Spec. No. : C328C3 Issued Date : 2009.12.14 Revised Date : 2010.10.21 Page No. : 1/6 CYStech Electronics Corp. High –speed double diode BAV99C3 Description The BAV99C3 consists of two high-speed switching diodes connected in series, fabricated in planar technology, and encapsulated in the small SOT-523 plastic SMD package. Equivalent Circuit Outline BAV99C3 2 SOT-523 1 Common connection 3 1：Anode 2：Cathode 3：Common connection Anode Cathode Features • Small plastic SMD package • Reverse voltage: max. 100V • Forward current: max. 75mA. • Pb-free lead plating package Applications • High-speed switching in thick and thin-film circuits. BAV99C3 CYStek Product Specification Spec. No. : C328C3 Issued Date : 2009.12.14 Revised Date : 2010.10.21 Page No. : 2/6 CYStech Electronics Corp. Absolute Maximum Ratings @TA=25℃ Parameters Reverse voltage Forward current Total power dissipation Junction Temperature Storage Temperature Symbol Min Max Unit VR IO Ptot Tj Tstg - 100 75 150 150 +150 V mA mW °C °C -65 Electrical Characteristics @ Tj=25℃ unless otherwise specified Parameters Symbol Reverse breakdown voltage VR Forward voltage VF Reverse current IR Diode capacitance CD Reverse recovery time trr Conditions Min IR=1μA 100 IF=1mA IF=10mA IF=50mA IF=150mA VR=25V VR=100V VR=0V, f=1MHz when switched from IF=10mA to IR=10mA,RL=100Ω, measured at IR=1mA Typ. Max Unit - - 715 855 1 1.25 30 2 1.5 V mV mV V V nA μA pF - 4 ns - Thermal Characteristics Symbol Parameter Conditions Value Rth, j-a thermal resistance from junction to ambient Note 1 833 Unit ℃/W Note 1: Device mounted on an FR-4 PCB. Ordering Information Device BAV99C3 BAV99C3 Package SOT-523 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel JE CYStek Product Specification Spec. No. : C328C3 Issued Date : 2009.12.14 Revised Date : 2010.10.21 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Diode Capacitance vs Reverse Voltage 275 250 225 200 175 150 125 100 75 50 25 0 0.7 Diode Capacitance---CD(pF) Forward Current---IF(mA) Forward Current vs Forward Voltage 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1 Forward Voltage---VF(V) BAV99C3 1.2 1.4 0 2 4 6 8 10 12 14 16 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C328C3 Issued Date : 2009.12.14 Revised Date : 2010.10.21 Page No. : 4/6 Reel Dimension Carrier Tape Dimension BAV99C3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C328C3 Issued Date : 2009.12.14 Revised Date : 2010.10.21 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BAV99C3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C328C3 Issued Date : 2009.12.14 Revised Date : 2010.10.21 Page No. : 6/6 SOT-523 Dimension Marking: C A 3 JE D 1 B 2 G F H I E 3-Lead SOT-523 Plastic Surface Mounted Package CYStek Package Code: C3 J K Style: Pin 1.Anode 2.Anode/Cathode 3.Cathode L N M O *: Typical Inches Min. Max. 0.0079 0.0157 0.0591 0.0669 0.0118 0.0197 0.0295 0.0335 0.0118 0.0197 0.0039 0.0118 0.0039 0.0118 *0.0197 - DIM A B C D E F G H Millimeters Min. Max. 0.20 0.40 1.50 1.70 0.30 0.50 0.75 0.85 0.30 0.50 0.10 0.30 0.10 0.30 *0.50 - DIM I J K L M N O Inches Min. Max. *0.0197 0.0610 0.0650 0.0276 0.0315 0.0224 0.0248 0.0020 0.0059 0.0039 0.0118 0 0.0031 Millimeters Min. Max. *0.50 1.55 1.65 0.70 0.80 0.57 0.63 0.05 0.15 0.10 0.30 0 0.08 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAV99C3 CYStek Product Specification