64- BGA (13 x 11 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LAA B1: 268.6013 mg Package Weight – Site 3 Body Size (mil/mm) Package Weight – Site 2 13 X 11 mm B1: 271.4910 mg Package Weight – Site 4 SUMMARY The 64-BGA package is compliant to RoHS. Cypress (Legacy Spansion Part) ordering part numbers containing an “F” or “H” (e.g. S29GL064A90FFIR30, SS29GL064S70FHI030) meet the Directive of 2002/95/ EC (Rohs) requirement. ASSEMBLY Site 1: Cypress Bangkok (SB) Package Qualification Report # 153705 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) Material Analysis report As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03790 Rev *A Page 1 of 6 64- BGA (13 x 11 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Material Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Aluminum Hydroxide Copper Gold Nickel Epoxy Resin SiO2 Glass Cloth Tin Silver Copper Silica Organic filler Acrylic resin Diluent Elastomer Organic peroxide Silicon Copper Palladium Silica (fused) Carbon Black Epoxy resin Phosphoric organic catalyst CAS Number % weight of substance per Homogenous material PPM % weight of substance per package 12.8271 15.0390% 47,755 4.7755% 26.1381 0.3974 1.8327 18.9361 25.1609 43.9998 1.3679 0.2280 0.0096 0.0480 0.1080 0.0600 0.0120 0.0024 7.6527 0.3121 0.0041 110.0787 0.3238 17.9364 30.6453% 0.4659% 2.1487% 22.2014% 29.4996% 96.4999% 3.0001% 0.5000% 4.0000% 20.0000% 45.0000% 25.0000% 5.0000% 1.0000% 100.0000% 98.7034% 1.2966% 85.0000% 0.2500% 13.8500% 97,312 1,480 6,823 70,499 93,674 163,811 5,093 849 36 179 402 223 45 9 28,491 1,162 15 409,822 1,205 66,777 9.7312% 0.1480% 0.6823% 7.0499% 9.3674% 16.3811% 0.5093% 0.0849% 0.0036% 0.0179% 0.0402% 0.0223% 0.0045% 0.0009% 2.8491% 0.1162% 0.0015% 40.9822% 0.1206% 6.6777% Trade secret 0.3885 0.3000% 1,446 0.1446% Trade secret 0.7770 0.6000% 2,893 0.2893% Package Weight (mg): 268.6013 % Total: 100.0000 Metal Oxides 7440-50-8 Weight by mg 7440-57-5 7440-02-0 9003-36-5 21645-51-2 65997-17-3 7440-31-5 7440-22-4 7440-50-8 Trade secret Trade secret Trade secret Trade secret Trade secret Trade secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 1333-86-4 Trade secret Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03790 Rev *A Page 2 of 6 64- BGA (13 x 11 mm) Pb-Free Package II. Type DECLARATION OF PACKAGING INDIRECT MATERIALS Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM PBDE PPM Analysis Report (Note2) < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 CoA-DESS-R *** ASSEMBLY Site 2: C Powertech Technology LTD – (PTI-Suzhou) Package Qualification Report # 153606 (Note 1) II. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) Material Analysis report As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03790 Rev *A Page 3 of 6 64- BGA (13 x 11 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material PPM % weight of substance per package Fiber Glass 65997-17-3 15.6470 17.2876% 28307 2.8307% Copper Cured Epoxy resin blend Silica Gold Nikel Tin Silver Copper Acrylate monomer Bismaleimide resin Carbocyclic acrylate Peroxide Silicon Copper Palladium Epoxy Resin Phenol Resin Carbon black Amorphous silica Crystal silica 7440-50-8 Trade Secret 44.7360 8.0840 49.4266% 8.9316% 997 74 0.0997% 0.0074% 60676-86-0 7440-57-5 7440-02-0 7440-31-5 7440-22-4 7440-50-8 Trade Secret Trade Secret 6.5630 1.7600 13.7200 51.8800 1.6100 0.2688 0.2625 0.3520 7.2511% 1.9445% 15.1585% 96.5051% 2.9949% 0.5000% 35.1641% 47.1534% 967 1297 324 162 57634 164779 29776 24174 0.0967% 0.1297% 0.0324% 0.0162% 5.7634% 16.4779% 2.9776% 2.4174% Trade Secret 0.0880 11.7883% 6483 0.6483% Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade secret Trade secret 1333-86-4 Trade secret Trade secret 0.0440 7.6850 0.2707 0.0200 7.1500 6.9440 0.2060 99.1100 5.0900 5.8942% 100.0000% 93.1201% 6.8799% 6.0338% 5.8599% 0.1738% 83.6371% 4.2954% 50536 26336 25577 759 365058 18748 191093 5930 990 5.0536% 2.6336% 2.5577% 0.0759% 36.5058% 1.8748% 19.1093% 0.5930% 0.0990% % Total: 100.0000 Package Weight (mg): 271.4910 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03790 Rev *A Page 4 of 6 64- BGA (13 x 11 mm) Pb-Free Package III. Type Tape & Reel Tray Others DECLARATION OF PACKAGING INDIRECT MATERIALS Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM PBDE PPM Analysis Report (Note2) < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 CoA-DESS-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03790 Rev *A Page 5 of 6 64- BGA (13 x 11 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. ** *A 64-BGA (13X11MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 002-03790 ECN No. Orig. of Change 4939291 CHAL 5141722 CHAL Description of Change New document Added package weight for Site 2, PTI Suzhou. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03790 Rev *A Page 6 of 6