28l Pdip Pb-free Package material declaration datasheet.pdf

28L - PDIP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
PZ
2,506.0520 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mils
2,054.3080 mg
SUMMARY
The 28L-300 mils PDIP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing
an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS)
requirement.
ASSEMBLY Site 1: Lingsen Taiwan
Package Qualification Report # 151901 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ28-LP
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03207 Rev. *I
Page 1 of 5
28L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Lead frame
Purpose of
Use
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS
Number
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Phosphorus (P)
Silver (Ag)
Tin (Sn)
Impurity
Silver (Ag)
Epoxy Resin
Diluent
Phenolic Hardener
Dicyandiamide
Amine Hardener
Silicon (Si)
Copper (Cu)
Paladium (Pd)
Impurity (Au+others)
Silica Fused
Epoxy Resin
Epoxy, Cresol
Novolac
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
7440-31-5
Trade Secret
7440-22-4
9003-36-5
Trade Secret
Trade Secret
461-58-5
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade Secret
60676-86-0
Trade Secret
29690-82-2
Trade Secret
1333-86-4
746.2978
17.6957
0.7694
0.7694
3.8469
24.7401
0.0025
1.5350
0.3070
0.1228
0.0614
0.0102
0.0102
18.1670
0.6073
0.0080
0.0012
1437.4351
100.7896
42.2775
% weight of
substance per
Homogenous
material
97.0000%
2.3000%
0.1000%
0.1000%
0.5000%
99.9900%
0.0100%
75.0000%
15.0000%
6.0000%
3.0000%
0.5000%
0.5000%
100.0000%
98.5000%
1.3000%
0.2000%
85.0000%
5.9600%
2.5000%
297,798
7,061
307
307
1,535
9,872
1
613
123
49
25
4
4
7,249
242
3
0
573,586
40,219
16,870
29.7798%
0.7061%
0.0307%
0.0307%
0.1535%
0.9872%
0.0001%
0.0613%
0.0123%
0.0049%
0.0025%
0.0004%
0.0004%
0.7249%
0.0242%
0.0003%
0.0000%
57.3586%
4.0219%
1.6870%
101.4660
9.1319
6.000%
0.5400%
40,488
3,644
4.0488%
0.3644%
Weight by mg
Package Weight (mg):
2,506.0520
% weight of
substance per
package
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03207 Rev. *I
Page 2 of 5
28L - PDIP
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines
Package Qualification Report # 122903 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ28Amkor
Philippines
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03207 Rev. *I
Page 3 of 5
28L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Die
Wire
Adhesive
Circuit
Interconnect
Mold
Compound
Encapsulation
600.6974
14.7940
0.7397
0.1849
1.8470
32.0750
97.1589
2.3929
0.1196
0.0299
0.2987
100.0000
292,409
7,201
360
90
899
15,615
% weight
of
substance
per
package
29.2409
0.7201
0.0360
0.0090
0.0899
1.5615
Trade Secret
7440-22-4
Trade Secret
0.2344
2.3437
0.1004
7.0000
70.0000
3.0000
114
1,141
49
0.0114
0.1141
0.0049
Trade Secret
Trade Secret
0.1674
0.1674
5.0000
5.0000
81
81
0.0081
0.0081
Trade Secret
0.3348
10.0000
163
0.0163
7440-21-3
7440-50-8
Trade Secret
14.9796
0.4869
103.8867
100.0000
100.0000
7.5000
7,292
237
50,570
0.7292
0.0237
5.0570
60676-86-0
1333-86-4
Trade Secret
1191.2336
6.9258
27.7031
86.0000
0.5000
2.0000
579,871
3,371
13,485
57.9871
0.3371
1.3485
Trade Secret
55.4062
4.0000
26,971
2.6971
Package Weight (mg):
2,054.3080
% Total:
100.0000
Substance
Composition
Copper (Cu)
Iron (Fe)
Zinc (Z)
Phosphorus (P)
Silver (Ag)
Tin (Sn)
Resin
Silver
Mixed aryl allyl
glycidyl compounds
Amine
Gamma
Butyrolactone
Diglycidylether of
bisphenol-F
Silicon
Copper (Cu)
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
CAS Number
Weight by mg
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
7440-31-5
% weight of
substance per
Homogenous
material
PPM
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03207 Rev. *I
Page 4 of 5
28L - PDIP
Pb-Free Package
Document History Page
Document Title:
Document Number:
28L-PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03207
Rev. ECN No. Orig. of
Description of Change
Change
**
385878
EML
New document
*A
639358
XRN/MRB 1. Updated Cypress Logo
2. Added on the material composition the percent weight
per homogeneous material and weight of substance
3. Updated and added Lead, Cr+VI, PBB and PBDE on
the Declaration of Packaging/Indirect Materials.
Added note 4: Engineering Calculations were applied
to derive individual package data.
*B
2617585 MAHA
Added Note 4: Actual testing performed on package
family basis. Engineering calculations were applied to
derive individual package data.
*C
2769732 MAHA
Added data for assembly site 2.
*D
3476432 MAHA
Deleted Assembly Site 1 – Omedata. Recalculated the
die attach composition of assembly site 1. Recalculated
PPM and % weight of substance per package values of
assembly site 1. Expressed the weight by mg, package
weight, % weight of substance per Homogeneous
material, and % weight of substance per package in four
decimal places.
*E
3892230 HLR
Sunset Due – No Change
*F
3925886 VFR
Added PMDD for Site 2 – Amkor Technology Philippines;
reference QTP # 122903
*G
4032217 YUM
Added assembly site name in the Assembly heading in
site 1 and 2.
Changed Assembly code to Assembly site name in site 1
and 2.
*H
4834550 ZJL
Deleted Assembly Site 1 – MMT and replaced with
PMDD data of new assembly site Lingsen Taiwan.
*I
5142476 HLR
Changed the substances with “------------- “to “Trade
Secret.
DCON
Removed “Distribution: WEB” and “Posting: None” from
history page
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03207 Rev. *I
Page 5 of 5