Spec. No. : C302S3-H Issued Date : 2004.04.13 Revised Date : 2015.01.07 Page No. : 1/6 CYStech Electronics Corp. Small Signal Schottky (double) diodes BAT54S3/BAT54AS3 BAT54CS3/BAT54SS3 Description Planar silicon Schottky barrier diodes encapsulated in a SOT-323 very small plastic SMD package. Single diodes and double diodes with different pinning are available. Features •Guard ring protected •Low forward voltage drop •Very small plastic SMD package •Pb-free lead plating and halogen-free package Applications •Ultra high-speed switching •Voltage clamping •Protection circuits •Blocking diodes Pinning Outline Pin 1 2 3 BAT54 A NC K Description BAT54A BAT54C K1 A1 K2 A2 A1,A2 K1,K2 3 3 3 1 SOT-323 BAT54S A1 K2 K1,A1 1 2 1 2 2 N.C. (1) BAT54 (2)BAT54A 3 2 1 Marking: 3 (3)BAT54C 1 2 (4)BAT54S Type BAT54 S3 BAT54AS3 BAT54CS3 BAT54SS3 Marking Code B4 B7 5C B8 Diode configuration and symbol BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S3-H Issued Date : 2004.04.13 Revised Date : 2015.01.07 Page No. : 2/6 Absolute Maximum Ratings Symbol Per diode VR IF IFRM IFSM Ptot Tstg Tj Tamb Parameter Conditions continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current total power dissipation (per package) storage temperature operating junction temperature operating ambient temperature tp≤1s, δ≤0.5 tp<10ms Tamb≤25℃ Min Max Unit -65 -65 -65 30 200 300 600 200 +150 +150 +125 V mA mA mA mW ℃ ℃ ℃ Characteristics (Ta=25°C, unless otherwise specified) Parameter Reverse Breakdown Voltage Forward Voltage (Note 1) Symbol Condition Min. Max. Unit VBR IR=100μA 30 - V VF(1) IF=0.1mA - 240 mV VF(2) IF=1mA - 320 mV VF(3) IF=10mA - 400 mV VF(4) IF=30mA - 500 mV VF(5) IF=100mA - 800 mV Reverse Leakage Current (Note 2) IR VR=25V - 2 μA Diode Capacitance CD - 10 pF Reverse Recovery Time trr VR=1V, f=1MHz when switched from IF= 10mA to IR=10mA; RL=100Ω; measured at IR=1mA - 5 ns Notes: 1.pulse test, tp=380μs, duty cycle<2%. 2.pulse test, tp=300μs, duty cycle<2%. Thermal Characteristics Symbol Parameter Rth j-a thermal resistance from junction to ambient Conditions Value Unit note 1 625 K/W Note 1 : Refer to SOT-323 standard mounting conditions. BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification Spec. No. : C302S3-H Issued Date : 2004.04.13 Revised Date : 2015.01.07 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Forward Current & Forward Voltage Diode Capacitance & Reverse-Biased Voltage 100 250 Diode Capacitance-Cd (pF) Forward Current-IF (mA) 200 150 100 10 50 0 1 0 200 400 600 800 1000 Forward Voltage-VF (mV) 0.1 1 10 100 Reverse Biased Voltage-VR (V) Ordering Information Device BAT54S3-0-T1-G BAT54AS3-0-T1-G BAT54CS3-0-T1-G BAT540SS3-0-T1-G Package Shipping SOT-323 (Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel Marking B4 B7 5C B8 Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product name Recommended Footprint BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S3-H Issued Date : 2004.04.13 Revised Date : 2015.01.07 Page No. : 4/6 Reel Dimension Carrier Tape Dimension BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302S3-H Issued Date : 2004.04.13 Revised Date : 2015.01.07 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification Spec. No. : C302S3-H Issued Date : 2004.04.13 Revised Date : 2015.01.07 Page No. : 6/6 CYStech Electronics Corp. SOT-323 Dimension Marking: L4_ XX Diagram: 3-Lead SOT-323 Plastic Surface Mounted Package. CYStek Package Code: S3 • BAT54 S3 : Single Diode (Marking Code B4) • BAT54AS3 : Common Anode. (Marking Code B7) • BAT54CS3 : Common Cathode. (Marking Code 5C) • BAT54SS3 : Series Connected. (Marking Code B8) Millimeters Min. Max. 0.900 1.100 0.000 0.100 0.900 1.000 0.200 0.400 0.080 0.150 2.000 2.200 1.150 1.350 DIM A A1 A2 b c D E Inches Min. Max. 0.035 0.043 0.000 0.004 0.035 0.039 0.008 0.016 0.003 0.006 0.079 0.087 0.045 0.053 DIM E1 e e1 L L1 θ Millimeters Min. Max. 2.150 2.450 0.650 TYP 1.200 1.400 0.525 REF 0.260 0.460 0° 8° Inches Min. Max. 0.085 0.096 0.026 TYP 0.047 0.055 0.021 REF 0.010 0.018 0° 8° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification