70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BU B1 : 30.0320 mg Body Size (mil/mm) Package Weight – Site 2 5.5 x 5.5 x 0.6mm B1 : 30.0320 mg B2 : 29.8318 mg SUMMARY The 70L-BGA package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 121302, 123605 I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BU70ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 1 of 8 70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Goldwire Material Material Purpose of Use Substance Composition SiO2 Substrate Solder Ball Die Attach Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation CAS Number Weight by mg % weight of substance per Homogeno us material PPM % weight of substance per package 60676-86-0 1.0466 11.0000 34,849 3.4849 Acrylic Trade Secret 0.9514 10.0000 31,680 3.1680 Epoxy Trade Secret 0.7611 8.0000 25,343 2.5343 Bisphenol 13676-54-5 1.4272 15.0000 47,523 4.7523 Triazol Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Au Ion Impurities SiO2 Epoxy Resin Phenol Resin Carbon Black 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 1.6650 3.4680 0.1427 0.0523 3.5393 0.0359 0.0180 17.5000 36.45000 1.5000 0.5500 98.5000 1.0000 0.5000 55,441 115,477 4,752 1,741 117,851 1,195 599 5.5441 11.5477 0.4752 0.1741 11.7851 0.1195 0.0599 Trade Secret 1.2749 65.5000 42,451 4.2451 Trade Secret 80-08-0 0.2920 0.1460 15.0000 7.5000 9,723 4,861 0.9723 0.4861 67762-90-7 0.0584 3.0000 1,945 0.1945 Trade Secret 0.0584 3.0000 1,945 0.1945 Trade Secret 0.0584 3.0000 1,945 0.1945 Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0584 3.8300 1.5500 0.0002 8.6092 0.5279 0.4319 0.0288 3.0000 100.0000 99.9900 0.0100 89.7000 5.5000 4.5000 0.3000 1,945 127,531 51,612 7 286,667 17,577 14,381 959 0.1945 12.7531 5.1612 0.0007 28.6667 1.7577 1.4381 0.0959 % Total: 100.0000 Package Weight (mg): 30.0320 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 2 of 8 70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Palladium Material Material Purpose of Use Substance Composition SiO2 Substrate Solder Ball Die Attach Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation CAS Number Weight by mg % weight of substance per Homogeno us material PPM % weight of substance per package 60676-86-0 1.0466 11.0000 35,083 3.5083 Acrylic Trade Secret 0.9514 10.0000 31,892 3.1892 Epoxy Trade Secret 0.7611 8.0000 25,513 2.5513 Bisphenol 13676-54-5 1.4272 15.0000 47,842 4.7842 Triazol Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Copper (Cu) Palladium (Pd) SiO2 Epoxy Resin Phenol Resin Carbon Black 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 1.6650 3.4680 0.1427 0.0523 3.5393 0.0359 0.0180 17.5000 36.4500 1.5000 0.5500 98.5000 1.0000 0.5000 55,813 116,252 4,783 1,753 118,642 1,203 603 5.5813 11.6252 0.4783 0.1753 11.8642 0.1203 0.0603 Trade Secret 1.2749 65.5000 42,736 4.2736 Trade Secret 80-08-0 0.2920 0.1460 15.0000 7.5000 9,788 4,894 0.9788 0.4894 67762-90-7 0.0584 3.0000 1,958 0.1958 Trade Secret 0.0584 3.0000 1,958 0.1958 Trade Secret 0.0584 3.0000 1,958 0.1958 Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0584 3.8300 1.3100 0.0400 8.6092 0.5279 0.4319 0.0288 3.0000 100.0000 97.0000 3.0000 89.7000 5.5000 4.5000 0.3000 1,958 128,386 43,913 1,341 288,591 17,696 14,478 965 0.1958 12.8386 4.3913 0.1341 28.8591 1.7696 1.4478 0.0965 % Total: 100.0000 Package Weight (mg): 29.8318 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 3 of 8 70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Cadmium PPM Cr VI PPM Mercury PPM PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Lead PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 4 of 8 70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Chung-Li (AC) Package Qualification Report # 123401 I. DECLARATION OF PACKAGED UNITS B. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BU70-AC As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 5 of 8 70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Goldwire Material Material Purpose of Use Substance Composition SiO2 Substrate Solder Ball Die Attach Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation CAS Number Weight by mg % weight of substance per Homogeno us material PPM % weight of substance per package 60676-86-0 1.0466 11.0000 34,849 3.4849 Acrylic Trade Secret 0.9514 10.0000 31,680 3.1680 Epoxy Trade Secret 0.7611 8.0000 25,343 2.5343 Bisphenol 13676-54-5 1.4272 15.0000 47,523 4.7523 Triazol Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Au Ion Impurities SiO2 Epoxy Resin Phenol Resin Carbon Black 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 1.6650 3.4680 0.1427 0.0523 3.5393 0.0359 0.0180 17.5000 36.45000 1.5000 0.5500 98.5000 1.0000 0.5000 55,441 115,477 4,752 1,741 117,851 1,195 599 5.5441 11.5477 0.4752 0.1741 11.7851 0.1195 0.0599 Trade Secret 1.2749 65.5000 42,451 4.2451 Trade Secret 80-08-0 0.2920 0.1460 15.0000 7.5000 9,723 4,861 0.9723 0.4861 67762-90-7 0.0584 3.0000 1,945 0.1945 Trade Secret 0.0584 3.0000 1,945 0.1945 Trade Secret 0.0584 3.0000 1,945 0.1945 Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0584 3.8300 1.5500 0.0002 8.6092 0.5279 0.4319 0.0288 3.0000 100.0000 99.9900 0.0100 89.7000 5.5000 4.5000 0.3000 1,945 127,531 51,612 7 286,667 17,577 14,381 959 0.1945 12.7531 5.1612 0.0007 28.6667 1.7577 1.4381 0.0959 % Total: 100.0000 Package Weight (mg): 30.0320 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 6 of 8 70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Cadmium PPM Cr VI PPM Mercury PPM PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Lead PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 7 of 8 70- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. 70 - BGA (5.5X5.5X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-90089 ** *A ECN No. Orig. of Change 4193652 JVP 4234702 JARG *B 4403548 JVP *C 5042780 HLR DCON Description of Change Initial Release Added material composition Assembly Site 2 for ASE Taiwan Chung-Li. Reference QTP 123401. Added B2 in Assembly Site 1 for CuPd material. Reference QTP 123605 Changed the substances with “------------- “to “Trade Secret”. Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-90089 Rev.*C Page 8 of 8