TI TPS22903YFPR

TPS22903
TPS22904
www.ti.com
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
ULTRA-SMALL LOW-INPUT-VOLTAGE LOW rON LOAD SWITCH
Check for Samples: TPS22903, TPS22904
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
1
•
•
•
•
•
•
•
•
Input Voltage: 1.1 V to 3.6 V
Ultra-Low ON-State Resistance
– rON = 66 mΩ at VIN = 3.6 V
– rON = 75 mΩ at VIN = 2.5 V
– rON = 90 mΩ at VIN = 1.8 V
– rON = 135 mΩ at VIN = 1.2 V
500-mA Maximum Continuous Switch Current
Quiescent Current < 1 mA
Shutdown Current < 1 mA
Low Control Input Threshold Enables Use of
1.2-V/1.8-V/2.5-V/3.3-V Logic
Controlled Slew Rate (5 ms Max at 3.6 V)
Quick Output Discharge (TPS22904 Only)
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
4-Terminal Wafer Chip-Scale Package (WCSP)
– 0.8 mm × 0.8 mm,
0.4-mm Pitch, 0.5-mm Height
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Portable Instrumentation
YFP PACKAGE
B
B
A
A
2
1
Laser Marking View
1 2
Bump View
TERMINAL ASSIGNMENTS
B
GND
ON
A
VOUT
VIN
2
1
DESCRIPTION
The TPS22903 and TPS22904 are ultra-small, low rON single channel load switches with controlled turn on. The
device contains a P-channel MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V. The switch
is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. In
TPS22904, a 85-Ω on-chip load resistor is added for output quick discharge when switch is turned off.
TPS22903 and TPS22904 are available in a space-saving 4-terminal WCSP 0.4-mm pitch (YFP). The devices
are characterized for operation over the free-air temperature range of –40°C to 85°C.
FEATURE LIST
(1)
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM
OUTPUT
CURRENT
ENABLE
5 ms max
No
500 mA
Active high
5 ms max
Yes
500 mA
Active high
DEVICE
rON TYPICAL
AT 3.6 V
SLEW RATE
AT 3.6 V
TPS22903
66 mΩ
TPS22904
66 mΩ
This feature discharges the output of the switch to ground through a 85-Ω resistor, preventing the
output from floating.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
TPS22903
TPS22904
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
(3)
ORDERABLE PART NUMBER
WCSP – YFP (0.4-mm pitch)
Tape and reel
TOP-SIDE MARKING (3)
TPS22903YFPR
_ _ _4P_
TPS22904YFPR
_ _ _4R_
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
BLOCK DIAGRAM
VIN
A1
Turn-On Slew Rate
Controlled Driver
ON
Control
Logic
B1
A2
VOUT
ESD Protection
Output Discharge
TPS22904 Only
B2
GND
Figure 1. Functional Block Diagram
FUNCTION TABLE
ON
(CONTROL INPUT)
VIN TO VOUT
L
OFF
ON
H
ON
OFF
VOUT TO GND (TPS22904 ONLY)
TERMINAL FUNCTIONS
TERMINAL
BALL NO.
2
NAME
I/O
DESCRIPTION
A1
VIN
I
Input of the switch, bypass this input with a ceramic capacitor to ground
A2
VOUT
O
Output of the switch
B1
ON
I
Switch control input, active high, do not leave floating
B2
GND
–
Ground
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
TPS22903
TPS22904
www.ti.com
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
ABSOLUTE MAXIMUM RATINGS (1)
VIN
Input voltage range
VOUT
Output voltage range
VON
Input voltage range
PD
Power dissipation at TA = 25°C
IMAX
Maximum continuous switch current
TA
Operating free-air temperature range
Tstg
Storage temperature range
Tlead
Maximum lead temperature (10-s soldering time)
ESD
Electrostatic discharge protection
(1)
MIN
MAX
–0.3
4
V
VIN + 0.3
V
–0.3
UNIT
4
V
0.48
W
0.5
A
–40
85
°C
–65
150
°C
300
°C
Human-Body Model (HBM)
2000
Charged Device Model (CDM)
1000
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS
Package thermal impedance (1)
qJA
(1)
TYP
UNIT
205
°C/W
MIN
MAX
UNIT
1.1
3.6
V
VIN
V
3.6
V
0.4
V
YFP package
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
VOUT
Output voltage range
VIH
High-level input voltage, ON
VIL
Low-level input voltage, ON
CIN
(1)
Input capacitor
0.85
(1)
1
mF
See Application Information
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
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TPS22903
TPS22904
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
www.ti.com
ELECTRICAL CHARACTERISTICS
VIN = 1.1 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN TYP (1)
MAX
UNIT
IIN
Quiescent current
IOUT = 0, VIN = VON
Full
1
mA
IIN(OFF)
OFF-state supply current
VON = GND, OUT = Open
Full
1
mA
IIN(LEAKAGE)
OFF-state switch current
VON = GND, VOUT = 0
Full
1
mA
25°C
VIN = 3.6 V
ON-state resistance
IOUT = –200 mA
Full
135
Full
157
Full
Output pulldown resistance
VIN = 3.3 V, VON = 0 (TPS22904 only),
IOUT = 30 mA
ION
ON-state input leakage current
VON = 1.1 V to 3.6 V or GND
mΩ
175
185
25°C
rPD
115
125
25°C
VIN = 1.1 V
95
110
90
Full
VIN = 1.2 V
(1)
75
25°C
VIN = 1.8 V
90
95
25°C
VIN = 2.5 V
rON
66
Full
275
300
85
Full
135
Ω
1
mA
Typical values are at VIN = 3.3 V and TA = 25°C.
SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TPS22903
MIN
TPS22904
TYP (1)
MAX
MIN
TYP (1)
MAX
UNIT
tON
Turn-ON time
IOUT = 100 mA, CL = 0.1 mF
0.9
1.5
0.9
1.5
ms
tOFF
Turn-OFF time
IOUT = 100 mA, CL = 0.1 mF
5.8
8
5.3
7
ms
tr
VOUT rise time
IOUT = 100 mA, CL = 0.1 mF
0.80
5
0.8
5
ms
tf
VOUT fall time
IOUT = 100 mA, CL = 0.1 mF
8.3
10
5.8
7
ms
(1)
4
Typical values are at TA = 25°C.
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
TPS22903
TPS22904
www.ti.com
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
TYPICAL CHARACTERISTICS
1.0
0.9
0.8
ON-State Resistance, rON (Ω)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Input Voltage, VIN (V)
Figure 2. rON vs VIN
100
90
80
W
Voltage Drop (mV)
70
Vdrop = 1.0 V
60
Vdrop = 1.2 V
50
Vdrop = 1.8 V
Vdrop = 2.5 V
40
Vdrop = 3.3 V
30
20
10
0
0.00
0.05
0.10
Temperature (°C)
Figure 3. rON vs Temperature (VIN = 3.3 V)
0.15
0.20
0.25
0.30
Load Current (A)
0.35
0.40
0.45
0.50
Figure 4. Voltage Drop vs Load Current
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
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TPS22903
TPS22904
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
250
200
180
200
Quiescent Current, IIN (nA)
Quiescent Current, IIN (nA)
160
140
150
120
100
100
80
60
50
40
20
0
0.5
0
1.0
1.5
2.0
2.5
3.0
Input Voltage, VIN(V)
3.5
–40
4.0
Figure 5. Quiescent Current vs VIN
(VON = VIN, IOUT = 0)
25
Temperature(°C)
85
Figure 6. Quiescent Current vs Temperature
(VIN = 3.3 V, IOUT = 0)
250
120
225
200
100
IIN(OFF) Current (nA)
IIN(OFF) Current (nA)
175
80
60
150
125
100
75
40
50
20
25
0
0.5
0
1.0
1.5
2.0
2.5
Input Voltage, VIN(V)
3.0
Figure 7. IIN(OFF) vs VIN (VON = 0 V)
6
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3.5
4.0
–40
25
Temperature(°C)
85
Figure 8. IIN(OFF) vs Temperature (VIN = 3.3 V)
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
TPS22903
TPS22904
www.ti.com
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
TYPICAL CHARACTERISTICS (continued)
250
120
225
200
IIN (Leakage) Current (nA)
IIN (Leakage) Current (nA)
100
80
60
40
175
150
125
100
75
50
20
25
0
0.5
0
1.0
1.5
2.0
2.5
3.0
3.5
–40
4.0
25
85
Temperature (°C)
Input Voltage, VIN (V)
Figure 9. IIN(Leakage) vs VIN (IOUT = 0)
Figure 10. IIN (Leakage) vs Temperature (VIN = 3.3 V)
4.0
VIN = 3.6 V
3.5
VIN = 3.3 V
3.0
VIN = 3 V
VIN = 2.5 V
VOUT (V)
2.5
2.0
VIN = 1.8 V
VIN = 1.5 V
1.5
VIN = 1.2 V
1.0
VIN = 1.1 V
0.5
0.0
–0.5
0.3
0.4
0.5
0.6
Input Voltage, VON (V)
Figure 11. ON-Input Threshold
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
0.7
0.8
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TPS22903
TPS22904
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
7
6.0
5.5
tfall
6
tOFF
5.0
4.5
5
tON/tOFF (ms)
tIrise /tfall (ms)
4.0
4
CL = 0.1 µF
IL = 100 mA
3
3.5
3.0
CL = 0.1 µF
IL = 100 mA
2.5
2.0
2
1.5
trise
1
tON
1.0
0.5
0.0
–40
0
–40
–20
0
20
40
60
80
100
–20
0
Temperature (°C)
20
40
60
80
100
Temperature (°C)
Figure 12. trise (TPS22903/4) / tfall (TPS22903) vs Temperature
(VIN = 3.3 V)
Figure 13. tON (TPS22903/4) / tOFF (TPS22903) vs Temperature
(VIN = 3.3 V)
6
6
tfall
5
5.5
4
CL = 0.1 µF
I L = 100 mA
3
t OFF (µs)
tfall (µs)
CL = 0.1 µF
IL = 100 mA
5
t OFF
2
4.5
1
0
-40
-20
0
20
40
60
80
Temperature (°C)
100
4
-40
-20
0
20
40
60
80
100
Temperature (°C)
Figure 14. tfall (TPS22904) vs Temperature (VIN = 3.3 V)
8
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Figure 15. tOFF (TPS22904) vs Temperature (VIN = 3.3 V)
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
TPS22903
TPS22904
www.ti.com
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
TYPICAL CHARACTERISTICS (continued)
VON
200 mV/DIV
VON
200 mV/DIV
CL= 0.1 mF
IOUT = 100 mA
VIN = 1.2 V
IOUT
20 mA/DIV
CL= 10 mF
IOUT = 100 mA
VIN = 1.2 V
IOUT
20 mA/DIV
5 ms/DIV
20 ms/DIV
Figure 16. tON Response
Figure 17. tON Response
VON
200 mV/DIV
VON
200 mV/DIV
CL= 0.1 mF
IOUT = 100 mA
VIN = 3.3 V
IOUT
20 mA/DIV
CL= 10 mF
