REJECTION RATIO
vs FREQUENCY
120
120
100
100
V+
80
PSRR (dB)
CMRR (dB)
80
60
40
20
V60
40
20
0
0
10
100
1k
10k
100k
1M
1
10
100
1k
Frequency (Hz)
Frequency (Hz)
Figure 5.
Figure 6.
10k
100k
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1M
5
PRODUCT PREVIEW
1k
OPA378
OPA2378
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SBOS417 – JANUARY 2008
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ, VS = +5.5V and VOUT = VS/2, unless otherwise noted.
QUIESCENT CURRENT
vs SUPPLY VOLTAGE
40
102
35
101
30
100
99
25
IQ (mA)
Offset Voltage (V)
VOLTAGE OFFSET vs TEMPERATURE
20
15
98
97
96
10
95
5
94
0
93
-50
-25
0
25
50
75
100
125
150
1.0
1.5
2.0
2.5
3.0
Temperature (°C)
5.0
5.5
QUIESCENT CURRENT
vs TEMPERATURE
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
110
250
108
200
106
150
Input Bias Current (pA)
PRODUCT PREVIEW
IQ (mA)
4.5
Figure 8.
102
100
98
96
94
6.0
-IN
100
50
0
-50
+IN
-100
-150
-200
92
-250
90
-50
-25
0
25
50
75
100
125
0
150
1
2
3
4
6
5
Input Common-Mode Voltage (V)
Temperature (°C)
Figure 9.
Figure 10.
INPUT BIAS CURRENT
vs TEMPERATURE
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
1500
3
1000
2
VS = +2.75
+25°C -40°C
+125°C
Output Swing (V)
Input Bias Current (pA)
4.0
Figure 7.
104
500
-IN
0
+IN
-500
1
0
+125°C
VS = ±0.9
+25°C
-40°C
-1
+125°C
VS = -2.75
-2
-1000
+25°C -40°C
-3
-1500
-50
-25
0
25
50
75
100
125
150
0
2
Temperature (°C)
4
6
8
10
12
14
16
18
20
Output Current (mA)
Figure 11.
6
3.5
VS (V)
Figure 12.
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OPA2378
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SBOS417 – JANUARY 2008
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ, VS = +5.5V and VOUT = VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO AND PSRR
vs TEMPERATURE
OPEN-LOOP GAIN
vs TEMPERATURE
120
140
PSRR
115
105
CMRR
VS = 1.8V
100
RL = 100kW
135
VS = 5.5V
AOL (dB)
PSRR, CMRR (dB)
110
RL = 10kW
130
RL = 5kW
95
90
125
85
120
-50
-25
0
25
50
75
100
125
-50
150
-25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
Figure 13.
Figure 14.
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
SMALL-SCALE STEP RESPONSE
150
PRODUCT PREVIEW
80
80
70
Overshoot (%)
60
Output Voltage (50mV/div)
Gain = -1V/V
RFB = 100kW
50
40
Gain = +1V/V
30
20
10
G = +1
RL = 10kW
Gain = -1V/V
RFB = 5kW
0
1
10
100
1k
Time (4ms/div)
10k
Load Capacitor (pF)
Figure 15.
Figure 16.
POSITIVE OVER-VOLTAGE RECOVERY
NEGATIVE OVER VOLTAGE RECOVERY
10kW
+2.5V
10kW
+2.5V
0
0
1kW
1kW
OPA378
2.5V
0 1V/div
2.5V
1V/div
Output
OPA378
2V/div
2V/div
Output
0
Input
Input
Time (10ms/div)
Time (4ms/div)
Figure 17.
Figure 18.
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OPA2378
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SBOS417 – JANUARY 2008
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ, VS = +5.5V and VOUT = VS/2, unless otherwise noted.
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
100nV/div
0.1Hz TO 10Hz NOISE
TBD
Time (1s/div)
PRODUCT PREVIEW
Figure 19.
Figure 20.
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
OUTPUT IMPEDANCE
vs FREQUENCY
0.250
0.225
0.200
0.175
0.150
0.125
0.100
0.075
0.050
0.025
Population
Open-Loop Output Resistance (W)
1000
100
400mA
10
2mA
1
0.1
0.01
1
10
Offset Voltage Drift (mV/°C)
Figure 21.
8
100
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 22.
