INTEGRATED CIRCUITS DATA SHEET TDA9880 Alignment-free multistandard vision and FM sound IF-PLL demodulator Product specification Supersedes data of 1998 Aug 12 File under Integrated Circuits, IC02 1999 Jul 21 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 • Precise fully digital Automatic Frequency Control (AFC) detector with 4-bit digital-to-analog converter FEATURES • 5 V supply voltage • Fully integrated sound carrier trap for 4.5, 5.5, 6.0 and 6.5 MHz, controlled by reference signal • Gain controlled wide-band Vision Intermediate Frequency (VIF) amplifier (AC-coupled) • Alignment-free selective FM-PLL demodulator with high linearity and low noise • True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics and excellent pulse response) • Digital frequency control, sound carrier frequencies 4.5, 5.5, 6.0 and 6.5 MHz • Fully integrated VIF Voltage Controlled Oscillator (VCO), alignment-free • Stabilizer circuit for ripple rejection and to achieve constant output signals • Digital acquisition help, VIF frequencies of 38.0, 38.9, 45.75 and 58.75 MHz • Electrostatic discharge (ESD) protection for all pins. • 4 MHz reference frequency input [signal from Phase-Locked Loop (PLL) tuning system] or operating as crystal oscillator GENERAL DESCRIPTION The TDA9880(T) is an integrated circuit for multistandard vision IF signal processing and FM demodulation in TV and VTR sets. • VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector, fast reaction time ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA9880 TDA9880T 1999 Jul 21 SDIP20 SO20 DESCRIPTION VERSION plastic shrink dual in-line package; 20 leads (300 mil) SOT325-1 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 2 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 QUICK REFERENCE DATA SYMBOL PARAMETER VP supply voltage IP supply current CONDITIONS note 1 MIN. TYP. MAX. UNIT 4.5 5 5.5 V 85 100 115 mA − 50 100 µV Vi(sens)(VIF)(rms) VIF input voltage sensitivity (RMS value) −1 dB video at output GVIF(cr) VIF gain control range see Fig.4 65 69 − dB fVIF VIF frequencies see Table 2 − 38.0 − MHz − 38.9 − MHz − 45.75 − MHz − 58.75 − MHz − ±2.38 − MHz ∆fVIF VIF frequency window of digital acquisition help referenced to fVIF Vo(v)(p-p) video output signal voltage (peak-to-peak value) sound carrier off; see Fig.10 1.7 2.0 2.3 V trap bypass mode; see Fig.10 0.95 1.10 1.25 V Gdif differential gain “NTC-7 Composite” − 2 5 % ϕdif differential phase “NTC-7 Composite” − 2 4 deg Bv(−3dB)(trap) −3 dB video bandwidth including sound carrier trap CL < 20 pF; RL > 1 kΩ; AC load; note 2 ftrap = 4.5 MHz (M/N standard) 3.95 4.05 − MHz ftrap = 5.5 MHz (B/G standard) 4.90 5.00 − MHz trap attenuation at first sound carrier M/N standard 30 36 − dB B/G standard 30 36 − dB αSC1 S/NW weighted signal-to-noise ratio of video signal see Fig.6; note 3 56 60 − dB PSRR13 power supply ripple rejection at pin 13 fripple = 70 Hz; video signal; grey level; see Fig.9 25 28 − dB Bv(−1dB) −1 dB video bandwidth CL < 20 pF; RL > 1 kΩ; AC load; trap bypass mode 5 6 − MHz Ich(max)(20) AGC maximum charge current at pin 20 6 8 10 µA Idch(max)(20) AGC maximum discharge current at pin 20 7.5 10 12.5 µA Isink(14) sink current of tuner AGC at pin 14 450 600 750 µA AFCstps AFC steepness ∆I19/∆f 0.85 1.05 1.25 µA/kHz Io(source)(19) AFC output source current at pin 19 160 200 240 µA Io(sink)(19) AFC output sink current at pin 19 160 200 240 µA Vo(intc)(rms) intercarrier output voltage (RMS value) − 49 − mV 1999 Jul 21 maximum tuner gain reduction; V14 = 1 V; see Fig.4 V i(SC) -------------- = – 24 dB ; note 4 V i(PC) 3 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL PARAMETER TDA9880 CONDITIONS Bintc(−3dB)(ul) upper limit −3 dB intercarrier bandwidth Vo(AF)(8)(rms) audio output signal voltage at pin 8 (RMS value) THD8 total harmonic distortion at pin 8 BAF(−3dB) −3 dB audio frequency bandwidth without de-emphasis; dependent on loop filter at pin 4 S/NW(AF) weighted signal-to-noise ratio of audio signal black picture white picture 6 kHz sine wave (black-to-white modulation) MIN. TYP. MAX. UNIT 7.5 9 − MHz 400 500 600 mV − 0.15 0.5 % 100 120 − kHz 50 56 − dB 45 51 − dB 40 46 − dB sound carrier subharmonics; f = 2.25 MHz ±3 kHz 35 40 − dB 75 µs de-emphasis; AM: f = 1 kHz; m = 0.3 referenced to 25 kHz FM deviation 40 46 − dB 25 kHz FM deviation; 75 µs de-emphasis αAM(sup) AM suppression of FM demodulator PSRR8 power supply ripple rejection at pin 8 fripple = 70 Hz; see Fig.9 14 20 − dB ∆fFM frequency window of digital acquisition help for FM demodulator − ±225 − kHz fref(15) frequency of reference signal at pin 15 − 4.0 − MHz Vref(15)(rms) amplitude of reference signal source operation as input terminal at pin 15 (RMS value) 80 − 400 mV Notes 1. Values of video and sound parameters can be decreased at VP = 4.5 V. 2. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps (see Figs 13 to 18); H (s) is the absolute value of transfer function. 3. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard) weighted in accordance with “CCIR 567”. 4. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal video signal with 1.1 V (p-p) as a reference: 1 V o(intc)(rms) = 1.1 V (p-p) × ----------- × 10 2 2 where: V i ( SC ) --------------- ( dB ) + 6 dB ± 3 dB V i ( PC ) ---------------------------------------------------------------20 V i ( SC ) 1 ----------- = correction term for RMS value, --------------- ( dB ) = sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB, V i ( PC ) 2 2 6 dB = correction term of internal circuitry and ±3 dB = tolerance of video output and intercarrier output amplitude Vo(intc)(rms). 