ETC UPD78018FGK-XXX-8A8

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
8-BIT SINGLE-CHIP MICROCONTROLLER
DESCRIPTION
The µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, and 78018F are the products in the µPD78018F subseries
within the 78K/0 series.
Compared with the older µPD78014 subseries, this subseries operates at lower voltage and provides a fuller set of ROM
and RAM variations.
A one-time PROM or EPROM product µPD78P018F capable of operating in the same power supply voltage range as
of the mask ROM product and other development tools are also provided.
Functions are described in detail in the following User's Manual, which should be read when carring out design
work.
µPD78018F, 78018FY Subseries User's Manual : U10659E
78K/0 Series Users Manual – Instruction
: U12326E
FEATURES
• Large on-chip ROM & RAM
Item
Product Name
•
•
•
•
•
•
•
Program
Memory
(ROM)
µPD78011F
8K bytes
µPD78012F
16K bytes
µPD78013F
24K bytes
µPD78014F
32K bytes
µPD78015F
40K bytes
µPD78016F
48K bytes
µPD78018F
60K bytes
Data Memory
Internal HighSpeed RAM
Internal
Expanded RAM
512 bytes
–
Package
Buffer RAM
32 bytes
• 64-pin plastic shrink DIP (750 mil)
• 64-pin plastic QFP (14 × 14 mm)
• 64-pin plastic LQFP (12 × 12 mm)
1024 bytes
512 bytes
1024 bytes
External memory expansion space : 64K bytes
Minimum instruction execution time can be varied from high-speed (0.4 µs) to ultra-low-speed (122 µs)
I/O ports: 53 (N-ch open-drain : 4)
8-bit resolution A/D converter : 8 channels
Serial interface : 2 channels
Timer : 5 channels
Supply voltage : VDD = 1.8 to 5.5 V
APPLICATION FIELDS
Cellular phone, pager, VCR, audio, camera, home appliances, etc
The information in this document is subject to change without notice.
Document No. U10280EJ2V1DS00 (2nd edition)
Date Published June 1998 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1994
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
ORDERING INFORMATION
Part Number
µPD78011FCW-×××
µPD78011FGC-×××-AB8
µPD78011FGK-×××-8A8
µPD78012FCW-×××
µPD78012FGC-×××-AB8
µPD78012FGK-×××-8A8
µPD78013FCW-×××
µPD78013FGC-×××-AB8
µPD78013FGK-×××-8A8
µPD78014FCW-×××
µPD78014FGC-×××-AB8
µPD78014FGK-×××-8A8
µPD78015FCW-×××
µPD78015FGC-×××-AB8
µPD78015FGK-×××-8A8
µPD78016FCW-×××
µPD78016FGC-×××-AB8
µPD78016FGK-×××-8A8
µPD78018FCW-×××
µPD78018FGC-×××-AB8
µPD78018FGK-×××-8A8
Package
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
64-pin
Remark ××× indicates a ROM code suffix.
2
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
plastic
shrink DIP (750 mil)
QFP (14 × 14 mm)
LQFP (12 × 12 mm)
shrink DIP (750 mil)
QFP (14 × 14 mm)
LQFP (12 × 12 mm)
shrink DIP (750 mil)
QFP (14 × 14 mm)
LQFP (12 × 12 mm)
shrink DIP (750 mil)
QFP (14 × 14 mm)
LQFP (12 × 12 mm)
shrink DIP (750 mil)
QFP (14 × 14 mm)
LQFP (12 × 12 mm)
shrink DIP (750 mil)
QFP (14 × 14 mm)
LQFP (12 × 12 mm)
shrink DIP (750 mil)
QFP (14 × 14 mm)
LQFP (12 × 12 mm)
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
78K/0 SERIES DEVELOPMENT
The following shows the products organized according to usage. The names in the parallelograms are subseries
names.
Products in mass production
Products under development
Y subseries products are compatible with I2C bus.
Control
100-pin
100-pin
100-pin
µ PD78075B
µ PD78078
µ PD78070A
100-pin
80-pin
µ PD780058
µ PD78058F
µPD78075BY
µPD78078Y
µ PD78070AY
µ PD780018AY
µ PD780058YNote
EMI-noise reduced version of µ PD78078
A timer was added to the µ PD78054 and external interface was enhanced
ROM-less version of the µPD78078
Serial I/O of the µ PD78078Y was enhanced and the function is limited.
Serial I/O of the µ PD78054 was enhanced and EMI-noise was reduced.
µ PD78058FY
EMI-noise reduced version of the µ PD78054
µPD78054
µPD780034
µ PD78054Y
µPD780034Y
UART and D/A converter were enhanced to the µ PD78014 and I/O was enhanced
64-pin
64-pin
µ PD780024
µ PD78014H
µ PD780024Y
64-pin
µPD78018F
µPD78014
µ PD780001
µPD78018FY
Serial I/O of the µ PD78018F was added and EMI-noise was reduced.
EMI-noise reduced version of µPD78018F
Low-voltage (1.8 V) operation version of the µPD78014, with larger selection of ROM and RAM capacities
µ PD78014Y
An A/D converter and 16-bit timer were added to the µPD78002
An A/D converter was added to the µPD78002
64-pin
µPD78002
µ PD78002Y
Basic subseries for control
42/44-pin
µ PD78083
80-pin
80-pin
64-pin
64-pin
64-pin
A/D converter of the µ PD780024 was enhanced
On-chip UART, capable of operating at low voltage (1.8 V)
Inverter control
64-pin
64-pin
A/D converter of the µ PD780924 was enhanced
On-chip inverter control circuit and UART. EMI-noise was reduced.
µPD780964
µPD780924
FIPTM drive
The I/O and FIP C/D of the µ PD78044F were enhanced, Display output total: 53
100-pin
µ PD780208
µ PD780228
80-pin
µ PD78044H
An N-ch open drain I/O was added to the µ PD78044F, Display output total: 34
80-pin
µPD78044F
Basic subseries for driving FIP, Display output total: 34
100-pin
78K/0
Series
The I/O and FIP C/D of the µ PD78044H were enhanced, Display output total: 48
LCD drive
100-pin
µ PD780308
µPD780308Y
100-pin
µPD78064B
µPD78064
The SIO of the µPD78064 was enhanced, and ROM, RAM capacity increased
EMI-noise reduced version of the µ PD78064
µ PD78064Y
Basic subseries for driving LCDs, On-chip UART
100-pin
IEBusTM supported
80-pin
µ PD78098B
EMI-noise reduced version of the µPD78098
80-pin
µ PD78098
An IEBus controller was added to the µPD78054
Meter control
80-pin
µ PD780973
On-chip controller/driver for automobile meters
LV
64-pin
µ PD78P0914
On-chip PWM output, LV digital code decoder, and Hsync counter
Note Under planning
3
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
The following lists the main functional differences between subseries products.
Function
Subseries Name
Control
ROM
Capacity
µPD78075B
32K-40K
µPD78078
48K-60K
µPD78070A
Timer
8-bit 10-bit 8-bit
8-bit 16-bit Watch WDT A/D A/D D/A
4ch 1ch
1ch 1ch 8ch
–
2ch 3ch (UART: 1ch)
–
µPD780058
24K-60K
µPD78058F
48K-60K
µPD78054
16K-60K
µPD780034
8K-32K
2ch
2ch 3ch (time division UART: 1ch)
3ch (UART: 1ch)
–
8ch
8ch
–
–
µPD78014H
µPD78018F
8K-60K
µPD78014
8K-32K
µPD780001
8K
µPD78002
8K-16K
–
Inverter
control
µPD780964
FIP
drive
µPD780208
32K-60K
2ch 1ch
µPD780228
48K-60K
3ch
µPD78044H
32K-48K
2ch 1ch
µPD78044F
16K-40K
µPD780308
48K-60K
µPD78064B
32K
µPD78064
16K-32K
32K-60K
Meter control µPD780973
24K-32K
LV
40K-60K
µPD78P0914 32K
Note 10-bit timer: 1 channel
4
3ch Note
–
88
1.8 V
61
2.7 V
68
1.8 V
69
2.7 V
3ch (UART: 1ch,
time division 3-wire: 1ch)
51
1.8 V
2ch
53
1.8 V
–
1ch
1ch
–
–
8ch
–
External
Expansion
1ch
39
–
53
–
8ch
8ch
–
1ch 1ch 8ch
–
µPD780924
IEBus
µPD78098
supported µPD78098B
VDD MIN.
Value
2.7 V
µPD78083
8K-32K
I/O
2.0 V
µPD780024
LCD
drive
Serial Interface
1ch (UART: 1ch)
33
1.8 V
–
2ch (UART: 2ch)
47
2.7 V
–
2ch
74
2.7 V
1ch
72
4.5 V
68
2.7 V
57
2.0 V
69
2.7 V
–
1ch
–
–
2ch
2ch 1ch
1ch 1ch 8ch
–
–
3ch (time division UART: 1ch)
–
2ch (UART: 1ch)
2ch 1ch
1ch 1ch 8ch
–
3ch 1ch
1ch 1ch 5ch
–
–
2ch (UART: 1ch)
56
4.5 V
–
–
2ch
54
4.5 V
6ch
–
–
1ch 8ch
2ch 3ch (UART: 1ch)
–
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
OVERVIEW OF FUNCTION (1/2)
Item
Product Name
µPD78011F
µPD78012F
8K bytes
16K bytes
ROM
High-speed
RAM
Expanded
RAM
Internal
memory
Buffer RAM
µPD78013F µPD78014F
24K bytes
µPD78015F
µPD78016F
µPD78018F
40K bytes
48K bytes
60K bytes
32K bytes
512 bytes
1024 bytes
—
512 bytes
1024 bytes
32 bytes
Memory space
64K bytes
General-purpose registers
8 bits × 32 registers (8 bits × 8 registers × 4 banks)
Minimum instruction execution time On-chip minimum instruction execution time cycle modification function
When main system
clock selected
When subsystem
clock selected
0.4 µs/0.8 µs/1.6 µs/3.2 µs/6.4 µs (at 10.0 MHz operation)
122 µs (at 32.768 kHz operation)
Instruction set
•
•
•
•
I/O ports
Total
• CMOS input
• CMOS I/O
• N-channel open-drain I/O
(15 V withstand voltage)
16-bit operation
Multiplication/division (8 bits × 8 bits,16 bits ÷ 8 bits)
Bit manipulation (set, reset, test, boolean operation)
BCD correction, etc.
: 53
: 02
: 47
: 04
A/D converter
• 8-bit resolution × 8 channels
• Operable over a wide power supply voltage range: AVDD = 1.8 to 5.5 V
Serial interface
• 3-wire serial I/O/SBI/2-wire serial I/O mode selectable: 1 channel
• 3-wire mode (on-chip max. 32 bytes automatic data transmit/receive function): 1 channel
Timer
•
•
•
•
Timer output
3 (14-bit PWM output × 1)
Clock output
39.1 kHz, 78.1 kHz, 156 kHz, 313 kHz, 625 kHz, 1.25 MHz (at main system clock: 10.0 MHz
operation), 32.768 kHz (at subsystem clock: 32.768 kHz operation)
Buzzer output
2.4 kHz, 4.9 kHz, 9.8 kHz (at main system clock: 10.0 MHz operation)
Vectored
Maskable
Internal : 8
External : 4
Non-maskable
Internal : 1
Software
1
interrupt
sources
16-bit timer/event counter
8-bit timer/event counter
Watch timer
Watchdog timer
:
:
:
:
1
2
1
1
channel
channels
channel
channel
5
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
OVERVIEW OF FUNCTION (2/2)
Item
Product Name
µPD78012F
Test input
Internal : 1
External : 1
Supply voltage
VDD = 1.8 to 5.5 V
Operating ambient
temperature
Package
6
µPD78011F
µPD78013F
TA = –40 to +85°C
• 64-pin plastic shrink DIP (750 mil)
• 64-pin plastic QFP (14 × 14 mm)
• 64-pin plastic LQFP (12 × 12 mm)
µPD78014F
µPD78015F
µPD78016F
µPD78018F
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
TABLE OF CONTENTS
1.
PIN CONFIGURATION (TOP VIEW) ....................................................................................................... 8
2.
BLOCK DIAGRAM ................................................................................................................................... 11
3.
PIN FUNCTIONS ...................................................................................................................................... 12
3.1 PORT PINS ........................................................................................................................................................ 12
3.2 PINS OTHER THAN PORT PINS ...................................................................................................................... 13
3.3 PIN I/O CIRCUITS AND RECOMMENDED CONNECTION OF UNUSED PINS ............................................. 15
4.
MEMORY SPACE .................................................................................................................................... 17
5.
PERIPHEL HARDWARE FUNCTION FEATURES ................................................................................ 19
5.1
5.2
5.3
5.4
5.5
5.6
5.7
6.
PORTS ...............................................................................................................................................................
CLOCK GENERATOR .......................................................................................................................................
TIMER/EVENT COUNTER ................................................................................................................................
CLOCK OUTPUT CONTROL CIRCUIT ............................................................................................................
BUZZER OUTPUT CONTROL CIRCUIT ...........................................................................................................
A/D CONVERTER ..............................................................................................................................................
SERIAL INTERFACES ......................................................................................................................................
19
20
21
23
23
24
24
INTERRUPT FUNCTIONS AND TEST FUNCTIONS .............................................................................. 26
6.1 INTERRUPT FUNCTIONS ................................................................................................................................. 26
6.2 TEST FUNCTIONS ............................................................................................................................................ 29
7.
EXTERNAL DEVICE EXPANSION FUNCTIONS .................................................................................... 30
8.
STANDBY FUNCTIONS .......................................................................................................................... 30
9.
RESET FUNCTIONS ................................................................................................................................ 30
10. INSTRUCTION SET ................................................................................................................................. 31
11. ELECTRICAL SPECIFICATIONS ............................................................................................................ 34
12. CHARACTERISTIC CURVE (REFERENCE VALUES) ........................................................................... 61
13. PACKAGE DRAWINGS ........................................................................................................................... 62
14. RECOMMENDED SOLDERING CONDITIONS ....................................................................................... 65
APPENDIX A. DEVELOPMENT TOOLS ...................................................................................................... 68
APPENDIX B. RELATED DOCUMENTS ...................................................................................................... 70
7
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
1. PIN CONFIGURATION (Top View)
• 64-Pin Plastic Shrink DIP (750 mil)
µPD78011FCW-×××, 78012FCW-×××, 78013FCW-×××,
µPD78014FCW-×××, 78015FCW-×××, 78016FCW-×××,
µPD78018FCW-×××
P20/SI1
1
64
AV REF
P21/SO1
2
63
AV DD
P22/SCK1
3
62
P17/ANI7
P23/STB
4
61
P16/ANI6
P24/BUSY
5
60
P15/ANI5
P25/SI0/SB0
6
59
P14/ANI4
P26/SO0/SB1
7
58
P13/ANI3
P27/SCK0
8
57
P12/ANI2
P30/TO0
9
56
P11/ANI1
10
55
P10/ANI0
P32/TO2
11
54
AV SS
P33/TI1
12
53
P04/XT1
P31/TO1
P34/TI2
13
52
XT2
P35/PCL
14
51
IC
P36/BUZ
15
50
X1
P37
16
49
X2
V SS
17
48
V DD
P40/AD0
18
47
P03/INTP3
P41/AD1
19
46
P02/INTP2
P42/AD2
20
45
P01/INTP1
P43/AD3
21
44
P00/INTP0/TI0
P44/AD4
22
43
RESET
P45/AD5
23
42
P67/ASTB
P46/AD6
24
41
P66/WAIT
P47/AD7
25
40
P65/WR
P50/A8
26
39
P64/RD
P51/A9
27
38
P63
P52/A10
28
37
P62
P53/A11
29
36
P61
P54/A12
30
35
P60
P55/A13
31
34
P57/A15
V SS
32
33
P56/A14
Cautions 1. Always connect the IC (Internally Connected) pin to VSS directly.
2. Always connect the AVDD pin to VDD.
3. Always connect the AVSS pin to VSS.
8
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
• 64-Pin Plastic QFP (14 × 14 mm)
µPD78011FGC-×××-AB8, 78012FGC-×××-AB8, 78013FGC-×××-AB8,
P27/SCK0
P26/SO0/SB1
P25/SI0/SB0
P24/BUSY
P23/STB
P22/SCK1
P21/SO1
P20/SI1
AV REF
AV DD
P17/ANI7
P16/ANI6
P15/ANI5
P14/ANI4
P13/ANI3
P12/ANI2
µPD78014FGC-×××-AB8, 78015FGC-×××-AB8, 78016FGC-×××-AB8,
µPD78018FGC-×××-AB8
• 64-Pin Plastic LQFP (12 × 12 mm)
µPD78011FGK-×××-8A8, 78012FGK-×××-8A8, 78013FGK-×××-8A8,
µPD78014FGK-×××-8A8, 78015FGK-×××-8A8, 78016FGK-×××-8A8,
µPD78018FGK-×××-8A8
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
P35/PCL
6
43
IC
P36/BUZ
7
42
X1
P37
8
41
X2
V SS
9
40
V DD
P40/AD0
10
39
P03/INTP3
P41/AD1
11
38
P02/INTP2
P42/AD2
12
37
P01/INTP1
P43/AD3
13
36
P00/INTP0/TI0
P44/AD4
14
35
RESET
P45/AD5
15
34
P67/ASTB
P46/AD6
16
17
P66/WAIT
18
19
20
21
22
23
24
25
26
27
28
29
30
31
33
32
P65/WR
XT2
P64/RD
44
P63
5
P62
P34/TI2
P61
P04/XT1
P60
AV SS
45
P57/A15
46
4
P56/A14
3
P33/TI1
V SS
P32/TO2
P55/A13
P10/ANI0
P54/A12
47
P53/A11
2
P52/A10
P31/TO1
P51/A9
P11/ANI1
P50/A8
1
P47/AD7
P30/TO0
Cautions 1. Always connect the IC (Internally Connected) pin to VSS directly.
2. Always connect the AVDD pin to VDD.
3. Always connect the AVSS pin to VSS.
9
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
A8 to A15
AD0 to AD7
ANI0 to ANI7
: Address Bus
: Address/Data Bus
: Analog Input
ASTB
AVDD
: Address Strobe
: Analog Power Supply
AVREF
AVSS
: Analog Reference Voltage
: Analog Ground
BUSY
BUZ
: Busy
: Buzzer Clock
IC
: Internally Connected
INTP0 to INTP3 : Interrupt from Peripherals
10
P00 to P04
P10 to P17
: Port0
: Port1
P20 to P27
P30 to P37
: Port2
: Port3
P40 to P47
P50 to P57
: Port4
: Port5
P60 to P67
: Port6
PCL
RD
: Programmable Clock
: Read Strobe
RESET
SB0, SB1
: Reset
: Serial Bus
SCK0, SCK1
SI0, SI1
: Serial Clock
: Serial Input
SO0, SO1
STB
: Serial Output
: Strobe
TI0 to TI2
TO0 to TO2
: Timer Input
: Timer Output
VDD
VSS
: Power Supply
: Ground
WAIT
WR
: Wait
: Write Strobe
X1, X2
XT1, XT2
: Crystal (Main System Clock)
: Crystal (Subsystem Clock)
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
2. BLOCK DIAGRAM
TO0/P30
TI0/INTP0/P00
P00
16-bit TIMER/
EVENT COUNTER
PORT0
P01 to P03
P04
TO1/P31
TI1/P33
TO2/P32
TI2/P34
8-bit TIMER/
EVENT COUNTER 1
8-bit TIMER/
EVENT COUNTER 2
WATCHDOG TIMER
WATCH TIMER
78K/0
CPU CORE
SI0/SB0/P25
SO0/SB1/P26
PORT1
P10 to P17
PORT2
P20 to P27
PORT3
P30 to P37
PORT4
P40 to P47
PORT5
P50 to P57
PORT6
P60 to P67
ROM
SERIAL
INTERFACE 0
SCK0/P27
SI1/P20
SO1/P21
SCK1/P22
AD0/P40 to
AD7/P47
SERIAL
INTERFACE 1
STB/P23
A8/P50 to
A15/P57
BUSY/P24
EXTERNAL
ACCESS
RAM
ANI0/P10 to
ANI7/P17
AVDD
RD/P64
WR/P65
WAIT/P66
A/D CONVERTER
AVSS
ASTB/P67
AVREF
RESET
INTP0/P00 to
INTP3/P03
INTERRUPT
CONTROL
X1
SYSTEM
CONTROL
X2
XT1
BUZ/P36
BUZZER OUTPUT
PCL/P35
CLOCK OUTPUT
CONTROL
XT2
VDD
VSS
IC
(VPP)
Remarks 1. Internal ROM & RAM capacity varies depending on the product.
2. ( ) : µPD78P018F
11
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
3. PIN FUNCTIONS
3.1 PORT PINS (1/2)
Pin Name
I/O
Input
P00
Input/
output
P01
P02
Function
Port 0
5-bit I/O port
On Reset
DualFunction Pin
Input only
Input
INTP0/TI0
Input/output can be specified bit-wise.
When used as an input port, on-chip pull-up
resistor can be used in software.
Input
INTP1
INTP2
P03
INTP3
P04Note 1
Input
Input only
P10 to P17
Input/
output
Port 1
8-bit input/output port.
Input/output can be specified bit-wise.
When used as an input port, on-chip pull-up resistor can be used
in software.Note 2
P20
Input/
output
Port 2
8-bit input/output port.
Input/output can be specified bit-wise.
When used as an input port, on-chip pull-up resistor can be used
in software.
P21
P22
P23
Input
XT1
Input
ANI0 to ANI7
Input
SI1
SO1
SCK1
STB
P24
BUSY
P25
SI0/SB0
P26
SO0/SB1
P27
SCK0
Input/
output
P30
P31
P32
P33
Port 3
8-bit input/output port.
Input/output can be specified in 1-bit units.
When used as an input port, on-chip pull-up resistor can be used
in software.
Input
TO0
TO1
TO2
TI1
P34
TI2
P35
PCL
P36
BUZ
P37
—
P40 to P47
Input/
output
Port 4
8-bit input/output port.
Input/output can be specified in 8-bit unit.
When used as an input port, on-chip pull-up resistor can be used
in software.
Test input flag (KRIF) is set to 1 by falling edge detection.
Input
AD0 to AD7
Notes 1. When using the P04/XT1 pins as an input port, set 1 to bit 6 (FRC) of the processor clock control register
(PCC). Do not use the on-chip feedback register of the subsystem clock oscillator.
2. When using the P10/ANI0 to P17/ANI7 pins as the A/D converter analog input, on-chip pull-up resistor is
automatically unused.
12
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
3.1 PORT PINS (2/2)
Pin Name
I/O
Function
P50 to P57
Input/
output
Port 5
8-bit input/output port.
LED can be driven directly.
Input/output can be specified bit-wise.
When used as an input port, on-chip pull-up resistor can be used in
software.
Input
P60
Input/
output
Port 6
8-bit input/output port.
Input/output can be specified
bit-wise.
Input
P61
P62
N-ch open-drain input/output port.
On-chip pull-up resistor can be
specified by mask option.
LED can be driven directly.
P63
On Reset
P64
P66
A8 to A15
RD
When used as an input port, on-chip
pull-up resistor can be used in software.
P65
DualFunction Pin
WR
WAIT
P67
ASTB
3.2 PINS OTHER THAN PORT PINS (1/2)
Pin Name
INTP0
I/O
Input
INTP1
INTP2
INTP3
SI0
Function
External interrupt request input by which the effective edge (rising
edge, falling edge, or both rising edge and falling edge) can be
specified.
On Reset
DualFunction Pin
Input
P00/TI0
P01
P02
P03
Falling edge detection external interrupt request input.
Input
Serial interface serial data input.
Input
SI1
SO0
P20
Output
Serial interface serial data output.
Input
SO1
SB0
P25/SB0
P26/SB1
P21
Input
Input
/output
Serial interface serial data input/output.
Input
/output
Serial interface serial clock input/output.
STB
Output
Serial interface automatic transmit/receive strobe output.
Input
P23
BUSY
Input
Serial interface automatic transmit/receive busy input.
Input
P24
SB1
SCK0
SCK1
P25/SI0
P26/SO0
Input
P27
P22
13
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
3.2 PINS OTHER THAN PORT PINS (2/2)
Pin Name
TI0
I/O
Input
Function
External count clock input to 16-bit timer (TM0).
TI1
External count clock input to 8-bit timer (TM1).
TI2
External count clock input to 8-bit timer (TM2).
TO0
Output
16-bit timer (TM0) output (shared as 14-bit PWM output).
TO1
8-bit timer (TM1) output.
TO2
8-bit timer (TM2) output.
PCL
BUZ
Output
Output
On Reset
Input
DualFunction Pin
P00/INTP0
P33
P34
Input
P30
P31
P32
Clock output (for main system clock, subsystem clock trimming).
Input
P35
Buzzer output.
Input
P36
P40 to P47
AD0 to AD7
Input
/output
Low-order address/data bus at external memory expansion.
Input
A8 to A15
Output
High-order address bus at external memory expansion.
Input
P50 to P57
RD
Output
External memory read operation strobe signal output.
Input
P64
WR
External memory write operation strobe signal output.
P65
Input
Wait insertion at external memory access.
Input
P66
ASTB
Output
Strobe output which latches the address information output at port 4 and
port 5 to access external memory.
Input
P67
ANI0 to ANI7
Input
A/D converter analog input.
Input
P10 to P17
AVREF
Input
A/D converter reference voltage input.
—
—
AVDD
—
A/D converter analog power supply. Connected to VDD.
—
—
AVSS
—
A/D converter ground potential. Connected to VSS.
—
—
RESET
Input
System reset input.
—
—
X1
Input
Main system clock oscillation crystal connection.
—
—
X2
—
—
—
XT1
Input
Input
P04
XT2
—
—
—
VDD
—
Positive power supply.
—
—
VSS
—
Ground potential.
—
—
IC
—
Internal connection. Connected to VSS directly.
—
—
WAIT
14
Subsystem clock oscillation crystal connection.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
3.3 PIN I/O CIRCUITS AND RECOMMENDED CONNECTION OF UNUSED PINS
The input/output circuit type of each pin and recommended connection of unused pins are shown in Table 3-1.
For the input/output circuit configuration of each type, refer to Figure 3-1.
Table 3-1. Input/Output Circuit Type of Each Pin
Pin Name
Input/output
Circuit Type
I/O
Recommended Connection when Not Used
P00/INTP0/TI0
2
Input
Connected to VSS .
P01/INTP1
8-A
Input/output
Individually connected to VSS via resistor.
P04/XT1
16
Input
Connected to VDD or VSS.
P10/ANI0 to P17/ANI7
11
Input/output
Individually connected to VDD or VSS via resisitor.
P20/SI1
8-A
P21/SO1
5-A
P22/SCK1
8-A
P23/STB
5-A
P24/BUSY
8-A
P25/SI0/SB0
10-A
P02/INTP2
P03/INTP3
P26/SO0/SB1
P27/SCK0
P30/TO0
5-A
P31/TO1
P32/TO2
P33/TI1
8-A
P34/TI2
P35/PCL
5-A
P36/BUZ
P37
P40/AD0 to P47/AD7
5-E
Individually connected to VDD via resistor.
P50/A8 to P57/A15
5-A
Individually connected to VDD or VSS via resistor.
P60 to P63
13-B
Individually connected to VDD via resistor.
P64/RD
5-A
Individually connected to VDD or VSS via resistor.
