24L-TSSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

24L - TSSOP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
ZZ
95.5902 mg
Package Weight – Site 3
B1: 93.2201 mg
B2: 111.8387 mg
Body Size (mil/mm)
Package Weight – Site 2
4.4 mm
B1: 87.6724 mg
B2: 92.5632 mg
SUMMARY
The 24L-TSSOP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 040807 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZZ24-CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 1 of 9
24L - TSSOP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic peroxide
Si
Au
Epoxy resin
Phenol resin
Brominated
epoxy resin
Antimony trioxide
Silica
Others
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
----------------------
32.3207
0.8694
0.0500
0.0700
0.1930
0.0035
0.0035
0.1600
0.0180
% weight of
substance per
Homogenous
material
97.0300
2.6100
0.1500
0.2100
96.5200
1.7400
1.7400
80.0000
9.0000
----------------------
0.0100
---------------------------------------------------------------7440-21-3
7440-57-5
129915-35-1
26834-02-6
---------------------1309-64-4
7631-86-9
----------------------
CAS Number
Package Weight (mg):
338,051
9,056
522
697
1,961
99
32
1,775
200
% weight of
Substance
per
package
33.8118
0.9095
0.0523
0.0732
0.2019
0.0036
0.0036
0.1674
0.0188
5.0000
111
0.0105
0.0040
0.0040
0.0040
2.9700
0.8400
2.8977
2.8977
0.5807
2.0000
2.0000
2.0000
100.0000
100.0000
4.9900
4.9900
1.0000
44
44
44
31,070
8,744
30,377
30,377
6,075
0.0042
0.0042
0.0042
3.1070
0.8788
3.0314
3.0314
0.6075
0.2904
50.8229
0.5807
0.5000
87.5200
1.0000
3,038
531,604
6,075
0.3037
53.1676
0.6075
Weight by
mg
95.5902
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 0.5
< 0.5
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 2 of 9
24L - TSSOP
Pb-Free Package
ASSEMBLY Site 2: Orient Semiconductor Electronics Taiwan (OSET)
Package Qualification Report # 043102 / 120605 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZZ24-OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 3 of 9
24L - TSSOP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: USING GOLD WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
Si
Ni
Mg
Tin
7440-50-8
7440-21-3
7440-02-0
7439-95-4
7440-31-5
22.9105
0.1744
0.7645
0.0430
1.5000
% weight of
substance per
Homogenous
material
95.9000%
0.7300%
3.2000%
0.1800%
100.0000%
Silver
Epoxy resin
Metal
GammaButyrolactone
Aromatic
hydrocarbons
Silicon
Gold
Epoxy resin
Phenol resin( 1 )
Phenol resin( 2 )
Carbon black
7440-22-4
Proprietary
Proprietary
96-48-0
0.1633
0.0460
0.0069
0.0069
Proprietary
Silica
Substance
Composition
Others
261,436
1,976
8,724
477
17,110
% weight of
Substance
per
package
26.1320%
0.1989%
0.8720%
0.0490%
1.7109%
71.0000%
20.0000%
3.0000%
3.0000%
1,782
502
75
75
0.1863%
0.0525%
0.0079%
0.0079%
0.0069
3.0000%
75
0.0079%
7440-21-3
7440-57-5
Trade secret
Trade secret
Trade secret
1333-86-4
5.1700
0.8800
2.8000
1.4000
1.4000
0.1120
100.0000%
100.0000%
5.0000%
2.5000%
2.5000%
0.2000%
58,971
10,038
31,938
15,969
15,969
1,278
5.8970%
1.0037%
3.1937%
1.5969%
1.5969%
0.1277%
60676-86-0
49.1680
87.8000%
560,830
56.0815%
--------------------
1.1200
2.0000%
12,775
1.2775%
CAS Number
Package Weight (mg):
Weight by
mg
87.6724
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 4 of 9
100.0000
24L - TSSOP
Pb-Free Package
B2: USING COPPER WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
24.7461
0.8478
0.1921
0.0464
0.6624
2.2231
% weight of
substance per
Homogenous
material
93.4000%
3.2000%
0.7250%
0.1750%
2.5000%
100.0000%
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
0.1020
0.0055
0.0083
0.0055
0.0083
0.0069
461-58-5
Trade Secret
7440-21-3
7440-50-8
Trade Secret
29690-82-2
Trade Secret
Trade Secret
1333-86-4
60676-86-0
76361-86-9
14808-60-7
CAS Number
Copper
Nickel
Silicon
Magnesium
Silver
Tin
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-22-4
7440-31-5
Silver
Epoxy resin A
Epoxy resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic peroxide
Silicon
Copper
Epoxy resin A
Epoxy,Cresol
Novolac
Phenol resin
Metal Hydroxide
Carbon Black
Silica Fused A
Silica Fused B
Silica,crystalline
Package Weight (mg):
267,343
9,159
2,075
501
7,156
24,017
% weight of
Substance
per
package
26.7343%
0.9159%
0.2075%
0.0501%
0.7156%
2.4017%
74.0000%
4.0000%
6.0000%
4.0000%
6.0000%
5.0000%
1,102
59
90
59
90
75
0.1102%
0.0059%
0.0090%
0.0059%
0.0090%
0.0075%
0.0007
0.0007
2.3558
0.1934
3.0579
3.0579
0.5000%
0.5000%
100.0000%
100.0000%
5.0000%
5.0000%
8
8
25,451
2,089
33,036
33,036
0.0008%
0.0008%
2.5451%
0.2089%
3.3036%
3.3036%
3.0579
3.0579
0.1835
42.4438
6.1158
0.1835
5.0000%
5.0000%
0.3000%
69.4000%
10.0000%
0.3000%
33,036
