INTEGRATED CIRCUITS DATA SHEET UBA2021 630 V driver IC for CFL and TL lamps Product specification Supersedes data of 2000 Jul 24 File under Integrated Circuits, IC11 2001 Jan 30 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 FEATURES GENERAL DESCRIPTION • Adjustable preheat and ignition time The UBA2021 is a high-voltage IC intended to drive and control Compact Fluorescent Lamps (CFL) or fluorescent TL-lamps. It contains a driver circuit for an external half-bridge, an oscillator and a control circuit for starting up, preheating, ignition, lamp burning and protection. • Adjustable preheat current • Adjustable lamp power • Lamp temperature stress protection at higher mains voltages • Capacitive mode protection • Protection against a too-low drive voltage for the power MOSFETs. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT High voltage supply VFS IFS < 15 µA; t < 0.5 s − high side supply voltage − 630 V Start-up state VVS(start) oscillator start voltage − 11.95 − V VVS(stop) oscillator stop voltage − 10.15 − V IVS(standby) standby current − 200 − µA − 108 − kHz − 666 − ms − −600 − mV VVS = 11 V Preheat mode fstart start frequency tph preheat time VRS(ctrl) control voltage at pin RS CCP = 100 nF Frequency sweep to ignition fB bottom frequency − 42.9 − kHz tign ignition time − 625 − ms Normal operation fB bottom frequency − 42.9 − kHz tno non-overlap time − 1.4 − µs Itot total supply current − 1 − mA RG1(on), RG2(on) high and low side on resistance − 126 − Ω RG1(off), RG2(off) high and low side off resistance − 75 − Ω IRHV = 0.75 mA − 63.6 − kHz IRHV = 1.0 mA − 84.5 − kHz 0 − 1000 µA fB = 43 kHz Feed-forward fff Ii(RHV) 2001 Jan 30 feed-forward frequency operating range of input current at pin RHV 2 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION UBA2021T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 UBA2021P DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 BLOCK DIAGRAM VS handbook, full pagewidth RHV 5 13 RREF CF 10 12 CI 14 bootstrap charging circuit SB SUPPLY n.c. 4 1 OSCILLATOR LEVEL SHIFTER HIGH SIDE DRIVER BAND GAP REFERENCE CP RS 8 9 TIMING RS MONITOR NON OVERLAP CONTROL LOW SIDE DRIVER 2 3 6 7 UBA2021 11 MGS988 SGND Fig.1 Block diagram. 2001 Jan 30 3 FS G1 S1 G2 PGND Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 PINNING SYMBOL PIN FS G1 S1 n.c. VS G2 PGND DESCRIPTION 1 2 3 high side floating supply voltage 4 5 6 7 high-voltage spacer, not to be connected gate high transistor (T1) source high transistor (T1) low voltage supply gate low transistor (T2) power ground timing/averaging capacitor RREF 8 9 10 SGND 11 signal ground CF 12 13 14 oscillator capacitor CP RS RHV CI current monitoring input reference resistor start-up resistor/feed-forward resistor integrating capacitor handbook, halfpage handbook, halfpage FS 1 14 CI FS 1 14 CI G1 2 13 RHV G1 2 13 RHV S1 3 12 CF S1 3 12 CF n.c. 4 UBA2021T 11 SGND n.c. 4 UBA2021P 11 SGND VS 5 10 RREF VS 5 10 RREF G2 6 9 RS G2 6 9 PGND 7 8 CP PGND 7 8 CP MGS989 MGS990 Fig.2 Pin configuration (SO14). 2001 Jan 30 RS Fig.3 Pin configuration (DIP14). 4 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 FUNCTIONAL DESCRIPTION Introduction MGS991 handbook, halfpage The UBA2021 is an integrated circuit for electronically ballasted compact fluorescent lamps and their derivatives operating with mains voltages up to 240 V (RMS). It provides all the necessary functions for preheat, ignition and on-state operation of the lamp. In addition to the control function, the IC provides level shift and drive functions for the two discrete power MOSFETs, T1 and T2 (see Fig.7). start-up VCF 0 internal clock 0 V(G1-S1) 0 Initial start-up V(G2) Initial start-up is achieved by charging capacitor CS9 with the current applied to pin RHV. At start-up, MOSFET T2 conducts and T1 is non-conducting, ensuring Cboot becomes charged. This start-up state is reached for a supply voltage VVS(reset) (this