CSP-6 TPS6267x www.ti.com SLVS952 – APRIL 2010 500-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEIGHT < 0.4mm) Check for Samples: TPS6267x FEATURES 1 • • • • 92% Efficiency at 6MHz Operation 17mA Quiescent Current Wide VIN Range From 2.3V to 4.8V 6MHz Regulated Frequency Operation Spread Spectrum, PWM Frequency Dithering Best in Class Load and Line Transient ±2% Total DC Voltage Accuracy Low Ripple Light-Load PFM Mode >50dB VIN PSRR (1kHz to 10kHz) Simple Logic Enable Inputs Supports External Clock Presence Detect Enable Input Three Surface-Mount External Components Required (One 0603 MLCC Inductor, Two 0402 Ceramic Capacitors) Complete Sub 0.33-mm Component Profile Solution Total Solution Size <10 mm2 Available in a 6-Pin NanoFree™ (CSP) Ultra-Thin Packaging, 0,4mm Max. Height 100 200 Efficiency - % VI = 3.6 V, 90 VO = 1.8 V 180 80 160 70 140 60 120 50 100 40 80 30 60 20 40 10 0 0.1 Power Loss - mW • • • • • • • • • • • 23 20 1 10 100 IO - Load Current - mA 0 1000 Figure 1. Efficiency vs. Load Current APPLICATIONS • • • • Cell Phones, Smart-Phones Camera Module Embedded Power Digital TV, WLAN, GPS and Bluetooth™ Applications DC/DC Micro Modules DESCRIPTION The TPS6267x device is a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. Intended for low-power applications, the TPS6267x supports up to 500-mA load current, and allows the use of low cost chip inductor and capacitors. With a wide input voltage range of 2.3V to 4.8V, the device supports applications powered by Li-Ion batteries with extended voltage range. Different fixed voltage output versions are available from 1.0V to 2.3V. The TPS6267x operates at a regulated 6-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 17mA (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. VBAT 2.3 V .. 4.8 V CI TPS62671 L VIN SW EN FB 2.2 mF VOUT 1.8 V @ 500mA 0.47 mH CO 4.7 mF GND MODE Figure 2. Smallest Solution Size Application 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. Bluetooth is a trademark of Bluetooth SIG, Inc. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TPS6267x SLVS952 – APRIL 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) TA -40°C to 85°C (1) (2) (3) (4) PACKAGE MARKING CHIP CODE PART NUMBER OUTPUT VOLTAGE (2) DEVICE SPECIFIC FEATURE ORDERING (3) TPS62671 (4) 1.8V PWM Spread Spectrum Modulation TPS62671YFD NZ TPS62672 (4) 1.5V PWM Spread Spectrum Modulation TPS62672YFD OA TPS62674 1.26V PWM Spread Spectrum Modulation PWM Operation Only Output Capacitor Discharge TPS62674YFD PN TPS62676 (4) 2.1V PWM Spread Spectrum Modulation TPS62676YFD PM TPS62677 (4) 1.2V PWM Spread Spectrum Modulation TPS62677YFD For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Internal tap points are available to facilitate output voltages in 25mV increments. The YFD package is available in tape and reel. Add a R suffix (e.g. TPS62670YFDR) to order quantities of 3000 parts. Add a T suffix (e.g. TPS62670YFDT) to order quantities of 250 parts. Product preview. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT Voltage at VIN (2) , SW (3) –0.3 V to 6 V Voltage at FB (3) VI Voltage at EN, MODE –0.3 V to 3.6 V (3) –0.3 V to VI + 0.3 V Power dissipation Internally limited (4) TA Operating temperature range TJ (max) Maximum operating junction temperature –40°C to 85°C Tstg Storage temperature range Human body model ESD rating (5) 2 kV Charge device model 1 kV Machine model (1) (2) (3) (4) (5) 2 150°C –65°C to 150°C 200 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Operation above 4.8V input voltage for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application (qJA), as given by the following equation: TA(max)= TJ(max)–(qJA X PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum junction temperature of 105°C. The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT 4.8 (1) 0 500 mA 1.8 µH 12 µF –40 +85 °C –40 +125 °C Input voltage range IO Output current range L Inductance 0.3 CO Output capacitance 1.4 TA Ambient temperature TJ Operating junction temperature (1) NOM 2.3 VI 2.5 V Operation above 4.8V input voltage for extended periods may affect device reliability. DISSIPATION RATINGS (1) PACKAGE YFD-6 (1) (2) RqJA (2) RqJB 125°C/W (2) 53°C/W POWER RATING TA ≤ 25°C DERATING FACTOR ABOVE TA = 25°C 800mW 8mW/°C Maximum power dissipation is a function of TJ(max), qJA and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = [TJ(max)–TA] / qJA. This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard). ELECTRICAL CHARACTERISTICS Minimum and maximum values are at VI = 2.3V to 5.5V, VO = 1.8V, EN = 1.8V, AUTO mode and TA = –40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VI = 3.6V, VO = 1.8V, EN = 1.8V, AUTO mode and TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX 40 UNIT SUPPLY CURRENT IQ Operating quiescent current