60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BU B1 : 29.2610 mg Body Size (mil/mm) Package Weight – Site 2 B2 : 29.0831 mg 5.5 x 5.5 x 0.6mm B1 : 29.5333 mg B2 : 29.3831 mg SUMMARY The 60L-BGA package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 121302, 123605 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BU60ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 1 of 9 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Goldwire Material Material Substrate Base Material Solder Ball External Plating Die Attach Die Wire Mold Compound Substance Composition Purpose of Use Adhesive Circuit Interconnect Encapsulation CAS Number SiO2 Acrylic 60676-86-0 Trade Secret Epoxy Trade Secret Bisphenol Triazol Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Au Ion impurities SiO2 Epoxy Resin Phenol Resin Crabon Black 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret Trade Secret 80-08-0 67762-90-7 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 1.0466 11.0000 35,767 % weight of substance per package 3.5767 0.9514 0.7611 10.0000 32,515 3.2515 1.4272 1.6650 3.4680 0.1427 0.0523 3.5393 0.0359 0.0180 8.0000 15.0000 17.5000 36.4500 1.5000 0.5500 98.5000 1.0000 0.5000 26,012 48,773 56,902 118,519 4,877 1,788 120,958 1,228 614 2.6012 4.8773 5.6902 11.8519 0.4877 0.1788 12.0958 0.1228 0.0614 1.2749 0.2920 0.1460 65.5000 15.0000 7.5000 43,570 9,978 4,989 4.3579 0.9978 0.4989 0.0584 0.0584 3.0000 3.0000 1,996 1,996 0.1996 0.1996 0.0584 0.0584 3.2770 1.3321 0.0001 8.6092 0.5279 0.4319 0.0288 3.0000 3.0000 100.0000 99.9900 0.0100 89.7000 5.5000 4.5000 0.3000 1,996 1,996 111,992 45,524 4.553 294,223 18,040 14,760 984 0.1996 0.1996 11.1992 4.5524 0.0004 29.4223 1.8040 1.4760 0.0984 % Total: 100.0000 Weight by mg 29.2610 % weight of substance per Homogenous material PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 2 of 9 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper/Palladium Wire Material Material Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition 1.0466 % weight of substance per Homogenous material 11.0000 35,986 3.5986 0.9514 0.7611 10.0000 8.0000 32,714 26,172 3.2714 2.6172 1.4272 1.6650 3.4680 0.1427 0.0523 3.5393 0.0359 0.0180 15.0000 17.5000 36.4500 1.5000 0.5500 98.5000 1.0000 0.5000 49,072 57,250 119,244 4,907 1,799 121,698 1,236 618 4.9072 5.7250 11.9244 0.4907 0.1799 12.1698 0.1236 0.0618 1.2749 0.2920 0.1460 65.5000 15.0000 7.5000 43,837 10,039 5,019 4.3837 1.0039 0.5019 0.0584 3.0000 2,008 0.2008 0.0584 3.0000 2,008 0.2008 Trade Secret 7440-21-3 7440-50-8 0.0584 0.0584 3.2770 1.1231 3.0000 3.0000 100.0000 97.3000 0.2008 0.2008 11.2677 3.8616 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0312 8.6092 0.5279 0.4319 0.0288 2.7000 89.7000 5.5000 4.5000 0.3000 2,008 2,008 112,677 38,616 1,071.5 54 296,023 18,151 14,851 990 CAS Number SiO2 Acrylic 60676-86-0 Trade Secret Epoxy 29690-82-2 Bisphenol Triazol Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Copper Palladium 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret SiO2 Epoxy Resin Phenol Resin Crabon Black Trade Secret 80-08-0 67762-90-7 Weight by mg % weight of substance per package PPM Trade Secret Trade Secret Package Weight (mg): 29.0831 % Total: 0.1072 29.6023 1.8151 1.4851 0.0990 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 3 of 9 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Cadmium PPM Cr VI PPM Mercury PPM PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Lead PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 4 of 9 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Chung-Li Package Qualification Report # 123401, 123603 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BU60-ASE Chung-Li As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 5 of 9 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Goldwire Material Material Substance Composition Purpose of Use Bismaleimide(B) Triazine / Epoxy Resin Continuous Filament Fiber Glass Inorganic Filler Substrate Solder Ball Die Attach Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation CAS Number Weight by mg % weight of substance per Homogeno us material PPM % weight of