CYStech Electronics Corp. Spec. No. : C335C2 Issued Date : 2013.02.05 Revised Date : Page No. : 1/6 High voltage switching diode BAS21C2 Description High voltage switching diode encapsulated in a SOD-523 small plastic SMD package. Features •Fast switching speed •Low forward voltage drop •Small plastic SMD package •Pb-free lead plating package Mechanical Data • Case: Molded Plastic, JEDEC SOD-523. • Terminals: Solder plated, solderable per MIL-STD-750 Method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. Symbol BAS21C2 Outline CYStek Product Specification Spec. No. : C335C2 Issued Date : 2013.02.05 Revised Date : Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Repetitive peak reverse voltage RMS voltage Continuous reverse voltage Continuous forward current Conditions Repetitive peak forward current tp=1ms, duty≤0.25 t=1μs Non-repetitive peak forward current Total Device Dissipation Thermal resistance Symbol Min TA=25°C (Note 1) TSP≤90°C (Note 2) Junction to ambient (Note 1) Junction to soldering point (Note3) Storage temperature range Typ Max Units VRRM 300 V VRMS 210 V VR 300 V IF 250 mA IFRM IFSM 1 A 4.5 A 250 PD 500 RθJA 500 RθJSP 120 mW °C/W Tstg -65 150 °C Tj -55 150 °C Operating junction temperature range Note :1.Parts mounted on FR-5 board with minimum pad, in free air. 2.Tsp is the solder point temperature at the soldering point of the cathode tab. 3.Soldering point of cathode tab. Characteristics (Ta=25°C) Characteristic Symbol Reverse Breakdown Voltage Forward Voltage (Note) Reverse Leakage Current (Note) Diode Capacitance Reverse Recovery Time VBR VF(1) VF(2) IR(1) IR(2) CD trr Condition IR=100μA IF=100mA IF=200mA VR=250V,Tj=25℃ VR=250V,Tj=150℃ VR=0V, f=1MHz IF=IR=30mA RL=100Ω measured at IR=3mA Min. Max. Unit 300 - 1 1.25 150 100 5 V V V nA μA pF - 50 ns Notes: Pulse test, tp=300μs, duty cycle<2%. Ordering Information Device BAS21C2-0-T5-G BAS21C2 Package SOD-523 (Pb-free lead plating and halogen-free package) Shipping 8000 pcs / Tape & Reel CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335C2 Issued Date : 2013.02.05 Revised Date : Page No. : 3/6 Typical Characteristics Reverse Leakage Current vs Reverse Voltage Forward Current vs Forward Voltage 100 150°C Pulse width=300μs Reverse Leakage Current---IR(μA) Instantaneous Forward Current---IF(mA) 1000 100 150°C 125°C 10 100°C 1 75°C 25°C 0.1 10 125℃ 100℃ 1 75℃ 0.1 25℃ 0.01 0.001 0 0.3 0.6 0.9 Forward Voltage---VF(V) 1.2 1.5 0 50 150 200 250 Reverse Voltage---VR(V) Power Derating Curve Junction Capacitance vs Reverse Voltage 300 10 Tj=25℃, f=1.0MHz PD, Power Dissipation(mW) Junction Capacitance---C J(pF) 100 1 250 200 150 100 50 0 0.1 0.1 1 10 Reverse Voltage---VR (V) 100 0 25 50 75 100 125 150 175 TA, Ambient Temperature(℃) Recommended Footprint BAS21C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335C2 Issued Date : 2013.02.05 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension BAS21C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335C2 Issued Date : 2013.02.05 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BAS21C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C335C2 Issued Date : 2013.02.05 Revised Date : Page No. : 6/6 SOD-523 Dimension Marking Code : 1 1 2 JS 2 Style : Pin 1. Cathode 2. Anode 2-lead SOD-523 Plastic Package CYStek Package Code : C2 *: Typical Millimeters Min. Max. 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 DIM A A1 b c D Inches Min. Max. 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 DIM Min. E E1 E2 L θ Millimeters Min. Max. 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF Inches Min. Max. 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAS21C2 CYStek Product Specification