100 VFBGA 6X6X1.0MM PB-FREE PMDD.pdf

100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
BZ
B1: 76.9920 mg
B2: 74.4402 mg
B3: 73.7260 mg
B4: 73.7578 mg
72.1902 mg
Body Size (mil/mm)
Package Weight – Site 2
6x6x1.0 mm
70.0303 mg
Package Weight – Site 4
B1: 71.1120 mg
B2: 71.1120 mg
SUMMARY
The 100-VFBGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 033105, 071405, #120301, #120612 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in
the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BZ100ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 1 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
SnAgCu Using Non-Green Substrate
Material
Purpose of
Use
Substance
Composition
SiO2
Acrylic
Epoxy
Substrate
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Bisphenol
Triazol
Cu
Ni
Au
Br
Sn
Ag
Cu
Fused silica
Diester
Epoxy Resin
Functionalized
esters
Polymeric resin
Silicon
Au
Ion Impurities
Silica Fused
Epoxy resin A
Phenol resin
CAS Number
60676-86-0
Trade Secret,
29690-82-2
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7726-95-6
7440-31-5
7440-22-4
7440-50-8
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
Package Weight (mg):
1.9206
1.7495
% weight of
substance per
Homogenous
material
11.0000
10.0200
1.4003
Weight by
mg
PPM
% weight of
substance per
package
24,946
22,723
2.4946%
2.2723%
8.0200
18,188
1.8188%
2.6207
3.0503
6.3502
0.2602
0.0995
0.0105
10.0084
0.4192
0.0524
5.6106
2.8573
0.5715
1.0390
15.0100
17.4700
36.3700
1.4900
0.5700
0.0600
95.5000
4.0000
0.5000
54.0000
27.5000
5.5000
10.0000
34,039
39,618
82,479
3,379
1,293
136
129,993
5,445
681
72,873
37,111
7,422
13,495
3.4039%
3.9618%
8.2479%
0.3379%
0.1293%
0.0136%
12.9993%
0.5445%
0.0681%
7.2873%
3.7111%
0.7422%
1.3495%
0.3117
6.2400
1.9498
0.0002
27.1183
1.6759
1.6759
3.0000
100.0000
99.9900
0.0100
89.0000
5.5000
5.5000
4,048
81,048
25,325
3
352,223
21,767
21,767
0.4048%
8.1048%
2.5325%
0.0003%
35.2223%
2.1767%
2.1767%
76.9920
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 2 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B2. SnAgCu Using Green Substrate
Material
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
% weight of
substance per
Homogenous
material
60676-86-0
2.2595
10.4900
30353
3.0354%
Trade Secret
29690-82-2,
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
Trade Secret
1.9817
9.2000
26621
2.6621%
1.3226
3.2267
3.8729
8.4717
0.2994
0.1055
6.6488
0.0675
0.0338
0.2807
1.1028
6.1400
14.9800
17.9800
39.3300
1.3900
0.4900
98.5000
1.0000
0.5000
7.0000
27.5000
17767
43346
52027
113806
4022
1418
89317
907
453
3771
14814
1.7767%
4.3346%
5.2027%
11.3806%
0.4022%
0.1418%
8.9317%
0.0907%
0.0453%
0.3771%
1.4814%
0.401
10.0000
5387
0.5387%
0.1203
2.1053
9.15
2.6697
0.0003
26.9848
1.3644
0.6064
1.3644
3.0000
52.5000
100.0000
99.9900
0.0100
89.0000
4.5000
2.0000
4.5000
1616
28281
122918
35864
4
362504
18329
8146
18329
0.1616%
2.8281%
12.2918%
3.5864%
0.0004%
36.2504%
1.8329%
0.8146%
1.8329%
CAS Number
SiO2
Acrylic
Epoxy
Substrate
Weight by
mg
Substance
Composition
Bisphenol
Triazol
Copper
Nickel
Gold
Sn
Ag
Cu
Epoxy Resin
Diester
Functionalized
Ester
Polymeric
Silica fused
Si
Au
Ion Impurities
Silica fused
Epoxy Resin (1)
Epoxy Resin (2)
Phenol resin
Trade Secret
Trade Secret
