RB521S-30C2

CYStech Electronics Corp.
Spec. No. : C302C2
Issued Date : 2003.12.05
Revised Date : 2010.08.12
Page No. : 1/5
Small Signal Schottky diode
RB521S-30C2
Description
Planar silicon Schottky barrier diode encapsulated in a SOD-523 plastic SMD package.
Features
•Extremely small surface mounting type.(SC-79/SOD523)
•IO=200mA guaranteed despite the size.
•Low VF.(VF=0.4V typ. at 200mA)
Applications
Low current rectification and high speed switching
Symbol
Outline
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature Tstg..................................................................................................... -45~+125°C
Junction Temperature Tj .............................................................................................................. +125°C
• Maximum Voltages and Currents (Ta=25°C)
DC Reverse Voltage VR ...................................................................................................................... 30 V
Mean Rectifying Current IF ......................................................................................................... 200 mA
Peak Forward Surge Current IFSM………………………………….. ……………………………………………1 A
RB521S-30C2
CYStek Product Specification
Spec. No. : C302C2
Issued Date : 2003.12.05
Revised Date : 2010.08.12
Page No. : 2/5
CYStech Electronics Corp.
Characteristics (Ta=25°C)
Characteristic
Symbol
Condition
Min.
Max.
Unit
Forward Voltage
VF
IF=200mA
-
500
mV
Reverse Leakage Current
IR
VR=10V
-
30
μA
Characteristic Curves
Forward Current vs Forward Voltage
Forward Current Derating Curve
1000
M ounting on glass
epoxy PCBs
100
125℃
100
Forward Current---I F(mA)
Percentage of Rated Forward Current---(%)
120
80
60
40
20
75℃
10
25℃
1
0.1
- 25℃
0.01
0
0.001
0
25
50
75
100
125
150
0
0.1
Ambient Temperature---TA(℃)
Reverse Leakage Current vs Reverse Voltage
0.3
0.4
0.5
0.6
Capacitance vs Reverse Voltage
10
1
Capacitance between terminals---C T(pF)
10
Reverse Leakage Current---I R(mA)
0.2
Forward Voltage---VF(V)
T a= 125℃
0.1
T a= 75℃
0.01
T a= 25℃
0.001
f=1MHz
Ta=25℃
1
0.0001
0
10
20
Reverse Voltage---VR(V)
RB521S-30C2
30
0
2
4
6
8
10
12
14
Reverse Voltage---VR(V)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302C2
Issued Date : 2003.12.05
Revised Date : 2010.08.12
Page No. : 3/5
Reel Dimension
Carrier Tape Dimension
RB521S-30C2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302C2
Issued Date : 2003.12.05
Revised Date : 2010.08.12
Page No. : 4/5
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
RB521S-30C2
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C302C2
Issued Date : 2003.12.05
Revised Date : 2010.08.12
Page No. : 5/5
SOD-523 Dimension
Marking Code :
1
1
2
C
2
Style : Pin 1. Cathode 2. Anode
2-lead SOD-523 Plastic Package
CYStek Package Code : C2
*: Typical
Millimeters
Min.
Max.
0.510
0.770
0.500
0.700
0.250
0.350
0.080
0.150
0.750
0.850
DIM
A
A1
b
c
D
Inches
Min.
Max.
0.020
0.031
0.020
0.028
0.010
0.014
0.003
0.006
0.030
0.033
DIM
Min.
E
E1
E2
L
θ
Millimeters
Min.
Max.
1.100
1.300
1.500
1.700
0.200 REF
0.010
0.070
7° REF
Inches
Min.
Max.
0.043
0.051
0.059
0.067
0.008 REF
0.001
0.003
7° REF
Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
2.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
RB521S-30C2
CYStek Product Specification