is the voltage level at pin VS at which the circuit will be reset to the initial state) and maintained until the low voltage supply (VVS) reaches a value of VVS(start). The circuit is reset in the start-up state. t no t no 0 time Fig.4 Oscillator timing. Operation in the preheat mode Oscillation The circuit starts oscillating at approximately 2.5 × fB (108 kHz). The frequency gradually decreases until a defined value of current Ishunt is reached (see Fig.5). The slope of the decrease in frequency is determined by capacitor CCI. The frequency during preheating is approximately 90 kHz. This frequency is well above the resonant frequency of the load, which means that the lamp is off; the load consists of L2, C5 and the electrode resistance only. The preheat time is determined by capacitor CCP. The circuit can be locked in the preheat state by connecting pin CP to ground. During preheating, the circuit monitors the load current by measuring the voltage drop over external resistor Rshunt at the end of conduction of T2 with decision level VRS(ctrl). The frequency is decreased as long as VRS > VRS(ctrl). The frequency is increased for VRS < VRS(ctrl). When the low voltage supply (VVS) has reached the value of VVS(start) the circuit starts oscillating in the preheat state. The internal oscillator is a current-controlled circuit which generates a sawtooth waveform. The frequency of the sawtooth is determined by the capacitor CCF and the current out of pin CF (mainly set by RRREF). The sawtooth frequency is twice the frequency of the signal across the load. The IC brings MOSFETs T1 and T2 alternately into conduction with a duty factor of approximately 50%. Figure 4 represents the timing of the IC. The circuit block 'non-overlap' generates a non-overlap time tno that ensures conduction periods of exclusively T1 or T2. Time tno is dependent on the reference current IRREF. 2001 Jan 30 5 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 Feed-forward frequency handbook, halfpage Above a defined voltage level the oscillation frequency also depends on the supply voltage of the half-bridge (see Fig.6). The current for the current-controlled oscillator is in the feed-forward range derived from the current through RRHV. The feed-forward frequency is proportional to the average value of the current through RRHV within the operating range of Ii(RHV), given the lower limit set by fB. For currents beyond the operating range (i.e. between 1.0 and 1.6 mA) the feed-forward frequency is clamped. In order to prevent feed-forward of ripple on Vin, the ripple is filtered out. The capacitor connected to pin CP is used for this purpose. This pin is also used in the preheat state and the ignition state for timing (tph and tign). MGS992 fstart fB preheat state ignition state burn state time For calculations refer to Chapter “Design equations”. Fig.5 Operation in the preheat mode. MGS993 handbook, halfpage f (kHz) Ignition state feed-forward range The RS monitoring function changes from VRS(ctrl) regulation to capacitive mode protection at the end of the preheat time. Normally this results in a further frequency decrease down to the bottom frequency fB (approximately 43 kHz). The rate of change of frequency in the ignition state is less than that in the preheat mode. During the downward frequency sweep, the circuit sweeps through the resonant frequency of the load. A high voltage then appears across the lamp. This voltage normally ignites the lamp. bottom frequency IRHV (mA) For calculations refer to Chapter “Design equations”. Fig.6 Feed-forward frequency. Failure to ignite Excessive current levels may occur if the lamp fails to ignite. The IC does not limit these currents in any manner. Capacitive mode protection Transition to the burn state When the preheat mode is completed, the IC will protect the power circuit against losing the zero voltage switching condition and getting too close