1999 Jul 21 4 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... CVAGC TAGC TOP VAGC REF AFC TR 14 3 20 15 19 12 AGC VIF1 1 VIF2 2 DIGITAL VCO CONTROL RC VCO AFC DETECTOR SOUND TRAPS 4.5 to 6.5 MHz VIF-PLL 13 CVBS video output 2 V (p-p) [1.1 V (p-p) without trap] 5 TDA9880 LOGIC SUPPLY 8 AUD NARROW-BAND FM-PLL DETECTOR 17 16 18 11 9 10 7 4 5 6 VP GND VPLL SIO S0 S1 FAGC FMPLL DEEM AFD sound intercarrier output VIF-PLL filter CFAGC FM-PLL filter audio output CAFD de-emphasis decoupling MHB506 Product specification TDA9880 Fig.1 Block diagram. CDEEM Philips Semiconductors CTR RTOP Alignment-free multistandard vision and FM sound IF-PLL demodulator BLOCK DIAGRAM dbook, full pagewidth 1999 Jul 21 trap disable switch external reference or 4 MHz crystal Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 PINNING SYMBOL PIN DESCRIPTION SYMBOL PIN DESCRIPTION VIF1 1 VIF differential input 1 SIO 11 sound intercarrier output VIF2 2 VIF differential input 2 TR 12 trap control TOP 3 tuner AGC TakeOver Point (TOP) CVBS 13 video output FMPLL 4 FM-PLL filter TAGC 14 tuner AGC output DEEM 5 de-emphasis capacitor REF 15 4 MHz crystal or reference input AFD 6 AF decoupling capacitor GND 16 ground supply FAGC 7 FM-PLL AGC capacitor VP 17 supply voltage (+5 V) AUD 8 audio output VPLL 18 VIF-PLL filter S0 9 switch input S0 AFC 19 AFC output S1 10 switch input S1 VAGC 20 VIF-AGC capacitor handbook, halfpage handbook, halfpage VIF1 1 20 VAGC VIF1 1 20 VAGC VIF2 2 19 AFC VIF2 2 19 AFC TOP 3 18 VPLL TOP 3 18 VPLL 17 VP FMPLL 4 16 GND DEEM 5 TDA9880T AFD 6 15 REF 15 REF FAGC 7 14 TAGC FAGC 7 14 TAGC AUD 8 13 CVBS AUD 8 13 CVBS S0 9 12 TR S0 9 12 TR S1 10 11 SIO S1 10 11 SIO MHB072 MHB106 Fig.2 Pin configuration for SDIP20. 1999 Jul 21 16 GND DEEM 5 TDA9880 AFD 6 17 VP FMPLL 4 Fig.3 Pin configuration for SO20. 6 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 After frequency lock-in the phase detector produces a DC current proportional to the phase difference between the VCO and the input signal. The DC current of either the frequency detector or the phase detector is converted into a DC voltage via the VIF-PLL filter, which controls the VCO frequency. FUNCTIONAL DESCRIPTION Figure 1 shows the simplified block diagram of the integrated circuit. The integrated circuit comprises the following functional blocks: 1. VIF amplifier 2. Tuner-AGC and VIF-AGC VCO and Travelling Wave Divider (TWD) 3. VIF-AGC detector The Resistor Capacitor (RC) VCO operates as an integrated relaxation oscillator at double the picture carrier frequency. The control voltage required to tune the VCO to actually double the picture carrier frequency is generated by the FPLL detector and fed via the loop filter to the VCO control input terminal. 4. Frequency Phase-Locked Loop (FPLL) detector 5. VCO and Travelling Wave Divider (TWD) 6. Digital acquisition help and AFC 7. Video demodulator and amplifier 8. Sound carrier trap The oscillator signal is divided-by-two with a TWD which generates two differential output signals with a 90 degrees phase difference independent of the frequency. 9. Intercarrier mixer 10. FM demodulator and acquisition help 11. Audio amplifier Digital acquisition help and AFC 12. Internal voltage stabilizer. The integrated relaxation oscillator has a very wide frequency range from approximately 30 to 70 MHz (after the TWD). To prevent false locking of the FPLL and with respect to the catching range of the frequency detector of maximum ±2.5 MHz, the Digital Acquisition Help (DAH) provides current into the loop filter until the VCO is in a frequency window of ±2.3 MHz around the wanted VIF frequency. In this case the analog operating FPLL will lock the VCO to the VIF carrier and the acquisition help does not provide any current to the loop filter. VIF amplifier The VIF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration. Tuner-AGC and VIF-AGC The AGC capacitor voltage is converted to an internal VIF gain control signal, and is fed to the tuner AGC to generate the tuner AGC output current at pin TAGC (open-collector output). The tuner AGC takeover point can be adjusted with RTOP. This allows the tuner to be matched to the SAW filter in order to achieve the optimum IF input level. The principle of the digital acquisition help is as follows: the VCO is connected to a downcounter, which is preset depending on the required VIF frequency. The counting time, as well as the counter control, is derived from a 4 MHz reference signal. This signal can be supplied from the internal 4 MHz crystal oscillator or from the 4 MHz reference oscillator of an external tuning system. The counting result after a counting cycle corresponds to the actual VCO frequency. VIF-AGC detector The AGC detector generates the required VIF gain control voltage for constant video output by charging or discharging the AGC capacitor. Gain control is performed by sync level detection. The newly developed AGC circuit provides fast reaction time to cope with ‘aeroplane fluttering’. The time constants for decreasing or increasing gain are nearly equal. The digital AFC is also derived from the counting result after a counting cycle by digital-to-analog converting the last four bits of the counter. Frequency Phase-Locked Loop (FPLL) detector Video demodulator and amplifier The VIF amplifier output signal is fed into a Frequency Detector (FD) and into a Phase Detector (PD) via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the ‘in phase’ signal of the travelling wave divider output. 1999 Jul 21 7 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator FM demodulator and acquisition help The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the video amplifier. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics. The video signal of 1.1 V (p-p) for nominal vision IF modulation is fed internally to the integrated sound carrier trap as well as to the VIF-AGC detector. The second stage of the video amplifier converts and amplifies the differential output signal from the sound carrier trap to the single-ended CVBS output signal at pin 13 with a 2 V (p-p) amplitude. The FM demodulator is realized as a narrow-band PLL with external loop filter, which provides the necessary selectivity. To achieve good selectivity, a linear phase detector and constant input level are required. The intercarrier signal from the intercarrier mixer is fed via a gain controlled amplifier to the phase detector and it’s output signal controls (via the loop filter) the integrated relaxation oscillator. The possible frequency range is from 4 to 7 MHz. As a result of locking the oscillator frequency tracks with the FM modulation of the input signal; therefore, the oscillator control voltage is superimposed by the AF voltage. In this way the FM-PLL operates as an FM demodulator. The AF voltage is present at the loop filter and is fed via a buffer with 0 dB gain to the audio amplifier. Noise clipping is provided. Furthermore the trap can be bypassed by the implemented input switch of the second amplifier stage, forced by connecting pin 12 to ground. Sound carrier trap The digital acquisition help operates in the same way as described in Section “Digital acquisition help and AFC”. The sound carrier trap consists of a reference filter, a phase detector and the sound trap itself. Audio amplifier A sound carrier reference signal is fed into the reference low-pass filter and is shifted by a nominal 90 degrees. The phase detector compares the original reference signal with the signal shifted by the reference filter and produces, at the external capacitor CTR, a DC voltage by charging or discharging the capacitor with a current proportional to the phase difference between both signals, respectively to the frequency error of the integrated filters. The DC voltage is converted to currents which control the frequency position of the reference filter and the sound trap. The audio amplifier consists of two parts: 1. The AF preamplifier is an operational amplifier with internal feedback, high gain and high common mode rejection. The AF voltage from the PLL demodulator, by principle a small output signal, is amplified by 30 dB. A DC operating point control circuit (pin 6) decouples the AF amplifier from the DC voltage of the PLL. The low-pass characteristic of the amplifier reduces the harmonics of the intercarrier signal at the sound output terminal. If required, a de-emphasis network can be realized by the amplifier output resistance and an external capacitor. The sound trap itself is constructed of three separate traps to realize sufficient suppression of the first and second sound carrier. The right frequency position of the different standards is set by the sound carrier reference signal. 2. The AF output amplifier (10 dB) provides the required output level by a rail-to-rail output stage. This amplifier makes use of an input selector for switching to mute state, automatically controlled by the mute switching voltage from the digital acquisition help in order to avoid lock-in noise. During normal operation the automatic audio mute function is not active. Application of a 2.2 kΩ resistor between the intercarrier output (pin 11) and ground will activate the automatic audio mute function. Intercarrier mixer The intercarrier mixer is realized by a multiplier, operating in quadrature mode for suppression of low frequency video signals. The VIF amplifier output signal is fed to the intercarrier mixer and converted to an intercarrier frequency by the regenerated 90 degree picture carrier from the VCO. The mixer output signal is fed via a band-pass filter and amplifier for attenuation of the high frequency video signal components and carrier harmonics to the output pin 11. The intercarrier signal is fed also to the integrated FM demodulator. 1999 Jul 21 TDA9880 Internal voltage stabilizer The band gap circuit internally generates a voltage of approximately 2.4 V, independent of the supply voltage and the temperature. A voltage regulator circuit, controlled by this voltage, produces a constant voltage of 3.55 V which is used as an internal reference voltage. 8 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER VP supply voltage Vn voltage at CONDITIONS MIN. IP = 115 mA; Tamb = 70 °C; at − maximum chip temperature of 125 °C MAX. UNIT 5.5 V pins 1 to 4, 6 to 10, 12 and 17 to 20 0 VP V pin 14 0 13.2 V tsc short-circuit time to ground or VP − 10 s Tstg storage temperature −25 +150 °C Tamb ambient temperature −20 +70 °C Ves electrostatic handling voltage for all pins note 1 −250 +250 V note 2 −3000 +3000 V Notes 1. Charge device model class A; machine model: discharging a 200 pF capacitor via a 0.75 µH inductance. 