60676-86-0
7440-21-3
7440-57-5
Trade Secret
60676-86-0
93705-66-9
Undisclosed
106466-55-1
Package Weight (mg):
74.4402
PPM
% Total:
% weight of
substance
per
package
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 3 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper Wire Material
Material
Purpose of
Use
Substance
Composition
SiO2
Acrylic
Epoxy
Substrate
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Silica,
amorphous,
fused
Bismaleimide
monomer
Acrylate
monomer
Epoxy resin
Acrylic resin
Silicon
Cu
Ion Impuritues
Silica
Epoxy resin A
Phenol resin
Carbon Black
60676-86-0
Trade Secret,
29690-82-2
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
60676-86-0
2.2600
1.9800
% weight of
substance per
Homogenous
material
10.4921
9.1922
1.3200
CAS Number
Weight
by mg
PPM
% weight of
substance per
package
30654
26856
3.0654%
2.6856%
6.1281
17904
1.7904%
3.2300
3.8700
8.4700
0.3000
0.1100
6.6487
0.0675
0.0338
2.1102
14.9954
17.9666
39.3222
1.3928
0.5107
98.5000
1.0000
0.5000
48.5000
43811
52492
114885
4069
1492
90199
949
407
28623
4.3811%
5.2492%
11.4885%
0.4069%
0.1492%
9.0199%
0.0949%
0.0407%
2.8623%
Trade Secret
1.4576
33.5000
19770
1.9770%
Trade Secret
0.3263
7.5000
4426
0.4426%
Trade Secret
Trade Secret
7440-21-3
7440-50-8
Trade Secret
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.3263
0.1305
9.1500
1.2449
0.0001
27.1101
1.6800
1.6800
0.2200
7.5000
3.0000
100.0000
99.9900
0.0100
88.3350
5.4741
5.4741
0.7168
4426
1770
124108
16885
2
367713
22787
22787
2984
0.4426%
0.1770%
12.4108%
1.6885%
0.0002%
36.7713%
2.2787%
2.2787%
0.2984%
Package Weight (mg):
73.7260
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 4 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B4. MATERIAL COMPOSITION (Note 3)
Using Copper PD Wire Material
Material
Purpose of
Use
Substance
Composition
SiO2
Acrylic
Epoxy
Substrate
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Silica,
amorphous,
fused
Bismaleimide
monomer
Acrylate
monomer
Epoxy resin
Acrylic resin
Silicon
Cu
Palladium
Silica
Epoxy resin A
Phenol resin
Carbon Black
60676-86-0
Trade Secret,
29690-82-2
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
60676-86-0
2.2600
1.9800
% weight of
substance per
Homogenous
material
10.4921
9.1922
1.3200
CAS Number
Weight
by mg
PPM
% weight of
substance per
package
30641
26845
3.0641%
2.6845%
6.1281
17896
1.7896%
3.2300
3.8700
8.4700
0.3000
0.1100
6.6487
0.0675
0.0338
2.1102
14.9954
17.9666
39.3222
1.3928
0.5107
98.5000
1.0000
0.5000
48.5000
43792
52469
114835
4067
1491
90160
949
407
28610
4.3792%
5.2469%
11.4835%
0.4067%
0.1491%
9.0160%
0.0949%
0.0407%
2.8610%
Trade Secret
1.4576
33.5000
19762
1.9762%
Trade Secret
0.3263
7.5000
4424
0.4424%
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.3263
0.1305
9.1500
1.2449
0.0319
27.1101
1.6800
1.6800
0.2200
7.5000
3.0000
100.0000
97.5016
2.4984
88.3350
5.4741
5.4741
0.7168
4424
1770
124055
16878
432
367554
22777
22777
2983
0.4424%
0.1770%
12.4055%
1.6878%
0.0432%
36.7554%
2.2777%
2.2777%
0.2983%
Package Weight (mg):
73.7578
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 5 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture
Barrier Bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 6 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