P65/WR
P66/WAIT
P67/ASTB
RESET
2
Input
XT2
16
—
AVREF
—
—
Leave open.
Connected to VSS .
AVDD
Connected to VDD .
AVSS
Connected to VSS .
IC
Connected to VSS directly.
15
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 3-1. Pin Input/Output Circuits
V DD
Type 10-A
Type 2
pull-up
enable
P-ch
V DD
IN
data
P-ch
IN / OUT
open drain
output disable
N-ch
Schmitt-Triggered Input with Hysteresis Characteristic
Type 5-A
Type 11
V DD
pull-up
enable
pull-up
enable
P-ch
IN / OUT
P-ch
IN / OUT
output
disable
N-ch
N-ch
P-ch
+
–
input
enable
Type 5-E
Type 13-B
V DD
data
output
disable
Comparator
N-ch
VREF (Threshold Voltage)
input
enable
pull-up
enable
P-ch
V DD
P-ch
data
V DD
data
V DD
V DD
Mask
Option
P-ch
V DD
data
output disable
N-ch
P-ch
V DD
IN / OUT
output
disable
IN / OUT
N-ch
P-ch
RD
Middle-High Voltage Input Buffer
V DD
Type 8-A
pull-up
enable
Type 16
feedback
cut-off
P-ch
V DD
data
P-ch
P-ch
IN / OUT
output
disable
N-ch
XT1
16
XT2
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
4. MEMORY SPACE
The memory maps of the µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, and 78018F are shown in Figure
4-1 and 4-2.
Figure 4-1. Memory Map (µPD78011F, 78012F, 78013F, 78014F)
FFFFH
Special Function Registers
(SFR) 256 × 8 Bits
FF00H
FEFFH General-Purpose Registers
32 × 8 Bits
FEE0H
FEDFH
Internal High-Speed RAMNote
mmmmH
mmmmH – 1
nnnnH
Use Prohibited
FAE0H
FADFH
Data
Memory
Space
FAC0H
FABFH
Program Area
1000H
0FFFH
Buffer RAM 32 × 8 Bits
CALLF Entry Area
Use Prohibited
0800H
07FFH
FA80H
FA7FH
Program Area
Program
Memory
Space
nnnnH + 1
nnnnH
0080H
007FH
External Memory
CALLT Table Area
0040H
003FH
Internal ROMNote
Vector Table Area
0000H
0000H
Note
Intermal ROM and internal high-speed RAM capacities vary depending on the product (refer to the
table below).
Intenal ROM End Address
nnnnH
Internal High-Speed RAM
Start Address
mmmmH
µPD78011F
1FFFH
FD00H
µPD78012F
3FFFH
µPD78013F
5FFFH
µPD78014F
7FFFH
Product Name
FB00H
17
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 4-2. Memory Map (µPD78015F, 78016F, 78018F)
FFFFH
Special Function Registers
(SFR) 256 × 8 Bits
FF00H
FEFFH General-Purpose Registers
32 × 8 Bits
FEE0H
FEDFH
Internal High-Speed RAMNote
mmmmH
mmmmH–1
Use Prohibited
FAE0H
FADFH
Data
Memory
Space
FAC0H
FABFH
Buffer RAM 32 × 8 Bits
nnnnH
Program Area
Use Prohibited
FA80H
FA7FH
1000H
0FFFH
Use Prohibited
F800H
F7FFH
Program
Memory
Space kkkkH
kkkkH – 1
CALLF Entry Area
0800H
07FFH
Internal Expanded RAMNote
Program Area
0080H
007FH
External Memory
nnnnH + 1
CALLT Table Area
nnnnH
0040H
003FH
Internal ROMNote
Vector Table Area
0000H
0000H
Note Intermal ROM, internal high-speed RAM, and internal expanded RAM capacities vary depending on the
product (refer to the table below).
Internal High-Speed RAM
Start Address
mmmmH
Internal Expanded RAM
Intenal ROM End Address
nnnnH
µPD78015F
9FFFH
FB00H
F600H
µPD78016F
BFFFH
µPD78018F
EFFFH
Product Name
18
Start Address
kkkkH
F400H
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
5. PERIPHERAL HARDWARE FUNCTION FEATURES
5.1 PORTS
The I/O port has the following three types
• CMOS input (P00, P04)
:
• CMOS input/output (P01 to P03, port 1 to port 5, P64 to P67)
• N-ch open-drain input/output(15V withstand voltage) (P60 to P63)
: 47
: 4
Total
2
: 53
Table 5-1. Functions of Ports
Port Name
Port 0
Pin Name
Function
P00, P04
Dedicated Input port
P01 to P03
Input/output ports. Input/output can be specified bit-wise.
Port 1
P10 to P17
Port 2
P20 to P27
Port 3
P30 to P37
Port 4
P40 to P47
Port 5
P50 to P57
Port 6
P60 to P63
P64 to P67
When used as an input port, pull-up resistor can be used in software.
Input/output ports. Input/output can be specified bit-wise.
When used as an input port, pull-up resistor can be used in software.
Input/output ports. Input/output can be specified bit-wise.
When used as an input port, pull-up resistor can be used in software.
Input/output ports. Input/output can be specified bit-wise.
When used as an input port, pull-up resistor can be used in software.
Input/output ports. Input/output can be specified in 8-bit units.
When used as an input port, pull-up resistor can be used in software.
Test input flag (KRIF) is set to 1 by falling edge detection.
Input/output ports. Input/output can be specified bit-wise.
When used as an input port, pull-up resistor can be used in software.
LED can be driven directly.
N-ch open-drain input/output port. Input/output can be specified bit-wise.
On-chip pull-up resistor can be specified by mask option.
LED can be driven directly.
Input/output ports. Input/output can be specified bit-wise.
When used as an input port, pull-up resistor can be used in software.
19
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
5.2 CLOCK GENERATOR
There are two types of clock generator: main system clock and subsystem clock.
The minimum instruction exection time can be changed.
• 0.4µs/0.8µs/1.6µs/3.2µs/6.4µs (Main system clock: at 10.0 MHz operation)
• 122µs (Subsystem clock: at 32.768 KHz operation)
Figure 5-1. Clock Generator Block Diagram
XT1/P04
XT2
Subsystem
Clock
Oscillator
Watch Timer
Clock Output
Function
fXT
Prescaler
X1
X2
Main
System
Clock
Oscillator
fX
Clock to
Peripheral
Hardware
Prescaler
fX
fX
fX
fX
2
22
23
24
STOP
Selector
Standby
Control
Circuit
Wait
Control
Circuit
INTP0
Sampling Clock
20
CPU Clock
(fCPU)
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
5.3 TIMER/EVENT COUNTER
The following five channels are incorporated in the timer/event counter.
• 16-bit timer/event counter
: 1 channel
• 8-bit timer/event counter
• Watch timer
: 2 channels
: 1 channel
• Watchdog timer
: 1 channel
Table 5-2. Operation of Timer/Event Counter
16-bit Timer/Event
Counter
Operation
mode
Functions
8-bit Timer/Event
Counter
Watch Timer
Watchdog Timer
Interval timer
1 channel
2 channels
1 channel
1 channel
Externanal event counter
1 channel
2 channels
–
–
Timer output
1 output
2 outputs
–
–
PWM output
1 output
–
–
–
1 input
–
–
–
1 output
2 outputs
–
–
Interrupt request
2
2
1
1
Test input
–
–
1 input
–
Pulse width mesurement
Sqare wave output
Figure 5-2. 16-bit Timer/Enent Counter Block Diagram
Internal Bus
16-Bit Compare
Register (CR00)
PWM
Pulse
Output
Control
Circuit
Match
fX/2
fX/22
Selector
INTTM0
Output
Control
Circuit
TO0/P30
16-Bit Timer
Register (TM0)
fX/23
TI0/INTP0/P00
Edge
Detector
Clear
Selector
INTP0
16-Bit Capture
Register (CR01)
Internal Bus
21
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 5-3. 8-bit Timer/Enent Counter Block Diagram
Internal Bus
INTIM1
8-Bit Compare
Register (CR10)
8-Bit Compare
Register (CR20)
Selector
Match
Output
Control
Circuit
TO2/P32
INTTM2
fX/22 to fX/210
Selector
fX/212
8-Bit Timer
Register 1 (TM1)
TI1/P33
Clear
Selector
8-Bit Timer
Register 2 (TM2)
Clear
fX/22 to fX/210
Selector
Selector
fX/212
TI2/P34
Output
Control
Circuit
TO1/P31
Internal Bus
Figure 5-4. Watch Timer Block Diagram
Selector
fX/28
Selector
fW
Selector
Prescaler
fXT
fW
24
fW
25
fW
26
fW
27
fW
28
INTWT
fW
213
fW
29
Selector
22
5-Bit Counter
fW
214
INTTM3
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 5-5. Watchdog Timer Block Diagram
fX
24
Prescaler
fX
25
fX
26
fX
27
fX
28
fX
29
fX
210
fX
212
INTWDT
Maskable
Interrupt Request
Selector
Control
Circuit
8-Bit Counter
RESET
INTWDT
Non-Maskable
Interrupt Request
5.4 CLOCK OUTPUT CONTROL CIRCUIT
The clock with the following frequencies can be output for clock output.
• 39.1 kHz/78.1 kHz/156 kHz/313 kHz/625 kHz/1.25 MHz (Main system clock: at 10.0 MHz operation)
• 32.768 kHz (Subsystem clock: at 32.768 kHz operation)
Figure 5-6. Clock Output Control Block Diagram
fX/23
fX/24
fX/25
Selector
fX/26
Synchronization
Circuit
Output Control
Circuit
PCL/P35
fX/27
fX/28
fXT
5.5 BUZZER OUTPUT CONTROL CIRCUIT
The clock with the following frequencies can be output for buzzer output.
• 2.4 kHz/4.9 kHz/9.8 kHz (Main system clock: at 10.0 MHz operation)
Figure 5-7. Buzzer Output Control Block Diagram
fX/210
fX/211
Selector
Output Control
Circuit
BUZ/P36
fX/212
23
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
5.6 A/D CONVERTER
The A/D converter has on-chip eight 8-bit resolution channels.
There are the following two method to start A/D conversion.
• Hardware starting
• Software starting
Figure 5-8. A/D Converter Block Diagram
Series Resistor String
AVDD
Sample & Hold Circuit
ANI0/P10
AVREF
ANI1/P11
Voltage Comparator
ANI2/P12
ANI3/P13
Tap
Selector
Selector
ANI4/P14
ANI5/P15
ANI6/P16
Succesive Approxmation
Register (SAR)
ANI7/P17
Falling
Edge
Detector
INTP3/P03
AVSS
Control
Circuit
INTAD
INTP3
A/D Conversion
Result Register (ADCR)
Internal Bus
5.7 SERIAL INTERFACES
There are two on-chip clocked serial interfaces as follows.
• Serial Interface channel 0
• Serial Interface channel 1
Table 5-3. Type and Function of Serial Interface
Function
Serial Interface Channel 0
Serial Interface Channel 1
3-wire serial I/O mode
O (MSB/LSB-first switchable)
O (MSB/LSB-first switchable)
3-wire serial I/O mode with automatic data transmit/
–
O (MSB/LSB-first switchable)
SBI (Serial Bus Interface) mode
O (MSB-first)
–
2-wire serial I/O mode
O (MSB-first)
–
receive function
24
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 5-9. Serial Interface Channel 0 Block Diagram
Internal Bus
SI0/SB0/P25
Serial I/O Shift
Register 0 (SIO0)
Selector
SO0/SB1/P26
Bus Release/Command/
Acknowledge Detection
Circuit
Selector
Serial Clock Counter
SCK0/P27
Output
Latch
Busy/Acknowlede
Output Circuit
Interrupt
Request
Signal
Generator
INTCSI0
fx/22 to fx/29
Serial Clock
Control Circuit
Selector
TO2
Figure 5-10. Serial Interface Channel 1 Block Diagram
Internal Bus
Automatic Data Transmit/
Receive Address Pointer
(ADTP)
SI1/P20
Buffer RAM
Serial I/O Shift Register 1 (SIO0)
SO1/P21
STB/P23
BUSY/P24
SCK/P22
Handshake
Control
Circuit
Serial Clock Counter
Interrupt Request
Signal Generator
INTCSI1
fX/22 to fX/29
Serial Clock Control Circuit
Selector
TO2
25
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
6. INTERRUPT FUNCTIONS AND TEST FUNCTIONS
6.1 INTERRUPT FUNCTIONS
There are interrupt functions, 14 sources of three different kinds, as shown below.
• Non-maskable
:
• Maskable
• Software
: 12
: 1
1
Table 6-1. Interrupt Source List
Interrupt Type
Default
Priority Note 1
Interrupt Source
Name
Trigger
Non-maskable
–––
INTWDT
Watchdog timer overflow (with watchdog
timer mode 1 selected)
Maskable
0
INTWDT
Watchdog timer overflow (with interval
timer mode selected)
1
INTP0
2
Software
Pin input edge detection
Internal/
External
Vector Table
Address
Basic
Configuratin
Type Note 2
Internal
0004H
(A)
(B)
0006H
(C)
INTP1
0008H
(D)
3
INTP2
000AH
4
INTP3
000CH
5
INTCSI0
Serial interface channel 0 transfer end
6
INTCSI1
Serial interface channel 1 transfer end
0010H
7
INTTM3
Reference time interval signal from
watch timer
0012H
8
INTTM0
16 bit timer/event counter match signal
generation
0014H
9
INTTM1
8-bit timer/event counter 1 match signal
generation
0016H
10
INTTM2
8-bit timer/event counter 2 match signal
generation
0018H
11
INTAD
A/D converter conversion end
001AH
–––
BRK
BRK instruction execution
External
Internal
–––
000EH
003EH
(B)
(E)
Notes 1. The default pririty is the priority applicable when more than one maskable interrupt request is generated. 0 is the
highest priority and 11, the lowest.