2. Charge device model class B; human body model: discharging a 100 pF capacitor via a 1.5 kΩ series resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) 1999 Jul 21 PARAMETER VALUE UNIT TDA9880 (SDIP20) 85 K/W TDA9880T (SO20) 85 K/W thermal resistance from junction to ambient CONDITIONS in free air 9 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 CHARACTERISTICS VP = 5 V; Tamb = 25 °C; see Table 2 for input frequencies; M standard (fPC = 45.75 MHz; fSC = 41.25 MHz; PC/SC = 10 dB) is used for specification; Vi(VIF)(rms) = 10 mV (sync level); IF input from 50 Ω via broadband transformer 1 : 1; DSB video modulation; 10% residual carrier; video signal in accordance with “NTC-7 Composite” ; measurements taken in test circuit of Fig.19; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pin 17) VP supply voltage 4.5 5 5.5 V IP supply current note 1 85 100 115 mA Ptot total power dissipation − 500 633 mW VIF amplifier (pins 1 and 2) Vi(sens)(VIF)(rms) VIF input voltage sensitivity (RMS value) −1 dB video at output − 50 100 µV Vi(max)(rms) maximum input signal voltage (RMS value) 1 dB video at output; note 2 110 − − mV ∆Vint internal IF amplitude difference within AGC range; between picture and sound ∆f = 4.5 MHz carrier − 0.7 1 dB GVIF(cr) VIF gain control range 65 69 − dB BVIF(−3dB)(ll) lower limit −3 dB VIF bandwidth − 15 25 MHz BVIF(−3dB)(ul) upper limit −3 dB VIF bandwidth 70 100 − MHz Ri(dif) differential input resistance note 3 1.7 2.2 2.7 kΩ Ci(dif) differential input capacitance note 3 VI DC input voltage see Fig.4 1.2 1.7 2.5 pF − 3.35 − V FPLL and true synchronous video demodulator; note 4 fVCO(max) maximum oscillator frequency for carrier regeneration f = 2fPC 120 140 − MHz fVIF vision carrier operating frequencies see Table 2 − 38.0 − MHz − 38.9 − MHz − 45.75 − MHz − 58.75 − MHz ∆fVIF VIF frequency window of digital referenced to fVIF acquisition help − ±2.38 − MHz tacq acquisition time BL = 70 kHz; note 5 − − 30 ms Vi(sens)(VIF)(rms) VIF input voltage sensitivity at pins 1 and 2 (RMS value) for PLL to be locked maximum IF gain − 30 70 µV for C/N = 10 dB notes 6 and 7 − 100 140 µV − 17 − µA SIGNAL AT PIN 18 Io(source)(PD)(max) maximum source current of phase detector output 1999 Jul 21 10 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL PARAMETER TDA9880 CONDITIONS MIN. TYP. MAX. UNIT Io(sink)(PD)(max) maximum sink current of phase detector output − 17 − µA Io(source)(DAH) output source current of digital acquisition help − 23 − µA Io(sink)(DAH) output sink current of digital acquisition help − 23 − µA tW(min)(DAH) minimum pulse width of digital acquisition help current − 64 − µs KO(VIF) VCO steepness ∆fVIF/∆V18 − 20 − MHz/V KD(VIF) phase detector steepness ∆I18/∆ϕVIF − 23 − µA/rad Video output signal and sound carrier trap (pin 13; sound carrier off) Vo(v)(p-p) video output signal voltage (peak-to-peak value) see Fig.10 1.7 2.0 2.3 V Vsync sync pulse voltage level see Fig.10 1.15 1.35 1.55 V Vzc zero carrier voltage level see Fig.10 3.27 3.57 3.87 V Vv(clu) upper video clipping voltage level VP − 1.1 VP − 1 − V Vv(cll) lower video clipping voltage level − 0.7 1.0 V Ro output resistance − − 30 Ω Ibias(int) internal DC bias current for emitter-follower 2.0 2.5 − mA Io(source)(max) maximum AC and DC output source current 2.4 − − mA Io(sink)(max) maximum AC and DC output sink current 1.4 − − mA ∆Vo deviation of CVBS output signal voltage 50 dB gain control − − 0.5 dB 30 dB gain control − − 0.1 dB note 3 ∆Vo(bl) black level tilt − − 1 % Gdif differential gain “NTC-7 Composite” − 2 5 % ϕdif differential phase “NTC-7 Composite” − 2 4 deg Bv(−3dB)(trap) −3 dB video bandwidth including sound carrier trap CL < 20 pF; RL > 1 kΩ; AC load; note 8 ftrap = 4.5 MHz (M/N standard) 3.95 4.05 − MHz ftrap = 5.5 MHz (B/G standard) 4.90 5.00 − MHz ftrap = 6.0 MHz (I standard) 5.2 5.50 − MHz ftrap = 6.5 MHz (D/K standard) 5.5 5.95 − MHz 1999 Jul 21 11 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL αSC1 αSC1(60 kHz) αSC2 αSC2(60 kHz) td(g)(CC) PARAMETER trap attenuation at first sound carrier trap attenuation at first sound carrier fSC1 ±60 kHz trap attenuation at second sound carrier trap attenuation at second sound carrier fSC2 ±60 kHz group delay at chrominance carrier frequency TDA9880 CONDITIONS MIN. TYP. MAX. UNIT M/N standard 30 36 − dB B/G standard 30 36 − dB I standard 26 32 − dB D/K standard 26 32 − dB M/N standard 21 27 − dB B/G standard 24 30 − dB I standard 20 26 − dB D/K standard 20 26 − dB M/N standard 21 27 − dB B/G standard 21 27 − dB I standard 12 18 − dB D/K standard 18 24 − dB M/N standard 15 21 − dB B/G standard 15 21 − dB I standard 10 15 − dB D/K standard 13 18 − dB 3.58 MHz at M/N standard 110 180 250 ns 4.43 MHz at B/G standard 110 180 250 ns − 90 160 ns 4.28 MHz at D/K standard − 60 130 ns 4.43 MHz at I standard S/NW weighted signal-to-noise ratio weighted in accordance with “CCIR 567”; see Fig.6; note 9 56 60 − dB S/NUW unweighted signal-to-noise ratio note 9 47 51 − dB αdblue intermodulation attenuation at ‘blue’ f = 0.92 MHz; see Fig.7; note 10 58 64 − dB f = 2.76 MHz; see Fig.7; note 10 58 64 − dB f = 0.92 MHz; see Fig.7; note 10 60 66 − dB f = 2.76 MHz; see Fig.7; note 10 59 65 − dB αdyellow intermodulation attenuation at ‘yellow’ ∆Vr(vc)(rms) residual vision carrier (RMS value) fundamental wave and harmonics − 2 5 mV αH(sup) harmonics suppression in video signal CL < 20 pF; RL > 1 kΩ; AC load; note 11a 35 40 − dB αH(spur) spurious elements suppression note 11b in video signal 40 − − dB PSRR13 power supply ripple rejection at fripple = 70 Hz; video pin 13 signal; grey level; see Fig.9 25 28 − dB 1999 Jul 21 12 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL PARAMETER TDA9880 CONDITIONS MIN. TYP. MAX. UNIT Video output signal (pin 13; trap bypass mode; V12 < 0.8 V; sound carrier off); see Fig.10; note 12 Vo(v)(p-p) video output signal voltage (peak-to-peak value) Vsync see Fig.10 0.95 1.10 1.25 V sync pulse voltage level 1.4 1.5 1.6 V Vzc zero carrier voltage level 2.57 2.72 2.87 V Vv(clu) upper video clipping voltage level 3.1 3.25 − V Vv(cll) lower video clipping voltage level − 1.15 1.3 V Bv(−1dB) −1 dB video bandwidth CL < 20 pF; RL > 1 kΩ; AC load 5 6 − MHz Bv(−3dB) −3 dB video bandwidth CL < 20 pF; RL > 1 kΩ; AC load 7 8 − MHz S/NW weighted signal-to-noise ratio weighted in accordance with “CCIR 567”; see