33,036
1,982
458,538
66,072
1,982
3.3036%
3.3036%
0.1982%
45.8538%
6.6072%
0.1982%
% Total:
100.0000
Weight by
mg
92.5632
PPM
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 0.5
< 0.5
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 5 of 9
24L - TSSOP
Pb-Free Package
ASSEMBLY Site 3: Amkor Technology Philippines (P1/P2)
Package Qualification Report # 032101 / 122204 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZZ24Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 6 of 9
24L - TSSOP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING Au WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
Ni
Si
Mg
Ag
Tin
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-22-4
7440-31-5
39.7412
1.2409
0.2707
0.0583
0.3290
2.3400
% weight of
substance per
Homogenous
material
95.4400
2.9800
0.6500
0.1400
0.7900
100.0000
Resin
Ag
Metal Oxide
Amine
Gamma
Butyrolactone
Silicon
Gold
Multi-aromatic
Resin
SiO2 Filler
Proprietary
7440-22-4
Proprietary
Proprietary
96-48-0
0.1491
0.4970
0.0213
0.0213
0.0213
7440-21-3
7440-57-5
Proprietary
60676-86-0
Substance
Composition
CAS Number
Package Weight (mg):
426,303
13,302
2,896
644
3,540
25,102
% weight of
Substance
per
package
42.6316
1.3311
0.2903
0.0625
0.3529
2.5102
21.0000
70.0000
3.0000
3.0000
3.0000
1,609
5,364
215
215
215
0.1599
0.5331
0.0228
0.0228
0.0228
2.3800
0.5200
7.3008
100.0000
100.0000
16.0000
25,531
5,578
78,309
2.5531
0.5578
7.8318
38.3292
84.0000
411,178
41.1169
Weight by
mg
93.2201
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 7 of 9
100.0000
24L - TSSOP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
USING Cu WIRE
Material
Lead frame
Lead Finish
Die Attach
Die
Wire
Purpose of
Use
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Phosphorus (P)
Silver (Ag)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
45.4357
1.1190
0.0559
0.0140
0.7361
% weight of
substance per
Homogenous
material
95.9355
2.3627
0.1181
0.0295
1.5542
Tin (Sn)
7440-31-5
2.7249
100.0000
24,366
2.4366
----------------------------------7440-22-4
------------------
0.0176
0.0101
0.1938
0.0101
7.0000
4.0000
77.0000
4.0000
158
90
1,733
90
0.0158
0.0090
0.1733
0.0090
------------------
0.0101
4.0000
90
0.0090
------------------
0.0101
4.0000
90
0.0090
7440-21-3
7440-50-8
-----------------60676-86-0
-----------------1333-86-4
0.8880
0.1353
5.4430
50.8015
3.9311
0.3024
100.0000
100.0000
9.0000
84.0000
6.5000
0.5000
7,940
1,210
48,668
454,239
35,149
2,704
0.7940
0.1210
4.8668
45.4239
3.5149
0.2704
Package Weight (mg):
111.8387
% Total:
100.0000
Substance
Composition
Epoxy Resin A
Epoxy Resin B
Silver (Ag)
Lactone
Polyoxypropylenedi
amine
2,6-Diglycidyl
phenyl allyl ether
oligomer
Silicon
Copper (Cu)
Epoxy Resin
SiO2 Filler
Phenol Resin
Carbon Black
CAS Number
Weight by mg
% weight of
substance per
package
PPM
406,261
10,005
500
125
6,582
40.6261
1.0005
0.0500
0.0125
0.6582
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 0.5
< 0.5
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 8 of 9
24L - TSSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
ECN No.
**
*A
24L-TSSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03033
Description of Change
385324
1504683
Orig. of
Change
YXP
HLR
*B
2569067
HLR
Added Note 4: Actual testing performed on package
family basis. Engineering calculations were applied to
derive individual package data.
*C
2767000
MAHA
*D
*E
2789763
3350819
MAHA
HLR
*F
3607050
COPI
*G
3925886
VFR
*H
4032168
YUM
*I
4491859
HLR
Added data for assembly site 2.
Changed CML to WEB in distribution list.
Added data for assembly site 3.
Changed the values on the material composition table
to 4 decimal points.
Removed the Tray and End Pin on the Indirect
Materials table.
Added PMDD for Assembly Site 2-B2 - OSE Taiwan
Copper Qualification under QTP # 120605.
Added B.2 for Site 3: Amkor-M Copper wire
qualification, reference QTP # 122204.
Added Assembly site name in the Assembly heading
in site 1, 2 and 3.
Changed Assembly code to Assembly site name in
site 1, 2 and 3.
Changed the atomic symbol of Zinc from “Z” to “Zn”.
Corrected the package weight of assembly site 1 from
95.5900mg to 95.5902mg and assembly site 3.B1
material composition from 93.2200mg to 93.2201mg.
New document.
Updated Cypress Logo.
Added % weight of substance per Homogenous
Material and % weight of substance per package on
the Material Composition for Assembly Site 1.
Completed the RoHS Substances namely; Lead
Cadmium, Mercury, Chromium VI, PBB and PBDE on
Declaration of Packaging Indirect Materials table for
Assembly Site 1.
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03033 Rev. *I
Page 9 of 9