2. Basic configuration types (A) to (E) correspond to (A) to (E) on the next page.
26
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 6-1. Basic Interrupt Function Configuration (1/2)
(A) Internal Non-Maskable Interrupt
Internal Bus
Interrupt
Request
Vector Table
Address
Generator
Priority Control
Circuit
Standby Release
Signal
(B) Internal Maskable Interrupt
Internal Bus
MK
Interrupt
Request
PR
IE
ISP
Vector Table
Address
Generator
Priority Control
Circuit
IF
Standby Release
Signal
(C) External Maskable Interrupt (INTP0)
Internal Bus
Sampling Clock
Select Register
(SCS)
Interrupt
Request
Sampling
Clock
External Interrupt
Mode Register
(INTM0)
Edge
Detector
MK
IF
IE
PR
Priority Control
Circuit
ISP
Vector Table
Address
Generator
Standby Release
Signal
27
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Figure 6-1. Basic Interrupt Function Configuration (2/2)
(D) External Maskable Interrupt (Except INTP0)
Internal Bus
External Interrupt
Mode Register
(INTM0)
Interrupt
Request
Edge
Detector
MK
IE
PR
Priority Control
Circuit
IF
ISP
Vector Table
Address
Generator
Standby Release
Signal
(E)
Software Interrupt
Internal Bus
Interrupt
Request
IF
IE
ISP
MK
PR
28
: Interrupt request flag
: Interrupt enable flag
: In-service priority flag
: Interrupt mask flag
: Priority spcification flag
Priority Control
Circuit
Vector Table
Address
Generator
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
6.2 TEST FUNCTIONS
There are two test functions as shown in Table 6-2.
Table 6-2. Test Source List
Test Source
Internal/External
Name
Trigger
INTWT
Watch timer overflow
Internal
INTPT4
Port 4 falling edge detection
External
Figure 6-2. Test Function Basic Configuration
Internal Bus
MK
Test
Input
IF
IF
Standby Release
Signal
: Test input flag
MK : Test mask flag
29
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
7. EXTERNAL DEVICE EXPANSION FUNCTIONS
The external device expansion function is used to connect external devices to areas other than the internal ROM, RAM
and SFR.
Ports 4 to 6 are used for connection with external devices.
8. STANDBY FUNCTIONS
There are the following two standby functions to reduce the current dissipation.
• HALT mode
: The CPU operating clock is stopped. The average consumption current can be reduced by intermittent
operation in combination with the normal operat ing mode.
• STOP mode
: The main system clock oscillation is stopped. The whole operation by the main system clock
is stopped, so that the system operates withultra-low power consumption using only the subsystem
clock.
Figure 8-1. Standby Functions
CSS=1
Main System
Clock Operation
Interrupt
Request
CSS=0
HALT
Instruction
STOP
Instruction
Interrupt
Request
STOP Mode
(Main system clock
oscillation stopped)
HALT Mode
(Clock supply to CPU is
stopped, oscillation)
Subsystem Clock
OperationNote
Interrupt
Request
HALT
Instruction
HALT ModeNote
(Clock supply to CPU is
stopped, oscillation)
Note The power consumption can be reduced by stopping the main system clock. When the CPU is operating on the
subsystem clock, set the bit 7 (MCC) of the processor clock control register (PCC) to stop the main system clock.
The STOP instruction cannot be used.
Caution
When the main system clock is stopped and the system is operated by the subsystem clock, the
subsystem clock should be switched again to the main system clock after the oscillation stabilization
time is secured by the program by the program.
9. RESET FUNCTIONS
There are the following two reset methods.
• External reset input by RESET pin.
• Internal reset by watchdog timer runaway time detection.
30
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
10. INSTRUCTION SET
(1) 8-Bit Instruction
MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC,
ROLC, ROR4, ROL4, PUSH, POP, DBNZ
2nd Operand
#byte
A
r Note
sfr
saddr
!addr16
MOV
XCH
ADD
ADDC
SUB
SUBC
AND
OR
XOR
CMP
MOV
XCH
MOV
XCH
ADD
ADDC
SUB
SUBC
AND
OR
XOR
CMP
MOV
XCH
ADD
ADDC
SUB
SUBC
AND
OR
XOR
CMP
PSW
[DE]
[HL]
MOV
XCH
MOV
XCH
ADD
ADDC
SUB
SUBC
AND
OR
XOR
CMP
1st Operand
A
ADD
ADDC
SUB
SUBC
AND
OR
XOR
CMP
r
MOV
MOV
[HL+byte]
[HL+B] $adder16
[HL+C]
MOV
XCH
ADD
ADDC
SUB
SUBC
AND
OR
XOR
CMP
1
None
ROR
ROL
RORC
ROLC
MOV
INC
DEC
ADD
ADDC
SUB
SUBC
AND
OR
XOR
CMP
B, C
DBNZ
sfr
MOV
MOV
sadder
MOV
MOV
ADD
ADDC
SUB
DBNZ
INC
DEC
SUBC
AND
OR
XOR
CMP
!adder16
PSW
MOV
MOV
MOV
[DE]
MOV
[HL]
MOV
[HL+byte]
[HL+B]
[HL+C]
MOV
PUSH
POP
ROR4
ROL4
X
MULU
C
DIVUW
Note Except r=A
31
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(2) 16-Bit Instruction
MOVW, XCHW ADDW, SUBW, CMPW, PUSH, POP, INCW, DECW
2nd Operand
1st Operand
AX
#byte
AX
rp Note
ADDW
MOVW
SUBW
XCHW
saddrp
MOVW
!addr16
MOVW
SP
MOVW
None
MOVW
CMPW
rp
MOVW
MOVWNote
sfrp
MOVW
MOVW
sadderp
MOVW
MOVW
MOVW
MOVW
!adder16
SP
INCW, DECW
PUSH, POP
MOVW
Note Only when rp=BC, DE, HL.
(3) Bit Manipulation Instruction
MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR
2nd Operand
A.bit
sfr.bit
saddr.bit
PWS.bit
[HL].bit
CY
$addr16
None
1st Operand
A.bit
MOV1
BT
BF
BTCLR
SET1
CLR1
sfr.bit
MOV1
BT
BF
BTCLR
SET1
CLR1
saddr.bit
MOV1
BT
BF
BTCLR
SET1
CLR1
PSW.bit
MOV1
BT
BF
BTCLR
SET1
CLR1
[HL].bit
MOV1
BT
BF
BTCLR
SET1
CLR1
CY
32
MOV1
AND1
OR1
XOR1
MOV1
AND1
OR1
XOR1
MOV1
AND1
OR1
XOR1
MOV1
AND1
OR1
XOR1
MOV1
AND1
OR1
XOR1
SET1
CLR1
NOT1
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(4) Call Instruction/Branch Instruction
CALL, CALLF, CALLT, BR, BC, BNC, BZ, BNZ, BT, BF, BTCLR, DBNZ
2nd Operand
AX
!addr16
!addr11
[addr5]
$addr16
1st Operand
Basic instruction
Compound instruction
BR
CALL, BR
CALLF
CALLT
BR, BC, BNC,
BZ, BNZ
BT,BF, BTCLR,
DBNZ
(5) Other Instruction
ADJBA, ADJBS, BRK, RET, RETI, RETB, SEL, NOP, EI, DI, HALT, STOP
33
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
11. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25 °C)
Parameter
Supply voltage
Input voltage
Symbol
Rating
Unit
VDD
–0.3 to +7.0
V
AVDD
–0.3 to VDD + 0.3
V
AVREF
–0.3 to VDD + 0.3
V
AVSS
–0.3 to +0.3
V
–0.3 to VDD + 0.3
V
–0.3 to +16
V
–0.3 to VDD + 0.3
V
AVSS – 0.3 to AVREF + 0.3
V
1 pin
–10
mA
P10 to P17, P20 to P27, P30 to P37 total
–15
mA
P01 to P03, P40 to P47, P50 to P57, P60 to P67 total
–15
mA
Peak value
30
mA
rms
15
mA
Peak value
100
mA
rms
70
mA
P01 to P03, P56, P57,
Peak value
100
mA
P60 to P67 total
rms
70
mA
P01 to P03,
Peak value
50
mA
P64 to P67 total
rms
20
mA
P10 to P17, P20 to P27, P30 to P37 Peak value
50
mA
total
20
mA
VI1
Test Conditions
P00 to P04, P10 to P17, P20 to P27, P30 to P37
P40 toP47, P50 to P57, P64 to P67, X1, X2, XT2
VI2
Output voltage
VO
Analog input
voltage
VAN
Output
current high
IOH
Output
current low
P60 to P67
P10 to P17
1 pin
P40 to P47, P50 to P55 total
IOLNote
Open-drain
Analog input pin
rms
Operating ambient
temperature
TA
–40 to +85
°C
Storage
temperature
Tstg
–65 to +150
°C
Note rms should be calculated as follows: [rms] = [peak value] × √duty
Caution Product quality may suffer if the absolute maximum rating is exceeded for even a single parameter or
even momentarily. That is, the absolute maximuam ratings are rated values at which the product is on
the verge of suffering physical damage, and therefore the product must be used under conditions which
ensure that the absolute maximum ratings are not exceeded.
34
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Capacitance ( TA = 25 °C, VDD = VSS = 0 V )
Parameter
Symbol
Input capacitance
CIN
Test Conditions
MIN.
TYP.
f = 1 MHz Unmeasured pins returned to 0 V
I/O capacitance
MAX.
Unit
15
pF
15
pF
20
pF
P01 to P03, P10 to P17,
f = 1 MHz Unmeasured P20 to P27, P30 toP37,
CIO
pins returned to 0 V
P40 toP47, P50 to P57,
P64 to P67
P60 to P63
Remark
The characteristics of a dual-function pin and a port pin are the same unless specified otherwise.
Main System Clock Oscillation Circuit Characteristics ( TA = –40 to +85 °C, VDD = 1.8 to 5.5 V)
Resonator
Ceramic
resonator
Recommended
Circuit
X1
X2 VSS
Parameter
Oscillator
frequency (fX) Note 1
R1
C1
Crystal
resonator
X1
C1
C2
X2 VSS
C2
Test Conditions
MIN.
TYP.
MAX.
2.7 V ≤ VDD ≤ 5.5 V
1
10
1.8 V ≤ VDD < 2.7 V
1
5
Unit
MHz
Oscillation
stabilization time Note 2
After VDD reaches oscillator voltage range MIN.
Oscillator
frequency (fX) Note 1
2.7 V ≤ VDD ≤ 5.5 V
1
10
1.8 V ≤ VDD < 2.7 V
1
5
Oscillation
stabilization time Note 2
VDD = 4.5 to 5.5 V
4
ms
MHz
10
ms
30
External
clock
X1
X2
X1 input
frequency (fX) Note 1
1.0
10.0
MHz
45
500
ns
X1 input
µPD74HCU04 high/low level width
(tXH , tXL)
Notes 1. Indicates only oscillation circuit characteristics. Refer to AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after reset or STOP mode release.
Cautions 1. When using the main system clock oscillator, wiring the area enclosed with the dotted line should
be carried out as follows to avoid an adverse effect from wiring capacitance.
● Wiring should be as short as possible.
● Wiring should not cross other signal lines.
● Wiring should not be placed close to a varying high current.
● The potential of the oscillator capacitor ground should be the same as VSS.
● Do not ground wiring to a ground pattern in which a high current flows.
● Do not fetch a signal from the oscillator.
2. When the main system clock is stopped and the system is operated by the subsystem clock, the
subsystem clock should be switched again to the main system clock after the oscillation stabilization
time is secured by the program.
35
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Subsystem Clock Oscillation Circuit Characteristics (TA = –40 to +85 °C, VDD = 1.8 to 5.5 V)
Resonator
Crystal
resonator
Recommended
Circuit
XT1 XT2 VSS
Test Conditions
Oscillator
frequency (fXT) Note 1
MIN.
TYP.
MAX.
Unit
32
32.768
35
kHz
1.2
2
R2
C3
External
clock
Parameter
XT1
C4
XT2
Oscillation
stabilization time Note 2
V DD = 4.5 to 5.5 V
s
10
XT1 input
frequency (fXT) Note 1
32
100
kHz
XT1 input
high/low level width
(tXTH , tXTL)
5
15
µs
Notes 1. Indicates only oscillation circuit characteristics. Refer to AC Characteristics for instruction execution time.
2. Time required to stabilize oscillation after VDD reaches oscillator voltage MIN.
Cautions 1. When using the subsystem clock oscillator, wiring in the area enclosed with the dotted line should
be carried out as follows to avoid an adverse effect from wiring capacitance.
● Wiring should be as short as possible.
● Wiring should not cross other signal lines.
● Wiring should not be placed close to a varying high current.
● The potential of the oscillator capacitor ground should be the same as VSS.
● Do not ground wiring to a ground pattern in which a high current flows.
● Do not fetch a signal from the oscillator.
2. The subsystem clock oscillation circuit is a circuit with a low amplification level,more prone to
misoperation due to noise than the main system clock.
Particular care is therefore required with the wiring method when the subsystem clock is used.
36
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Recommended Oscillation Circuit Constant
Recommended oscillation circuit constant differs depending on the model.
(1) µPD78011F, 78012F, 78013F, 78014F
(a) Main system clock: ceramic resonator (TA = –45 to +85 °C)
Manufacturer
TDK Corp.
Murata Mfg. Co. Ltd.
