48L - QFN PB-free Package Material Declaration Datasheet.pdf

48L - QFN
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
LY / LT
143.0000 mg
175.1700 mg
Body Size (mil/mm)
Package Weight – Site 2
Package Weight – Site 4
Package Weight – Site 5
B1: 134.9900 mg
B2:134.9650 mg
B3: 134.9650 mg
Package Weight – Site 6
7x7 mm
140.2700 mg
B1: 144.7900 mg
B2: 143.5145 mg
B3: 143.5145 mg
N/A
SUMMARY
The 48L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology SeoulKorea
Package Qualification Report # 031803 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LY48Amkor Seoul
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 1 of 17
48L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substance
Composition
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Cu
Fe
P
Zn
Ag
Sn
Resin
Ag
Metal oxide
Amine
Gamma
Butyrolactone
Si
Au
Phenol Resin
Epoxy Resin
Carbon Black
Silica Fused
CAS Number
531,119
12,797
140
629
5,944
20,280
2,378
7,832
350
350
53.1119%
1.2797%
0.0140%
0.0629%
0.5944%
2.0280%
0.2378%
0.7832%
0.0350%
0.0350%
0.0500
3.1056
350
0.0350%
8.6700
2.2200
3.2200
4.4000
0.2000
41.0400
100.0000
100.0000
6.5903
9.0053
0.4093
83.9951
60,629
15,524
22,517
30,769
1,399
286,993
6.0629%
1.5524%
2.2517%
3.0769%
0.1399%
28.6993%
% Total:
100.0000
Weight by
mg
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
Trade Secret
7440-22-4
Trade Secret
Trade Secret
96-48-0
7440-21-3
7440-57-5
Trade secret
Trade secret
(1333-86-4)
60676-86-0
Package Weight (mg):
75.9500
1.8300
0.0200
0.0900
0.8500
2.9000
0.3400
1.1200
0.0500
0.0500
%weight of
substance
per
Homogene
ous
material
96.4567
2.3241
0.0254
0.1143
1.0795
100.0000
21.1180
69.5652
3.1056
3.1056
143.0000
PPM
% weight of
substance
per
package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Lead
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmium
PPM
<20.0
<5.0
< 5.0
< 5.0
Cr VI
PPM
<20.0
<5.0
< 5.0
< 5.0
Mercury
PPM
<20.0
<10.0
< 10.0
< 10.0
PBB
PPM
<20.0
<50.0
<50.0
<50.0
PBDE
PPM
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
Material
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 2 of 17
48L - QFN
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P3/P4)
Package Qualification Report # 090603 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT48AAmkor Philippines
(P3/P4)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 3 of 17
48L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Purpose of
Use
Material
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Ag
Bismaleimide
Methacrylate
Ester
Polymer
Acrylate
Si
Au
Phenol Resin
Epoxy Resin
Carbon Black
Silica Fused
Crystalline silica
Metal hydro
oxide
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
Trade Secret
75.9623
1.8309
0.0234
0.0935
1.1022
0.0238
%weight of
substance
per
Homogene
ous
material
97.5000
2.3500
0.0300
0.1200
97.5400
2.1100
0.0040
0.3500
28
0.0028%
1.3366
0.0489
82.0000
3.0000
9,529
349
0.9529%
0.0349%
Trade Secret
0.0489
3.0000
349
0.0349%
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
1333-86-4
60676-86-0
14808-60-7
0.0163
0.1793
8.7700
0.8000
4.5026
4.5026
0.2502
32.5195
1.0006
1.0000
11.0000
100.0000
100.0000
9.0000
9.0000
0.5000
65.0000
2.0000
116
1,278
62,522
5,703
32,100
32,100
1,783
231,835
7,133
0.0116%
0.1278%
6.2522%
0.5703%
3.2100%
3.2100%
0.1783%
23.1835%
0.7133%
Trade Secret
7.2544
14.5000
51,717
5.1717%
% Total:
100.0000
CAS Number
Package Weight (mg):
Weight by
mg
140.2700
% weight of
substance
per package
PPM
541,543
13,053
167
667
7,858
170
54.1543%
1.3053%
0.0167%
0.0667%
0.7858%
0.0170%
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Lead
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmium
PPM
<20.0
<5.0
< 5.0
< 5.0
Cr VI
PPM
<20.0
<5.0
< 5.0
< 5.0
Mercury
PPM
<20.0
<10.0
< 10.0
< 10.0
PBB
PPM
<20.0
<50.0
<50.0
<50.0
PBDE
PPM
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
Material
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 4 of 17
48L - QFN
Pb-Free Package
ASSEMBLY Site 3: CARSEM Malaysia
Package Qualification Report # 083701
(Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT48CARSEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 5 of 17
48L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Base Material
Lead Finish
External Plating
Die Attach
Circuit
Interconnect
Mold Compound
Encapsulation
56.3625%
1.3187%
0.0114%
0.0742%
0.6736%
0.0571%
0.0114%
0.3026%
Trade Secret
0.1500
20.2703
856
0.0856%
Trade Secret
0.0200
2.7027
114
0.0114%
Trade Secret
96-48-0
7440-21-3
7440-57-5
60676-86-0
(Trade secret )
(Trade secret )
(1333-86-4)
0.0200
0.0200
2.1000
1.1000
64.4100
2.0600
2.0600
0.2100
2.7027
2.7027
100.0000
100.0000
93.7009
2.9968
2.9968
0.3055
114
114
11,988
6,280
367,700
11,760
11,760
1,199
0.0114%
0.0114%
1.1988%
0.6280%
36.7700%
1.1760%
1.1760%
0.1199%
Package Weight (mg):
175.1700
% Total
100.0000
Cu
Fe
P
Zn
Ni
Pd
Au
Silver
Carbocycllic
Acrylate
Bismaleimide
resin
Acrylate
Additive
Si
Au
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Adhesive
Die
Wire
563,625
13,187
114
742
6,736
571
114
3,026
Substance
Composition
Purpose of Use
Leadframe
98.7300
2.3100
0.0200
0.1300
1.1800
0.1000
0.0200
0.5300
%weight of
substance
per
Homogene
ous
material
97.5689
2.2828
0.0198
0.1285
90.7692
7.6923
1.5385
71.6216
Weight by
mg
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
PPM
% weight of
substance
per
package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Lead
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmium
PPM
<20.0
<5.0
< 5.0
< 5.0
Cr VI
PPM
<20.0
<5.0
< 5.0
< 5.0
Mercury
PPM
<20.0
<10.0
< 10.0
< 10.0
PBB
PPM
<20.0
<50.0
<50.0
<50.0
PBDE
PPM
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
Material
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 6 of 17
48L - QFN
Pb-Free Package
ASSEMBLY Site 4: Cypress Manufacturing Limited (CML)
Package Qualification Report # 102610, 120206, 133308, 150304 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT48CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 7 of 17
48L - QFN
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING GOLD WIRE
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Silver
Carbocycllic
Acrylate
Bismaleimide
resin
Acrylate
Additive
Si
Au
Pd
Silica Fused
Crystalline Silica
Metal OH
Epoxy Resin
Phenol Resin
Carbon Black
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Weight by
(mg)
% weight
of
substance
per
Homogene
ous
material
% weight of
substance
per package
PPM
68.6800
1.6900
0.0500
0.0800
1.0600
0.0200
0.0200
0.5200
97.4100
2.4000
0.0700
0.1200
96.5200
1.737
1.743
74.0000
474,284
11,685
341
584
7,317
132
132
3,595
47.4284%
1.1685%
0.0341%
0.0584%
0.7317%
0.0132%
0.0132%
0.3595%
Trade Secret
0.1400
20.0000
972
0.0972%
Trade Secret
0.0100
2.0000
97
0.0097%
Trade Secret
96-48-0
7440-21-3
7440-57-5
7440-05-3
60676-86-0
14808-60-7
Trade Secret
Trade secret
Trade secret
1333-86-4
0.0100
0.0100
9.8500
2.3700
0.0200
51.8200
1.5100
1.8100
2.4100
2.4100
0.3000
2.0000
2.0000
100.0000
99.0000
1.0000
86.0000
2.5000
3.0000
4.0000
4.0000
0.5000
97
97
68,007
16,369
165
357,868
10,403
12,484
16,645
16,645
2,081
0.0097%
0.0097%
6.8007%
1.6369%
0.0165%
35.7868%
1.0403%
1.2484%
1.6645%
1.6645%
0.2081%
% Total:
100.0000
Package Weight (mg):
144.7900
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 8 of 17
48L - QFN
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
USING COPPER WIRE
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
(mg)
Cu
Fe
P
Zn
Ni
Pd
Au
Silver
Carbocycllic Acrylate
Bismaleimide resin
Acrylate
Additive
Si
Cu
Silica Fused
Crystalline Silica
Metal OH
Epoxy Resin
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
96-48-0
7440-21-3
7440-50-8
60676-86-0
14808-60-7
Trade Secret
Trade secret
Trade secret
1333-86-4
68.6800
1.6900
0.0500
0.0800
1.0600
0.0200
0.0200
0.5200
0.1400
0.0100
0.0100
0.0100
9.8500
1.1145
51.8200
1.5100
1.8100
2.4100
2.4100
0.3000
Package Weight (mg):
143.5145
% weight of
substance per
Homogeneou
s material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7370%
1.7430%
74.0000%
20.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
86.0000%
2.5000%
3.0000%
4.0000%
4.0000%
0.5000%
PPM
% weight of
substance
