48L - QFN Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 LY / LT 143.0000 mg 175.1700 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 4 Package Weight – Site 5 B1: 134.9900 mg B2:134.9650 mg B3: 134.9650 mg Package Weight – Site 6 7x7 mm 140.2700 mg B1: 144.7900 mg B2: 143.5145 mg B3: 143.5145 mg N/A SUMMARY The 48L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology SeoulKorea Package Qualification Report # 031803 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LY48Amkor Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 1 of 17 48L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substance Composition Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe P Zn Ag Sn Resin Ag Metal oxide Amine Gamma Butyrolactone Si Au Phenol Resin Epoxy Resin Carbon Black Silica Fused CAS Number 531,119 12,797 140 629 5,944 20,280 2,378 7,832 350 350 53.1119% 1.2797% 0.0140% 0.0629% 0.5944% 2.0280% 0.2378% 0.7832% 0.0350% 0.0350% 0.0500 3.1056 350 0.0350% 8.6700 2.2200 3.2200 4.4000 0.2000 41.0400 100.0000 100.0000 6.5903 9.0053 0.4093 83.9951 60,629 15,524 22,517 30,769 1,399 286,993 6.0629% 1.5524% 2.2517% 3.0769% 0.1399% 28.6993% % Total: 100.0000 Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Trade Secret 7440-22-4 Trade Secret Trade Secret 96-48-0 7440-21-3 7440-57-5 Trade secret Trade secret (1333-86-4) 60676-86-0 Package Weight (mg): 75.9500 1.8300 0.0200 0.0900 0.8500 2.9000 0.3400 1.1200 0.0500 0.0500 %weight of substance per Homogene ous material 96.4567 2.3241 0.0254 0.1143 1.0795 100.0000 21.1180 69.5652 3.1056 3.1056 143.0000 PPM % weight of substance per package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 2 of 17 48L - QFN Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P3/P4) Package Qualification Report # 090603 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT48AAmkor Philippines (P3/P4) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 3 of 17 48L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Purpose of Use Material Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Ag Bismaleimide Methacrylate Ester Polymer Acrylate Si Au Phenol Resin Epoxy Resin Carbon Black Silica Fused Crystalline silica Metal hydro oxide 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret 75.9623 1.8309 0.0234 0.0935 1.1022 0.0238 %weight of substance per Homogene ous material 97.5000 2.3500 0.0300 0.1200 97.5400 2.1100 0.0040 0.3500 28 0.0028% 1.3366 0.0489 82.0000 3.0000 9,529 349 0.9529% 0.0349% Trade Secret 0.0489 3.0000 349 0.0349% Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret 1333-86-4 60676-86-0 14808-60-7 0.0163 0.1793 8.7700 0.8000 4.5026 4.5026 0.2502 32.5195 1.0006 1.0000 11.0000 100.0000 100.0000 9.0000 9.0000 0.5000 65.0000 2.0000 116 1,278 62,522 5,703 32,100 32,100 1,783 231,835 7,133 0.0116% 0.1278% 6.2522% 0.5703% 3.2100% 3.2100% 0.1783% 23.1835% 0.7133% Trade Secret 7.2544 14.5000 51,717 5.1717% % Total: 100.0000 CAS Number Package Weight (mg): Weight by mg 140.2700 % weight of substance per package PPM 541,543 13,053 167 667 7,858 170 54.1543% 1.3053% 0.0167% 0.0667% 0.7858% 0.0170% II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 4 of 17 48L - QFN Pb-Free Package ASSEMBLY Site 3: CARSEM Malaysia Package Qualification Report # 083701 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT48CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 5 of 17 48L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Base Material Lead Finish External Plating Die Attach Circuit Interconnect Mold Compound Encapsulation 56.3625% 1.3187% 0.0114% 0.0742% 0.6736% 0.0571% 0.0114% 0.3026% Trade Secret 