DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT MPC8230TU SiGe:C LOW NOISE AMPLIFIER FOR GPS DESCRIPTION The MPC8230TU is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise amplifier for GPS. This device exhibits low noise figure and high power gain characteristics, so this IC can improve the sensitivity of GPS receiver. In addition, the MPC8230TU which is included output matching circuit contributes to reduce external components and system size. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process. FEATURES • Low noise : NF = 0.85 dB TYP. @ fin = 1 575 MHz • High gain : GP = 18.5 dB TYP. @ fin = 1 575 MHz • Low current consumption : ICC = 6.0 mA TYP. @ VCC = 3.0 V • Built-in power-saving function • High-density surface mounting : 8-pin lead-less minimold package (2.0 s 2.0 s 0.5 mm) • Included output matching circuit • Included very robust bandgap regulator (Small VCC and TA dependence) • Included protection circuits for ESD APPLICATION • Low noise amplifier for GPS ORDERING INFORMATION Part Number Order Number MPC8230TU-E2 MPC8230TU-E2-A Package 8-pin lead-less minimold (Pb-Free) Marking 8230 Supplying Form v 8 mm wide embossed taping v Pin 5, 6, 7, 8 indicates pull-out direction of tape v Qty 5 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: MPC8230TU Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PU10612EJ01V0DS (1st edition) Date Published April 2006 NS CP(N) MPC8230TU PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 8 2 7 Pin No. Pin Name 1 VCC 2 N.C. 3 GND 4 INPUT 5 Power Save 6 GND 7 OUTPUT 8 VCC 6 Bias 3 4 5 ABSOLUTE MAXIMUM RATINGS P a ra m et er S ym bo l T e s t C on di ti on s R a ti ng s U n it Supply Vol tage VCC TA = +25oC 4.0 V Power-Saving Voltage VPS TA = +25oC 4.0 V Power Dissipatio n PD TA = +85°C 295 mW Operating Ambient Temperature TA 40 to +85 oC Storage Temperature Tstg 55 to +150 oC Input Power Pin +10 dBm Note Note Mounted on double-side copper-clad 50 s 50 s 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Vol tage VCC 2.7 3.0 3.3 V Operating Ambient Temperature TA 40 +25 +85 oC Power Save Turn-on Voltage VPSon 2.2 VCC V Power Save Turn-off Voltage VPSoff 0 0.8 V 2 Data Sheet PU10612EJ01V0DS MPC8230TU ELECTRICAL CHARACTERISTICS (TA = +25oC, VCC = VPS = 3.0 V, fin = 1 575 MHz, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 4.5 6.0 8.0 mA Circuit Current ICC No Signal (VPS = 3.0 V) At Power-Saving Mode (VPS = 0 V) 1 MA Power Gain GP Pin = 35 dBm 16 18 .5 21 dB Noise Figure NF 0.85 1.15 dB Input 3rd Order Distortion Intercept IIP3 5 dBm fin1 = 1 574 MHz, fin2 = 1 575 MHz Point Input Retu rn Lo ss RLin 8 11 dB Output Return Loss RLout 7 10 dB ISL 39 dB Pin (1 dB) 17 dBm Isolation Gain 1 dB Compression Input Power TEST CIRCUIT VCC 0.1 MF 1 8 2 7 OUTPUT 1 pF INPUT 100 pF 3 6 4 5 VPS 4.7 nH 0.1 MF Data Sheet PU10612EJ01V0DS 3 MPC8230TU TYPICAL CHARACTERISTICS (TA = +25oC, unless otherwise specified) CIRCUIT CURRENT vs. POWER-SAVING VOLTAGE 10 10 9 9 8 7 Circuit Current ICC (mA) Circuit Current ICC (mA) CIRCUIT CURRENT vs. SUPPLY VOLTAGE TA = +85oC 6 5 4 +25oC –40oC 3 2 VCC = VPS RF = off 1 0 2.0 2.5 3.5 3.0 8 TA = +85oC 7 6 5 +25oC 4 –40oC 3 2 VCC = 3 V RF = off 1 0 0 4.0 0.5 Supply Voltage VCC (V) 1.0 2.5 3.0 NOISE FIGURE vs. FREQUENCY POWER GAIN vs. FREQUENCY 1.6 1.4 TA = +85oC Noise Figure NF (dB) TA = –40oC 22 Power Gain GP (dB) 2.0 Power-Saving Voltage VPS (V) 24 20 18 +25oC 16 14 1 500 1.5 +85oC 1.0 0.8 0.6 +25oC 0.4 –40oC 0.2 VCC = VPS = 3 V 1 525 1.2 1 550 1 575 0 1 500 1 600 VCC = VPS = 3 V 1 525 1 550 1 575 1 600 Frequency fin (MHz) Frequency fin (MHz) POWER GAIN vs. OPERATING AMBIENT TEMPERATURE NOISE FIGURE vs. OPERATING AMBIENT TEMPERATURE 1.6 24 1.4 Noise Figure NF (dB) Power Gain GP (dB) 22 20 18 16 VCC = VPS = 3 V fin = 1 575 MHz 14 –50 –25 0 25 50 75 100 1.2 1.0 0.8 0.6 0.4 0.2 0 –50 Operating Ambient Temperature TA (oC) Remark The graphs indicate nominal characteristics. 