Fig.6; note 9 56 60 − dB S/NUW unweighted signal-to-noise ratio note 9 49 53 − dB 5 9 13 µA Trap control (pin 12) Io(source)(max) maximum output source current Io(sink)(max) maximum output sink current KD(trap) frequency detector steepness ∆I12/∆ftrap 9 13 17 µA ftrap = 4.5 MHz (M/N standard) − −8 − µA/MHz ftrap = 6.5 MHz (D/K standard) − −5.5 − µA/MHz 1.5 − 3.5 V V12 operating voltage range of trap frequency control at pin 12 IL(12) leakage current at pin 12 ∆ftrap < ±25 kHz − − ±80 nA CRstps control steepness ∆ftrap/∆V12 ftrap = 4.5 MHz (M/N standard) − 4.5 − MHz/V ftrap = 6.5 MHz (D/K standard) − 9 − MHz/V Vsw switching voltage trap bypass mode active − − 0.8 V Isource source current trap bypass mode active; V12 ≤ 0.8 V − 185 − µA 6 8 10 µA VIF-AGC detector (pin 20) Ich(max)(20) maximum charge current Idch(max)(20) maximum discharge current tres(inc) AGC response time to an increasing VIF step 1999 Jul 21 7.5 10 12.5 µA 6 dB; note 13 − 2.0 − ms 20 dB; note 13 − 2.5 − ms 40 dB; note 13 − 4.0 − ms 13 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL tres(dec) PARAMETER AGC response time to a decreasing VIF step V20 gain control voltage range at pin 20 CRstps control steepness ∆GIF/∆V20 TDA9880 CONDITIONS MIN. TYP. MAX. UNIT −6 dB; note 13 − 1.0 − ms −20 dB; note 13 − 1.5 − ms −40 dB; note 13 − 2.5 − ms 1.7 − 3.6 V − −40 − dB/V − 2 5 mV V20 = 2.2 to 3.2 V Tuner AGC (pin 14); see Figs 4 and 5 Vi(VIF)(min)(rms) VIF input signal voltage for RTOP = 22 kΩ; minimum starting point of tuner I14 = 120 µA takeover at pins 1 and 2 (RMS value) Vi(VIF)(max)(rms) VIF input signal voltage for maximum starting point of tuner takeover at pins 1 and 2 (RMS value) RTOP = 0 Ω; I14 = 120 µA 45 90 − mV QVi(VIF)(rms) tuner takeover point accuracy (RMS value) RTOP = 12 kΩ; I14 = 120 µA 5 10 20 mV Vo permissible output voltage from external source − − 13.2 V Vsat saturation voltage I14 = 450 µA − − 0.2 V Vi(VIF)(rms)/∆T variation of takeover point with temperature I14 = 120 µA − 0.03 0.07 dB/K Isink sink current no tuner gain reduction; see Fig.4 V14 = 12 V − − 0.75 µA V14 = 13.2 V − − 1.5 µA maximum tuner gain reduction; V14 = 1 V; see Fig.4 450 600 750 µA tuner gain current from 20% to 80% − 5 8 dB 0.85 1.05 1.25 µA/kHz −20 − +20 kHz ∆GIF IF slip by automatic gain control AFC circuit (pin 19); notes 14 and 15 AFCstps AFC steepness ∆I19/∆fVIF QfVIF accuracy of AFC circuit Io(19) = 0; f15 = 4.0 MHz Vsat(ul) upper limit saturation voltage see Fig.8 VP − 0.6 VP − 0.3 − V Vsat(ll) lower limit saturation voltage see Fig.8 − 0.3 0.6 V Io(source) output source current 160 200 240 µA Io(sink) output sink current 160 200 240 µA 1999 Jul 21 14 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL PARAMETER TDA9880 CONDITIONS MIN. TYP. MAX. UNIT Intercarrier mixer (pin 11) 49 − mV 7.5 9 − MHz fundamental wave and harmonics − 2 − mV note 3 − − 70 Ω DC output voltage 1.85 2.05 2.35 V Ibias(int) internal DC bias current for emitter-follower 0.9 1.15 − mA Io(source)(max) maximum AC output source current note 17 0.6 0.8 − mA Io(sink)(max) maximum AC output sink current note 17 0.6 0.8 − mA IO(source) DC output source current automatic audio mute function activated; note 17 0.75 0.93 1.20 mA see Table 2 − 4.5 − MHz − 5.5 − MHz − 6.0 − MHz − 6.5 − MHz Vo(intc)(rms) intercarrier output voltage (RMS value) Bintc(−3dB)(ul) upper limit −3 dB intercarrier bandwidth ∆Vr(SC)(rms) residual sound carrier (RMS value) Ro output resistance VO − V i(SC) -------------- = – 24 dB ; note 16 V i(PC) FM-PLL demodulator; notes 15 and 18 to 21 fintc sound intercarrier operating frequencies ∆fFM frequency window of digital acquisition help for FM demodulator − ±225 − kHz VFM(rms) IF intercarrier level for gain corresponding PC/SC controlled operation of FM-PLL ratio at input pins 1 and 2 (RMS value) is 7 to 40 dB 6 − 320 mV VFM(lock)(rms) IF intercarrier level for lock-in of PLL (RMS value) − − 3 mV GFM IF intercarrier gain control range 30 34 − dB V7 gain control voltage range at pin 7 1.5 − 3.5 V Ich(max)(7) maximum charge current 1.5 2.2 2.9 µA Idch(max)(7) maximum discharge current 1.5 2.2 2.9 µA CRstps control steepness ∆GFM/∆V7 V7 = 2.2 to 2.7 V − −30 − dB/V audio output signal voltage (RMS value) 25 kHz FM deviation 400 500 600 mV 27 kHz FM deviation 432 540 648 mV SIGNAL AT PIN 7 SIGNAL AT PIN 8 Vo(AF)(rms) 1999 Jul 21 15 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL Vo(AF)(cl)(rms) PARAMETER audio output clipping signal voltage level (RMS value) TDA9880 CONDITIONS THD < 1.5% MIN. 1.3 TYP. MAX. UNIT 1.4 − V 0.5 % THD total harmonic distortion − 0.15 ∆Vo(AF)/∆T temperature drift of AF output signal voltage − 3 × 10−3 7 × 10−3 dB/K ∆fAF audio frequency deviation THD < 1.5%; note 22 − − ±55 kHz BAF(−3dB) −3 dB audio frequency bandwidth without de-emphasis; 80 dependent on loop filter at pin 4; measured in accordance with Fig.19 100 − kHz S/NW weighted signal-to-noise ratio of audio signal black picture 50 56 − dB white picture 45 51 − dB 6 kHz sine wave (black-to-white modulation) 40 46 − dB sound carrier subharmonics; f = 2.25 MHz ±3 kHz 35 40 − dB ∆Vr(SC)(rms) residual sound carrier (RMS value) fundamental wave and harmonics; without de-emphasis − − 2 mV αAM(sup) AM suppression of FM demodulator 75 µs de-emphasis; AM: f = 1 kHz; m = 0.3 referenced to 25 kHz FM deviation 40 46 − dB PSRR8 power supply ripple rejection at fripple = 70 Hz; see Fig.9 pin 8 14 20 − dB Io(source)(PD)(max) maximum phase detector output source current − 86 − µA Io(sink)(PD)(max) maximum phase detector output sink current − 80 − µA Io(source)(DAH) output source current of digital acquisition help − 110 − µA Io(sink)(DAH) output sink current of