0.1500 20.2703 856 0.0856% Trade Secret 0.0200 2.7027 114 0.0114% Trade Secret 96-48-0 7440-21-3 7440-57-5 60676-86-0 (Trade secret ) (Trade secret ) (1333-86-4) 0.0200 0.0200 2.1000 1.1000 64.4100 2.0600 2.0600 0.2100 2.7027 2.7027 100.0000 100.0000 93.7009 2.9968 2.9968 0.3055 114 114 11,988 6,280 367,700 11,760 11,760 1,199 0.0114% 0.0114% 1.1988% 0.6280% 36.7700% 1.1760% 1.1760% 0.1199% Package Weight (mg): 175.1700 % Total 100.0000 Cu Fe P Zn Ni Pd Au Silver Carbocycllic Acrylate Bismaleimide resin Acrylate Additive Si Au Silica Fused Epoxy Resin Phenol Resin Carbon Black Adhesive Die Wire 563,625 13,187 114 742 6,736 571 114 3,026 Substance Composition Purpose of Use Leadframe 98.7300 2.3100 0.0200 0.1300 1.1800 0.1000 0.0200 0.5300 %weight of substance per Homogene ous material 97.5689 2.2828 0.0198 0.1285 90.7692 7.6923 1.5385 71.6216 Weight by mg CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 PPM % weight of substance per package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 6 of 17 48L - QFN Pb-Free Package ASSEMBLY Site 4: Cypress Manufacturing Limited (CML) Package Qualification Report # 102610, 120206, 133308, 150304 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT48CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 7 of 17 48L - QFN Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Silver Carbocycllic Acrylate Bismaleimide resin Acrylate Additive Si Au Pd Silica Fused Crystalline Silica Metal OH Epoxy Resin Phenol Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Weight by (mg) % weight of substance per Homogene ous material % weight of substance per package PPM 68.6800 1.6900 0.0500 0.0800 1.0600 0.0200 0.0200 0.5200 97.4100 2.4000 0.0700 0.1200 96.5200 1.737 1.743 74.0000 474,284 11,685 341 584 7,317 132 132 3,595 47.4284% 1.1685% 0.0341% 0.0584% 0.7317% 0.0132% 0.0132% 0.3595% Trade Secret 0.1400 20.0000 972 0.0972% Trade Secret 0.0100 2.0000 97 0.0097% Trade Secret 96-48-0 7440-21-3 7440-57-5 7440-05-3 60676-86-0 14808-60-7 Trade Secret Trade secret Trade secret 1333-86-4 0.0100 0.0100 9.8500 2.3700 0.0200 51.8200 1.5100 1.8100 2.4100 2.4100 0.3000 2.0000 2.0000 100.0000 99.0000 1.0000 86.0000 2.5000 3.0000 4.0000 4.0000 0.5000 97 97 68,007 16,369 165 357,868 10,403 12,484 16,645 16,645 2,081 0.0097% 0.0097% 6.8007% 1.6369% 0.0165% 35.7868% 1.0403% 1.2484% 1.6645% 1.6645% 0.2081% % Total: 100.0000 Package Weight (mg): 144.7900 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 8 of 17 48L - QFN Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by (mg) Cu Fe P Zn Ni Pd Au Silver Carbocycllic Acrylate Bismaleimide resin Acrylate Additive Si Cu Silica Fused Crystalline Silica Metal OH Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret 96-48-0 7440-21-3 7440-50-8 60676-86-0 14808-60-7 Trade Secret Trade secret Trade secret 1333-86-4 68.6800 1.6900 0.0500 0.0800 1.0600 0.0200 0.0200 0.5200 0.1400 0.0100 0.0100 0.0100 9.8500 1.1145 51.8200 1.5100 1.8100 2.4100 2.4100 0.3000 Package Weight (mg): 143.5145 % weight of substance per Homogeneou s material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7370% 1.7430% 74.0000% 20.