4 Data Sheet PU10612EJ01V0DS VCC = VPS = 3 V fin = 1 575 MHz –25 0 25 50 75 Operating Ambient Temperature TA (oC) 100 MPC8230TU POWER GAIN vs. SUPPLY VOLTAGE NOISE FIGURE vs. SUPPLY VOLTAGE 24 1.6 1.4 TA = –40oC Noise Figure NF (dB) Power Gain GP (dB) 22 20 18 +25oC 16 +85oC 14 2.4 2.6 2.8 3.0 VCC = VPS fin = 1 575 MHz 3.2 3.4 1.0 0.8 +25oC 0.6 0.4 –40oC 0 2.4 3.6 2.6 2.8 3.2 3.4 3.6 OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER 10 VCC = VPS = 3 V fin = 1 575 MHz TA = +25oC –20 0 VCC = VPS = 3 V fin = 1 575 MHz TA = –40oC –10 –20 Pin (1dB) = –19.1 dBm Pin (1dB) = –17.4 dBm –30 –50 –40 –30 –20 –30 –50 –10 Input Power Pin (dBm) VCC = VPS = 3 V fin = 1 575 MHz TA = +85oC –10 –20 Pin (1dB) = –16.3 dBm –40 –30 –20 –10 Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) OUTPUT POWER vs. INPUT POWER –30 –50 –40 –20 –30 –10 Input Power Pin (dBm) 10 Output Power Pout (dBm) 3.0 Supply Voltage VCC (V) –10 0 VCC = VPS fin = 1 575 MHz Supply Voltage VCC (V) Output Power Pout (dBm) Output Power Pout (dBm) 1.2 0.2 10 0 TA = +85oC OUTPUT POWER, IM3 vs. INPUT POWER +20 VCC = VPS = 3 V fin1 = 1 574 MHz 0 fin2 = 1 575 MHz Pout –20 –40 IM3 –60 –80 IIP3 = –4.5 dBm –100 –40 Input Power Pin (dBm) –30 –20 –10 0 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10612EJ01V0DS 5 MPC8230TU S-PARAMETERS (TA = +25oC, VCC = VPS = 3.0 V, monitored at connector on board) S11–FREQUENCY S22–FREQUENCY 1:1 575 MHz 50.16 7 –28.16 7 1:1 575 MHz 34.06 7 11.57 7 1 1 START 100.000 000 MHz START 100.000 000 MHz STOP 4 000.000 000 MHz OUTPUT RETURN LOSS vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY 0 Power Gain GP (dB) Output Return Loss RLout (dB) –5 –10 –15 –20 –25 0 500 –5 –10 –15 –20 –25 –30 1 000 1 500 2 000 2 500 3 000 3 500 4 000 1 000 1 500 2 000 2 500 3 000 3 500 4 000 POWER GAIN vs. FREQUENCY ISOLATION vs. FREQUENCY 0 25 –10 20 15 10 –20 –30 –40 –50 5 0 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 –60 0 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 Frequency f (MHz) Frequency f (MHz) Remark The graphs indicate nominal characteristics. 6 500 Frequency f (MHz) 30 0 0 Frequency f (MHz) Isolation ISL (dB) Input Return Loss RLin (dB) 0 –30 STOP 4 000.000 000 MHz Data Sheet PU10612EJ01V0DS MPC8230TU PACKAGE DIMENSIONS 8-PIN LEAD-LESS MINIMOLD (UNIT: mm) (Top View) (Bottom View) (0.65) (0.65) (0.6) (0.3) (0.6) 8 0.4±0.1 7 0.4±0.1 (0.6) 6 (0.35) (0.35) 5 5 (0.35)(0.35) 6 (0.5) (0.5) 7 8230 2.0±0.1 2.2±0.05 8 (1.4) 2.0±0.1 1 2 3 4 0.16±0.05 0.125+0.1 –0.05 0.5±0.03 (0.25) (0.25) (0.75) 4 3 (0.75) 2 1 Remark ( ) : Reference value Data Sheet PU10612EJ01V0DS 7 MPC8230TU NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) Do not supply DC voltage to INPUT pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Metho d Infrared Reflow Wave Soldering S o l d e r i n g C ond itions C ondi ti on Sy mbo l Peak temperature (package surface temperature) : 260oC or below Time at peak temperature : 10 seconds or less Time at temperature of 220oC or higher : 60 seconds or less Preheating time at 120 to 180oC : 120p30 seconds Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 3 times : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260oC or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120oC or below Partial Heating Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 1 time : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350oC or below Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 3 seconds or less : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 8 Data Sheet PU10612EJ01V0DS HS350 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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