TPS62671 TPS62672 TPS62676 TPS62677 IO = 0mA. Device not switching 17 TPS62671 IO = 0mA, PWM mode 5.5 TPS62674 IO = 0mA, PWM mode 5.0 EN = GND 0.2 1 mA 2.05 2.1 V I(SD) Shutdown current UVLO Undervoltage lockout threshold mA mA mA ENABLE, MODE VIH High-level input voltage VIL Low-level input voltage Ilkg Input leakage current VIH Input connected to GND or VIN High-level input voltage (ENABLE) High-level input voltage (MODE) VIL Low-level input voltage (ENABLE) Ilkg Input leakage current CIN Input capacitance (ENABLE) EXTCLK 1.0 V TPS62671 TPS62672 TPS62676 TPS62677 0.01 0.4 V 1.5 mA 1.26 V 1.0 V TPS62674 Input connected to GND or VIN 0.01 0.54 V 1.5 mA 5 pF Clock presence detect frequency 4 27 MHz Clock presence detect duty cycle 40 60 % Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 3 TPS6267x SLVS952 – APRIL 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Minimum and maximum values are at VI = 2.3V to 5.5V, VO = 1.8V, EN = 1.8V, AUTO mode and TA = –40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VI = 3.6V, VO = 1.8V, EN = 1.8V, AUTO mode and TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SWITCH rDS(on) P-channel MOSFET on resistance Ilkg P-channel leakage current, PMOS rDS(on) N-channel MOSFET on resistance Ilkg N-channel leakage current, NMOS rDIS Discharge resistor for power-down sequence VI = V(GS) = 3.6V. PWM mode 170 VI = V(GS) = 2.5V. PWM mode 230 V(DS) = 5.5V, -40°C ≤ TJ ≤ 85°C 120 VI = V(GS) = 2.5V. PWM mode 180 V(DS) = 5.5V, -40°C ≤ TJ ≤ 85°C 2.3V ≤ VI ≤ 4.8V. Open loop Input current limit under short-circuit conditions VO shorted to ground mΩ 1 VI = V(GS) = 3.6V. PWM mode P-MOS current limit mΩ 900 Thermal shutdown Thermal shutdown hysteresis mA mΩ mΩ 2 mA 70 150 Ω 1000 1150 mA 12 mA 140 °C 10 °C OSCILLATOR fSW Oscillator center frequency TPS62671 TPS62672 TPS62676 TPS62677 IO = 0mA. PWM operation 5.4 6 6.6 MHz Oscillator center frequency TPS62674 IO = 0mA. PWM operation 4.9 5.45 6.0 MHz 2.3V ≤ VI ≤ 4.8V, 0mA ≤ IO ≤ 500 mA PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V 2.3V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 500 mA PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V 2.3V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 500 mA PWM operation 0.98×VNOM VNOM 1.02×VNOM V 2.3V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 500 mA PWM operation 0.98×VNOM VNOM 1.02×VNOM V OUTPUT Regulated DC output voltage TPS62671 TPS62672 TPS62676 TPS62677 V(OUT) TPS62674 Line regulation Load regulation TPS6267X VI = VO + 0.5V (min 2.3V) to 5.5V, IO = 200 mA IO = 0mA to 500 mA. PWM operation Feedback input resistance ΔVO Power-save mode ripple voltage PSRR Power Supply Rejection Ratio Start-up time Shutdown time 4 0.23 –0.00045 %/V %/mA 480 kΩ TPS62671 IO = 1mA, VO = 1.8 V 20 mVPP TPS62677 IO = 1mA, VO = 1.2 V 24 mVPP TPS62671 f = 10kHz, IO = 150mA. PWM mode TBD dB TPS62671 IO = 0mA, Time from active EN to VO 130 ms TPS62674 IO = 0mA, Time from EXTCLK clock active to VO 125 ms TPS62674 IO = 0mA, Time from EXTCLK clock inactive to VO down 1.2 ms Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 PIN ASSIGNMENTS TPS6267x CSP-6 (TOP VIEW) TPS6267x CSP-6 (BOTTOM VIEW) MODE A1 A2 VIN VIN A2 A1 MODE SW B1 B2 EN EN B2 B1 SW C2 GND GND C2 C1 FB FB C1 TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. FB C1 I Output feedback sense input. Connect FB to the converter’s output. VIN A2 I Power supply input. SW B1 I/O EN B2 I This is the switch pin of the converter and is connected to the drain of the internal Power MOSFETs. This is the enable pin of the device. Connecting this pin to ground forces the device into shutdown mode. Pulling this pin to VI enables the device. If an external clock (4MHz to 27MHz) is detected the device will automatically power up. This pin must not be left floating and must be terminated. This is the mode selection pin of the device. This pin must not be left floating and must be terminated. MODE A1 I GND C2 – MODE = LOW: The device is operating in regulated frequency pulse width modulation mode (PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load currents. MODE = HIGH: Low-noise mode enabled, regulated frequency PWM operation forced. Ground pin. FUNCTIONAL BLOCK DIAGRAM MODE VIN Undervoltage Lockout Bias Supply Bandgap EN Soft-Start V REF = 0.8 V Negative Inductor Current Detect Power Save Mode Switching Logic Thermal Shutdown VIN Current Limit Detect Frequency Control R1 FB Gate Driver R2 Anti Shoot-Through VREF SW + GND Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 5 TPS6267x SLVS952 – APRIL 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION TPS6267x VI CI L VIN SW EN FB VO CO GND MODE List of components: • L = MURATA LQM21PN1R0NGR • CI = MURATA GRM155R60J225ME15 (2.2mF, 6.3V, 0402, X5R) • CO = MURATA GRM155R60J475M (4.7mF, 6.3V, 0402, X5R) 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 TYPICAL CHARACTERISTICS Table of Graphs FIGURE Efficiency h Peak-to-peak output ripple voltage vs Load current 3, 4, 5, 6 vs Input voltage 7 vs Load current 8, 9 Combined line/load transient response 10, 11 12, 13, 14, 15, 16, 17, 18 Load transient response AC load transient response VO IQ fs PSRR 19 DC output voltage vs Load current 20, 21, 22 PFM/PWM boundaries vs Input voltage 23 Quiescent current vs Input voltage 24 PWM switching frequency vs Input voltage 25, 26 PFM switching frequency vs Input voltage 27 Power supply rejection ratio vs. Frequency 28 PWM operation 29, 30 Power-save mode operation 31 Start-up 32, 33 Shutdown 34 Spurious output noise (PWM mode) vs. Frequency 35, 36, 38 Spurious output noise (PFM mode) vs. Frequency 37 EFFICIENCY vs LOAD CURRENT 100 EFFICIENCY vs LOAD CURRENT 100 VO = 1.8 V 90 90 80 60 50 80 VI = 3.6 V PFM/PWM Operation VI = 4.2 V PFM/PWM Operation VI = 2.7 V PFM/PWM Operation 40 VI = 3.6 V Forced PWM Operation 30 60 50 VI = 4.2 V PFM/PWM Operation VI = 3.6 V Forced PWM Operation 40 30 20 20 10 10 0 0 0.1 VI = 3.6 V PFM/PWM Operation 70 Efficiency - % Efficiency - % 70 VI = 2.7 V PFM/PWM Operation VO = 1.2 V 1 10 100 IO - Load Current - mA 1000 0.1 Figure 3. 1 10 100 IO - Load Current - mA 1000 Figure 4. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 7 TPS6267x SLVS952 – APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) EFFICIENCY vs LOAD CURRENT EFFICIENCY vs LOAD CURRENT 100 VO = 1.26 V 90 VI = 2.7 V PWM Operation 80 VI = 3.6 V PWM Operation 60 Efficiency - % Efficiency - % 70 50 VI = 4.2 V PWM Operation 40 30 20 10 0 1 10 100 IO - Load Current - mA 1000 82 IO = 1 mA 78 76 74 VO = 1.2 V PFM/PWM Operation 3.4 3.7 4.0 VI - Input Voltage - V 4.3 4.6 4.8 VO - Peak-to-Peak Output ripple Voltage - mV 84 Efficiency - % 10 100 IO - Load Current - mA VO = 1.8 V 18 16 14 12 10 8 6 4 2 0 0 Figure 7. 8 1000 20 IO = 100 mA 86 3.1 1 PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE vs LOAD CURRENT IO = 300 mA 2.8 VI - 3.6 V, VO = 1.2 V PFM/PWM Operation EFFICIENCY vs INPUT VOLTAGE 88 70 2.5 L = muRata LQM18PN1R5-B35 Figure 6. IO = 10 mA 72 L = muRata LQM21PN1R0NGR L = muRata LQM21PN1R0MC0 Figure 5. 90 80 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 50 100 150 200 250 IO - Load Current - mA 300 350 Figure 8. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 TYPICAL CHARACTERISTICS (continued) VO - Peak-to-Peak Output ripple Voltage - mV PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE vs LOAD CURRENT 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 COMBINED LINE/LOAD TRANSIENT RESPONSE VO = 1.2 V VI = 3.6 V, VO = 1.2 V VI = 4.8 V VI = 3.6 V VI = 2.5 V 50 to 350 mA Load Step 3.3V to 3.9V Line Step MODE = Low 0 50 100 150 200 250 IO - Load Current - mA 300 350 Figure 9. Figure 10. COMBINED LINE/LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION VI = 3.6 V, VO = 1.2 V VI = 3.6 V, VO = 1.2 V 5 to 150 mA Load Step 50 to 350 mA Load Step 2.7V to 3.3V Line Step MODE = Low Figure 11. MODE = Low Figure 12. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 9 TPS6267x SLVS952 – APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION VI = 3.6 V, VO = 1.2 V 50 to 350 mA Load Step LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION VI = 2.7 V, VO = 1.2 V 50 to 350 mA Load Step MODE = Low VI = 4.8 V, VO = 1.2 V MODE = Low Figure 13. Figure 14. LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION 50 to 350 mA Load Step VI = 3.6 V, VO = 1.2 V 150 to 500 mA Load Step MODE = Low Figure 15. 10 MODE = Low Figure 16. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 TYPICAL CHARACTERISTICS (continued) LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION VI = 2.7 V, VO = 1.2 V 150 to 500 mA Load Step LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION VI = 4.8 V, VO = 1.2 V 150 to 500 mA Load Step MODE = Low MODE = Low Figure 17. Figure 18. AC LOAD TRANSIENT RESPONSE DC OUTPUT VOLTAGE vs LOAD CURRENT 1.836 VO = 1.8 V PFM/PWM Operation VI = 3.6 V, VO = 1.2 V 5 to 300 mA Load Sweep VO - Output Voltage - V 1.818 VI = 4.5 V VI = 3.6 V 1.8 VI = 2.7 V 1.782 MODE = Low 1.764 0.1 Figure 19. 1 10 100 IO - Load Current - mA 1000 Figure 20. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 11 TPS6267x SLVS952 – APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) DC OUTPUT VOLTAGE vs LOAD CURRENT OUTPUT VOLTAGE vs LOAD CURRENT 1.224 1.285 VO = 1.2 V PFM/PWM Operation 1.273 VI = 3.6 V VO - Output Voltage - V VO - Output Voltage - V 1.212 VO = 1.26 V PWM Operation VI = 4.5 V 1.200 VI = 2.7 V 1.188 1 10 100 IO - Load Current - mA 1000 10 100 IO - Load Current - mA PFM/PWM BOUNDARIES 1000 28 VO = 1.2 V Always PWM 26 24 PWM to PFM Mode Change TA = 85°C TA = 25°C 22 The Switching Mode Changes at These Borders PFM to PWM Mode Change Always PFM 20 18 16 14 12 TA = -40°C 10 8 6 4 2 3 3.3 3.6 3.9 4.2 VI - Input Voltage - V 4.5 4.8 0 2.7 Figure 23. 12 1 QUIESCENT CURRENT vs INPUT VOLTAGE 80 70 60 10 0 2.7 1.235 0.1 Figure 22. 100 90 30 20 VI = 2.7 V Figure 21. 120 110 50 40 1.260 IQ - Quiescent Current - mA IO - Load Current - mA 140 130 VI = 4.5 V 1.247 1.176 0.1 160 150 VI = 3.6 V 3 3.3 3.6 3.9 4.2 VI - Input Voltage - V 4.5 4.8 Figure 24. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 TYPICAL CHARACTERISTICS (continued) PWM SWITCHING FREQUENCY vs INPUT VOLTAGE 6.5 PWM SWITCHING FREQUENCY vs INPUT VOLTAGE 6.5 IO = 150 mA VO = 1.2 V 6.3 fs - Switching Frequency - MHz fs - Switching Frequency - MHz 6 IO = 500 mA 5.5 IO = 400 mA 5 IO = 300 mA 4.5 4 3.5 3 2.9 3.1 3.3 3.5 3.7 3.9 4.1 VI - Input Voltage - V 4.3 5.3 5.1 4.9 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 VI - Input Voltage - V Figure 26. PFM SWITCHING FREQUENCY vs INPUT VOLTAGE POWER SUPPLY REJECTION RATIO vs FREQUENCY 4.5 60 VO = 1.2 V PSRR - Power Supply Rejection Ratio - dB fs - Switching Frequency - MHz 5.5 Figure 25. 5.5 5 VI = 2.7 V 4.5 VI = 3.6 V 4 VI = 4.8 V 3.5 3 2.5 2 1.5 1 0.5 0 0 5.7 4.5 2.5 4.5 6.5 6 5.9 4.7 VO = 1.8 V 2.5 2.5 2.7 IO Ranging from 0 to 500 mA 6.1 20 40 60 80 100 120 IO - Load Current - mA 140 160 VI = 3.6 V, VO = 1.8 V 55 50 45 IO = 150 mA 40 35 30 25 20 15 10 5 PFM/PWM Operation 0 0.1 Figure 27. 1 10 100 f - Frequency - kHz 1000 10000 Figure 28. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 13 TPS6267x SLVS952 – APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) PWM OPERATION SSFM MODULATION PWM OPERATION VI = 3.6 V, VO = 1.2 V, IO = 200 mA VI = 3.6 V, VO = 1.2 V, IO = 150 mA MODE = Low MODE = Low Figure 29. Figure 30. POWER-SAVE MODE OPERATION START-UP VI = 3.6 V, VO = 1.2V, IO = 40 mA VI = 3.6 V, VO = 1.2 V, IO = 0 mA MODE = Low Figure 31. 14 MODE = Low Figure 32. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 TYPICAL CHARACTERISTICS (continued) SHUT-DOWN (RF CLOCK) vs START-UP (RF CLOCK) VI = 3.6 V, VO = 1.2 V, IO = 0 mA VI = 3.6 V, VO = 1.2 V, IO = 0 mA MODE = High MODE = High Figure 33. Figure 34. SPURIOUS OUTPUT NOISE (PWM MODE) vs FREQUENCY SPURIOUS OUTPUT NOISE (PWM MODE) vs FREQUENCY 300 m 220 m VO = 1.26 V RL = 12 Ω Spurious Output Noise (PWM Mode) - mV Spurious Output Noise (PWM Mode) - mV 350 m 250 m 200 m VI = 4.2 V 150 m VI = 3.6 V 100 m VI = 2.7 V 50 m 3.5 n 0 Span = 4 MHz f - Frequency - MHz 40 200 m 180 m VI = 3.6 V VO = 1.26 V RL = 12 Ω 160 m 140 m 120 m 100 m 80 m 60 m 40 m 20 m 2.2 n 4.15 Figure 35. Span = 250 kHz f - Frequency - MHz 6.65 Figure 36. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 15 TPS6267x SLVS952 – APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) SPURIOUS OUTPUT NOISE (PFM MODE) vs FREQUENCY SPURIOUS OUTPUT NOISE (PWM MODE) vs FREQUENCY Spurious Output Noise (PWM Mode) - mV 350 m 300 m VO = 1.8 V RL = 12 Ω 250 m 200 m 150 m 100 m 50 m 3.5 n 0 Figure 37. 16 VI = 3.6 V VI = 4.2 V VI = 2.7 V Span = 10 MHz f - Frequency - MHz 100 Figure 38. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 DETAILED DESCRIPTION OPERATION The TPS6267x is a synchronous step-down converter typically operates at a regulated 6-MHz frequency pulse width modulation (PWM) at moderate to heavy load currents. At light load currents, the TPS6267x converter operates in power-save mode with pulse frequency modulation (PFM). The converter uses a unique frequency locked ring oscillating modulator to achieve best-in-class load and line response and allows the use of tiny inductors and small ceramic input and output capacitors. At the beginning of each switching cycle, the P-channel MOSFET switch is turned on and the inductor current ramps up rising the output voltage until the main comparator trips, then the control logic turns off the switch. One key advantage of the non-linear architecture is that there is no traditional feed-back loop. The loop response to change in VO is essentially instantaneous, which explains the transient response. The absence of a traditional, high-gain compensated linear loop means that the TPS6267x is inherently stable over a range of L and CO. Although this type of operation normally results in a switching frequency that varies with input voltage and load current, an internal frequency lock loop (FLL) holds the switching frequency constant over a large range of operating conditions. Combined with best in class load and line transient response characteristics, the low quiescent current of the device (ca. 17mA) allows to maintain high efficiency at light load, while preserving fast transient response for applications requiring tight output regulation. Using the YFD package allows for a low profile solution size (0.4mm max height, including external components). The recommended external components are stated within the application information. The maximum output current is 500mA when these specific low profile external components are used. SWITCHING FREQUENCY The magnitude of the internal ramp, which is generated from the duty cycle, reduces for duty cycles either set of 50%. Thus, there is less overdrive on the main comparator inputs which tends to slow the conversion down. The intrinsic maximum operating frequency of the converter is about 10MHz to 12MHz, which is controlled to circa. 