Data Sheet 4V Drive Nch MOSFET RQ1E075XN Structure Silicon N-channel MOSFET Dimensions (Unit : mm) TSMT8 (8) (7) (6) (5) Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TSMT8). (1) (2) (3) (4) Abbreviated symbol : XR Application Switching Packaging specifications Package Type Code Basic ordering unit (pieces) RQ1E075XN Inner circuit Taping TCR 3000 ○ (8) Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage VDSS Gate-source voltage Drain current Source current (Body Diode) Continuous Pulsed Continuous VGSS ID IDP IS Pulsed ISP PD Power dissipation Channel temperature Range of storage temperature *1 *1 Limits Unit 30 20 7.5 V V A 30 1.25 30 A A A 1.5 W Tch Tstg 150 55 to 150 C C Symbol Limits Unit 83.3 C / W *2 (1) Source (2) Source (3) Source (4) Gate (5) Drain (6) Drain (7) Drain (8) Drain (7) (6) (5) (3) (4) ∗2 ∗1 (1) (2) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE *1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board. Thermal resistance Parameter Channel to Ambient Rth (ch-a)* *Mounted on a ceramic board. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/6 2011.04 - Rev.A Data Sheet RQ1E075XN Electrical characteristics (Ta = 25C) Parameter Gate-source leakage Symbol Min. Typ. Max. Unit IGSS - - 10 A Drain-source breakdown voltage V(BR)DSS Zero gate voltage drain current Gate threshold voltage Conditions VGS=20V, VDS=0V 30 - - V ID=1mA, V GS=0V IDSS - - 1 A VDS=30V, VGS=0V VGS (th) 1.0 - 2.5 V - 12 17 ID=7.5A, VGS=10V - 17 24 m ID=7.5A, VGS=4.5V VDS=10V, ID=1mA Static drain-source on-state resistance RDS (on)* - 19 27 Forward transfer admittance l Yfs l* 4.5 - - S ID=7.5A, VDS=10V Input capacitance Ciss - 440 - pF VDS=10V Output capacitance Coss - 170 - pF VGS=0V Reverse transfer capacitance Crss - 85 - pF f=1MHz Turn-on delay time td(on) * - 7 - ns ID=3.75A, VDD 15V Rise time tr * td(off) * - 25 - ns VGS=10V - 35 - ns RL=4.0 tf * - 7 - ns RG=10 Total gate charge Qg * - 6.8 - nC ID=7.5A, VDD 15 Gate-source charge Qgs * Qgd * 1.6 2.6 - nC nC VGS=5V Gate-drain charge - Turn-off delay time Fall time ID=7.5A, VGS=4.0V *Pulsed Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage Symbol VSD * Min. Typ. Max. - - 1.2 Unit V Conditions Is=7.5A, VGS=0V *Pulsed www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/6 2011.04 - Rev.A Data Sheet RQ1E075XN Electrical characteristic curves (Ta=25C) Fig.1 Typical Output Characteristics(Ⅰ) 7 7 Ta=25°C Pulsed 6 5 4 VGS= 3.0V 3 Ta=25°C Pulsed VGS= 10V VGS= 4.5V VGS= 4.0V 6 VGS= 10V VGS= 4.5V VGS= 4.0V DRAIN CURRENT : ID[A] DRAIN CURRENT : ID[A] Fig.2 Typical Output Characteristics(Ⅱ) VGS= 2.8V VGS= 2.5V 2 1 5 VGS= 2.8V 4 VGS= 2.5V 3 2 1 VGS= 2.0V VGS= 2.0V 0 0 0 0.2 0.4 0.6 0.8 1 0 2 Fig.3 Typical Transfer Characteristics 8 10 100 10 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] VDS= 10V Pulsed DRAIN CURRENT : ID[A] 6 Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ) 100 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1 0.1 0.01 Ta=25°C Pulsed 10 . VGS= 4.0V VGS= 4.5V VGS= 10V 1 0.001 GATE-SOURCE VOLTAGE : VGS[V] 1 10 DRAIN-CURRENT : ID[A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ) 0 1 2 0.01 3 100 0.1 100 100 VGS= 10V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] 4 DRAIN-SOURCE VOLTAGE : VDS[V] DRAIN-SOURCE VOLTAGE : VDS[V] 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1 VGS= 4.5V Pulsed 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1 0.01 0.1 1 10 100 0.01 DRAIN-CURRENT : ID[A] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 0.1 1 10 100 DRAIN-CURRENT : ID[A] 3/6 2011.04 - Rev.A Data Sheet RQ1E075XN Fig.8 Forward Transfer Admittance vs. Drain Current Fig.7 Static Drain-Source On-State Resistance vs. Drain Current(Ⅳ) 100 FORWARD TRANSFER ADMITTANCE : |Yfs| [S] 100 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] VGS= 4.0V Pulsed 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1 0.01 0.1 1 10 VDS= 10V Pulsed 10 1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 0.01 100 0.1 Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage 50 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ] VGS=0V Pulsed SOURCE CURRENT : Is [A] 10 Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage 100 10 1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 0.01 Ta=25°C Pulsed ID= 3.75A 40 ID= 7.5A 30 20 10 0 0 0.5 1 1.5 0 2 4 6 8 10 GATE-SOURCE VOLTAGE : VGS[V] SOURCE-DRAIN VOLTAGE : VSD [V] Fig.12 Dynamic Input Characteristics Fig.11 Switching Characteristics 10 1000 tf GATE-SOURCE VOLTAGE : VGS [V] Ta=25°C VDD=15V VGS=10V RG=10Ω Pulsed td(off) SWITCHING TIME : t [ns] 1 DRAIN-CURRENT : ID[A] DRAIN-CURRENT : ID[A] 100 td(on) 10 8 6 4 Ta=25°C VDD= 15V ID= 7.5A RG=10Ω Pulsed 2 tr 1 0 0.01 0.1 1 10 100 0 DRAIN-CURRENT : ID[A] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2 4 6 8 10 12 14 16 TOTAL GATE CHARGE : Qg [nC] 4/6 2011.04 - Rev.A Data Sheet RQ1E075XN Fig.13 Typical Capacitance vs. Drain-Source Voltage Fig.14 Maximum Safe Operating Aera 10000 1000 Operation in this area is limited by RDS(ON) (VGS=10V) Ciss DRAIN CURRENT : ID (A) CAPACITANCE : C [pF] Ta=25°C f=1MHz VGS=0V 1000 Crss 100 Coss 100 10 PW =100us PW =1ms 1 PW = 10ms 0.1 10 Ta=25°C Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm) DC operation 0.01 0.01 0.1 1 10 100 0.1 DRAIN-SOURCE VOLTAGE : VDS[V] 1 10 100 DRAIN-SOURCE VOLTAGE : VDS[V] Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width NORMARIZED TRANSIENT THERMAL RESISTANCE : r (t) 10 1 0.1 0.01 Mounted on a ceramic board. (30mm × 30mm × 0.8mm) Rth(ch-a)=83.3°C/W Rth(ch-a)(t)=r(t)×Rth(ch-a) 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 PULSE WIDTH : Pw(s) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/6 2011.04 - Rev.A Data Sheet RQ1E075XN Measurement circuits Pulse width VGS ID VDS 90% 50% 10% VGS VDS RL 50% 10% D.U.T. VDD RG 10% 90% td(on) ton Fig.1-1 Switching Time Measurement Circuit 90% td(off) tr tf toff Fig.1-2 Switching Waveforms VG VGS ID VDS Qg RL IG(Const.) VGS D.U.T. Qgs Qgd VDD Charge Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/6 2011.04 - Rev.A Notice Notes Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A