Product Name
Frequency
(MHz)
Recommended Oscillation
Circuit Constant
Oscillation
Voltage Range
C1 (pF)
C2 (pF)
MIN. (V)
MAX. (V)
CCR4.19MC3
4.19
Built-in
Built-in
1.8
5.5
FCR4.19MC5
4.19
Built-in
Built-in
1.8
5.5
CCR5.00MC3
5.00
Built-in
Built-in
1.8
5.5
FCR5.00MC5
5.00
Built-in
Built-in
1.8
5.5
CCR8.38MC
8.00
Built-in
Built-in
2.7
5.5
FCR8.38MC5
8.00
Built-in
Built-in
2.7
5.5
CCR10.00MC
10.00
Built-in
Built-in
2.7
5.5
FCR10.00MC5
10.00
Built-in
Built-in
2.7
5.5
CSA4.19MG
4.19
30
30
1.8
5.5
CST4.19MGW
4.19
Built-in
Built-in
1.8
5.5
CSA5.00MG
5.00
30
30
1.8
5.5
CST5.00MGW
5.00
Built-in
Built-in
1.8
5.5
CSA8.38MTZ
8.38
30
30
2.7
5.5
CST8.38MTW
8.38
Built-in
Built-in
2.7
5.5
CSA10.00MTZ
10.00
30
30
2.7
5.5
CST10.00MTW
10.00
Built-in
Built-in
2.7
5.5
(b) Main system clock: ceramic resonator (TA = –20 to +80 °C)
Manufacturer
Kyocera Corp.
Caution
Product Name
Frequency
(MHz)
Recommended Oscillation
Circuit Constant
Oscillation
Voltage Range
C1 (pF)
C2 (pF)
MIN. (V)
MAX. (V)
5.00
33
33
1.8
5.5
PBRC5.00B
5.00
Built-in
Built-in
1.8
5.5
KBR-5.00MSA
5.00
33
33
1.8
5.5
KBR-5.00MKS
5.00
Built-in
Built-in
1.8
5.5
PBRC5.00A
KBR-8M
8.00
33
33
2.7
5.5
KBR-10M
10.00
33
33
2.7
5.5
The oscillation circuit constants and oscillation voltage range indicate conditions for stable oscillation
but do not guarantee the accuracy of the oscillation frequency. If the application circuit requires
accuracy of the oscillation frequency, it is necessary to set the oscillation frequency of the resonator
in the application circuit. For this, it is necessary to directly contact manufacturer of the resonator being
used.
37
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(2) µPD78015F, 78016F
(a) Main system clock: ceramic resonator (TA = –45 to +85 °C)
Manufacturer
Product Name
Recommended Oscillation
Circuit Constant
Frequency
(MHz)
C1 (pF)
TDK Corp.
Murata Mfg. Co. Ltd.
C2 (pF)
R1 (kΩ)
Oscillation
Voltage Range
MIN. (V)
MAX. (V)
CSB1000J
1.00
100
100
5.6
1.8
6.0
CSA2.00MG040
2.00
100
100
0
1.8
6.0
CST2.00MG040
2.00
Built-in
Built-in
0
1.8
6.0
CSA4.00MG040
4.00
100
100
0
1.8
6.0
CST4.00MGW040
4.00
Built-in
Built-in
0
1.8
6.0
CSA6.00MG
6.00
30
30
0
1.8
6.0
CST6.00MGW
6.00
Built-in
Built-in
0
1.8
6.0
CSA10.0MTZ
10.0
30
30
0
1.8
6.0
CST10.0MTW
10.0
Built-in
Built-in
0
1.8
6.0
CSA6.00MG040
6.00
100
100
0
2.7
6.0
(EMI noise reduced
CST6.00MGW040
6.00
Built-in
Built-in
0
2.7
6.0
products)
CSA10.0MTZ040
10.0
100
100
0
2.7
6.0
CST10.0MTW040
10.0
Built-in
Built-in
0
2.7
6.0
FCR4.0MC5
4.0
Built-in
Built-in
2.2
1.8
6.0
FCR10.0MC
10.0
Built-in
Built-in
1.0
1.8
6.0
TDK Corp.
(b) Main system clock: ceramic resonator (TA = –20 to +80 °C)
Manufacturer
Kyocera Corp.
Caution
Product Name
Frequency
(MHz)
Recommended Oscillation
Circuit Constant
Oscillation
Voltage Range
C1 (pF)
C2 (pF)
MIN. (V)
MAX. (V)
PBRC5.00A
5.00
33
33
1.8
5.5
PBRC5.00B
5.00
Built-in
Built-in
1.8
5.5
KBR-5.00MSA
5.00
33
33
1.8
5.5
KBR-5.00MKS
5.00
Built-in
Built-in
1.8
5.5
KBR-8M
8.00
33
33
2.7
5.5
KBR-10M
10.00
33
33
2.7
5.5
The oscillation circuit constants and oscillation voltage range indicate conditions for stable oscillation
but do not guarantee the accuracy of the oscillation frequency. If the application circuit requires
accuracy of the oscillation frequency, it is necessary to set the oscillation frequency of the resonator
in the application circuit. For this, it is necessary to directly contact manufacturer of the resonator being
used.
38
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(3) µPD78018F
(a) Main system clock: ceramic resonator (TA = –40 to +85 °C)
Manufacturer
TDK Corp.
Product Name
CCR4.0MC3
Murata Mfg. Co. Ltd.
Frequency
(MHz)
4.00
Recommended Oscillation
Circuit Constant
Oscillation
Voltage Range
C1 (pF)
C2 (pF)
MIN. (V)
MAX. (V)
Built-in
Built-in
1.8
5.5
FCR4.0MC5
4.00
Built-in
Built-in
1.8
5.5
CCR8.0MC5
8.00
Built-in
Built-in
2.7
5.5
FCR8.0MC
8.00
Built-in
Built-in
2.7
5.5
CCR10.0MC5
10.0
Built-in
Built-in
2.7
5.5
FCR10.0MC
10.0
Built-in
Built-in
2.7
5.5
CSA4.0MG
4.00
30
30
1.8
5.5
CST4.0MGW
4.00
Built-in
Built-in
1.8
5.5
CSA8.0MTZ
8.00
30
30
2.7
5.5
CST8.0MTW
8.00
Built-in
Built-in
2.7
5.5
(b) Main system clock: ceramic resonator (TA = –20 to +80 °C)
Manufacturer
Kyocera Corp.
Caution
Product Name
Frequency
(MHz)
Recommended Oscillation
Circuit Constant
Oscillation
Voltage Range
C1 (pF)
C2 (pF)
MIN. (V)
MAX. (V)
FBRC4.00A
4.00
33
33
1.8
5.5
FBRC4.00B
4.00
Built-in
Built-in
1.8
5.5
KBR-4.00MSB
4.00
33
33
1.8
5.5
KBR-4.00MKC
4.00
Built-in
Built-in
1.8
5.5
KBR-8M
8.00
33
33
2.7
5.5
KBR-10M
10.00
33
33
2.7
5.5
The oscillation circuit constants and oscillation voltage range indicate conditions for stable oscillation
but do not guarantee the accuracy of the oscillation frequency. If the application circuit requires
accuracy of the oscillation frequency, it is necessary to set the oscillation frequency of the resonator
in the application circuit. For this, it is necessary to directly contact manufacturer of the resonator being
used.
39
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
DC Characteristics (TA = –40 to +85 °C, VDD = 1.8 to 5.5 V)
Parameter
Input voltage
Symbol
VIH1
high
Test Conditions
MAX.
Unit
0.7 VDD
VDD
V
0.8 VDD
VDD
V
P00 to P03, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V
0.8 VDD
VDD
V
P33, P34, RESET
0.85 VDD
VDD
V
VDD = 2.7 to 5.5 V
0.7 VDD
15
V
0.8 VDD
15
V
VDD = 2.7 to 5.5 V
VDD – 0.5
VDD
V
VDD – 0.2
VDD
V
4.5 V ≤ VDD ≤ 5.5 V
0.8 VDD
VDD
V
2.7 V ≤ VDD < 4.5 V
0.9 VDD
VDD
V
1.8 V ≤ VDD < 2.7 V Note
0.9 VDD
VDD
V
0
0.3 VDD
V
P50 to P57, P64 to 67
0
0.2 VDD
V
P00 to P03, P20, P22, P24 to P27, VDD = 2.7 to 5.5 V
0
0.2 VDD
V
P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V
MIN.
TYP.
P35 to P37, P40 to P47,
P50 to P57, P64 to 67
VIH2
VIH3
P60 to P63
(N-ch open-drain)
VIH4
VIH5
Input voltage
VIL1
low
X1, X2
XT1/P04, XT2
P10 to P17, P21, P23, P30 to P32, VDD = 2.7 to 5.5 V
P35 to P37, P40 to P47,
VIL2
P33, P34, RESET
VIL3
VIL4
VIL5
Output
VOH1
voltage high
Output
VOL1
P60 to P63
X1, X2
XT1/P04, XT2
0
0.15 VDD
V
4.5 V ≤ VDD ≤ 5.5 V
0
0.3 VDD
V
2.7 V ≤ VDD < 4.5 V
0
0.2 VDD
V
0
0.1 VDD
V
0
0.4
V
0
0.2
V
0
0.2 VDD
V
VDD = 2.7 to 5.5 V
4.5 V ≤ VDD ≤ 5.5 V
2.7 V ≤ VDD < 4.5 V
0
0.1 VDD
V
1.8 V ≤ VDD < 2.7 V Note
0
0.1 VDD
V
VDD = 4.5 to 5.5 V, IOH = –1 mA
VDD – 1.0
V
IOH = –100 µA
VDD – 0.5
V
P50 to P57, P60 to P63
voltage low
VDD = 4.5 to 5.5 V,
0.4
2.0
V
0.4
V
0.2 VDD
V
0.5
V
IOL = 15 mA
P01 to P03, P10 to P17, P20 to P27
VOL2
VDD = 4.5 to 5.5 V,
P30 to P37, P40 to P47, P64 to P67
IOL = 1.6 mA
SB0, SB1, SCK0
VDD = 4.5 to 5.5 V, open-drain
pulled-up (R = 1 KΩ)
VOL3
Note
When using XT1/P04 as P04, input the inverse of P04 to XT2 using an inverter.
Remark
40
IOL = 400 µA
The characteristics of a dual-function pin and a port pin are the same unless specified otherwise.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
DC Characteristics (TA = –40 to +85 °C, VDD = 1.8 to 5.5 V)
Parameter
Symbol
Input leakage ILIH1
Test Conditions
MAX.
Unit
3
µA
X1, X2, XT1/P04, XT2
20
µA
VIN = 15 V
P60 to P63
80
µA
VIN = 0 V
P00 to P03, P10 to P17,
–3
µA
–20
µA
–3 Note
µA
VOUT = VDD
3
µA
VOUT = 0 V
–3
µA
VIN = VDD
current high
MIN.
TYP.
P00 to P03, P10 to P17,
P20 to P27, P30 to P37,
P40 to P47, P50 to P57,
P60 to P67, RESET
ILIH2
ILIH3
Input leakege ILIL1
current low
P20 to P27, P30 to P37,
P40 to P47, P50 to P57,
P60 to P67, RESET
ILIL2
X1, X2, XT1/P04, XT2
ILIL3
P60 to P63
Output leakage ILOH1
current high
Output leakage ILOL
current low
Mask option
R1
VIN = 0 V, P60 to P63
20
40
90
kΩ
R2
VIN = 0 V, P01 to P03, P10 to P17, P20 to P27, P30 to P37,
15
40
90
kΩ
pull-up resister
Software
pull-up resister
P40 to P47, P50 to P57, P60 to P67
Note For P60 to P63, if pull-up resistor is not provided (specifiable by mask option) a low-level input leak current of –200
µA (MAX.) flows only during the 3 clocks (no-wait time) after an instruction has been executed to read out port 6 (P6)
or port mode register 6 (PM6). Outside the period of 3 clocks following execution a read-out instruction, the current
is –3 µA (MAX.).
Remark
The characteristics of a dual-function pin and a port pin are the same unless specified otherwise.
41
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
DC Characteristics (TA = –40 to +85 °C, VDD = 1.8 to 5.5 V)
Parameter
Supply
current
Symbol
IDD1
Note 1
IDD2
IDD3
Test Conditions
IDD6
MAX.
Unit
VDD = 5.0 V ± 10 % Note 2
9.0
18.0
mA
oscillation operation mode
VDD = 3.0 V ± 10 %
Note 3
1.3
2.6
mA
10.00 MHz crystal
VDD = 5.0 V ± 10 %
Note 2
2.4
4.8
mA
oscillation HALT mode
VDD = 3.0 V ± 10 % Note 3
1.2
2.4
mA
VDD = 5.0 V ± 10 %
60
120
µA
VDD = 3.0 V ± 10 %
35
70
µA
VDD = 2.0 V ± 10 %
24
48
µA
VDD = 5.0 V ± 10 %
25
50
µA
VDD = 3.0 V ± 10 %
5
15
µA
32.768 kHz crystal
Note 4
32.768 kHz crystal
oscillation HALT mode
IDD5
TYP.
10.00 MHz crystal
oscillation operation mode
IDD4
MIN.
Note 4
VDD = 2.0 V ± 10 %
2
10
µA
XT1 = VDD
VDD = 5.0 V ± 10 %
1
30
µA
STOP mode when using feedback
VDD = 3.0 V ± 10 %
0.5
10
µA
resistor
VDD = 2.0 V ± 10 %
0.3
10
µA
XT1 = VDD
VDD = 5.0 V ± 10 %
0.1
30
µA
STOP mode when not using
VDD = 3.0 V ± 10 %
0.05
10
µA
feedback resistor
VDD = 2.0 V ± 10 %
0.05
10
µA
Notes 1. This current excludes the AVREF current, port current, and current which flows in the built-in pull-down resistor.