to the capacitive mode of operation. This is detected by monitoring voltage VRS at pin RS. If the voltage is below VRS(cap) at the time of turn-on of T2, then capacitive mode operation is assumed. Consequently the frequency increases as long as the capacitive mode is detected. The frequency decreases down to the feed-forward frequency if no capacitive mode is detected. Frequency modulation is achieved via pin CI. Assuming that the lamp has ignited during the downward frequency sweep, the frequency normally decreases to the bottom frequency. The IC can transit to the burn state in two ways: 1. In the event that the bottom frequency is not reached, transition is made after reaching the ignition time tign. 2. As soon as the bottom frequency is reached. The bottom frequency is determined by RRREF and CCF. 2001 Jan 30 6 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 IC supply Ground pins Initially, the IC is supplied from Vin by the current through RRHV. This current charges the supply capacitor CS9 via an internal diode. As soon as VVS exceeds VVS(start), the circuit starts oscillating. After the preheat phase is finished, pin RHV is connected to an internal resistor Ri(RHV); prior to this, pin RHV is internally connected to pin VS. The voltage level at pin RHV thus drops from VVS + Vdiode to IRHV × Ri(RHV). The capacitor CS9 at pin VS will now be charged via the snubber capacitor CS7. Excess charge is drained by an internal clamp that turns on at voltage VVS(clamp). Pin PGND is the ground reference of the IC with respect to the application. As an exception, pin SGND provides a local ground reference for the components connected to pins CP, CI, RREF and CF. For this purpose pins PGND and SGND are short-circuited internally. External connection of pins PGND and SGND is not preferred. The sum of currents flowing out of the pins CP, CI, RREF, CF and SGND must remain zero at any time. Charge coupling Due to parasitic capacitive coupling to the high voltage circuitry, all pins are burdened with a repetitive charge injection. Given the typical application in Fig.7, pins RREF and CF are sensitive to this charge injection. For the rating Qcouple a safe functional operation of the IC is guaranteed, independent of the current level. Charge coupling at current levels below 50 µA will not interfere with the accuracy of the VRS(cap) and VRS(ctrl) levels. Charge coupling at current levels below 20 µA will not interfere with the accuracy of any parameter. Minimum gate-source voltage of T1 and T2 The high side driver is supplied via capacitor Cboot. Capacitor Cboot is charged via the bootstrap switch during the on-periods of T2. The IC stops oscillating at a voltage level VVS(stop). Given a maximum charge consumption on the load at pin G1 of 1 nC/V, this safeguards the minimum drive voltages V(G1−S1) for the high side driver; see Table 1. Table 1 Minimum gate-source voltages FREQUENCY VOLTAGE <75 kHz 8 V (min.) 75 kHz to 85 kHz 7 V (min.) ≥85 kHz 6 V (min.) The drive voltage at G2 will exceed the drive voltage of the high side driver. Frequency and change in frequency At any point in time during oscillation, the circuit will operate between fB and fstart. Any change in frequency will be gradual, no steps in frequency will occur. Changes in frequency caused by a change in voltage at pin CI show a rather-constant df/dt over the entire frequency range. The following rates are realised (at a frequency of 85 kHz and with a 100 nF capacitor connected to pin CI): • For any increase in frequency: df/dt is between 15 and 37.5 kHz/ms • During preheat and normal operation: df/dt for a decrease in frequency is between −6 and −15 kHz/ms • During the ignition phase: df/dt for a decrease in frequency is between −150 and −375 Hz/ms. 2001 Jan 30 7 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages referenced to ground. SYMBOL VFS PARAMETER high side floating supply voltage