6MHz by a frequency locked loop. When high or low duty cycles are encountered, the loop runs out of range and the conversion frequency falls below 6MHz. The tendency is for the converter to operate more towards a "constant inductor peak current" rather than a "constant frequency". In addition to this behavior which is observed at high duty cycles, it is also noted at low duty cycles. When the converter is required to operate towards the 6MHz nominal at extreme duty cycles, the application can be assisted by decreasing the ratio of inductance (L) to the output capacitor's equivalent serial inductance (ESL). This increases the ESL step seen at the main comparator's feed-back input thus decreasing its propagation delay, hence increasing the switching frequency. POWER-SAVE MODE If the load current decreases, the converter will enter Power Save Mode operation automatically (does not apply for TPS62674). During power-save mode the converter operates in discontinuous current (DCM) single-pulse PFM mode, which produces low output ripple compared with other PFM architectures. When in power-save mode, the converter resumes its operation when the output voltage trips below the nominal voltage. It ramps up the output voltage with a minimum of one pulse and goes into power-save mode when the inductor current has returned to a zero steady state. The PFM on-time varies inversely proportional to the input voltage and proportional to the output voltage giving the regulated switching frequency when in steady-state. PFM mode is left and PWM operation is entered as the output current can no longer be supported in PFM mode. As a consequence, the DC output voltage is typically positioned ca. 0.5% above the nominal output voltage and the transition between PFM and PWM is seamless. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 17 TPS6267x SLVS952 – APRIL 2010 www.ti.com PFM Mode at Light Load PFM Ripple Nominal DC Output Voltage PWM Mode at Heavy Load Figure 39. Operation in PFM Mode and Transfer to PWM Mode MODE SELECTION The MODE pin allows to select the operating mode of the device. Connecting this pin to GND enables the automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at moderate to heavy loads and in the PFM mode during light loads, which maintains high efficiency over a wide load current range. Pulling the MODE pin high forces the converter to operate in the PWM mode even at light load currents. The advantage is that the converter modulates its switching frequency according to a spread spectrum PWM modulation technique allowing simple filtering of the switching harmonics in noise-sensitive applications. In this mode, the efficiency is lower compared to the power-save mode during light loads. Notice that the TPS62674 device only permits PWM operation and required the MODE input to be tied high. For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This allows efficient power management by adjusting the operation of the converter to the specific system requirements. SPREAD SPECTRUM, PWM FREQUENCY DITHERING The goal is to spread out the emitted RF energy over a larger frequency range so that the resulting EMI is similar to white noise. The end result is a spectrum that is continuous and lower in peak amplitude, making it easier to comply with electromagnetic interference (EMI) standards and with the power supply ripple requirements in cellular and non-cellular wireless applications. Radio receivers are typically susceptible to narrowband noise that is focused on specific frequencies. Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to an output. In most cases, the frequency of operation is either fixed or regulated, based on the output load. This method of conversion creates large components of noise at the frequency of operation (fundamental) and multiples of the operating frequency (harmonics). The spread spectrum architecture varies the switching frequency by ca. ±10% of the nominal switching frequency thereby significantly reducing the peak radiated and conducting noise on both the input and output supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency fm. 18 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 0 dBV FENV,PEAK Dfc Non-modulated harmonic Dfc F1 Side-band harmonics window after modulation 0 dBVref B = 2 × fm × (1 + mf ) = 2 × ( Dfc + fm ) B = 2 × fm × (1 + mf ) = 2 × ( Dfc + fm ) Bh = 2 × fm × (1 + mf × h ) Figure 40. Spectrum of a Frequency Modulated Sin. Wave with Sinusoidal Variation in Time Figure 41. Spread Bands of Harmonics in Modulated Square Signals The above figures show that after modulation the sideband harmonic is attenuated compared to the non-modulated harmonic, and the harmonic energy is spread into a certain frequency band. The higher the modulation index (mf) the larger the attenuation. mƒ = δ ´ ƒc ƒm (1) With: fc is the carrier frequency fm is the modulating frequency (approx. 0.008*fc) d is the modulation ratio (approx 0.1) d= D ƒc ƒc (2) The maximum switching frequency fc is limited by the process and finally the parameter modulation ratio (d), together with fm , which is the side-band harmonics bandwidth around the carrier frequency fc . The bandwidth of a frequency modulated waveform is approximately given by the Carson’s rule and can be summarized as: B = 2 ´ ¦m ´ 1 + m ¦ ( )=2 ´ (D ¦c + ¦m ) (3) fm < RBW: The receiver is not able to distinguish individual side-band harmonics, so, several harmonics are added in the input filter and the measured value is higher than expected in theoretical calculations. fm > RBW: The receiver is able to properly measure each individual side-band harmonic separately, so the measurements match with the theoretical calculations. ENABLE The TPS6267x device starts operation when EN is set high and starts up with the soft start as previously described. For proper operation, the EN pin must be terminated and must not be left floating. Pulling the EN pin low forces the device into shutdown, with a shutdown quiescent current of typically 0.1mA. In this mode, the P and N-channel MOSFETs are turned off, the internal resistor feedback divider is disconnected, and the entire internal-control circuitry is switched off. The TPS6267x device can actively discharge the output capacitor when it turns off. The integrated discharge resistor has a typical resistance of 100 Ω. The required time to discharge the output capacitor at the output node depends on load current and the output capacitance value. When an external clock signal (EXTCLK), 4MHz to 27MHz is applied to the TPS62674, the DC/DC converter powers-up automatically within approx. 120ms. When the external clock signal is stopped, the DC/DC converter is powered down and the output capacitor is discharged actively. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 19 TPS6267x SLVS952 – APRIL 2010 www.ti.com SOFT START The TPS6267x has an internal soft-start circuit that limits the inrush current during start-up. This limits input voltage drops when a battery or a high-impedance power source is connected to the input of the converter. The soft-start system progressively increases the on-time from a minimum pulse-width of 35ns as a function of the output voltage. This mode of operation continues for c.a. 100ms after enable. Should the output voltage not have reached its target value by this time, such as in the case of heavy load, the soft-start transitions to a second mode of operation. The converter then operates in a current limit mode, specifically the P-MOS current limit is set to half the nominal limit, and the N-channel MOSFET remains on until the inductor current has reset. After a further 100 ms, the device ramps up to the full current limit operation if the output voltage has risen above 0.5V (approximately). Therefore, the start-up time mainly depends on the output capacitor and load current. UNDERVOLTAGE LOCKOUT The undervoltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the converter from turning on the switch or rectifier MOSFET under undefined conditions. The TPS6267x device have a UVLO threshold set to 2.05V (typical). Fully functional operation is permitted down to 2.1V input voltage. SHORT-CIRCUIT PROTECTION The TPS6267x integrates a P-channel MOSFET current limit to protect the device against heavy load or short circuits. When the current in the P-channel MOSFET reaches its current limit, the P-channel MOSFET is turned off and the N-channel MOSFET is turned on. The regulator continues to limit the current on a cycle-by-cycle basis. As soon as the output voltage falls below ca. 0.4V, the converter current limit is reduced to half of the nominal value. Because the short-circuit protection is enabled during start-up, the device does not deliver more than half of its nominal current limit until the output voltage exceeds approximately 0.5V. This needs to be considered when a load acting as a current sink is connected to the output of the converter. THERMAL SHUTDOWN As soon as the junction