2. When operating at high-speed mode (when the processor clock control register (PCC) is set to 00H)
3. When operating at low-speed mode (when the PCC is set to 04H)
4. When main system clock stopped.
42
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
AC Characteristics
(1) Basic Operation (TA = –40 to +85 °C, VDD = 1.8 to 5.5 V)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
3.5 V ≤ VDD ≤ 5.5 V
0.4
64
µs
(Min. instruction
2.7 V ≤ VDD < 3.5 V
0.8
64
µs
execution time)
1.8 V ≤ VDD < 2.7 V
2.0
64
µs
125
µs
Cycle time
TCY
Operating on main system clock
Operating on subsystem clock
TI0 input
frequency
TI1, TI2 input
40
2/fsam + 0.1
µs
Note
µs
µs
tTIH0
3.5 V ≤ VDD ≤ 5.5 V
tTIL0
2.7 V ≤ VDD < 3.5 V
2/fsam + 0.2
1.8 V ≤ VDD < 2.7 V
2/fsam + 0.5 Note
fTI1
VDD = 4.5 to 5.5 V
frequency
TI1, TI2 input
122
Note
tTIH1
VDD = 4.5 to 5.5 V
0
4
MHz
0
275
kHz
100
ns
1.8
µs
3.5 V ≤ VDD ≤ 5.5 V
2/fsam + 0.1 Note
µs
2.7 V ≤ VDD < 3.5 V
2/fsam + 0.2 Note
µs
1.8 V ≤ VDD < 2.7 V
Note
µs
high/low-level
tTIL1
width
Interrupt
tINTH
request input
tINTL
INTP0
high/low-level
width
INTP1 to INTP3, KR0 to KR7
RESET low
tRSL
VDD = 2.7 to 5.5 V
VDD = 2.7 to 5.5 V
level width
2/fsam + 0.5
10
µs
20
µs
10
µs
20
µs
Note In combination with bits 0 (SCS0) and 1 (SCS1) of sampling clock select register (SCS), selection of fsam is possible
between fX/2N+1, fX/64 and fx/128 (when N= 0 to 4).
43
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
TCY vs VDD (At main system clock operation)
60.0
Operation Guaranteed
Range
Cycle Time TCY [ µ S]
10.0
5.0
1.0
0.5
0.1
0
1.0
3.0 3.5 4.0
2.0
1.8
2.7
Supply voltage VDD [V]
44
5.0 5.5 6.0
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(2) Read/Write Operation (TA = –40 to +85 °C, VDD = 2.7 to 5.5 V)
Parameter
Symbol
Test Conditions
MIN.
MAX.
Unit
ASTB high-level width
tASTH
0.5tCY
ns
Address setup time
tADS
0.5tCY – 30
ns
Address hold time
tADH
50
ns
Data input time from address
Data input time from RD↓
tADD1
(2.5 + 2n) tCY – 50
ns
tADD2
(3 + 2n) tCY – 100
ns
tRDD1
(1 + 2n) tCY – 25
ns
tRDD2
(2.5 + 2n) tCY – 100
ns
Read data hold time
tRDH
0
ns
RD low-level width
tRDL1
(1.5 + 2n) tCY – 20
ns
tRDL2
(2.5 + 2n) tCY – 20
ns
WAIT↓ input time from RD↓
tRDWT1
0.5tCY
ns
tRDWT2
1.5tCY
ns
WAIT↓ input time from WR↓
tWRWT
0.5tCY
ns
WAIT low-level width
tWTL
(0.5 + 2n) tCY + 10
(2 + 2n) tCY
ns
Write data setup time
tWDS
100
ns
Write data hold time
tWDH
20
ns
WR low-level width
tWRL1
(2.5 + 2n) tCY – 20
ns
RD↓ delay time from ASTB↓
tASTRD
0.5tCY – 30
ns
WR↓ delay time from ASTB↓
tASTWR
1.5tCY – 30
ns
ASTB↑ delay time from
RD↑ in external fetch
tRDAST
tCY – 10
tCY + 40
ns
Address hold time from
RD↑ in external fetch
tRDADH
tCY
tCY + 50
ns
Write data output time from RD↑
tRDWD
0.5tCY + 5
0.5tCY + 30
ns
0.5tCY + 15
0.5tCY + 90
ns
30
ns
Load resistor ≥ 5 kΩ
VDD = 4.5 to 5.5 V
Write data output time from WR↓
tWRWD
VDD = 4.5 to 5.5 V
5
15
90
ns
Address hold time from WR↑
tWRADH
VDD = 4.5 to 5.5 V
tCY
tCY + 60
ns
tCY
tCY + 100
ns
RD↑ delay time from WAIT↑
tWTRD
0.5tCY
2.5tCY + 80
ns
WR↑ delay time from WAIT↑
tWTWR
0.5tCY
2.5tCY + 80
ns
Remarks 1. tCY = TCY/4
2. n indicates number of waits.
45
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(3) Serial Interface (TA = –40 to +85 °C, VDD = 1.8 to 5.5 V)
(a) Serial Interface Channel 0
(i) 3-wire serial I/O mode (SCK0... Internal clock output)
Parameter
SCK0 cycle time
Symbol
tKCY1
SCK0 high/low-level
tKH1
width
tKL1
SI0 setup time
tSIK1
(to SCK0↑)
SI0 hold time
Conditions
MIN.
TYP.
MAX.
Unit
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.7 V ≤ VDD < 4.5 V
1600
ns
2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
tKCY1/2 – 50
ns
VDD = 4.5 to 5.5 V
tKCY1/2 – 100
ns
4.5 V ≤ VDD ≤ 5.5 V
100
ns
2.7 V ≤ VDD < 4.5 V
150
ns
2.0 V ≤ VDD < 2.7 V
300
ns
400
ns
400
ns
tKSI1
(from SCK0↑)
SO0 output delay time
tKSO1
C = 100 pF Note
300
ns
MAX.
Unit
from SCK0↓
Note C is the load capacitance of SCK0 and SO0 output line.
(ii) 3-wire serial I/O mode (SCK0... External clock input)
Parameter
SCK0 cycle time
Symbol
tKCY2
Test Conditions
MIN.
TYP.
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.7 V ≤ VDD < 4.5 V
1600
ns
2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
SCK0 high/low-level
tKH2
4.5 V ≤ VDD ≤ 5.5 V
400
ns
width
tKL2
2.7 V ≤ VDD < 4.5 V
800
ns
2.0 V ≤ VDD < 2.7 V
1600
ns
2400
ns
100
ns
150
ns
400
ns
SI0 setup time
tSIK2
VDD = 2.0 to 5.5 V
(to SCK0↑)
SI0 hold time
tKSI2
(from SCK0↑)
SO0 output delay time
tKSO2
C = 100 pF Note VDD = 2.0 to 5.5 V
tR2
When external device
tF2
expansion function is used
from SCK0↓
SCK0 rise, fall time
When external
When 16-bit timer
300
ns
500
ns
160
ns
700
ns
1000
ns
device expansion output function is
function is not
used
used
When 16-bit timer
output function is
not used
Note C is the load capacitance of SO0 output line.
46
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iii) SBI mode (SCK0... Internal clock output)
Parameter
SCK0 cycle time
Symbol
tKCY3
SCK0 high/low-level
tKH3
width
tKL3
SB0, SB1 setup time
tSIK3
(to SCK0↑)
SB0, SB1 hold time
Test Conditions
MIN.
TYP.
MAX.
Unit
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.0 V ≤ VDD < 4.5 V
3200
ns
4800
ns
VDD = 4.5 to 6.0 V
tKCY3/2 – 50
ns
tKCY3/2 – 150
ns
4.5 V ≤ VDD ≤ 5.5 V
100
ns
2.0 V ≤ VDD < 4.5 V
300
ns
400
ns
tKCY3/2
ns
tKSI3
(from SCK0↑)
SB0, SB1output delay
tKSO3
R = 1 kΩ,
C = 100 pF Note
time from SCK0↓
VDD = 4.5 to 5.5 V
0
250
ns
0
1000
ns
SB0, SB1↓ from SCK0↑ tKSB
tKCY3
ns
SCK0↓ from SB0, SB1↓ tSBK
tKCY3
ns
SB0, SB1 high-level
tSBH
tKCY3
ns
tSBL
tKCY3
ns
width
SB0, SB1 low-level
width
Note R and C are the load resistors and load capacitance of the SB0, SB1 and SCK0 output line.
47
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iv) SBI mode (SCK0... External clock input)
Parameter
SCK0 cycle time
Symbol
tKCY4
Test Conditions
MIN.
TYP.
MAX.
Unit
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.0 V ≤ VDD < 4.5 V
3200
ns
4800
ns
SCK0 high/low-level
tKH4
4.5 V ≤ VDD ≤ 5.5 V
400
ns
width
tKL4
2.0 V ≤ VDD < 4.5 V
1600
ns
2400
ns
4.5 V ≤ VDD ≤ 5.5 V
100
ns
2.0 V ≤ VDD < 4.5 V
300
ns
400
ns
tKCY4/2
ns
SB0, SB1 setup time
tSIK4
(to SCK0↑)
SB0, SB1 hold time
tKSI4
(from SCK0↑)
SB0, SB1 output delay
tKSO4
time from SCK0↓
R = 1 kΩ,
C = 100 pF
VDD = 4.5 to 5.5 V
Note
0
300
ns
0
1000
ns
SB0, SB1↓ from SCK0↑ tKSB
tKCY4
ns
SCK0↓ from SB0, SB1↓ tSBK
tKCY4
ns
SB0, SB1 high-level
tSBH
tKCY4
ns
tSBL
tKCY4
ns
width
SB0, SB1 low-level
width
SCK0 rise, fall time
tR4
When external device
tF4
expansion function is used
When external
When 16-bit timer
160
ns
700
ns
1000
ns
device expansion output function is
function is not
used
used
When 16-bit timer
output function is
not used
Note R and C are the load resistors and load capacitance of the SB0 and SB1 output line.
48
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(v) 2-wire serial I/O mode (SCK0... Internal clock output)
Parameter
SCK0 cycle time
SCK0 high-level width
Symbol
tKCY5
tKH5
Test Conditions
MIN.
TYP.
MAX.
Unit
2.7 V ≤ VDD ≤ 5.5 V
1600
ns
C = 100 pF Note 2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
R = 1 kΩ,
VDD = 2.7 to 5.5 V tKCY5/2 – 160
ns
tKCY5/2 – 190
ns
tKCY5/2 – 50
ns
SCK0 low-level width
tKL5
VDD = 4.5 to 5.5 V
tKCY5/2 – 100
ns
SB0, SB1 setup time
tSIK5
4.5 V ≤ VDD ≤ 5.5 V
300
ns
2.7 V ≤ VDD < 4.5 V
350
ns
2.0 V ≤ VDD < 2.7 V
400
ns
(to SCK0↑)
SB0, SB1 hold time
500
ns
tKSI5
600
ns
tKSO5
0
(from SCK0↑)
SB0, SB1 output delay
300
ns
time from SCK0↓
Note R and C are the load resistors and load capacitance of the SCK0, SB0 and SB1 output line.
49
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(vi) 2-wire serial I/O mode (SCK0... External clock input)
Parameter
SCK0 cycle time
SCK0 high-level width
SCK0 low-level width
SB0, SB1 setup time
Symbol
tKCY6
tKH6
tKL6
tSIK6
Test Conditions
TYP.
MAX.
Unit
2.7 V ≤ VDD ≤ 5.5 V
1600
ns
2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
2.7 V ≤ VDD ≤ 5.5 V
650
ns
2.0 V ≤ VDD < 2.7 V
1300
ns
2100
ns
2.7 V ≤ VDD ≤ 5.5 V
800
ns
2.0 V ≤ VDD < 2.7 V
1600
ns
2400
ns
100
ns
VDD = 2.0 to 5.5 V
(to SCK0↑)
SB0, SB1 hold time
MIN.
tKSI6
150
ns
tKCY6/2
ns
(from SCK0↑)
SB0, SB1 output delay
tKSO6
time from SCK0↓
SCK0 rise, fall time
4.5 V ≤ VDD ≤ 5.5 V
0
300
ns
C = 100 pF Note 2.0 V ≤ VDD < 4.5 V
0
500
ns
0
800
ns
160
ns
700
ns
1000
ns
R = 1 kΩ,
tR6
When external device
tF6
expansion function is used
When external
When 16-bit timer
device expansion output function is
function is not
used
used
When 16-bit timer
output function is
not used
Note R and C are the load resistors and load capacitance of the SB0 and SB1 output line.
50
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(b) Serial Interface Channel 1
(i) 3-wire serial I/O mode (SCK1... Internal clock output)
Parameter
SCK1 cycle time
Symbol
tKCY7
SCK1 high/low-level
tKH7
width
tKL7
SI1 setup time
tSIK7
(to SCK1↑)
SI1 hold time
Test Conditions
MIN.
TYP.
MAX.
Unit
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.7 V ≤ VDD < 4.5 V
1600
ns
2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
VDD = 4.5 to 5.5 V
tKCY7/2 – 50
ns
tKCY7/2 – 100
ns
4.5 V ≤ VDD ≤ 5.5 V
100
ns
2.7 V ≤ VDD < 4.5 V
150
ns
2.0 V ≤ VDD < 2.7 V
300
ns
400
ns
400
ns
tKSI7
(from SCK1↑)
SO1 output delay time
tKSO7
C = 100 pF Note
300
ns
MAX.
Unit
from SCK1↓
Note C is the load capacitance of SCK1 and SO1 output line.
(ii) 3-wire serial I/O mode (SCK1... External clock input)
Parameter
SCK1 cycle time
Symbol
tKCY8
Test Conditions
MIN.
TYP.
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.7 V ≤ VDD < 4.5 V
1600
ns
2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
400
ns
SCK1 high/low-level
tKH8
4.5 V ≤ VDD ≤ 5.5 V
width
tKL8
2.7 V ≤ VDD < 4.5 V
800
ns
2.0 V ≤ VDD < 2.7 V
1600
ns
2400
ns
SI1 setup time
tSIK8
VDD = 2.0 to 5.5 V
(to SCK1↑)
SI1 hold time
tKSI8
100
ns
150
ns
400
ns
(from SCK1↑)
SO0 output delay time
tKSO8
C = 100 pF Note VDD = 2.0 to 5.5 V
from SCK1↓
SCK1 rise, fall time
tR8
When external device
tF8
expansion function is used
When external
When 16-bit timer
300
ns
500
ns
160
ns
700
ns
1000
ns
device expansion output function is
function is not
used
used
When 16-bit timer
output function is
not used
Note C is the load capacitance of SO1 output line.