digital acquisition help − 110 − µA tW(DAH) pulse width of digital acquisition help current − 16 − µs Tcy(DAH) cycle time of digital acquisition help − 64 − µs KO(FM) VCO steepness ∆fFM/∆V4 − 3.3 − MHz/V KD(FM) phase detector steepness ∆I4/∆ϕFM − 9 − µA/rad SIGNAL AT PIN 4 1999 Jul 21 16 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL PARAMETER TDA9880 CONDITIONS MIN. TYP. MAX. UNIT Audio amplifier (pins 5, 6 and 8) Ro(5) output resistance at pin 5 4.4 5.0 5.6 kΩ VAF(5)(rms) audio signal (RMS value) at pin 5 note 23 − 170 − mV VO(5) DC output voltage at pin 5 − 2.37 − V Ro(8) output resistance at pin 8 − − 200 Ω VO(8) DC output voltage at pin 8 − 2.37 − V Io(source)(max)(8) maximum AC and DC output source current at pin 8 − − 0.5 mA Io(sink)(max)(8) maximum AC and DC output sink current at pin 8 − − 0.5 mA V6 DC decoupling voltage at pin 6 dependent on intercarrier frequency fFM 1.5 − 3.3 V IL(6) leakage current at pin 6 − − ±25 nA Ich(max)(6) maximum charge current at pin 6 1.15 1.5 1.85 µA Idch(max)(6) maximum discharge current at pin 6 1.15 1.5 1.85 µA BAF(−3dB) −3 dB audio frequency bandwidth of audio amplifier upper limit 150 − − kHz lower limit; note 24 − − 20 Hz αmute(8) mute attenuation of AF signal at pin 8 note 17 70 75 − dB ∆V8 DC jump voltage at pin 8 for switching AF output to mute state and vice versa activated by digital acquisition help; note 17 − ±50 ±150 mV pin open-circuit; Ii(9,10) < 0.1 µA 2.8 3.0 3.6 V for LOW 0 − 0.8 V for MID 1.3 1.8 2.3 V for HIGH 2.8 − VP V Vi(9,10) = 0 V 87 105 122 µA Vi(9,10) = 1.8 V 33 39 45 µA note 3 ∆VO(8) < ±50 mV Standard switch (pins 9 and 10); see Table 2 Vi Ii(source) input voltage input source current Reference input (pin 15); note 25 VI DC input voltage 2.3 2.6 2.9 V Ri input resistance 2.5 3.0 3.5 kΩ Rxtal resonance resistance of crystal operation as crystal oscillator − − 200 Ω Cx pull-up/down capacitance − − − pF fref frequency of reference signal − 4.0 − MHz ∆fref tolerance of reference frequency − − ±0.1 % 1999 Jul 21 note 26 note 15 17 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator SYMBOL PARAMETER Vref(rms) amplitude of reference signal source (RMS value) Ro(ref) output resistance of reference source CK decoupling capacitance to external reference source TDA9880 CONDITIONS operation as input terminal operation as input terminal MIN. TYP. MAX. UNIT 80 − 400 mV − − 4.7 kΩ 22 100 − pF Notes 1. Values of video and sound parameters can be decreased at VP = 4.5 V. 2. This parameter is tested with 110 mV to ensure maximum input level. 3. This parameter is not tested during production and is only given as application information for designing the television receiver. 4. Loop bandwidth BL = 70 kHz (damping factor d = 1.9; calculated with sync level within gain control range). Calculation of the VIF-PLL filter can be done by use of the following formulae: 1 BL –3 dB = ------- K O K D R , valid for d ≥ 1.2 2π 1 d = --- R K O K D C , 2 where: rad Hz µA KO = VCO steepness -------- or 2π ------- ; KD = phase detector steepness -------- ; V rad V R = loop resistor; C = loop capacitor; BL−3 dB = loop bandwidth for −3 dB; d = damping factor. 5. Vi(VIF)(rms) = 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video modulation. 6. Vi(VIF) signal for nominal video signal. 7. Broadband transformer at VIF input. The C/N ratio at VIF input is defined as the VIF input signal (sync level, RMS value) related to a superimposed 4.2 MHz band-limited white noise signal (RMS value); white picture video modulation. 8. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps (see Figs 13 to 18); H (s) is the absolute value of transfer function. 9. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard). 10. The intermodulation figures are defined: V 0 at 3.58 MHz αd 0.92 = 20 log --------------------------------------- + 3.6 dB ; αd0.92 value at 0.92 MHz referenced to black or white signal; V 0 at 0.92 MHz V 0 at 3.58 MHz αd 2.76 = 20 log --------------------------------------- ; αd2.76 value at 2.76 MHz referenced to chrominance carrier. V 0 at 2.76 MHz 11. Measurements taken with SAW filter M1963M (sound shelf: 20 dB); loop bandwidth BL = 70 kHz. a) Modulation Vestigial Side-Band (VSB); sound carrier off; fvideo > 0.5 MHz. b) Sound carrier on; fvideo = 10 kHz to 10 MHz. 12. The sound carrier trap can be disabled by switching pin 12 to ground (<0.8 V). In this way the full composite video spectrum appears at pin 13. The amplitude is 1.1 V (p-p). 13. Response time valid for a VIF input level range of 200 µV to 70 mV. 1999 Jul 21 18 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.8. The AFC steepness can be changed by resistors R1 and R2. 15. The tolerance of the reference frequency determines the accuracy of the VIF AFC, FM demodulator centre frequency and maximum FM deviation. 16. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal video signal with 1.1 V (p-p) as a reference: 1 V o(intc)(rms) = 1.1 V (p-p) × ----------- × 10 2 2 where: V i ( SC ) --------------- ( dB ) + 6 dB ± 3 dB V i ( PC ) ---------------------------------------------------------------20 V i ( SC ) 1 ----------- = correction term for RMS value, --------------- ( dB ) = sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB, V i ( PC ) 2 2 6 dB = correction term of internal circuitry and ±3 dB = tolerance of video output and intercarrier output amplitude Vo(intc)(rms). 