per package
478,558
11,776
348
557
7,386
139
139
3,623
976
70
70
70
68,634
7,766
361,078
10,522
12,612
16,793
16,793
2,090
47.8558%
1.1776%
0.0348%
0.0557%
0.7386%
0.0139%
0.0139%
0.3623%
0.0976%
0.0070%
0.0070%
0.0070%
6.8634%
0.7766%
36.1078%
1.0522%
1.2612%
1.6793%
1.6793%
0.2090%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 9 of 17
48L - QFN
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
USING COPPER-PALLADIUM WIRE
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
(mg)
Cu
Fe
P
Zn
Ni
Pd
Au
Silver
Carbocycllic Acrylate
Bismaleimide resin
Acrylate
Additive
Si
Cu
Pd
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
96-48-0
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade secret
Trade secret
1333-86-4
68.6800
1.6900
0.0500
0.0800
1.0600
0.0200
0.0200
0.5200
0.1400
0.0100
0.0100
0.0100
9.8500
1.1143
0.0002
52.8782
4.2182
3.0130
0.1506
Package Weight (mg):
143.5145
% weight of
substance per
Homogeneou
s material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7370%
1.7430%
74.0000%
20.0000%
2.0000%
2.0000%
2.0000%
100.0000%
99.9800%
0.0200%
87.7500%
7.0000%
5.0000%
0.2500%
PPM
% weight of
substance
per package
478,558
11,776
348
557
7,386
139
139
3,623
976
70
70
70
68,634
7,764
2
368452
29392
20994
1049
47.8558%
1.1776%
0.0348%
0.0557%
0.7386%
0.0139%
0.0139%
0.3623%
0.0976%
0.0070%
0.0070%
0.0070%
6.8634%
0.7764%
0.0002%
36.8452%
2.9392%
2.0994%
0.1049%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 10 of 17
48L - QFN
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Lead
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmium
PPM
<20.0
<5.0
< 5.0
< 5.0
Cr VI
PPM
<20.0
<5.0
< 5.0
< 5.0
Mercury
PPM
<20.0
<10.0
< 10.0
< 10.0
PBB
PPM
<20.0
<50.0
<50.0
<50.0
PBDE
PPM
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
Material
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 11 of 17
48L - QFN
Pb-Free Package
ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 112107, 114905, 133309 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT48-ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 12 of 17
48L - QFN
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING GOLD WIRE
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-57-5
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret1333-86-4
60676-86-0
47.9900
1.2100
0.0400
0.0800
0.6400
0.0300
0.0100
1.8900
% weight of
substance
per
Homogeneo
us material
97.3000
2.4500
0.0900
0.1600
94.3900
4.4100
1.2000
70.0000
0.2000
7.5000
1,482
0.1482%
0.2500
9.2500
1,852
0.1852%
0.0900
3.5000
667
0.0667%
0.2000
7.5000
1,482
0.1482%
0.0300
1.0000
222
0.0222%
0.0300
9.8000
0.4999
1.2500
100.0000
99.9900
0.0100
222
72,598
3,703
0.0222%
7.2598%
0.3703%
1
0.0001%
Package Weight (mg):
134.9900
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Die Attach
Adhesive
Butadiene copolymer
Acrylate
Peroxide
Die
Circuit
Wire
Interconnect
Additive
Silicon
Gold
Ion Impurities
Epoxy Resin A
Mold
Compound
Encapsulation
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS
Number
Weight by
mg
0.0001
% weight of
substance per
package
PPM
355,508
8,964
296
593
4,741
222
74
14,001
35.5508%
0.8964%
0.0296%
0.0593%
0.4741%
0.0222%
0.0074%
1.4001%
3.2400
4.5000
24,002
2.4002%
2.1600
3.0000
16,001
1.6001%
4.7500
0.3600
61.4900
6.6000
0.5000
85.4000
35,188
2,667
455,514
3.5188%
0.2667%
45.5514%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 13 of 17
48L - QFN
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
USING COPPER WIRE
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
73.0723
1.8400
0.0676
0.1202
0.9703
0.0454
0.0123
0.5600
0.0600
% weight
of
substance
per
Homogene
ous
material
97.3000
2.4500
0.0900
0.1600
94.3880
4.4120
1.2000
70.0000
7.5000
541,417
13,633
501
890
7,189
336
91
4,149
445
54.1417%
1.3633%
0.0501%
0.0890%
0.7189%
0.0336%
0.0091%
0.4149%
0.0445%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
0.0740
0.0280
0.0600
0.0080
0.0100
6.9990
0.2800
2.2841
1.5227
3.3500
0.2538
43.3473
9.2500
3.5000
7.5000
1.0000
1.2500
100.0000
100.0000
4.5000
3.0000
6.6000
0.5000
85.4000
548
207
445
59
74
51,858