51
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iii) 3-wire serial I/O mode with automatic transmit/receive function (SCK1... Internal clock output)
Parameter
SCK1 cycle time
Symbol
tKCY9
SCK1 high/low-level
tKH9
width
tKL9
SI1 setup time
tSIK9
(to SCK1↑)
SI1 hold time
Test Conditions
MIN.
TYP.
MAX.
Unit
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.7 V ≤ VDD < 4.5 V
1600
ns
2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
tKCY9/2 – 50
ns
tKCY9/2 – 100
ns
4.5 V ≤ VDD ≤ 5.5 V
100
ns
2.7 V ≤ VDD < 4.5 V
150
ns
2.0 V ≤ VDD < 2.7 V
300
ns
400
ns
400
ns
VDD = 4.5 to 5.5 V
tKSI9
(from SCK1↑)
SO1 output delay time
tKSO9
C = 100 pF Note
300
ns
tKCY9/2 – 100
tKCY9/2 + 100
ns
tKCY9 – 30
tKCY9 + 30
ns
tKCY9 – 60
tKCY9 + 60
ns
tKCY9 – 90
tKCY9 + 90
ns
from SCK1↓
STB↑ from SCK1↑
tSBD
Strobe signal
tSBW
2.0 V ≤ VDD < 2.7 V
high-level width
Busy signal setup time
2.7 V ≤ VDD ≤ 5.5 V
tBYS
100
ns
4.5 V ≤ VDD ≤ 5.5 V
100
ns
(from busy signal
2.7 V ≤ VDD < 4.5 V
150
ns
detection timing)
2.0 V ≤ VDD < 2.7 V
200
ns
300
ns
(to busy signal
detection timing)
Busy signal hold time
SCK1↓ from busy
tBYH
tSPS
inactive
Note C is the load capacitance of SCK1 and SO1 output line.
52
2tKCY9
ns
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
(iv) 3-wire serial I/O mode with automatic transmit/receive function (SCK1... External clock input)
Parameter
SCK1 cycle time
Symbol
tKCY10
Test Conditions
MIN.
TYP.
MAX.
Unit
4.5 V ≤ VDD ≤ 5.5 V
800
ns
2.7 V ≤ VDD < 4.5 V
1600
ns
2.0 V ≤ VDD < 2.7 V
3200
ns
4800
ns
SCK1 high/low-level
tKH10,
4.5 V ≤ VDD ≤ 5.5 V
400
ns
width
tKL10
2.7 V ≤ VDD < 4.5 V
800
ns
2.0 V ≤ VDD < 2.7 V
1600
ns
2400
ns
100
ns
150
ns
400
ns
SI1 setup time
tSIK10
VDD = 2.0 to 5.5 V
(to SCK1↑)
SI1 hold time
tKSI10
(from SCK1↑)
SO1 output delay time
tKSO10
C = 100 pF Note VDD = 2.0 to 5.5 V
tR10, tF10
When external device expansion
from SCK1↓
SCK1 rise, fall time
300
ns
500
ns
160
ns
1000
ns
function is used
When external device expansion
function is not used
Note C is the load capacitance of the SO1 output line.
53
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
AC Timing Test Point (Excluding X1, XT1 Input)
0.8 VDD
0.8 VDD
Test Points
0.2 VDD
0.2 VDD
Clock Timing
1/fX
tXL
tXH
VIH4 (MIN.)
X1 Input
VIL4 (MAX.)
1/fXT
tXTL
tXTH
VIH5 (MIN.)
VIL5 (MAX.)
XT1 Input
TI Timing
tTIH0
tTIL0
TI0
1/fTI1
tTIL1
TI1,TI2
54
tTIH1
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Read/Write Operation
External fetch (No wait):
A8 to A15
Higher 8-Bit Address
tADD1
Hi-Z
Lower 8-Bit
Address
AD0 to AD7
tADS
tADH
Operation Code
tRDD1
tRDADH
tASTH
tRDAST
ASTB
RD
tASTRD
tRDL1
tRDH
External fetch (Wait insertion):
A8 to A15
Higher 8-Bit Address
tADD1
Lower 8-Bit
Address
AD0 to AD7
tADS
tADH
Hi-Z
Operation Code
tRDADH
tRDD1
tASTH
tRDAST
ASTB
RD
tASTRD
tRDL1
tRDH
WAIT
tRDWT1
tWTL
tWTRD
55
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
External data access (No wait):
A8 to A15
Higher 8-Bit Address
tADD2
Lower 8-Bit
Address
AD0 to AD7
tADS
Hi-Z
Read Data
Hi-Z
Hi-Z
Write Data
tRDD2
tADH
tASTH
tRDH
ASTB
RD
tASTRD
tRDWD
tRDL2
tWDS
tWDH
tWRADH
tWRWD
WR
tASTWR
tWRL1
External data access (Wait insertion):
A8 to A15
Higher 8-Bit Address
tADD2
Lower 8-Bit
Address
AD0 to AD7
Hi-Z
Read Data
Hi-Z
Hi-Z
Write Data
tADS
tADH
tASTH
tRDD2
tRDH
ASTB
tASTRD
RD
tRDL2
tRDWD
tWDH
tWDS
tWRWD
WR
tASTWR
tWRL1
tWRADH
WAIT
tRDWT2
tWTL
tWTRD
tWTL
tWRWT
56
tWTWR
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Serial Transfer Timing
3-wire serial I/O mode:
tKCYm
tKLm
tKHm
tFn
tRn
SCK0,SCK1
tSIKm
SI0,SI1
tKSIm
Input Data
tKSOm
Output Data
SO0,SO1
m = 1, 2, 7, 8
n = 2, 8
SBI mode (Bus release signal transfer):
tKCY3, 4
tKL3, 4
tKH3, 4
tR4
tF4
SCK0
tKSB
tSBL
tSBH
tSIK3, 4
tSBK
tKSI3, 4
SB0, SB1
tKSO3, 4
SBI Mode (command signal transfer):
tKCY3, 4
tKL3, 4
tR4
tKH3, 4
tF4
SCK0
tKSB
tSIK3, 4
tSBK
tKSI3, 4
SB0, SB1
tKSO3, 4
57
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
2-wire serial I/O mode:
tKCY5,6
tKL5,6
tR6
tKH5,6
tF6
SCK0
tSIK5,6
tKSO5,6
tKSI5,6
SB0, SB1
3-wire serial I/O mode with automatic transmit/receive function:
SO1
SI1
D2
D1
D2
D7
D0
D1
D7
D0
tSIK9,10
tKSI9,10
tKSO9,10
tKH9,10
tF10
SCK1
tKL9,10
tKCY9,10
tR10
tSBD
tSBW
STB
3-wire serial I/O mode with automatic transmit/receive function (busy processing):
SCK1
7
8
9
Note
10
tBYS
Note
Note
tBYH
BUSY
(Active High)
Note The signal is not actually driven low here; it is shown as such to indicate the timing.
58
1
10 + n
tSPS
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
A/D converter characteristics (TA = –40 to +85 °C, AVDD = VDD = 1.8 to 5.5 V, AVSS = VSS = 0 V)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
8
8
8
bit
2.7 V ≤ AVREF ≤ AVDD
0.6
%
1.8 V ≤ AVREF < 2.7 V
1.4
%
Resolution
Overall error Note
Conversion time
tCONV
2.0 V ≤ AVDD ≤ 5.5 V
19.1
200
µs
1.8 V ≤ AVDD < 2.0 V
38.2
200
µs
µs
Sampling time
tSAMP
24/fX
Analog input voltage
VIAN
AVSS
AVREF
V
Reference voltage
AVREF
1.8
AVDD
V
AVREF resistance
RAIREF
4
14
kΩ
Note Overall error excluding quantization error (±1/2 LSB). It is indicated as a ratio to the full-scale value.
Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85 °C)
Parameter
Symbol
Data retention supply
Test Conditions
VDDDR
MIN.
TYP.
1.8
MAX.
Unit
5.5
V
10
µA
voltage
Data retention supply
IDDDR
current
VDDDR = 1.8 V
0.1
Subsystem clock stop and feedback resister disconnected
Release signal set time
Oscillation stabilization
wait time
tSREL
tWAIT
µs
0
18
Release by RESET
2 /fX
ms
Release by interrupt request
Note
ms
Note In combination with bit 0 to bit 2 (OSTS0 to OSTS2) of oscillation stabilization time select register (OSTS), selection
of 213/fX and 215/fX to 218/fX is possible.
Data Retention Timing (STOP Mode Release by RESET)
Internal Reset Operation
HALT Mode
Operating Mode
STOP Mode
Data Retension Mode
VDD
VDDDR
tSREL
STOP Instruction Execution
RESET
tWAIT
59
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Data Retention Timing (Standby Release Signal : STOP Mode Release by Interrupt Request Signal)
HALT Mode
Operating Mode
STOP Mode
Data Retension Mode
VDD
VDDDR
tSREL
STOP Instruction Execition
Standby Release Signal
(Interrupt Request)
tWAIT
Interrupt Request Input Timing
tINTL
INTP0 to INTP2
tINTL
INTP3
RESET Input Timing
tRSL
RESET
60
tINTH
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
12. CHARACTERISTIC CURVE (REFERENCE VALUES)
IDD vs VDD (Main System Clock: 10.0 MHz)
(TA = 25 °C)
10.0
PCC = 00H
PCC = 01H
5.0
PCC = 02H
PCC = 03H
PCC = 04H
PCC = 30H
HALT (X1 Oscillation,
XT1 Stop)
1.0
Supply Current IDD [mA]
0.5
0.1
0.05
PCC = B0H
HALT (X1 Stop,
XT1 Oscillation)
0.01
0.005
fX = 10.0 MHz
fXT = 32.768 kHz
0.001
0
1
2
3
4
5
6
7
8
Supply Voltage VDD [V]
61
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
13. PACKAGE DRAWINGS
64 PIN PLASTIC SHRINK DIP (750 mil)
64
33
1
32
A
K
H
G
J
I
L
F
D
N
M
NOTE
B
C
M
R
ITEM
MILLIMETERS
INCHES
1) Each lead centerline is located within 0.17 mm (0.007 inch) of
its true position (T.P.) at maximum material condition.
A
58.68 MAX.
2.311 MAX.
B
1.78 MAX.
0.070 MAX.
2) Item "K" to center of leads when formed parallel.
C
1.778 (T.P.)
0.070 (T.P.)
D
0.50±0.10
0.020 +0.004
–0.005
F
0.9 MIN.
0.035 MIN.
G
3.2±0.3
0.126±0.012
H
0.51 MIN.
0.020 MIN.
I
4.31 MAX.
0.170 MAX.
J
5.08 MAX.
0.200 MAX.
K
19.05 (T.P.)
0.750 (T.P.)
L
17.0
0.669
M
0.25 +0.10
–0.05
0.010 +0.004
–0.003
N
0.17
0.007
R
0~15°
0~15°
P64C-70-750A,C-1
Remark
62
Dimensions and materials of ES products are the same as those of mass-production products.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
64 PIN PLASTIC QFP (
14)
A
B
48
49
33
32
F
Q
5°±5°
S
D
C
detail of lead end
64
1
G
17
16
H
I M
J
M
P
K
N
L
P64GC-80-AB8-2
NOTE
Each lead centerline is located within 0.15
mm (0.006 inch) of its true position (T.P.) at
maximum material condition.
Remark
ITEM
MILLIMETERS
INCHES
A
17.6 ± 0.4
0.693 ± 0.016
B
14.0 ± 0.2
0.551 +0.009
–0.008
C
14.0 ± 0.2
0.551+0.009
–0.008
D
17.6 ± 0.4
0.693 ± 0.016
F
1.0
0.039
G
1.0
0.039
H
0.35 ± 0.10
0.014 +0.004
–0.005
I
0.15
0.006
J
0.8 (T.P.)
0.031 (T.P.)
K
1.8 ± 0.2
0.071 ± 0.008
L
0.8 ± 0.2
0.031+0.009
–0.008
M
0.15+0.10
–0.05
0.006 +0.004
–0.003
N
0.10
0.004
P
2.55
0.100
Q
0.1 ± 0.1
0.004 ± 0.004
S
2.85 MAX.
0.112 MAX.
Dimensions and materials of ES products are the same as those of mass-production products.
63
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
64 PIN PLASTIC LQFP (
12)
A
B
33
32
detail of lead end
Q
R
D
C
S
48
49
F
64
17
16
1
H
I
M
J
K
M
P
G
N
L
NOTE
Each lead centerline is located within 0.13 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
INCHES
A
14.8±0.4
0.583±0.016
B
12.0±0.2
0.472 +0.009
–0.008
C
12.0±0.2
0.472 +0.009
–0.008
D
14.8±0.4
0.583±0.016
F
1.125
0.044
G
1.125
0.044
H
0.30±0.10
0.012 +0.004
–0.005
I
0.13
0.005
J
0.65 (T.P.)
0.026 (T.P.)
K
1.4±0.2
0.055±0.008
L
0.6±0.2
0.024 +0.008
–0.009
M
0.15 +0.10
–0.05
0.006 +0.004
–0.003
N
0.10
0.004
P
1.4
0.055
Q
R
0.125±0.075
5°±5°
0.005±0.003
5°±5°
S
1.7 MAX.
0.067 MAX.
P64GK-65-8A8-1
Remark
64
Dimensions and materials of ES products are the same as those of mass-production products.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
14. RECOMMENDED SOLDERING CONDITIONS
The µPD78011F/78012F/78013F/78014F/78015F/78016F/78018F should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact our salespersonnel.
