Package Chemistry Substances Analysis Table FAA 064 (Pb-free solder balls) 13 x 10 mm 211 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 22.7321 subtotal 22.7321 #1 Copper 7440-50-8 0.2453 #2 Palladium 5/3/7440 0.0042 subtotal 0.2495 #1 Epoxy resin Trade Secret 0.1726 #2 Polytetrafluoroethylene 9002-84-0 0.3836 subtotal 0.5563 #1 Brominated Epoxy Resins Trade Secret 5.1790 #2 Copper 7440-50-8 11.4225 #3 Gold 7440-57-5 0.0664 #4 Nickel 7440-02-0 0.3063 #5 Epoxy resin Trade Secret 19.4397 #6 Silica 14808-60-7 4.3822 #7 SiO2 Glass Cloth 65997-17-3 19.1225 subtotal 59.9188 #1 Silica (fused) 60676-86-0 91.9015 #2 Carbon Black 1333-86-4 0.2703 #3 Epoxy resin Trade Secret 14.9745 #4 Phosphoric organic catalyst Trade Secret 0.3244 #5 Metal Oxide Trade Secret 0.6487 subtotal 108.1194 #1 Tin 7440-31-5 19.0263 #2 Silver 7440-22-4 0.5915 #3 Copper 7440-50-8 0.0986 subtotal 19.7163 TOTAL PACKAGE 211.2924 unit weight/package (%) 10.7586 10.7586 0.1161 0.0020 0.1181 0.0817 0.1816 0.2633 2.4511 5.4060 0.0314 0.1450 9.2004 2.0740 9.0503 28.3582 43.4949 0.1279 7.0871 0.1535 0.3070 51.1705 9.0047 0.2799 0.0467 9.3313 100.0000 Amount (ppm) 107,586 107,586 1,161 20 1,181 817 1,816 2,633 24,511 54,060 314 1,450 92,004 20,740 90,503 283,582 434,949 1,279 70,871 1,535 3,070 511,705 90,047 2,799 467 93,313 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12939 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (FAA064) - BKK - CuPd Wire Document Number: 002-12939 Rev. ** ECN No. Orig. of Description of Change Change 5268231 AAC Initial Release. Document No. 002-12939 Rev. ** Page 2 of 2