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 86.0000% 2.5000% 3.0000% 4.0000% 4.0000% 0.5000% PPM % weight of substance per package 478,558 11,776 348 557 7,386 139 139 3,623 976 70 70 70 68,634 7,766 361,078 10,522 12,612 16,793 16,793 2,090 47.8558% 1.1776% 0.0348% 0.0557% 0.7386% 0.0139% 0.0139% 0.3623% 0.0976% 0.0070% 0.0070% 0.0070% 6.8634% 0.7766% 36.1078% 1.0522% 1.2612% 1.6793% 1.6793% 0.2090% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 9 of 17 48L - QFN Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) USING COPPER-PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by (mg) Cu Fe P Zn Ni Pd Au Silver Carbocycllic Acrylate Bismaleimide resin Acrylate Additive Si Cu Pd Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret 96-48-0 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade secret Trade secret 1333-86-4 68.6800 1.6900 0.0500 0.0800 1.0600 0.0200 0.0200 0.5200 0.1400 0.0100 0.0100 0.0100 9.8500 1.1143 0.0002 52.8782 4.2182 3.0130 0.1506 Package Weight (mg): 143.5145 % weight of substance per Homogeneou s material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7370% 1.7430% 74.0000% 20.0000% 2.0000% 2.0000% 2.0000% 100.0000% 99.9800% 0.0200% 87.7500% 7.0000% 5.0000% 0.2500% PPM % weight of substance per package 478,558 11,776 348 557 7,386 139 139 3,623 976 70 70 70 68,634 7,764 2 368452 29392 20994 1049 47.8558% 1.1776% 0.0348% 0.0557% 0.7386% 0.0139% 0.0139% 0.3623% 0.0976% 0.0070% 0.0070% 0.0070% 6.8634% 0.7764% 0.0002% 36.8452% 2.9392% 2.0994% 0.1049% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 10 of 17 48L - QFN Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 PBDE PPM <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Material Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 11 of 17 48L - QFN Pb-Free Package ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 112107, 114905, 133309 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT48-ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 12 of 17 48L - QFN Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE Material Lead Frame Purpose of Use Base material Lead Finish External Plating 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret1333-86-4 60676-86-0 47.9900 1.2100 0.0400 0.0800 0.6400 0.0300 0.0100 1.8900 % weight of substance per Homogeneo us material 97.3000 2.4500 0.0900 0.1600 94.3900 4.4100 1.2000 70.0000 0.2000 7.5000 1,482 0.1482% 0.2500 9.2500 1,852 0.1852% 0.0900 3.5000 667 0.0667% 0.2000 7.5000 1,482 0.1482% 0.0300 1.0000 222 0.0222% 0.0300 9.8000 0.4999 1.2500 100.0000 99.9900 0.0100 222 72,598 3,703 0.0222% 7.2598% 0.3703% 1 0.0001% Package Weight (mg): 134.9900 Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Die Attach Adhesive Butadiene copolymer Acrylate Peroxide Die Circuit Wire Interconnect Additive Silicon Gold Ion Impurities Epoxy Resin A Mold Compound Encapsulation Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number Weight by mg 0.0001 % weight of substance per package PPM 355,508 8,964 296 593 4,741 222 74 14,001 35.5508% 0.8964% 0.0296% 0.0593% 0.4741% 0.0222% 0.0074% 1.4001% 3.2400 4.5000 24,002 2.4002% 2.1600 3.0000 16,001 1.6001% 4.7500 0.3600 61.4900 6.6000 0.5000 85.4000 35,188 2,667 455,514 3.5188% 0.2667% 45.5514% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 13 of 17 48L - QFN Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 73.0723 1.8400 0.0676 0.1202 0.9703 0.0454 0.0123 0.5600 0.0600 % weight of substance per Homogene ous material 97.3000 2.4500 0.0900 0.1600 94.3880 4.4120 1.2000 70.0000 7.5000 541,417 13,633 501 890 7,189 336 91 4,149 445 54.1417% 1.3633% 0.0501% 0.0890% 0.7189% 0.0336% 0.0091% 0.4149% 0.0445% Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 0.0740 0.0280 0.0600 0.0080 0.0100 6.9990 0.2800 2.2841 1.5227 3.3500 0.2538 43.3473 9.2500 3.5000 7.5000 1.0000 1.2500 100.0000 100.0000 4.5000 3.0000 6.6000 0.5000 85.4000 548 207 445 59 74 51,858 2,076 16,924 11,282 24,821 1,880 321,175 0.0548% 0.0207% 0.0445% 0.0059% 0.0074% 5.1858% 0.2076% 1.6924% 1.1282% 2.4821% 0.1880% 32.1175% Package Weight (mg): 134.9650 % Total: 