2,076
16,924
11,282
24,821
1,880
321,175
0.0548%
0.0207%
0.0445%
0.0059%
0.0074%
5.1858%
0.2076%
1.6924%
1.1282%
2.4821%
0.1880%
32.1175%
Package Weight (mg):
134.9650
% Total:
100.0000
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene copolymer
Acrylate
Peroxide
Additive
Silicon
Copper
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Weight by
mg
PPM
% weight of
substance
per package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 14 of 17
48L - QFN
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
USING COPPER-PALLADIUM WIRE
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
73.0723
1.8400
0.0676
0.1202
0.9703
0.0454
0.0123
0.5600
0.0600
% weight
of
substance
per
Homogene
ous
material
97.3000
2.4500
0.0900
0.1600
94.3880
4.4120
1.2000
70.0000
7.5000
541,417
13,633
501
890
7,189
336
91
4,149
445
54.1417%
1.3633%
0.0501%
0.0890%
0.7189%
0.0336%
0.0091%
0.4149%
0.0445%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
0.0740
0.0280
0.0600
0.0080
0.0100
6.9990
0.2799
0.0001
2.2841
1.5227
3.3500
0.2538
43.3473
9.2500
3.5000
7.5000
1.0000
1.2500
100.0000
99.9800
0.0200
4.5000
3.0000
6.6000
0.5000
85.4000
548
207
445
59
74
51,858
2,075
1
16,924
11,282
24,821
1,880
321,175
0.0548%
0.0207%
0.0445%
0.0059%
0.0074%
5.1858%
0.2075%
0.0001%
1.6924%
1.1282%
2.4821%
0.1880%
32.1175%
Package Weight (mg):
134.9650
% Total:
100.0000
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene copolymer
Acrylate
Peroxide
Additive
Silicon
Copper
Palladium
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Weight by
mg
PPM
% weight of
substance
per package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 15 of 17
48L - QFN
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Lead
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
Shielding bag
<2.0
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
<2.0
<2.0
<2.0
<5.0
<5.0
Cadmium
PPM
PBDE
PPM
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 16 of 17
48L - QFN
Pb-Free Package
Document History Page
Document Title:
48L - QFN Pb-Free Package Material Declaration Datasheet
Document Number: 001-04326
Rev.
**
*A
*B
*C
*D
*E
*F
*G
*H
*I
*J
*K
*L
*M
ECN No. Orig. of Description of Change
Change
390888
YXP
New Specification
596677
YRB
Added column for %weight of substance per homogeneous
material in material composition.
Added column for Lead, Cr VI, PBB, PBDE in declaration of
packaging indirect materials.
Removed the following indirect materials such as moisture barrier
bag, protective band, shipping and inner/pizza box.
Updated Cypress Logo
Change assembly location from M to L on analysis report column
under Banned Substances.
2679173 DPT
Add Amkor Phil (P3) for 48QFN (LT48A). Change distribution from
CML to WEB.
2683314 EBZ/
Added Carsem Malaysia (CA) as additional site for 48QFN
HLR
(LT48A).
Added Note 4 on footer section.
3078566 TSV
Add Cypress Mfg ltd. (RA) as additional site for the 48QFN (LT48A)
3264898 VFR
Added Assembly Site 5, ASE-G. Reference QTP # 112107.
3465207 VFR
Added Assembly Site 6 – ASE Taiwan (G) Copper wire
qualification. Reference QTP # 114905.
3578203 UDR
Added B2 for Assembly Site 4 – Autoline (CML-RA) Copper wire
qualification. Reference QTP # 120206.
3855071 JARG
Corrected Material Composition Tables for Assembly Sites 1, 2, 3,
4:B1 and 5 to meet 4 decimal places on values.
4033441 YUM
Added assembly site name in the Assembly heading in site 1, 2, 3,
4 and 5.
Changed Assembly Code to Assembly Site Name in site 1, 2, 3, 4
and 5.
Removed entire Tube row in the Indirect Materials Section.
4087009 YUM
Added “P3/P4” in the assembly heading in site 2.
Consolidated material composition in one assembly site (ASET).
4103713 MLA
Added copper-palladium wire options for Site4 (QTP133308) and
Site5 (QTP133309).
4741000 CMG
Added QTP# 150304 on Assembly Site 4,
CorrectedAssembly Site 4 – B3 material composition due to error in
mold compound substance composition
5108997 MRB
Changed CAS # from Proprietary and “---------“to Trade Secret
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04326 Rev. *M
Page 17 of 17