ASSEMBLY Site 2: PT UNISEM Batam
Package Qualification Report # 071202 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in
the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BZ100PT UNISEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 7 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
7440-57-5
0.0207
Ni, metal & alloy
7440-02-0
0.0952
Cu, metal & alloy
Acrylic Resin
Phthalcyanine
Blue,
Organic
Pigment
Fillers
(Barium
Sulfate,
Silica,
Talc)
Aromatic Carbonyl
Compound
Amine Compound
Levelling Agents &
Others
Acrylic Monomer
Epoxy Resin
7440-50-8
Substance Composition
Plating 1
Plating 2
Substrate
Au, metal & alloy
% weight of
substance
per
Homogenou
s
material
0.7400
Base Material
Barium Sulfate
Organic Fillers
BT Resin
Fibrous-glasswool
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Sn
Ag
Cu
Ag
Epoxy Resin
Diester
Polymeric Resin
Functionalized Ester
Si
Au
Fused Silica
Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon Black
CAS Number
Weight by
mg
PPM
% weight
of
substance
per
package
296
0.0296%
3.4000
1359
0.1359%
0.7154
0.0216
0.0003
25.5500
0.7700
0.0100
10216
308
4
1.0216%
0.0308%
0.0004%
0.0165
0.5900
236
0.0236%
0.0022
0.0800
32
0.0032%
0.0036
0.0008
0.1300
0.0300
52
12
0.0052%
0.0012%
Trade Secret
29690-82-2
68541-56-0
25068-38-6
Trade Secret
Trade Secret
13676-54-5
25722-66-1
65997-17-3
0.0028
0.0095
0.1000
0.3400
40
136
0.0040%
0.0136%
0.0042
0.0008
0.8400
0.1500
0.0300
30.0000
60
12
11995
0.0060%
0.0012%
1.1995%
1.0668
38.1000
15233
1.5233%
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
9003-35-4
Trade Secret
1333-86-4
40.8283
0.4145
0.2073
4.5570
0.3255
0.6510
0.3255
0.6510
4.0000
1.7498
12.8440
0.2704
0.0676
0.1352
0.1352
0.0676
98.5000
1.0000
0.5000
70.0000
5.0000
10.0000
5.0000
10.0000
100.0000
99.9900
95.0000
2.0000
0.5000
1.0000
1.0000
0.5000
583008
5919
2959
65072
4648
9296
4648
9296
57118
24987
183406
3861
965
1931
1931
965
58.3008%
0.5919%
0.2959%
6.5072%
0.4648%
0.9296%
0.4648%
0.9296%
5.7118%
2.4987%
18.3406%
0.3861%
0.0965%
0.1931%
0.1931%
0.0965%
% Total:
100.0000
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Package Weight (mg):
70.0303
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 8 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture
Barrier Bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 9 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
ASSEMBLY Site 3: Cypress Manufacturing Limited (CML)
Package Qualification Report # 042801(Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in
the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BZ100CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 10 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS
Number
Cured Resin
Glass Fabrics
Copper Foil
Diethylene Glycol
Monoethyl
Acetate
Acetophenone
Crystalline
Silica Crystalline
Solvent Naptha
Sn
Ag
Cu
Silver
Bismaleimide
Polymer
Silicon
Gold
Silica
Non Brominated
Flame Retardant
Epoxy resin
Phenol Resin
Mixed Siloxanes
Carbon Black
Pigment
Trade Secret
Trade Secret
Trade Secret
5.8240
4.5760
6.2400
1.0400
% weight of
substance per
Homogenous
material
28.0000
22.0000
30.0000
5.0000
1.0400
Weight by
mg
% weight of
substance per
package
PPM
80,676
63,388
86,439
14,406
8.0676%