17. For normal operation no DC load at pin 11 is allowed, so the automatic audio mute function is not active. By connecting a 2.2 kΩ resistor between pin 11 and ground the automatic audio mute function will be activated. With this application also the series capacitor CS of the loop filter at pin 4 should be changed from 33 nF to 4.7 nF. 18. Calculation of the FM-PLL filter can be done approximately by use of the following formulae: 1 KO KD f o = ------- --------------2π C P 1 ϑ = -----------------------------------2R K O K D C P 2 BL –3 dB = f o ( 1.55 – ϑ ) The formulae are only valid under the following conditions: ϑ ≤ 1 and CS > 5CP where: rad Hz µA KO = VCO steepness -------- or 2π ------- ; KD = phase detector steepness -------- ; V rad V RS = loop resistor; CS = series capacitor; CP = parallel capacitor; fo = natural frequency of PLL; BL−3 dB = loop bandwidth for −3 dB; ϑ = damping factor. For examples see Table 1. 19. For all S/N measurements the used vision IF modulator requires an incidental phase modulation for black-to-white jump of less than 0.5 degrees. 20. Measurements taken with SAW filter M1963M (Siemens) for vision and sound IF (sound shelf: 20 dB). Picture-to-sound carrier ratio of transmitter: PC/SC = 10 dB. Input level (at pins 1 and 2) Vi(VIF)(rms) = 10 mV (sync level), 25 kHz FM deviation for sound carrier, fAF = 400 Hz. Measurement in accordance with “CCIR 468-4”. De-emphasis = 75 µs. 21. The PC/SC ratio is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change these values. 22. Measured with an FM deviation of 25 kHz, the typical AF output signal is 500 mV (RMS). By using Rx = 20 kΩ the AF output signal is attenuated by 6 dB, so 250 mV (RMS). For handling an FM deviation of more than 55 kHz the AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an FM deviation up to 100 kHz an attenuation of 6 dB is recommended. 23. CDEEM = 10 nF results in τ = 50 µs and CDEEM = 15 nF results in τ = 75 µs. 1999 Jul 21 19 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 24. The lower limit of audio bandwidth depends on the value of the capacitor at pin 6. A value of CAFD = 470 nF leads to fAF(−3 dB) ≈ 20 Hz and CAFD = 220 nF leads to fAF(−3 dB) ≈ 40 Hz. 25. The reference input pin 15 is able to operate as a 1-pin crystal oscillator as well as an input terminal with external reference signal, e.g. from the tuning system. 26. The value of Cx determines the accuracy of the resonance frequency of the crystal. It depends on the type of crystal used. Table 1 Table 2 Examples to note 18 of Chapter “Characteristics” BL−3 dB (kHz) CS (nF) CP (pF) R (kΩ) ϑ 100 33 820 2.7 0.5 160 33 330 3.9 0.5 Standard switch settings S0 S1 fVIF (MHz) fintc (MHz) STANDARD REMARK LOW LOW 38.9 5.5 B/G Europe LOW MID 38.9 6.5 D/K LOW HIGH 38.9 6.0 I MID LOW 38.0 5.5 B/G MID MID 38.0 6.0 I MID HIGH 38.0 6.5 D/K HIGH LOW 45.75 4.5 M/N HIGH MID 38.0 4.5 M HIGH HIGH 58.75 4.5 M 1999 Jul 21 20 United Kingdom USA Japan Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 MHB158 handbook, V halfpage handbook, halfpage Vi(VIF) (dB/µV) (µA) 4 MHB159 120 I14 20 (V) 600 100 500 400 90 3 300 80 200 (1) (2) (3) (4) 2 100 70 0 1 30 50 (1) VIF AGC voltage. (2) Ituner; RTOP = 22 kΩ. 70 60 90 110 Vi(VIF) (dB/µV) 0 4 8 12 16 20 24 RTOP (kΩ) (3) Ituner; RTOP = 12 kΩ. (4) Ituner; RTOP = 0 Ω. Fig.5 Typical tuner takeover point as a function of RTOP. Fig.4 Typical VIF and tuner AGC characteristic. MHB160 70 handbook, halfpage S/N (dB) 60 3.2 dB handbook, halfpage 10 dB 13.2 dB 13.2 dB 50 21 dB 21 dB 40 30 SC CC PC SC CC PC 20 BLUE YELLOW 10 MHA739 0 30 50 70 90 Vi(VIF) (dB/µV) 110 SC = sound carrier, with respect to sync level. CC = chrominance carrier, with respect to sync level. PC = picture carrier, with respect to sync level. The sound carrier levels are taking into account a sound shelf attenuation of 20 dB (SAW filter M1963M). Fig.6 Typical signal-to-noise ratio as a function of VIF input voltage. 1999 Jul 21 Fig.7 Input signal conditions. 21 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 lock range without SAW filter handbook, full pagewidth 5 V19 −200 I19 (V) VP 4 (µA) −100 TDA9880 19 I19 R1 22 kΩ 3 0 R2 22 kΩ 2 100 1 200 MHB075 0 43 44 45 46 45.94 45.56 47 f (MHz) 45.75 Fig.8 Measurement conditions and typical AFC characteristic. handbook, full pagewidth VP = 5 V VP = 5 V 100 mV (fripple = 70 Hz) TDA9880 MHB076 t Fig.9 Ripple rejection condition. 1999 Jul 21 22 48 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 trap bypass mode handbook, full pagewidth normal mode 2.72 V 2.6 V 3.57 V 3.35 V zero carrier level white level 1.83 V 1.95 V black level 1.5 V 1.35 V sync level MHB163 Fig.10 Typical video signal levels on output pin 13 (sound carrier off). MHB164 10 handbook, full pagewidth audio S/N 0 (dB) (1) −10 −20 −30 −40 (2) −50 (3) −60 −70 49 46 43 40 37 34 31 28 25 22 19 16 13 10 gain controlled operation of FM-PLL PC/SC ratio at pins 1 and 2 (dB) Conditions: 25 kHz FM deviation; 75 µs de-emphasis. (1) Signal. (2) Noise at H-picture. (3) Noise at black picture. Fig.0 Audio S/N as a function of picture-to-sound carrier ratio. 1999 Jul 21 23 7 4 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 MHB079 handbook, full pagewidth 120 1 video 1.1 V (p-p) antenna input (dBµV) (1) 100 10−1 SAW insertion loss 14 dB IF signals RMS value (V) IF slip 6 dB 10−2 (TOP) 80 tuner gain control range 70 dB VIF AGC 10−3 0.66 × 10−3 60 SAW insertion loss 14 dB 10−4 40 40 dB RF gain 10−5 0.66 × 10−5 20 10 VHF/UHF tuner VIF VIF amplifier, demodulator and video tuner SAW filter TDA9880 (1) Depends on TOP. Fig.12 Front-end level diagram. 1999 Jul 21 24 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 MHB166 10 handbook, full pagewidth H (s) (dB) 0 −10 −20 −30 −40 minimum requirements 2 2.5 3 3.5 4 4.5 f (MHz) 5 Fig.13 Typical amplitude response for sound trap at M/N standard (including Korea). handbook, full pagewidth MHB167 400 group delay (ns) 300 200 ideal characteristic due to pre-correction in the transmitter 100 0 −100 minimum requirements 0 0.5 1 1.5 2 2.5 3 3.5 Remark: overall delay is not shown, here the maximum ripple is specified. Fig.14 Typical group delay for sound trap at M/N standard. 