IVS(clamp) clamp current VRS input voltage pin RS CONDITIONS MIN. MAX. UNIT operating − 570 V t ≤ 0.5 s − 630 V t ≤ 0.5 s − 35 mA −2.5 +2.5 V −15.0 +2.5 V transient of 50 ns SR slew rate at pins S1, G1 and FS (with respect to ground) −4 +4 V/ns P power dissipation − 500 mW Tamb ambient temperature −40 +150 °C Tj junction temperature −40 +150 °C Tstg storage temperature −55 +150 °C Qcouple charge coupling at pins RREF and CF operating −8 +8 pC Ves electrostatic handling voltage human body model; note 1 − 3000 V 300 V machine model; note 2 − Notes 1. Human body model: all pins are 3000 V maximum, except pins FS, G1, S1 and VS which are 1500 V maximum and pin G2 which is 1000 V maximum. 2. Machine model: all pins are 300 V maximum, except pin G2 which is 125 V maximum. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-pin) PARAMETER VALUE UNIT SO14 100 K/W DIP14 60 K/W SO14 50 K/W DIP14 30 K/W thermal resistance from junction to ambient thermal resistance from junction to pcb CONDITIONS in free air in free air QUALITY SPECIFICATION In accordance with “SNW-FQ-611-E”. 2001 Jan 30 8 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 CHARACTERISTICS VVS = 11 V; VFS − VS1 = 11 V; Tamb = 25 °C; all voltages referenced to ground; see Fig.7; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT leakage current on high voltage pins VFS, VG1 and VS1 = 630 V − − 15 µA VVS(reset) reset voltage T1 off; T2 on 4.0 5.5 6.5 V VVS(start) oscillator start voltage 11.35 11.95 12.55 V VVS(stop) oscillator stop voltage 9.55 10.15 10.75 V VVS(hys) supply voltage hysteresis 1.5 1.8 2.0 V IVS(standby) standby supply current at pin VS 150 200 250 µA ∆V(RHV−VS) voltage difference between pins RHV IRHV = 1.0 mA and VS 0.7 0.8 1.0 V VVS(clamp-start) clamp margin VVS(clamp) to VVS(start) note 2 0.2 0.3 0.4 V IVS(clamp) clamp current VVS < 17 V − 14 35 mA fstart starting frequency VCI = 0 V 98 108 118 kHz tg conducting time T1 and T2 fstart = 108 kHz − 3.2 − µs High voltage supply IL Start-up state VVS = 11 V; note 1 Preheat mode ICI(charge) charge current at pin CI VCI = 1.5 V; VRS = −0.3 V 38 44 50 µA ICI(discharge) discharge current at pin CI VCI = 1.5 V; VRS = −0.9 V 79 93 107 µA tph preheat time 599 666 733 ms ICP(charge) charge current at pin CP VCP = 1 V − 6.0 − µA ICP(discharge) discharge current at pin CP VCP = 1 V − 5.95 − µA ∆VCP(pk) peak voltage difference at pin CP when timing − 2.5 − V VRS(ctrl) control voltage at pin RS note 3 −636 −600 −564 mV 0.8 1.0 1.2 µA Frequency sweep to ignition ICI(charge) charge current at pin CI VCI = 1.5 V; f ≈ 85 kHz fB bottom frequency VCI at clamp level tign ignition time − 42.9 − kHz − 625 − ms 42.21 42.90 44.59 kHz fB = 43 kHz − 10.2 − µs Normal operation fB bottom frequency tg conducting time T1 and T2 tno non-overlap conductance time 1.05 1.4 1.75 µs Itot total supply current fB = 43 kHz; note 4 0.85 1.0 1.1 mA VRS(cap) capacitive mode control voltage note 5 0 20 40 mV VRREF reference voltage note 6 2.425 2.5 2.575 V VG1(on) on voltage at pin G1 IG1 = 1 mA 10.5 − − V VG1(off) off voltage at pin G1 IG1 = 1 mA − − 0.3 V VG2(on) on voltage at pin G2 IG2 = 1 mA 10.5 − − V VG2(off) off voltage at pin G2 IG2 = 1 mA − − 0.3 V RG1(on) high side driver on resistance V(G1 − S1) = 3 V; note 7 100 126 152 Ω 2001 Jan 30 9 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps SYMBOL PARAMETER UBA2021 CONDITIONS MIN. RG1(off) high side driver off resistance V(G1 − S1) = 3 V; note 7 60 TYP. 75 MAX. UNIT 90 Ω RG2(on) low side driver on resistance VG2 = 3 V; note 7 100 126 152 Ω RG2(off) low side driver off resistance VG2 = 3 V; note 7 60 75 90 Ω Vdrop voltage drop at bootstrap switch IFS = 5 mA 0.6 1.0 1.4 V 1.54 2.2 2.86 kΩ 0 − 1000 µA Feed-forward Ri(RHV) input resistance at pin RHV Ii(RHV) operating range of input current at pin RHV fff feed-forward frequency note 8 IRHV = 0.75 mA 60.4 63.6 66.15 kHz IRHV = 1 mA 80.3 84.5 88.2 kHz SYMff symmetry IRHV = 1 mA; note 9 0.9 1.0 1.1 RR ripple rejection fVin = 100 Hz − 6 − dB RCP(sw) CP switch series resistance ICP = 100 µA 0.75 1.5 2.25 kΩ RAV averaging resistor ICP = 10 µA 22.4 32 41.6 kΩ Notes 1. The start-up supply current is specified in a temperature (Tvj) range of 0 to 125 °C. For Tvj <0 and Tvj >125 °C the start-up supply current is <350 µA. 2. The clamp margin is defined as the voltage difference between turn-on of the clamp and start of oscillation. The clamp is in the off-state at start of oscillation. 