6.3388%
8.6439%
1.4406%
5.0000
14,406
1.4406%
1.0400
1.0400
34.4849
0.3501
0.1751
0.4880
0.0610
0.0610
10.8000
2.0200
2.5960
0.0295
5.0000
5.0000
98.5000
1.0000
0.5000
80.0000
10.0000
10.0000
100.0000
100.0000
88.0000
1.0000
14,406
14,406
477,696
4,850
2,425
6,760
845
845
149,605
27,982
35,961
409
1.4406%
1.4406%
47.7696%
0.4850%
0.2425%
0.6760%
0.0845%
0.0845%
14.9605%
2.7982%
3.5961%
0.0409%
0.1475
0.1475
0.0148
0.0148
5.0000
5.0000
0.5000
0.5000
2,043
2,043
204
204
0.2043%
0.2043%
0.0204%
0.0204%
Trade Secret
Trade Secret
Trade Secret
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
93705-66-9
106466-55-1
Trade Secret
1333-86-4
Package Weight (mg):
72.1902
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture
Barrier Bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 11 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
ASSEMBLY Site 4: Cypress Manufacturing Limited (CML)
Package Qualification Report # 120609, 120610 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in
the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BZ100CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 12 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1. USING COPPER WIRE
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cured Resin
Glass Fabrics
Copper Foil
Diethylene Glycol
Monoethyl
Acetate
Acetophenone
Crystalline
Silica Crystalline
Solvent Naptha
Sn
Ag
Cu
Silver
Bismaleimide
Resin
Synthetic Resin
Additive
Silicon
Copper
Silica
Epoxy resin
Phenol Resin
Melamine
Cyanurate
Carbon Black
Pigment
CAS Number
Trade Secret
Trade Secret
Trade Secret
5.8200
4.5800
6.2400
1.0400
% weight of
substance
per
Homogenou
s
material
27.9808
22.0192
30.0000
5.0000
1.0400
1.0400
1.0400
34.4847
0.3501
0.1751
0.4571
0.1068
Weight by
mg
PPM
% weight of
substance per
package
81,843
64,405
87,749
14,625
8.1843%
6.4405%
8.7749%
1.4625%
5.0000
14,625
1.4625%
5.0000
5.0000
98.5000
1.0000
0.5000
74.9300
14,625
14,625
484,869
4,922
2,531
6,428
1.4625%
1.4625%
48.4869%
0.4922%
0.2531%
0.6428%
17.5100
5.0400
2.5200
100.0000
100.0000
89.0000
7.0000
3.0000
1,502
432
216
151,873
13,246
36,920
2,904
1,245
207
0.1502%
0.0432%
0.0216%
15.1873%
1.3246%
3.6920%
0.2904%
0.1245%
0.0207%
207
0.0207%
Trade Secret
Trade Secret
Trade Secret
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
60676-86-0
93705-66-9
106466-55-1
Trade Secret
1333-86-4
Package Weight (mg):
0.0307
0.0154
10.8000
0.9420
2.6255
0.2065
0.0885
0.0148
0.5000
0.0148
0.5000
71.1120
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 13 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
USING COPPER - PALLADIUM WIRE
Material
Substrate
Purpose of
Use
Substance
Composition
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Cured Resin
Glass Fabrics
Copper Foil
Diethylene Glycol
Monoethyl
Acetate
Acetophenone
Crystalline
Silica Crystalline
Solvent Naptha
Sn
Ag
Cu
Silver
Bismaleimide
Resin
Synthetic Resin
Additive
Silicon
Copper
Palladium
Silica
Epoxy resin
Phenol Resin
Melamine
Cyanurate
Carbon Black
Pigment
Trade Secret
7440-50-8
Trade Secret
5.8200
4.5800
6.2400
% weight of
substance per
Homogenous
material
27.9808
22.0192
30.0000
Trade Secret
1.0400
5.0000
14,625
1.4625%
Trade Secret
1.0400
5.0000
14,625
1.4625%
Trade Secret
1.0400