1999 Jul 21 25 f (MHz) 4 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 MHB168 10 handbook, full pagewidth H (s) (dB) 0 −10 −20 −30 −40 minimum requirements 4 4.5 5 5.5 6 6.5 f (MHz) 7 Fig.15 Typical amplitude response for sound trap at B/G standard. MHB169 400 group delay (ns) handbook, full pagewidth 300 200 ideal characteristic due to pre-correction in the transmitter 100 0 −100 minimum requirements 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 f (MHz) 5 Remark: Overall delay is not shown, here the maximum ripple is specified. Fig.16 Typical group delay for sound trap at B/G standard. 1999 Jul 21 26 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 MHB170 handbook, full pagewidth 10 H (s) (dB) 0 −10 −20 −30 −40 minimum requirements 4 4.5 5 5.5 6 6.5 f (MHz) 7 Fig.17 Typical amplitude response for sound trap at I standard. MHB171 handbook, full pagewidth 10 H (s) (dB) 0 −10 −20 −30 −40 minimum requirements 4 4.5 5 5.5 6 6.5 f (MHz) 7 Fig.18 Typical amplitude response for sound trap at D/K standard. 1999 Jul 21 27 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 22 kΩ 100 nF R 150 Ω fref AFC 19 VP VPLL 18 auto mute 3.3 MΩ CTR 470 nF 2.2 kΩ Cx(3) 22 kΩ VAGC 20 sound intercarrier output CVBS output 10 nF 4 MHz 10 nF C 220 nF CVAGC 10 nF TAGC output VP 17 GND 16 bypass TAGC REF 15 CVBS TR SIO 14 13 12 11 7 8 9 10 TDA9880 28 1 2 VIF1 3 VIF2 22 kΩ 50 Ω 5 FMPLL 6 DEEM AFD FAGC AUD S0 S1 470 nF 1:1 IF input 4 TOP Philips Semiconductors 1.5 kΩ VIF-PLL filter Alignment-free multistandard vision and FM sound IF-PLL demodulator TEST CIRCUIT 1999 Jul 21 (1) AFC output CS 33 nF CP RTOP 820 pF RS 2.7 kΩ (4) L CFAGC 100 nF Rx audio output M H 47 kΩ CDEEM 15 nF FM-PLL filter M L H 47 kΩ logic MHB162 Fig.19 Test circuit. Product specification See note 4 of Chapter “Characteristics”. See notes 17 and 18 of Chapter “Characteristics”. See note 26 of Chapter “Characteristics”. See note 22 of Chapter “Characteristics”. TDA9880 (1) (2) (3) (4) handbook, full pagewidth (2) Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 INTERNAL PIN CONFIGURATIONS + handbook, halfpage handbook, halfpage 30 kΩ 20 kΩ 1 1.1 kΩ 5 kΩ + + 3.55 V 9 kΩ 3.55 V 1.1 kΩ 2 3 2.65 V 1.9 V MHB088 MHB087 Fig.20 Pin 1 (VIF1) and pin 2 (VIF2). Fig.21 Pin 3 (TOP). handbook, halfpage maximum 100 µA handbook, halfpage + 240 µA + 5.0 kΩ 5 4 MHB090 maximum 100 µA MHB089 Fig.22 Pin 4 (FMPLL). 1999 Jul 21 Fig.23 Pin 5 (DEEM). 29 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 + handbook, halfpage maximum 2.2 µA + handbook, halfpage + 7 maximum 1.5 µA 2 kΩ 6 maximum 1.5 µA maximum 2.2 µA 1.5 V MHB092 MHB091 Fig.24 Pin 6 (AFD). + handbook, halfpage Fig.25 Pin 7 (FAGC). + handbook, halfpage + 600 µA + 9 15 kΩ 27 kΩ 8 10 pF 3.55 V MHB094 MHB093 Fig.26 Pin 8 (AUD). handbook, halfpage Fig.27 Pin 9 (S0). + + handbook, halfpage 10 14.7 kΩ 11 27 kΩ 3.55 V 1.2 mA MHB096 MHB095 Fig.28 Pin 10 (S1). 1999 Jul 21 Fig.29 Pin 11 (SIO). 30 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 maximum 150 µA handbook, halfpage maximum 9 µA + + + handbook, halfpage 1 kΩ 12 10 kΩ 7 kΩ 13 maximum 13 µA 500 Ω 2.5 mA MHB098 1.1 V MHB165 Fig.30 Pin 12 (TR). Fig.31 Pin 13 (CVBS). handbook, halfpage + handbook, halfpage 14 3 kΩ 15 maximum 600 µA MHB099 200 µA Fig.32 Pin 14 (TAGC). handbook, halfpage MHB100 Fig.33 Pin 15 (REF). handbook, halfpage GND 16 17 + MHB101 MHB102 Fig.34 Pin 16 (GND). 1999 Jul 21 Fig.35 Pin 17 (VP). 31 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 + handbook, halfpage handbook, halfpage + + VCO maximum 200 µA 25 kΩ 19 18 maximum 15 µA maximum 5 µA 1 kΩ 1 kΩ MHB104 MHB103 Fig.36 Pin 18 (VPLL). Fig.37 Pin 19 (AFC). handbook, halfpage + maximum 8 µA 20 maximum 10 µA MHB105 Fig.38 Pin 20 (VAGC). 1999 Jul 21 32 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 PACKAGE OUTLINES SDIP20: plastic shrink dual in-line package; 20 leads (300 mil) SOT325-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) MH b 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.3 1.0 0.53 0.38 0.32 0.20 19.50 18.55 6.48 6.14 1.778 7.62 3.2 2.8 8.25 7.80 10.0 8.3 0.18 1.9 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-10-13 95-02-04 SOT325-1 1999 Jul 21 EUROPEAN PROJECTION 33 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC 1999 Jul 21 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 34 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE • For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 1999 Jul 21 TDA9880 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 35 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator TDA9880 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) Surface mount REFLOW(1) DIPPING − suitable BGA, SQFP not suitable suitable − HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(3) suitable − PLCC(4), suitable SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable − not recommended(4)(5) suitable − not recommended(6) suitable − Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Jul 21 36 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator NOTES 1999 Jul 21 37 TDA9880 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator NOTES 1999 Jul 21 38 TDA9880 Philips Semiconductors Product specification Alignment-free multistandard vision and FM sound IF-PLL demodulator NOTES 1999 Jul 21 39 TDA9880 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545004/03/pp40 Date of release: 1999 Jul 21 Document order number: 9397 750 05318