Table 14-1. Surface Mounting Type Soldering Conditions (1/2)
(1) µPD78011FGC-×××-AB8: 64-Pin Plastic QFP (14 × 14 mm)
µPD78012FGC-×××-AB8: 64-Pin Plastic QFP (14 × 14 mm)
µPD78013FGC-×××-AB8:
µPD78014FGC-×××-AB8:
µPD78015FGC-×××-AB8:
µPD78016FGC-×××-AB8:
µPD78018FGC-×××-AB8:
Soldering Method
64-Pin Plastic QFP (14 × 14 mm)
64-Pin Plastic QFP (14 × 14 mm)
64-Pin Plastic QFP (14 × 14 mm)
64-Pin Plastic QFP (14 × 14 mm)
64-Pin Plastic QFP (14 × 14 mm)
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Three times max.
IR35-00-3
VPS
Package peak temperature: 215 °C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Three times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260 °C max. Duration: 10 sec. max.
Number of times: Once
Preheating temperature: 120 °C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 °C max., Duration: 3 sec. max. (per device side)
—
Caution Use more than one soldering method should be avoided (except in the case of partial heating).
65
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Table 14-1. Surface Mounting Type Soldering Conditions (2/2)
(2) µPD78011FGK-×××-8A8 : 64-Pin Plastic LQFP (12 × 12 mm)
µPD78012FGK-×××-8A8 : 64-Pin Plastic LQFP (12 × 12 mm)
µPD78013FGK-×××-8A8 :
µPD78014FGK-×××-8A8 :
µPD78015FGK-×××-8A8 :
µPD78016FGK-×××-8A8 :
µPD78018FGK-×××-8A8 :
64-Pin Plastic LQFP (12 × 12 mm)
64-Pin Plastic LQFP (12 × 12 mm)
64-Pin Plastic LQFP (12 × 12 mm)
64-Pin Plastic LQFP (12 × 12 mm)
64-Pin Plastic LQFP (12 × 12 mm)
Soldering Conditions
Soldering Method
Infrared reflow
Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Twice max., Number of days: 7 days Note (after that, 125 °C prebaking
Recommended
Condition Symbol
IR35-107-2
for 10 hours is necessary.)
< Precautions >
(1) Start the second reflow after the device temprature by the first reflow returns to
normal.
(2) Flux washing by the water after the first reflow should be avoided.
VPS
Package peak temperature: 215 °C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Twice max., Number of days: 7 days Note (after that, 125 °C prebaking
for 10 hours is necessary.)
< Precautions >
(1) Start the second reflow after the device temprature by the first reflow returns to
normal.
(2) Flux washing by the water after the first reflow should be avoided.
VP15-107-2
Wave soldering
Solder bath temperature: 260 °C max. Duration: 10 sec. max.
Number of times: Once, Preheating temperature: 120 °C max. (Package surface
temperature), Number of days: 7 days Note (after that, 125 °C prebaking for 10 hours is
WS60-107-1
necessary.)
Partial heating
Pin temperature: 300 °C max., Duration: 3 sec. max. (per device side)
—
Note The number of days the device can be stored at 25 °C, 65% RH MAX. after the dry pack has been opend.
Caution Use more than one soldering method should be avoided (except in the case of partial heating).
66
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Table 14-2. Insertion Type Soldering Conditions
µPD78011FCW-×××
µPD78012FCW-×××
µPD78013FCW-×××
µPD78014FCW-×××
µPD78015FCW-×××
µPD78016FCW-×××
µPD78018FCW-×××
Soldering Method
Caution
: 64-Pin Plastic Shrink DIP (750 mil)
: 64-Pin Plastic Shrink DIP (750 mil)
: 64-Pin Plastic Shrink DIP (750 mil)
: 64-Pin Plastic Shrink DIP (750 mil)
: 64-Pin Plastic Shrink DIP (750 mil)
: 64-Pin Plastic Shrink DIP (750 mil)
: 64-Pin Plastic Shrink DIP (750 mil)
Soldering Conditions
Wave soldering
(pin only)
Solder bath temperature: 260°C max., Duration: 10 sec. max.
Partial heating
Pin temperature: 300°C max., Duration: 3 sec. max. (per pin)
Wave soldering is only for the lead part in order that jet solder can not contact with the chip directly.
67
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
APPENDIX A. DEVELOPMENT TOOLS
The following development tools are available for system development using the µPD78018F subseries.
Language Processing Software
RA78K/0 Notes 1, 2, 3, 4
78K/0 series common assembler package
CC78K/0 Notes 1, 2, 3, 4
78K/0 series common C compiler package
DF78014 Notes 1, 2, 3, 4
Device file common to µPD78014 subseries
CC78K/0-L Notes 1, 2, 3, 4
78K/0 series common C compiler library source file
PROM Writting Tools
PG-1500
PROM programmer
PA-78P014CW
PA-78P018GC
PA-78P018GK
Programmer adapter connected to PG-1500
PA-78P018KK-S
PG-1500 controller Notes 1, 2
PG-1500 control program
Debugging Tool
IE-78000-R
78K/0 series common in-circuit emulator
IE-78000-R-A
78K/0 series common in-circuit emulator (for integrated debugger)
IE-78000-R-BK
78K/0 series common break board
IE-78014-R-EM-A
µPD78018F and 78018FY subseries evaluation emulation board (VDD = 3.0 to 6.0 V)
IE-78000-R-SV3
Interface adapter and cable when an EWS is used as the host machine (for IE-78000R-A)
IE-70000-98-IF-B
Interface adapter when PC-9800 series (except notebook PC) is used as the host machine (for IE-78000-R-A)
IE-70000-98N-IF
Interface adapter and cable when PC-9800 series notebook PC is used as the host machine (for IE-78000-R-A)
IE-70000-PC-IF-B
Interface adapter when IBM PC/ATTM is used as the host machine (for IE-78000-R-A)
EP-78240CW-R
EP-78240GC-R
Emulation probe common to µPD78244 subseries
EV-78012GK-R
µPD78018F subseries emulation probe
EV-9200GC-64
Socket to be mounted on target system board created for the 64-pin plastic QFP (GC-AB8 type)
TGC-064SBW
Conversion adapter to be mounted on a target system board made for 64-pin plastic QFP (GK-8A8 type)
TGC-100SDW is a product from Tokyo Eletech Corp. (TEL (03) 5295-1661)
When purchasing this product, please consult with our sales offices.
EV-9900
Tools for removing µPD78P018FKK-S from EV-9200GC-64
SM78K0 Notes 5, 6, 7
78K/0 series common system simulator
ID78K0
Notes 4, 5, 6, 7
SD78K/0 Notes 1, 2
DF78014
Notes 1, 2, 4, 5, 6, 7
IE-78000-R-A integrated dubugger
IE-78000-R screen debugger
Device file common to µPD78014 subseries
Real-Time OS
RX78K/0 Notes 1, 2, 3, 4
78K/0 series real-time OS
MX78K0 Notes 1, 2, 3, 4
78K/0 series OS
68
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Fuzzy Inference Devleopment Support System
FE9000 Note 1/FE9200 Note 6
Fuzzy knowledge data creation tool
FT9080 Note 1/FT9085 Note 2
Translator
FI78K0 Notes 1, 2
Fuzzy inference module
FD78K0 Notes 1, 2
Fuzzy inference debugger
Notes 1. PC-9800 series (MS-DOSTM) based
2. IBM PC/AT and compatible (PC DOSTM/IBM DOSTM/MS-DOS) based
3. HP9000 series 300TM (HP-UXTM) based
4. HP9000 series 700TM (HP-UX) based, SPARCstationTM (SunOSTM) based, EWS4800 series (EWS-UX/V) based
5. PC-9800 series (MS-DOS + WindowsTM) based
6. IBM PC/AT and compatible (PC DOS/IBM DOS/MS-DOS + Windows) based
7. NEWSTM (NEWS-OSTM) based
Remarks 1. For development tools manufactured by a third party, refer to the 78K/0 Series Selection Guide (U11126E).
2. RA78K/0, CC78K/0, SM78K0, ID78K0, SD78K/0, and RX78K/0 are used in combination with DF78014.
69
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
APPENDIX B. RELATED DOCUMENTS
Device Related Documents
Document No.
Document Name
Japanese
English
µPD78018F, 78018FY Subseries User’s Manual
U10659J
U10659E
78K/0 Series User’s Manual - Instruction
U12326J
IEU-1372
78K/0 Series Instruction Table
U10903J
—
78K/0 Series Instruction Set
U10904J
—
µPD78018F Subseries Special Function Register Table
IEM-5594
—
Fundamental (I)
IEA-715
IEA-1288
Floating-Point Arithmetic Program
IEA-718
IEA-1289
78K/0 Series Application Note
Development Tools Documents (User’s Manual) (1/2)
Document No.
Document Name
Japanese
English
Operation
EEU-809
EEU-1399
Language
EEU-815
EEU-1404
EEU-817
EEU-1402
Operation
U11802J
U11802E
Assembly Language
U11801J
U11801E
Structured Assembly Language
U11789J
U11789E
Operation
EEU-656
EEU-1280
Language
EEU-655
EEU-1284
Operation
U11517J
U11517E
Language
U11518J
U11518E
Programming Know-how
EEA-618
EEA-1208
CC78K Series Library Source File
U12322J
—
PG-1500 PROM Programmer
U11940J
EEU-1335
PG-1500 Controller PC-9800 Series (MS-DOS) Based
EEU-704
EEU-1291
PG-1500 Controller IBM PC Series (PC DOS) Based
EEU-5008
U10540E
IE-78000-R
U11376J
U11376E
E-78000-R-A
U10057J
U10057E
IE-78000-R-BK
EEU-867
EEU-1427
IE-78014-R-EM-A
EEU-962
U10418E
EP-78240
EEU-986
EEU-1513
EEU-5012
EEU-1538
U10181J
U10181E
RA78K Series Assembler Package
RA78K Series Structured Assembler Preprocessor
RA78K0 Assembler Package
CC78K Series C Compiler
CC78K0 C Compiler
CC78K/0 C Compiler Application Note
EP-78012GK-R
SM78K0 System Simulator
Caution
70
Reference
The contents of the above related documents are subject to change without notice. The latest documents
should be used for designing, etc.
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Development Tools Documents (User’s Manual) (2/2)
Document No.
Document Name
Japanese
English
SM78K Series System Simulator
External Part User Open
Interface Specifications
U10092J
U10092E
ID78K0 Integrated Debugger EWS Based
Reference
U11151J
—
ID78K0 Integrated Debugger PC Based
Reference
U11539J
U11539E
ID78K0 Integrated Debugger Windows Based
Guide
U11649J
U11649E
SD78K/0 Screen Debugger
Introduction
EEU-852
U10539E
PC-9800 Series (MS-DOS) Based
Reference
U10952J
—
SD78K/0 Screen Debugger
Introduction
EEU-5024
EEU-1414
IBM PC/AT (PC DOS) Based
Reference
U11279J
U11279E
Embedded Software Documents (User’s Manual)
Document No.
Document Name
Japanese
English
Fundamental
U11537J
U11537E
Installation
U11536J
U11536E
Fundamental
U12257J
—
Fuzzy Knowledge Data Creation Tool
EEU-829
EEU-1438
78K/0, 78K/II, 87AD Series
EEU-862
EEU-1444
EEU-858
EEU-1441
EEU-921
EEU-1458
78K/0 Series Real-Time OS
78K/0 Series OS MX78K0
Fuzzy Inference Development Support System - Translator
78K/0 Series Fuzzy Inference Development Suport System Fuzzy Inference Module
78K/0 Series Fuzzy Inference Development Support System Fuzzy Inference Debugger
Other Documents
Document Name
Document No.
Japanese
IC Package Manual
English
C10943X
Semiconductor Device Mounting Technology Manual
C11535J
C10535E
Quality Grades on NEC Semiconductor Device
C11531J
C11531E
NEC Semiconductor Device Reliability/Quality Control System
C10983J
C10983E
Electrostatic Discharge (ESD) Test
MEM-539
—
Guide to Quality Assurance for Semiconductor Device
C11893J
MEI-1202
Guide for Products Related to Microcomputer: Other Companies
U11416J
—
Caution
The contents of the above related documents are subject to change without notice.
The latest
documents should be used for designing, etc.
71
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must
be taken to stop generation of static electricity as much as possible, and
quickly dissipate it once, when it has occurred. Environmental control must
be adequate. When it is dry, humidifier should be used. It is recommended
to avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material.
All test and measurement tools
including work bench and floor should be grounded. The operator should
be grounded using wrist strap. Semiconductor devices must not be touched
with bare hands. Similar precautions need to be taken for PW boards with
semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using a pull-up or pull-down
circuitry.
Each unused pin should be connected to VDD or GND with a
resistor, if it is considered to have a possibility of being an output pin. All
handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized
until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
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µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
NEC Electronics (Germany) GmbH
NEC Electronics Hong Kong Ltd.
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
NEC Electronics Singapore Pte. Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
Spain Office
Madrid, Spain
Tel: 01-504-2787
Fax: 01-504-2860
United Square, Singapore 1130
Tel: 65-253-8311
Fax: 65-250-3583
NEC Electronics Italiana s.r.1.
NEC Electronics (Germany) GmbH
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
NEC Electronics (France) S.A.
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-719-2377
Fax: 02-719-5951
NEC do Brasil S.A.
Cumbica-Guarulhos-SP, Brasil
Tel: 011-6465-6810
Fax: 011-6465-6829
J98. 2
73
µPD78011F, 78012F, 78013F, 78014F, 78015F, 78016F, 78018F
FIP and IEBus are trademarks of NEC Corporation.
MS-DOS and Windows are either registered trademarks or trademarks of Microsoft Corporation
in the United States and/or other countries.
IBM DOS, PC/AT, and PC DOS are trademarks of IBM Corporation.
HP9000 series 300, HP9000 series 700, and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
NEWS and NEWS-OS are trademarks of Sony Corporation.
The related documents referred to in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
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