IOUT = 100 mA
VIN = 3.3 V
IOUT
20 mA/DIV
5 ms/DIV
20 ms/DIV
Figure 18. tON Response
Figure 19. tON Response
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
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TPS22903
TPS22904
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
CL= 0.1 mF
IOUT = 100 mA
VIN = 1.2 V
CL= 10 mF
IOUT = 100 mA
VIN = 1.2 V
VON
200 mV/DIV
VON
200 mV/DIV
IOUT
20 mA/DIV
IOUT
20 mA/DIV
2 ms/DIV
100 ms/DIV
Figure 20. tOFF Response (TPS22903)
Figure 21. tOFF Response (TPS22903)
CL= 0.1 mF
IOUT = 100 mA
VIN = 3.3 V
CL= 10 mF
IOUT = 100 mA
VIN = 3.3 V
VON
200 mV/DIV
VON
200 mV/DIV
IOUT
20 mA/DIV
IOUT
20 mA/DIV
5 ms/DIV
200 ms/DIV
Figure 22. tOFF Response (TPS22903)
10
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Figure 23. tOFF Response (TPS22903)
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
TPS22903
TPS22904
www.ti.com
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
TYPICAL CHARACTERISTICS (continued)
VON
200 mV/DIV
VON
200 mV/DIV
IOUT
20 mA/DIV
IOUT
20 mA/DIV
CL= 0.1 mF
IOUT = 100 mA
VIN = 3.3 V
CL= 0.1 mF
IOUT = 100 mA
VIN = 1.2 V
5 ms/DIV
2 ms/DIV
Figure 24. tOFF Response (TPS22904)
Figure 25. tOFF Response (TPS22904)
VON
200 mV/DIV
VON
200 mV/DIV
IOUT
20 mA/DIV
IOUT
20 mA/DIV
CL= 10 mF
IOUT = 100 mA
VIN = 1.2 V
CL= 10 mF
IOUT = 100 mA
VIN = 3.3 V
100 ms/DIV
200 ms/DIV
Figure 26. tOFF Response (TPS22904)
Figure 27. tOFF Response (TPS22904)
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
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TPS22903
TPS22904
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VIN
ON
VOUT
(A)
RL
CL
+
–
TPS22903
OFF
CIN =10 x CL
GND
GND
GND
TEST CIRCUIT
1.8 V
VON
VON
VON/2
VON/2
tr
0V
tON
tOFF
90%
VOUT
VOH
VOUT
tf
0V
VOUT/2
VOUT/2
10%
90%
10%
VOL
tON/tOFF WAVEFORMS
A.
trise and tfall of the control signal is 100 ns.
Figure 28. Test Circuit and tON/tOFF Waveforms
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
TPS22903
TPS22904
www.ti.com
SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010
APPLICATION INFORMATION
ON/OFF Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state as there
is no fault. ON is active-high and has a low threshold, making it capable of interfacing with low-voltage signals.
The ON pin is compatible with standard GPIO logic thresholds. It can be used with any microcontroller with
1.2-V, 1.8-V, 2.5-V, or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-mF ceramic
capacitor, CIN, placed close to the pins, is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop during high-current application. When switching heavy loads, it is recommended to have an
input capacitor about 10 times higher than the output capacitor to avoid excessive voltage drop.
Output Capacitor
Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case-to-ambient thermal impedance.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22903 TPS22904
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS22903YFPR
ACTIVE
DSBGA
YFP
4
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22904YFPR
ACTIVE
DSBGA
YFP
4
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22904YFPT
ACTIVE
DSBGA
YFP
4
250
Call TI
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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information may not be available for release.
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Addendum-Page 1
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Applications
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amplifier.ti.com
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www.ti.com/audio
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dataconverter.ti.com
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www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
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interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
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