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OPA2378
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SBOS417 – JANUARY 2008
APPLICATIONS INFORMATION
Following these guidelines reduces the likelihood of
junctions being at different temperatures, which can
cause thermoelectric voltages of 0.1µV/°C or higher,
depending on materials used.
Current-limiting resistor
required if input voltage
exceeds supply rails by
³ 0.5V.
+5V
IOVERLOAD
10mA max
OPA378
VOUT
VIN
5kW
Figure 23. Input Current Protection
INTERNAL OFFSET CORRECTION
The OPA378 and OPA2378 op amps use an
auto-calibration technique with a time-continuous
350kHz op amp in the signal path. This amplifier is
zero-corrected every 3µs using a proprietary
technique. Upon power-up, the amplifier requires
approximately 100µs to achieve specified VOS
accuracy. This architecture has no aliasing or flicker
noise.
GENERAL LAYOUT GUIDELINES
OPERATING VOLTAGE
The OPA378 and OPA2378 op amps operate over a
power-supply range of +1.8V to +5.5V (±0.9V to
±2.75V). Supply voltages higher than +7V (absolute
maximum) can permanently damage the device.
Parameters that vary over supply voltage or
temperature are shown in the Typical Characteristics
section of this data sheet.
INPUT VOLTAGE
The OPA378 and OPA2378 input common-mode
voltage range extends 0.1V beyond the supply rails.
The OPA378 is designed to cover the full
common-mode range without the troublesome
transition region found in some other rail-to-rail
amplifiers.
Normally, input bias current is about 150pA; however,
input voltages exceeding the power supplies can
cause excessive current to flow into or out of the
input pins. Momentary voltages greater than the
power supply can be tolerated if the input current is
limited to 10mA. This limitation is easily accomplished
with an input resistor, as shown in Figure 23.
Attention to good layout practices is always
recommended. Keep traces short and, when
possible, use a printed circuit board (PCB) ground
plane with surface-mount components placed as
close to the device pins as possible. Place a 0.1µF
capacitor closely across the supply pins. These
guidelines should be applied throughout the analog
circuit to improve performance and provide
benefits such as reducing the electromagnetic
interference (EMI) susceptibility.
Operational amplifiers vary in susceptibility to radio
frequency interference (RFI). RFI can generally be
identified as a variation in offset voltage or dc signal
levels with changes in the interfering RF signal. The
OPA378 has been specifically designed to minimize
susceptibility to RFI and demonstrates remarkably
low sensitivity compared to previous generation
devices. Despite this design, strong RF fields may
cause varying offset levels. If the amplifier cannot be
located away from sources of radiation, shielding may
be needed. Twisting wire input leads makes them
more resistant to RF fields.
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PRODUCT PREVIEW
The OPA378 and OPA2378 are unity-gain stable and
free from unexpected output phase reversal. These
devices use a proprietary auto-calibration technique
to provide low offset voltage and very low drift over
time and temperature. For lowest offset voltage and
precision performance, circuit layout and mechanical
conditions should be optimized. Avoid temperature
gradients that create thermoelectric (Seebeck) effects
in the thermocouple junctions formed from connecting
dissimilar conductors. These thermally-generated
potentials can be made to cancel by assuring they
are equal on both input terminals. Other layout and
design considerations include:
• Use low thermoelectric-coefficient conditions
(avoid dissimilar metals).
• Thermally isolate components from power
supplies or other heat sources.
• Shield op amp and input circuitry from air
currents, such as cooling fans.
OPA378
OPA2378
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SBOS417 – JANUARY 2008
REF3140
+5V
0.1mF
4.096V
+
R8
150kW
R1
6.04kW
R5
31.6kW
D1
-
R2
2.94kW
-
+ +
K-Type
Thermocouple
40.7mV/°C
+5V
10mF
0.1mF
R7
549W
R4
6.04kW
VO
OPA378
R6
200W
R3
60.4W
Zero Adj.
Figure 24. Temperature Measurement
Figure 25 shows the basic configuration for a bridge
amplifier.
VEX
PRODUCT PREVIEW
A low-side current shunt monitor is shown in
Figure 26. RN are operational resistors used to isolate
the ADS1100 from the noise of the digital I2C™ bus.
Because the ADS1100 is a 16-bit converter, a precise
reference is essential for maximum accuracy. If
absolute accuracy is not required, and the 5V power
supply is sufficiently stable, the REF3130 may be
omitted.
R1
+5V
R R
R R
VOUT
OPA378
R1
VREF
Figure 25. Single Op Amp Bridge Amplifier
+5V
REF3130
3V
Load
R1
4.99kW
R2
49.9kW
R6
71.5kW
V
ILOAD
RSHUNT
1W
RN
56W
OPA378
R3
4.99kW
Stray Ground-Loop Resistance
R4
48.7kW
ADS1100
R7
1.18kW
RN
56W
2
IC
(PGA Gain = 4)
FS = 3.0V
NOTE: 1% resistors provide adequate common-mode rejection at small ground-loop errors.
Figure 26. Low-Side Current Monitor
10
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SBOS417 – JANUARY 2008
Figure 27 shows a high side current monitor. The
load current develops a drop across RSHUNT, and the
low (or load side, most negative side) of RSHUNT is
connected to the noninverting input of the op amp.
The op amp feedback forces a replica of this voltage
on its inverting input, yielding a drop across RG that is
identical to the drop across RSHUNT. RG can be sized
to provide whatever current is most convenient to the
designer based on this voltage drop. The MOSFET
conveys this current out of its drain to ground, where
a resistor RL converts the current that flows through
RG and the MOSFET back into a voltage. In this way
RL/RG sets the voltage gain of this circuit. The op
amp is powered by the zener diode, which forms a
small power supply window of voltage. For the
OPA378, ±VS but must be between 1.8V and
5.5V.Two possible methods are shown to bias the
zener, the customary resistor bias and a current
mirror. To operate over at the lowest possible voltage
for the shunt supply, current mirror biasing could also
be used. In either case, note that the voltage at the
output terminal of this circuit is restricted by whatever
voltage is available at the shunt. Resistor R1 and the
diode on the noninverting input provide protection in
situations where the load might be shorted out. These
components clamp the noninverting input to within a
diode drop of the negative rail of the op amp under
short-circuit conditions.
RG
zener
(1)
V+
(2)
R1
10kW
CBYPASS
MOSFET rated to
stand-off supply voltage
such as BSS84 for
up to 50V.
OPA378
+5V
PRODUCT PREVIEW
RSHUNT
V+
Two zener
biasing methods
(3)
are shown.
Output
Load
RBIAS
RL
NOTES: (1) zener rated for op amp supply capability (that is, 5.1V for OPA378).
(2) Current-limiting resistor.
(3) Choose zener biasing resistor or dual NMOSFETs (FDG6301N, NTJD4001N, or Si1034)
Figure 27. High-Side Current Monitor
1MW
100kW
60kW
V1
-In
INA152
OPA378
3V
1MW
NTC
Thermistor
R2
OPA378
R1
5
2
6
R2
3
Figure 28. Thermistor Measurement
VO
1
OPA378
V2
+In
VO = (1 + 2R2/R1) (V2 - V1)
Figure 29. Precision Instrumentation Amplifier
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SBOS417 – JANUARY 2008
+VS
R1
100kW
fLPF = 150Hz
C4
1.06nF
1/2
OPA2378
RA
+VS
R2
100kW
R6
100kW
1/2
OPA2378
+VS
3
2
LL
7
INA321
(1)
4
5
R8
100kW
+VS
dc
R3
100kW
1/2
OPA2378
Wilson
LA
R14
1MW
GTOT = 1kV/V
R7
100kW
ac
GINA = 5
R12
5kW
6
+VS
1
VOUT
OPA378
C3
1m F
R13
318kW
GOPA = 200
+VS
1/2
OPA2378
VCENTRAL
C1
47pF
(RA + LA + LL)/3
fHPF = 0.5Hz
(provides ac signal coupling)
1/2 VS
PRODUCT PREVIEW
R5
390kW
R9
20kW
+VS
R4
100kW
1/2
OPA2378
RL
Inverted
VCM
+VS
VS = +2.7V to +5.5V
1/2
OPA2378
BW = 0.5Hz to 150Hz
+VS
R10
1MW
1/2 VS
C2
0.64mF
NOTE: (1) Other instrumentation amplifiers can be used,
such as the INA326, which has lower noise,
but higher quiescent current.
R11
1MW
fO = 0.5Hz
Figure 30. Single-Supply, Very Low Power, ECG Circuit
12
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): OPA378 OPA2378
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jan-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
OPA378AIDBVR
PREVIEW
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
OPA378AIDBVT
PREVIEW
SOT-23
DBV
5
250
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1