temperature, TJ, exceeds typically 140°C, the device goes into thermal shutdown. In this mode, the P- and N-channel MOSFETs are turned off. The device continues its operation when the junction temperature again falls below typically 130°C. 20 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 APPLICATION INFORMATION INDUCTOR SELECTION The TPS6267x series of step-down converters have been optimized to operate with an effective inductance value in the range of 0.3mH to 1.8mH and with output capacitors in the range of 2.2mF to 4.7mF. The internal compensation is optimized to operate with an output filter of L = 0.47mH and CO = 2.2mF. Larger or smaller inductor values can be used to optimize the performance of the device for specific operation conditions. For more details, see the CHECKING LOOP STABILITY section. The inductor value affects its peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage ripple and the efficiency. The selected inductor has to be rated for its dc resistance and saturation current. The inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VI or VO. V V *V DI I O DI + O DI +I ) L L L(MAX) O(MAX) 2 V L ƒ sw I with: fSW = switching frequency (6 MHz typical) L = inductor value ΔIL = peak-to-peak inductor ripple current IL(MAX) = maximum inductor current (4) In high-frequency converter applications, the efficiency is essentially affected by the inductor AC resistance (i.e. quality factor) and to a smaller extent by the inductor DCR value. To achieve high efficiency operation, care should be taken in selecting inductors featuring a quality factor above 25 at the switching frequency. Increasing the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor size, increased inductance usually results in an inductor with lower saturation current. The total losses of the coil consist of both the losses in the DC resistance (DC)) and the following frequency-dependent components: • The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies) • Additional losses in the conductor from the skin effect (current displacement at high frequencies) • Magnetic field losses of the neighboring windings (proximity effect) • Radiation losses The following inductor series from different suppliers have been used with the TPS6267x converters. Table 1. List of Inductors MANUFACTURER MURATA SERIES DIMENSIONS (in mm) LQM21PN1R0NGR 2.0 x 1.2 x 1.0 max. height LQM21PNR47MC0 2.0 x 1.2 x 0.55 max. height LQM21PN1R0MC0 2.0 x 1.2 x 0.55 max. height LQM18PN1R5-B35 1.6 x 0.8 x 0.4 max. height LQM18PN1R5-A62 1.6 x 0.8 x 0.33 max. height PANASONIC ELGTEAR82NA 2.0 x 1.2 x 1.0 max. height SEMCO CIG21L1R0MNE 2.0 x 1.2 x 1.0 max. height BRC1608T1R0 1.6 x 0.8 x 0.9 max. height TAIYO YUDEN BRC1608T1R5 1.6 x 0.8 x 0.9 max. height CKP1608L1R5M 1.6 x 0.8 x 0.55 max. height CKP1608U1R5M 1.6 x 0.8 x 0.4 max. height TDK MLP2012SR82T 2.0 x 1.2 x 0.6 max. height TOKO MDT2012-CR1R0A 2.0 x 1.2 x 1.0 max. height Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 21 TPS6267x SLVS952 – APRIL 2010 www.ti.com OUTPUT CAPACITOR SELECTION The advanced fast-response voltage mode control scheme of the TPS6267x allows the use of tiny ceramic capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are recommended. For best performance, the device should be operated with a minimum effective output capacitance of 0.8mF. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors, aside from their wide variation in capacitance over temperature, become resistive at high frequencies. At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the voltage step caused by the output capacitor ESL and the ripple current flowing through the output capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup during large load transitions. A 2.2mF capacitor typically provides sufficient bulk capacitance to stabilize the output during large load transitions. The typical output voltage ripple is 1% of the nominal output voltage VO. The output voltage ripple during PFM mode operation can be kept very small. The PFM pulse is time controlled, which allows to modify the charge transferred to the output capacitor by the value of the inductor. The resulting PFM output voltage ripple and PFM frequency depend in first order on the size of the output capacitor and the inductor value. The PFM frequency decreases with smaller inductor values and increases with larger once. Increasing the output capacitor value and the effective inductance will minimize the output ripple voltage. INPUT CAPACITOR SELECTION Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is required to prevent large voltage transients that can cause misbehavior of the device or interferences with other circuits in the system. For most applications, a 1 or 2.2-mF capacitor is sufficient. If the application exhibits a noisy or erratic switching frequency, the remedy will probably be found by experimenting with the value of the input capacitor. Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the power is being supplied through long wires, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or could even damage the part. Additional "bulk" capacitance (electrolytic or tantalum) should in this circumstance be placed between CI and the power source lead to reduce ringing than can occur between the inductance of the power source leads and CI. CHECKING LOOP STABILITY The first step of circuit and stability evaluation is to look from a steady-state perspective at the following signals: • Switching node, SW • Inductor current, IL • Output ripple voltage, VO(AC) These are the basic signals that need to be measured when evaluating a switching converter. When the switching waveform shows large duty cycle jitter or the output voltage or inductor current shows oscillations, the regulation loop may be unstable. This is often a result of board layout and/or L-C combination. As a next step in the evaluation of the regulation loop, the load transient response is tested. The time between the application of the load transient and the turn on of the P-channel MOSFET, the output capacitor must supply all of the current required by the load. VO immediately shifts by an amount equal to ΔI(LOAD) x ESR, where ESR is the effective series resistance of CO. ΔI(LOAD) begins to charge or discharge CO generating a feedback error signal used by the regulator to return VO to its steady-state value. The results are most easily interpreted when the device operates in PWM mode. During this recovery time, VO can be monitored for settling time, overshoot or ringing that helps judge the converter’s stability. Without any ringing, the loop has usually more than 45° of phase margin. Because the damping factor of the circuitry is directly related to several resistive parameters (e.g., MOSFET rDS(on)) that are temperature dependant, the loop stability analysis has to be done over the input voltage range, load current range, and temperature range. 22 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 LAYOUT CONSIDERATIONS As for all switching power supplies, the layout is an important step in the design. High-speed operation of the TPS6267x devices demand careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If the layout is not carefully done, the regulator could show poor line and/or load regulation, stability and switching frequency issues as well as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins as well as the inductor and output capacitor. In order to get an optimum ESL step, the output voltage feedback point (FB) should be taken in the output capacitor path, approximately 1mm away for it. The feed-back line should be routed away from noisy components and traces (e.g. SW line). MODE L VIN CI ENABLE CO GND VOUT Figure 42. Suggested Layout (Top) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 23 TPS6267x SLVS952 – APRIL 2010 www.ti.com THERMAL INFORMATION Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below: • Improving the power dissipation capability of the PCB design • Improving the thermal coupling of the component to the PCB • Introducing airflow into the system The maximum recommended junction temperature (TJ) of the TPS6267x devices is 105°C. The thermal resistance of the 6-pin CSP package (YFD-6) is RqJA = 125°C/W. Regulator operation is specified to a maximum steady-state ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 160 mW. PD(MAX) = TJ(MAX) - TA 105°C - 85°C = = 160mW RqJA 125°C/W (5) PACKAGE SUMMARY CHIP SCALE PACKAGE (BOTTOM VIEW) D A2 A1 B2 B1 CHIP SCALE PACKAGE (TOP VIEW) YMSCC LLLL A1 C1 C2 Code: E • YM — Year Month date Code • S — Assembly site code • CC— Chip code • LLLL — Lot trace code CHIP SCALE PACKAGE DIMENSIONS The TPS6267x device is available in an 6-bump chip scale package (YFD, NanoFree™). The package dimensions are given as: • D = 1.30 ±0.03 mm • E = 0.926 ±0.03 mm 24 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x TPS6267x www.ti.com SLVS952 – APRIL 2010 APPLICATION INFORMATION VBAT 2.3 V .. 4.8 V CI 1 mF EXTCLK TPS62674 VIN SW MODE FB EN VOUT 1.26 V @ 500 mA L GND 1.5 mH CO 2.2 mF L = muRata LQM18PN1R5-B35 CI = muRata GRM153R60J105M CO = muRata GRM153R60G225M Figure 43. 1.26V CMOS Sensor Embedded Power Solution — Featuring Sub 0.4mm Profile Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS6267x 25 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS62674YFDR ACTIVE DSBGA YFD 6 3000 TBD Call TI Call TI TPS62674YFDT ACTIVE DSBGA YFD 6 250 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 X: Max = 1350 µm, Min = 1250 µm Y: Max = 976 µm, Min = 876 µm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated