100 – VFBGA (6x6x1.0 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 BZ B1: 76.9920 mg B2: 74.4402 mg B3: 73.7260 mg B4: 73.7578 mg 72.1902 mg Body Size (mil/mm) Package Weight – Site 2 6x6x1.0 mm 70.0303 mg Package Weight – Site 4 B1: 71.1120 mg B2: 71.1120 mg SUMMARY The 100-VFBGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 033105, 071405, #120301, #120612 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ100ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 1 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) SnAgCu Using Non-Green Substrate Material Purpose of Use Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Bisphenol Triazol Cu Ni Au Br Sn Ag Cu Fused silica Diester Epoxy Resin Functionalized esters Polymeric resin Silicon Au Ion Impurities Silica Fused Epoxy resin A Phenol resin CAS Number 60676-86-0 Trade Secret, 29690-82-2 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7726-95-6 7440-31-5 7440-22-4 7440-50-8 60676-86-0 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret Package Weight (mg): 1.9206 1.7495 % weight of substance per Homogenous material 11.0000 10.0200 1.4003 Weight by mg PPM % weight of substance per package 24,946 22,723 2.4946% 2.2723% 8.0200 18,188 1.8188% 2.6207 3.0503 6.3502 0.2602 0.0995 0.0105 10.0084 0.4192 0.0524 5.6106 2.8573 0.5715 1.0390 15.0100 17.4700 36.3700 1.4900 0.5700 0.0600 95.5000 4.0000 0.5000 54.0000 27.5000 5.5000 10.0000 34,039 39,618 82,479 3,379 1,293 136 129,993 5,445 681 72,873 37,111 7,422 13,495 3.4039% 3.9618% 8.2479% 0.3379% 0.1293% 0.0136% 12.9993% 0.5445% 0.0681% 7.2873% 3.7111% 0.7422% 1.3495% 0.3117 6.2400 1.9498 0.0002 27.1183 1.6759 1.6759 3.0000 100.0000 99.9900 0.0100 89.0000 5.5000 5.5000 4,048 81,048 25,325 3 352,223 21,767 21,767 0.4048% 8.1048% 2.5325% 0.0003% 35.2223% 2.1767% 2.1767% 76.9920 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 2 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B2. SnAgCu Using Green Substrate Material Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation % weight of substance per Homogenous material 60676-86-0 2.2595 10.4900 30353 3.0354% Trade Secret 29690-82-2, 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 Trade Secret Trade Secret 1.9817 9.2000 26621 2.6621% 1.3226 3.2267 3.8729 8.4717 0.2994 0.1055 6.6488 0.0675 0.0338 0.2807 1.1028 6.1400 14.9800 17.9800 39.3300 1.3900 0.4900 98.5000 1.0000 0.5000 7.0000 27.5000 17767 43346 52027 113806 4022 1418 89317 907 453 3771 14814 1.7767% 4.3346% 5.2027% 11.3806% 0.4022% 0.1418% 8.9317% 0.0907% 0.0453% 0.3771% 1.4814% 0.401 10.0000 5387 0.5387% 0.1203 2.1053 9.15 2.6697 0.0003 26.9848 1.3644 0.6064 1.3644 3.0000 52.5000 100.0000 99.9900 0.0100 89.0000 4.5000 2.0000 4.5000 1616 28281 122918 35864 4 362504 18329 8146 18329 0.1616% 2.8281% 12.2918% 3.5864% 0.0004% 36.2504% 1.8329% 0.8146% 1.8329% CAS Number SiO2 Acrylic Epoxy Substrate Weight by mg Substance Composition Bisphenol Triazol Copper Nickel Gold Sn Ag Cu Epoxy Resin Diester Functionalized Ester Polymeric Silica fused Si Au Ion Impurities Silica fused Epoxy Resin (1) Epoxy Resin (2) Phenol resin Trade Secret Trade Secret 60676-86-0 7440-21-3 7440-57-5 Trade Secret 60676-86-0 93705-66-9 Undisclosed 106466-55-1 Package Weight (mg): 74.4402 PPM % Total: % weight of substance per package 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 3 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Material Purpose of Use Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Bisphenol Triazol Cu Ni Au Sn Ag Cu Silica, amorphous, fused Bismaleimide monomer Acrylate monomer Epoxy resin Acrylic resin Silicon Cu Ion Impuritues Silica Epoxy resin A Phenol resin Carbon Black 60676-86-0 Trade Secret, 29690-82-2 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 2.2600 1.9800 % weight of substance per Homogenous material 10.4921 9.1922 1.3200 CAS Number Weight by mg PPM % weight of substance per package 30654 26856 3.0654% 2.6856% 6.1281 17904 1.7904% 3.2300 3.8700 8.4700 0.3000 0.1100 6.6487 0.0675 0.0338 2.1102 14.9954 17.9666 39.3222 1.3928 0.5107 98.5000 1.0000 0.5000 48.5000 43811 52492 114885 4069 1492 90199 949 407 28623 4.3811% 5.2492% 11.4885% 0.4069% 0.1492% 9.0199% 0.0949% 0.0407% 2.8623% Trade Secret 1.4576 33.5000 19770 1.9770% Trade Secret 0.3263 7.5000 4426 0.4426% Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade Secret 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.3263 0.1305 9.1500 1.2449 0.0001 27.1101 1.6800 1.6800 0.2200 7.5000 3.0000 100.0000 99.9900 0.0100 88.3350 5.4741 5.4741 0.7168 4426 1770 124108 16885 2 367713 22787 22787 2984 0.4426% 0.1770% 12.4108% 1.6885% 0.0002% 36.7713% 2.2787% 2.2787% 0.2984% Package Weight (mg): 73.7260 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 4 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) Using Copper PD Wire Material Material Purpose of Use Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Bisphenol Triazol Cu Ni Au Sn Ag Cu Silica, amorphous, fused Bismaleimide monomer Acrylate monomer Epoxy resin Acrylic resin Silicon Cu Palladium Silica Epoxy resin A Phenol resin Carbon Black 60676-86-0 Trade Secret, 29690-82-2 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 60676-86-0 2.2600 1.9800 % weight of substance per Homogenous material 10.4921 9.1922 1.3200 CAS Number Weight by mg PPM % weight of substance per package 30641 26845 3.0641% 2.6845% 6.1281 17896 1.7896% 3.2300 3.8700 8.4700 0.3000 0.1100 6.6487 0.0675 0.0338 2.1102 14.9954 17.9666 39.3222 1.3928 0.5107 98.5000 1.0000 0.5000 48.5000 43792 52469 114835 4067 1491 90160 949 407 28610 4.3792% 5.2469% 11.4835% 0.4067% 0.1491% 9.0160% 0.0949% 0.0407% 2.8610% Trade Secret 1.4576 33.5000 19762 1.9762% Trade Secret 0.3263 7.5000 4424 0.4424% Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.3263 0.1305 9.1500 1.2449 0.0319 27.1101 1.6800 1.6800 0.2200 7.5000 3.0000 100.0000 97.5016 2.4984 88.3350 5.4741 5.4741 0.7168 4424 1770 124055 16878 432 367554 22777 22777 2983 0.4424% 0.1770% 12.4055% 1.6878% 0.0432% 36.7554% 2.2777% 2.2777% 0.2983% Package Weight (mg): 73.7578 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 5 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 6 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package ASSEMBLY Site 2: PT UNISEM Batam Package Qualification Report # 071202 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ100PT UNISEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 7 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use 7440-57-5 0.0207 Ni, metal & alloy 7440-02-0 0.0952 Cu, metal & alloy Acrylic Resin Phthalcyanine Blue, Organic Pigment Fillers (Barium Sulfate, Silica, Talc) Aromatic Carbonyl Compound Amine Compound Levelling Agents & Others Acrylic Monomer Epoxy Resin 7440-50-8 Substance Composition Plating 1 Plating 2 Substrate Au, metal & alloy % weight of substance per Homogenou s material 0.7400 Base Material Barium Sulfate Organic Fillers BT Resin Fibrous-glasswool Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Sn Ag Cu Ag Epoxy Resin Diester Polymeric Resin Functionalized Ester Si Au Fused Silica Epoxy Resin Phenol Resin Phenol Novolac Metal Hydroxide Carbon Black CAS Number Weight by mg PPM % weight of substance per package 296 0.0296% 3.4000 1359 0.1359% 0.7154 0.0216 0.0003 25.5500 0.7700 0.0100 10216 308 4 1.0216% 0.0308% 0.0004% 0.0165 0.5900 236 0.0236% 0.0022 0.0800 32 0.0032% 0.0036 0.0008 0.1300 0.0300 52 12 0.0052% 0.0012% Trade Secret 29690-82-2 68541-56-0 25068-38-6 Trade Secret Trade Secret 13676-54-5 25722-66-1 65997-17-3 0.0028 0.0095 0.1000 0.3400 40 136 0.0040% 0.0136% 0.0042 0.0008 0.8400 0.1500 0.0300 30.0000 60 12 11995 0.0060% 0.0012% 1.1995% 1.0668 38.1000 15233 1.5233% 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 9003-35-4 Trade Secret 1333-86-4 40.8283 0.4145 0.2073 4.5570 0.3255 0.6510 0.3255 0.6510 4.0000 1.7498 12.8440 0.2704 0.0676 0.1352 0.1352 0.0676 98.5000 1.0000 0.5000 70.0000 5.0000 10.0000 5.0000 10.0000 100.0000 99.9900 95.0000 2.0000 0.5000 1.0000 1.0000 0.5000 583008 5919 2959 65072 4648 9296 4648 9296 57118 24987 183406 3861 965 1931 1931 965 58.3008% 0.5919% 0.2959% 6.5072% 0.4648% 0.9296% 0.4648% 0.9296% 5.7118% 2.4987% 18.3406% 0.3861% 0.0965% 0.1931% 0.1931% 0.0965% % Total: 100.0000 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Package Weight (mg): 70.0303 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 8 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 9 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package ASSEMBLY Site 3: Cypress Manufacturing Limited (CML) Package Qualification Report # 042801(Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ100CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 10 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cured Resin Glass Fabrics Copper Foil Diethylene Glycol Monoethyl Acetate Acetophenone Crystalline Silica Crystalline Solvent Naptha Sn Ag Cu Silver Bismaleimide Polymer Silicon Gold Silica Non Brominated Flame Retardant Epoxy resin Phenol Resin Mixed Siloxanes Carbon Black Pigment Trade Secret Trade Secret Trade Secret 5.8240 4.5760 6.2400 1.0400 % weight of substance per Homogenous material 28.0000 22.0000 30.0000 5.0000 1.0400 Weight by mg % weight of substance per package PPM 80,676 63,388 86,439 14,406 8.0676% 6.3388% 8.6439% 1.4406% 5.0000 14,406 1.4406% 1.0400 1.0400 34.4849 0.3501 0.1751 0.4880 0.0610 0.0610 10.8000 2.0200 2.5960 0.0295 5.0000 5.0000 98.5000 1.0000 0.5000 80.0000 10.0000 10.0000 100.0000 100.0000 88.0000 1.0000 14,406 14,406 477,696 4,850 2,425 6,760 845 845 149,605 27,982 35,961 409 1.4406% 1.4406% 47.7696% 0.4850% 0.2425% 0.6760% 0.0845% 0.0845% 14.9605% 2.7982% 3.5961% 0.0409% 0.1475 0.1475 0.0148 0.0148 5.0000 5.0000 0.5000 0.5000 2,043 2,043 204 204 0.2043% 0.2043% 0.0204% 0.0204% Trade Secret Trade Secret Trade Secret 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret 93705-66-9 106466-55-1 Trade Secret 1333-86-4 Package Weight (mg): 72.1902 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 11 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package ASSEMBLY Site 4: Cypress Manufacturing Limited (CML) Package Qualification Report # 120609, 120610 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ100CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 12 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. USING COPPER WIRE Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cured Resin Glass Fabrics Copper Foil Diethylene Glycol Monoethyl Acetate Acetophenone Crystalline Silica Crystalline Solvent Naptha Sn Ag Cu Silver Bismaleimide Resin Synthetic Resin Additive Silicon Copper Silica Epoxy resin Phenol Resin Melamine Cyanurate Carbon Black Pigment CAS Number Trade Secret Trade Secret Trade Secret 5.8200 4.5800 6.2400 1.0400 % weight of substance per Homogenou s material 27.9808 22.0192 30.0000 5.0000 1.0400 1.0400 1.0400 34.4847 0.3501 0.1751 0.4571 0.1068 Weight by mg PPM % weight of substance per package 81,843 64,405 87,749 14,625 8.1843% 6.4405% 8.7749% 1.4625% 5.0000 14,625 1.4625% 5.0000 5.0000 98.5000 1.0000 0.5000 74.9300 14,625 14,625 484,869 4,922 2,531 6,428 1.4625% 1.4625% 48.4869% 0.4922% 0.2531% 0.6428% 17.5100 5.0400 2.5200 100.0000 100.0000 89.0000 7.0000 3.0000 1,502 432 216 151,873 13,246 36,920 2,904 1,245 207 0.1502% 0.0432% 0.0216% 15.1873% 1.3246% 3.6920% 0.2904% 0.1245% 0.0207% 207 0.0207% Trade Secret Trade Secret Trade Secret 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 93705-66-9 106466-55-1 Trade Secret 1333-86-4 Package Weight (mg): 0.0307 0.0154 10.8000 0.9420 2.6255 0.2065 0.0885 0.0148 0.5000 0.0148 0.5000 71.1120 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 13 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) USING COPPER - PALLADIUM WIRE Material Substrate Purpose of Use Substance Composition Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Cured Resin Glass Fabrics Copper Foil Diethylene Glycol Monoethyl Acetate Acetophenone Crystalline Silica Crystalline Solvent Naptha Sn Ag Cu Silver Bismaleimide Resin Synthetic Resin Additive Silicon Copper Palladium Silica Epoxy resin Phenol Resin Melamine Cyanurate Carbon Black Pigment Trade Secret 7440-50-8 Trade Secret 5.8200 4.5800 6.2400 % weight of substance per Homogenous material 27.9808 22.0192 30.0000 Trade Secret 1.0400 5.0000 14,625 1.4625% Trade Secret 1.0400 5.0000 14,625 1.4625% Trade Secret 1.0400 1.0400 34.4847 0.3501 0.1751 0.4571 5.0000 5.0000 98.5000 1.0000 0.5000 74.9300 14,625 14,625 484,869 4,922 2,531 6,428 1.4625% 1.4625% 48.4869% 0.4922% 0.2531% 0.6428% Trade Secret 0.1068 17.5100 1,502 0.1502% Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 93705-66-9 106466-55-1 0.0307 0.0154 10.8000 0.9326 0.0094 2.6255 0.2065 0.0885 5.0400 2.5200 100.0000 99.0000 1.0000 89.0000 7.0000 3.0000 432 216 151,873 13,115 132 36,920 2,904 1,245 0.0432% 0.0216% 15.1873% 1.3115% 0.0132% 3.6920% 0.2904% 0.1245% Trade Secret 0.0148 0.5000 207 0.0207% 1333-86-4 0.0148 0.5000 207 0.0207% CAS Number Weight by mg 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Package Weight (mg): 71.1120 PPM % weight of substance per package 81,843 64,405 87,749 8.1843% 6.4405% 8.7749% % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 14 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. ** *A *B *C *D *E *F *G *H *I *J *K *L 100-VFBGA 6X6X1.0MM PB-FREE Package Material Declaration Datasheet 001-05088 ECN No. Orig. of Description of Change Change 399798 YXP New specification. 979562 VFR Changed Cypress Logo Added PMDD for site 2 – AIT, Batam, Indonesia. 2558679 HLR Added Assembly Site 3 for CML assembled. Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition for Assembly Site 1. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table for Assembly Site 2. DCon: Replaced with CML to WEB in the distribution list 2678542 HLR Changed CAS number of Gold. Removed the material name of substrate on Assembly Site 2 material composition table. 2882716 HLR Added CAS number of Bromine on Assembly Site 1. 2932196 HLR Added material composition table using Green Substrate and 071405 on the referenced QTP for Assembly Site 1. 3242150 HLR Removed Tube based on Indirect Packaging Materials. 3546390 COPI Added Assembly Site 4 – AUTOLINE RA Copper wire qualification. Reference QTP # 120609. 3600806 HLR Updated Assembly Sites 1 to 3 to reflect 4 decimal places on values of material composition table. 3599213 EBZ Added package weight B3 and B4 for Site 1. Added Material Composition table B3 using copper wire and B4 using copper palladium wire material for Site 1. 3633783 JARG Added material composition for Assembly Site 4-B2: Using Copper – Palladium wire in reference to QTP 120610 3984746 HLR Added CAS Number of Copper Foil for Assembly Site 4. Adjusted the Solder Ball Composition to reflect Sn98.5%Ag1.0%Cu0.5%. 4043504 YUM Added Assembly Site Name in the Assembly heading in site 1, 2, 3 and 4. Changed Assembly code to Assembly Site Name in site 1, 2, 3 and Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 15 of 16 100 – VFBGA (6x6x1.0 mm) Pb-Free Package Rev. *M ECN No. Orig. of Description of Change Change 4. 5277649 HLR Changed Cypress Logo. Changed the substances with “------------- “ to “Trade Secret". DCON Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05088 Rev. *M Page 16 of 16