CYStech Electronics Corp. Spec. No. : C302S Issued Date : 2004.11.26 Revised Date : 2015.01.07 Page No. : 1/6 Small Signal Schottky diode BAT54S2 Features •Guard ring protected •Low forward voltage drop •Very small plastic SMD package •Pb-free lead plating and halogen-free package Applications •Ultra high-speed switching •Voltage clamping •Protection circuits •Blocking diodes Symbol Outline BAT54S2 SOD-323 Ordering Information Device BAT54S2-0-T1-G Package SOD-323 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name BAT54S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S Issued Date : 2004.11.26 Revised Date : 2015.01.07 Page No. : 2/6 Absolute Maximum Ratings Symbol VR IF IFRM IFSM Ptot Tstg Tj Tamb Parameter continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current total power dissipation storage temperature operating junction temperature operating ambient temperature Conditions tp≤1s, δ≤0.5 tp<10ms Tamb≤25℃ Min -65 -65 -65 Max 30 200 300 600 200 +150 +150 +125 Unit V mA mA mA mW ℃ ℃ ℃ Characteristics (Ta=25°C, unless otherwise specified) Parameter Reverse Breakdown Voltage Forward Voltage (Note 1) Symbol Condition Min. Max. Unit VBR IR=100μA 30 - V VF(1) IF=0.1mA - 240 mV VF(2) IF=1mA - 320 mV VF(3) IF=10mA - 400 mV VF(4) IF=30mA - 500 mV VF(5) IF=100mA - 800 mV Reverse Leakage Current (Note 2) IR VR=25V - 2 μA Diode Capacitance CD - 10 pF Reverse Recovery Time trr VR=1V, f=1MHz when switched from IF= 10mA to IR=10mA; RL=100Ω; measured at IR=1mA - 5 ns Notes: 1.pulse test, tp=380μs, duty cycle<2%. 2.pulse test, tp=300μs, duty cycle<2%. Thermal Characteristics Symbol Parameter Rth j-a thermal resistance from junction to ambient Conditions Value Unit note 1 635 K/W Note 1 : Device mounted on a FR-4 PCB BAT54S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S Issued Date : 2004.11.26 Revised Date : 2015.01.07 Page No. : 3/6 Typical Characteristics Forward Current & Forward Voltage Diode Capacitance & Reverse-Biased Voltage 100 250 Diode Capacitance-Cd (pF) Forward Current-IF (mA) 200 150 100 10 50 0 1 0 200 400 600 800 1000 0.1 Forward Voltage-VF (mV) 1 10 100 Reverse Biased Voltage-VR (V) Recommended Footprint mm inch BAT54S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S Issued Date : 2004.11.26 Revised Date : 2015.01.07 Page No. : 4/6 Reel Dimension Carrier Tape Dimension BAT54S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S Issued Date : 2004.11.26 Revised Date : 2015.01.07 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BAT54S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S Issued Date : 2004.11.26 Revised Date : 2015.01.07 Page No. : 6/6 SOD-323 Dimension Marking: K A 5JVH 2 1 Style: Pin 1.Cathode 2.Anode B D 2-Lead SOD-323 Plastic Surface Mounted Package, CYStek Package Code: S2 J H E C *: Typical Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Inches Min. Max. 0.0060 REF 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAT54S2 CYStek Product Specification