1.0400
34.4847
0.3501
0.1751
0.4571
5.0000
5.0000
98.5000
1.0000
0.5000
74.9300
14,625
14,625
484,869
4,922
2,531
6,428
1.4625%
1.4625%
48.4869%
0.4922%
0.2531%
0.6428%
Trade Secret
0.1068
17.5100
1,502
0.1502%
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
93705-66-9
106466-55-1
0.0307
0.0154
10.8000
0.9326
0.0094
2.6255
0.2065
0.0885
5.0400
2.5200
100.0000
99.0000
1.0000
89.0000
7.0000
3.0000
432
216
151,873
13,115
132
36,920
2,904
1,245
0.0432%
0.0216%
15.1873%
1.3115%
0.0132%
3.6920%
0.2904%
0.1245%
Trade Secret
0.0148
0.5000
207
0.0207%
1333-86-4
0.0148
0.5000
207
0.0207%
CAS Number
Weight by
mg
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Package Weight (mg):
71.1120
PPM
% weight of
substance per
package
81,843
64,405
87,749
8.1843%
6.4405%
8.7749%
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture
Barrier Bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 14 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
**
*A
*B
*C
*D
*E
*F
*G
*H
*I
*J
*K
*L
100-VFBGA 6X6X1.0MM PB-FREE Package Material Declaration Datasheet
001-05088
ECN No. Orig. of Description of Change
Change
399798
YXP
New specification.
979562
VFR
Changed Cypress Logo
Added PMDD for site 2 – AIT, Batam, Indonesia.
2558679 HLR
Added Assembly Site 3 for CML assembled.
Added % weight of substance per Homogenous Material and %
weight of substance per package on the Material Composition for
Assembly Site 1.
Completed the RoHS Substances namely; Lead Cadmium,
Mercury, Chromium VI, PBB and PBDE on Declaration of
Packaging Indirect Materials table for Assembly Site 2.
DCon: Replaced with CML to WEB in the distribution list
2678542 HLR
Changed CAS number of Gold. Removed the material name of
substrate on Assembly Site 2 material composition table.
2882716 HLR
Added CAS number of Bromine on Assembly Site 1.
2932196 HLR
Added material composition table using Green Substrate and
071405 on the referenced QTP for Assembly Site 1.
3242150 HLR
Removed Tube based on Indirect Packaging Materials.
3546390 COPI
Added Assembly Site 4 – AUTOLINE RA Copper wire qualification.
Reference QTP # 120609.
3600806 HLR
Updated Assembly Sites 1 to 3 to reflect 4 decimal places on
values of material composition table.
3599213 EBZ
Added package weight B3 and B4 for Site 1. Added Material
Composition table B3 using copper wire and B4 using copper
palladium wire material for Site 1.
3633783 JARG
Added material composition for Assembly Site 4-B2: Using Copper
– Palladium wire in reference to QTP 120610
3984746 HLR
Added CAS Number of Copper Foil for Assembly Site 4.
Adjusted the Solder Ball Composition to reflect
Sn98.5%Ag1.0%Cu0.5%.
4043504 YUM
Added Assembly Site Name in the Assembly heading in site 1, 2, 3
and 4.
Changed Assembly code to Assembly Site Name in site 1, 2, 3 and
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 15 of 16
100 – VFBGA (6x6x1.0 mm)
Pb-Free Package
Rev.
*M
ECN No. Orig. of Description of Change
Change
4.
5277649 HLR
Changed Cypress Logo.
Changed the substances with “------------- “ to “Trade Secret".
DCON
Removed Distribution and posting information from Document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05088 Rev. *M
Page 16 of 16
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