28L - PDIP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 PZ 2,506.0520 mg Body Size (mil/mm) Package Weight – Site 2 300 mils 2,054.3080 mg SUMMARY The 28L-300 mils PDIP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Lingsen Taiwan Package Qualification Report # 151901 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-PZ28-LP As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03207 Rev. *I Page 1 of 5 28L - PDIP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Lead frame Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Copper (Cu) Iron (Fe) Zinc (Zn) Phosphorus (P) Silver (Ag) Tin (Sn) Impurity Silver (Ag) Epoxy Resin Diluent Phenolic Hardener Dicyandiamide Amine Hardener Silicon (Si) Copper (Cu) Paladium (Pd) Impurity (Au+others) Silica Fused Epoxy Resin Epoxy, Cresol Novolac Phenol Resin Carbon Black 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 7440-31-5 Trade Secret 7440-22-4 9003-36-5 Trade Secret Trade Secret 461-58-5 Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret 60676-86-0 Trade Secret 29690-82-2 Trade Secret 1333-86-4 746.2978 17.6957 0.7694 0.7694 3.8469 24.7401 0.0025 1.5350 0.3070 0.1228 0.0614 0.0102 0.0102 18.1670 0.6073 0.0080 0.0012 1437.4351 100.7896 42.2775 % weight of substance per Homogenous material 97.0000% 2.3000% 0.1000% 0.1000% 0.5000% 99.9900% 0.0100% 75.0000% 15.0000% 6.0000% 3.0000% 0.5000% 0.5000% 100.0000% 98.5000% 1.3000% 0.2000% 85.0000% 5.9600% 2.5000% 297,798 7,061 307 307 1,535 9,872 1 613 123 49 25 4 4 7,249 242 3 0 573,586 40,219 16,870 29.7798% 0.7061% 0.0307% 0.0307% 0.1535% 0.9872% 0.0001% 0.0613% 0.0123% 0.0049% 0.0025% 0.0004% 0.0004% 0.7249% 0.0242% 0.0003% 0.0000% 57.3586% 4.0219% 1.6870% 101.4660 9.1319 6.000% 0.5400% 40,488 3,644 4.0488% 0.3644% Weight by mg Package Weight (mg): 2,506.0520 % weight of substance per package PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Others Material Plastic Tube End Pin End Plug Shielding Bag Lead PPM <2.0 <2.0 <2.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 < 2.0 Cr VI PPM <2.0 <2.0 <2.0 < 2.0 Mercury PPM <2.0 <2.0 <2.0 < 2.0 PBB PPM <0.0005 <0.0005 <0.0005 < 5.0 PBDE PPM <0.0005 <0.0005 <0.0005 < 5.0 Analysis Report (Note2) CoA-PLTB-R CoA-ENDP-R CoA-EPLG-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03207 Rev. *I Page 2 of 5 28L - PDIP Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines Package Qualification Report # 122903 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-PZ28Amkor Philippines As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03207 Rev. *I Page 3 of 5 28L - PDIP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Die Wire Adhesive Circuit Interconnect Mold Compound Encapsulation 600.6974 14.7940 0.7397 0.1849 1.8470 32.0750 97.1589 2.3929 0.1196 0.0299 0.2987 100.0000 292,409 7,201 360 90 899 15,615 % weight of substance per package 29.2409 0.7201 0.0360 0.0090 0.0899 1.5615 Trade Secret 7440-22-4 Trade Secret 0.2344 2.3437 0.1004 7.0000 70.0000 3.0000 114 1,141 49 0.0114 0.1141 0.0049 Trade Secret Trade Secret 0.1674 0.1674 5.0000 5.0000 81 81 0.0081 0.0081 Trade Secret 0.3348 10.0000 163 0.0163 7440-21-3 7440-50-8 Trade Secret 14.9796 0.4869 103.8867 100.0000 100.0000 7.5000 7,292 237 50,570 0.7292 0.0237 5.0570 60676-86-0 1333-86-4 Trade Secret 1191.2336 6.9258 27.7031 86.0000 0.5000 2.0000 579,871 3,371 13,485 57.9871 0.3371 1.3485 Trade Secret 55.4062 4.0000 26,971 2.6971 Package Weight (mg): 2,054.3080 % Total: 100.0000 Substance Composition Copper (Cu) Iron (Fe) Zinc (Z) Phosphorus (P) Silver (Ag) Tin (Sn) Resin Silver Mixed aryl allyl glycidyl compounds Amine Gamma Butyrolactone Diglycidylether of bisphenol-F Silicon Copper (Cu) Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin CAS Number Weight by mg 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 7440-31-5 % weight of substance per Homogenous material PPM II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Others Material Plastic Tube End Pin End Plug Shielding Bag Lead PPM <2.0 <2.0 <2.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 < 2.0 Cr VI PPM <2.0 <2.0 <2.0 < 2.0 Mercury PPM <2.0 <2.0 <2.0 < 2.0 PBB PPM <0.0005 <0.0005 <0.0005 < 5.0 PBDE PPM <0.0005 <0.0005 <0.0005 < 5.0 Analysis Report (Note2) CoA-PLTB-R CoA-ENDP-R CoA-EPLG-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03207 Rev. *I Page 4 of 5 28L - PDIP Pb-Free Package Document History Page Document Title: Document Number: 28L-PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03207 Rev. ECN No. Orig. of Description of Change Change ** 385878 EML New document *A 639358 XRN/MRB 1. Updated Cypress Logo 2. Added on the material composition the percent weight per homogeneous material and weight of substance 3. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials. Added note 4: Engineering Calculations were applied to derive individual package data. *B 2617585 MAHA Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. *C 2769732 MAHA Added data for assembly site 2. *D 3476432 MAHA Deleted Assembly Site 1 – Omedata. Recalculated the die attach composition of assembly site 1. Recalculated PPM and % weight of substance per package values of assembly site 1. Expressed the weight by mg, package weight, % weight of substance per Homogeneous material, and % weight of substance per package in four decimal places. *E 3892230 HLR Sunset Due – No Change *F 3925886 VFR Added PMDD for Site 2 – Amkor Technology Philippines; reference QTP # 122903 *G 4032217 YUM Added assembly site name in the Assembly heading in site 1 and 2. Changed Assembly code to Assembly site name in site 1 and 2. *H 4834550 ZJL Deleted Assembly Site 1 – MMT and replaced with PMDD data of new assembly site Lingsen Taiwan. *I 5142476 HLR Changed the substances with “------------- “to “Trade Secret. DCON Removed “Distribution: WEB” and “Posting: None” from history page Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03207 Rev. *I Page 5 of 5