100.0000 Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Copper Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Weight by mg PPM % weight of substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 14 of 17 48L - QFN Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) USING COPPER-PALLADIUM WIRE Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation 73.0723 1.8400 0.0676 0.1202 0.9703 0.0454 0.0123 0.5600 0.0600 % weight of substance per Homogene ous material 97.3000 2.4500 0.0900 0.1600 94.3880 4.4120 1.2000 70.0000 7.5000 541,417 13,633 501 890 7,189 336 91 4,149 445 54.1417% 1.3633% 0.0501% 0.0890% 0.7189% 0.0336% 0.0091% 0.4149% 0.0445% Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 0.0740 0.0280 0.0600 0.0080 0.0100 6.9990 0.2799 0.0001 2.2841 1.5227 3.3500 0.2538 43.3473 9.2500 3.5000 7.5000 1.0000 1.2500 100.0000 99.9800 0.0200 4.5000 3.0000 6.6000 0.5000 85.4000 548 207 445 59 74 51,858 2,075 1 16,924 11,282 24,821 1,880 321,175 0.0548% 0.0207% 0.0445% 0.0059% 0.0074% 5.1858% 0.2075% 0.0001% 1.6924% 1.1282% 2.4821% 0.1880% 32.1175% Package Weight (mg): 134.9650 % Total: 100.0000 Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Weight by mg PPM % weight of substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 15 of 17 48L - QFN Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 Shielding bag <2.0 Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 <2.0 <2.0 <2.0 <5.0 <5.0 Cadmium PPM PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 16 of 17 48L - QFN Pb-Free Package Document History Page Document Title: 48L - QFN Pb-Free Package Material Declaration Datasheet Document Number: 001-04326 Rev. ** *A *B *C *D *E *F *G *H *I *J *K *L *M ECN No. Orig. of Description of Change Change 390888 YXP New Specification 596677 YRB Added column for %weight of substance per homogeneous material in material composition. Added column for Lead, Cr VI, PBB, PBDE in declaration of packaging indirect materials. Removed the following indirect materials such as moisture barrier bag, protective band, shipping and inner/pizza box. Updated Cypress Logo Change assembly location from M to L on analysis report column under Banned Substances. 2679173 DPT Add Amkor Phil (P3) for 48QFN (LT48A). Change distribution from CML to WEB. 2683314 EBZ/ Added Carsem Malaysia (CA) as additional site for 48QFN HLR (LT48A). Added Note 4 on footer section. 3078566 TSV Add Cypress Mfg ltd. (RA) as additional site for the 48QFN (LT48A) 3264898 VFR Added Assembly Site 5, ASE-G. Reference QTP # 112107. 3465207 VFR Added Assembly Site 6 – ASE Taiwan (G) Copper wire qualification. Reference QTP # 114905. 3578203 UDR Added B2 for Assembly Site 4 – Autoline (CML-RA) Copper wire qualification. Reference QTP # 120206. 3855071 JARG Corrected Material Composition Tables for Assembly Sites 1, 2, 3, 4:B1 and 5 to meet 4 decimal places on values. 4033441 YUM Added assembly site name in the Assembly heading in site 1, 2, 3, 4 and 5. Changed Assembly Code to Assembly Site Name in site 1, 2, 3, 4 and 5. Removed entire Tube row in the Indirect Materials Section. 4087009 YUM Added “P3/P4” in the assembly heading in site 2. Consolidated material composition in one assembly site (ASET). 4103713 MLA Added copper-palladium wire options for Site4 (QTP133308) and Site5 (QTP133309). 4741000 CMG Added QTP# 150304 on Assembly Site 4, CorrectedAssembly Site 4 – B3 material composition due to error in mold compound substance composition 5108997 MRB Changed CAS # from Proprietary and “---------“to Trade Secret Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04326 Rev. *M Page 17 of 17