3. Data sampling of VRS(ctrl) is performed at the end of conduction of T2. 4. The total supply current is specified in a temperature (Tvj) range of −20 to +125 °C. For Tvj < −20 and Tvj >125 °C the total supply current is <1.5 mA. 5. Data sampling of VRS(cap) is performed at the start of conduction of T2. 6. Within the allowed range of RRREF, defined as 30 kΩ +10%. 7. Typical values for the on and off resistances at Tvj = 87.5 °C are: RG2(on) and RG1(on) = 164 Ω, RG2(off) and RG1(off) = 100 Ω. 8. The input current at pin RHV may increase to 1600 µA during voltage transient at Vin. Only for currents IRHV beyond approximately 550 µA is the oscillator frequency proportional to IRHV. 9. The symmetry SYMff is calculated from the quotient SYMff = T1tot/T2tot, with T1tot the time between turn-off of G2 and turn-off of G1, and T2tot the time between turn-off of G1 and turn-off of G2. 2001 Jan 30 10 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps DESIGN EQUATIONS 1 • Bottom frequency: f B = --------------------------------------------------------------------------------------------------------------------------2 × { [ ( C CF + C par ) × ( X1 × R RREF – R int ) ] + τ } 1 • Feed-forward frequency: f ff = ---------------------------------------------------------------------------------------------------------------------------× V RREF X2 2 × ( C CF + C par ) × -----------------------------– R int + τ I i ( RHV ) Where: – X1 = 3.68 – X2 = 22.28 – τ = 0.4 µs – Rint = 3 kΩ – Cpar = 4.7 pF • Operating frequency is the maximum of fB, fff or fcm Where: – fB = bottom frequency – fff = feed-forward frequency – fcm = frequency due to capacitive mode detection C CP R RREF • Preheat time: t ph = ------------------ × ----------------150 nF 30 kΩ 15 • Ignition time: t ign = ------ × t ph 16 R RREF • Non-overlap time: t no = 1.4 µs × ----------------30kΩ 2001 Jan 30 11 UBA2021 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 APPLICATION INFORMATION RRHV Vin L1 handbook, full pagewidth 490 kΩ DS1 T1 DS2 C3 G1 lamp CCI 100 nF S1 R1 8 3 FS 1 Cboot CS7 C2 C5 T2 G2 CCP CP 100 nF L2 mains supply RHV CI 13 14 2 UBA2021 12 CF 100 nF CCF 100 pF 6 10 RREF RRREF 30 kΩ DS7 DS3 DS4 VS C4 CS4 Rshunt DS6 CS9 5 7 PGND 9 11 SGND RS MGS994 Fig.7 Application diagram. 2001 Jan 30 12 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.244 0.039 0.041 0.228 0.016 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 2001 Jan 30 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 13 o 8 0o Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.2 inches 0.17 0.020 0.13 0.068 0.044 0.021 0.015 0.014 0.009 0.77 0.73 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC EIAJ SOT27-1 050G04 MO-001 SC-501-14 2001 Jan 30 14 EUROPEAN PROJECTION ISSUE DATE 95-03-11 99-12-27 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE • For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2001 Jan 30 UBA2021 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 15 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Jan 30 16 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 Jan 30 17 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps NOTES 2001 Jan 30 18 UBA2021 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps NOTES 2001 Jan 30 19 UBA2021 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613502/02/pp20 Date of release: 2001 Jan 30 Document order number: 9397 750 07752