substance per package 105391-33-1 1.8752 25.5000 63,495 6.3495% 65997-17-3 1.1472 15.6000 38,844 3.8844% 21645-51-2 0.8310 11.3000 28,137 2.8137% Barium Sulfate 7727-43-7 0.6618 9.0000 22,410 2.2410% Monomethlyl ether 34590-94-8 0.1838 2.5000 6,225 0.6225% Talc 14807-96-6 0.0368 0.5000 1,245 0.1245% Silica, amorphous 7631-86-9 0.0368 0.5000 1,245 0.1245% Epoxy Resin Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Au Pd SiO2 Epoxy Resin Phenol Resin Crabon Black Proprietary 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret 0.0735 2.3532 0.1103 0.0441 3.5598 0.0545 0.0182 1.0000 32.0000 1.5000 0.6000 98.5000 1.0000 0.5000 2,490 79,680 3,735 1,494 120,536 1,845 615 0.2490% 7.9680% 0.3735% 0.1494% 12.0536% 0.1845% 0.0615% 0.2713 65.0000 9,185 0.9185% Trade Secret 80-08-0 0.0835 0.0292 20.0000 7.0000 2,826 989 0.2826% 0.0989% 67762-90-7 0.0083 2.0000 283 0.0283% Trade Secret Trade Secret 0.0083 2.0000 283 0.0283% 0.0083 2.0000 283 0.0283% Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0083 2.7244 0.2776 0.0028 13.1890 1.0588 0.8319 0.0454 2.0000 100.0000 99.0000 1.0000 87.2000 7.0000 5.5000 0.3000 283 92,247 9,399 95 446,580 35,849 28,167 1,536 0.0283% 9.2247% 0.9399% 0.0095% 44.6580% 3.5849% 2.8167% 0.1536% % Total: 100.0000 Package Weight (mg): 29.5333 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 6 of 9 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper/Palladium Wire Material Material Substrate 105391-33-1 1.8752 65997-17-3 1.1472 21645-51-2 Barium Sulfate 7727-43-7 Monomethlyl ether Talc Substance Composition Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Bismaleimide(B) Triazine / Epoxy Resin Continuous Filament Fiber Glass Inorganic Filler % weight of substance per Homogeno us material 25.5000 Circuit Interconnect Mold Compound Encapsulation CAS Number Weight by mg PPM % weight of substance per package 63,819 6.3819% 15.6000 39,042 3.9042% 0.8310 11.3000 28,281 2.8281% 0.6618 9.0000 22,525 2.2525% 34590-94-8 0.1838 2.5000 6,257 0.6257% 14807-96-6 0.0368 0.5000 1,251 0.1251% Silica, amorphous 7631-86-9 0.0368 0.5000 1,251 0.1251% Epoxy Resin Cu Ni Au Sn Ag Cu Modified epoxy resin Epoxy resin Daspone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Si Cu Pd SiO2 Epoxy Resin Phenol Resin Crabon Black Trade Secret 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret 0.0735 2.3532 0.1103 0.0441 3.5598 0.0545 0.0182 0.2713 1.0000 32.0000 1.5000 0.6000 98.5000 1.0000 0.5000 65.0000 2,503 80,087 3,754 1,502 121,152 1,854 618 9,232 0.2503% 8.0087% 0.3754% 0.1502% 12.1152% 0.1854% 0.0618% 0.9232% Trade Secret 80-08-0 67762-90-7 0.0835 0.0292 0.0083 20.0000 7.0000 2.0000 2,841 994 284 0.2841% 0.0994% 0.0284% Trade Secret Trade Secret 0.0083 0.0083 2.0000 2.0000 284 284 0.0284% 0.0284% Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0083 2.7244 0.1277 0.0025 13.1890 1.0588 0.8319 0.0454 2.0000 100.0000 98.0000 2.0000 87.2000 7.0000 5.5000 0.3000 284 92,719 4,347 84 448,863 36,033 28,311 1,544 0.0284% 9.2719% 0.4347% 0.0084% 44.8863% 3.6033% 2.8311% 0.1544% Package Weight (mg): 29.3831 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 7 of 9 100.0000 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Cadmium PPM Cr VI PPM Mercury PPM PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Lead PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 8 of 9 60- BGA (5.5 x 5.5 x 0.6 mm) Pb-Free Package Document History Page Document Title: 60 - BGA (5.5X5.5X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-78057 Rev. ** *A ECN No. Orig. of Change 3564923 JSO 3739860 JSO *B *C 3787622 JSO 4064282 YUM *D *E 4771626 HLR 5285407 HLR MEL Description of Change Initial Release Added assembly site 1.B2 Material Composition table for ASEK’s CuPd wire. Added assembly site 2 for ASE Chung-li. Added reference QTP# for CuPd wire Added assembly site name in the assembly heading in site 1 and 2. Changed assembly code to assembly site name in site 1 and 2. Sunset Due – No Change. Changed Cypress Logo. Changed the substances with “------------- “and Proprietary to “Trade Secret". Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-78057 Rev. *E Page 9 of 9