Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball LAE 064 (Pb-free solder balls) 9 x 9 mm 189.8mg 260°C 3 BKK Product is RoHS Compliant CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 7.6527 subtotal 7.6527 #1 Copper 7440-50-8 0.1932 #2 Palladium (Pd) 7440-05-3 0.0033 subtotal 0.1965 #1 Epoxy resin Trade Secret 0.4670 #2 Polytetrafluoroethylene 9002-84-0 0.3821 subtotal 0.8490 #1 Aluminum Hydroxide 21645-51-2 7.2657 #2 Copper 7440-50-8 8.0995 #3 Gold 7440-57-5 0.0434 #4 Nickel 7440-02-0 0.2293 #5 Epoxy resin 9003-36-5 16.7780 #6 SiO2 Glass Cloth 65997-17-3 14.2520 subtotal 46.6677 #1 Silica (fused) 60676-86-0 68.8712 #2 Carbon Black 1333-86-4 0.2026 #3 Epoxy resin Trade Secret 11.2220 #4 Phosphoric organic catalyst Trade Secret 0.2431 #5 Metal Oxides Trade Secret 0.4861 subtotal 81.0250 #1 Tin 7440-31-5 51.5084 #2 Silver 7440-22-4 1.6013 #3 Copper 7440-50-8 0.2669 subtotal 53.3765 189.7674 TOTAL PACKAGE unit weight/package (%) 4.0326 4.0326 0.1018 0.0018 0.1036 0.2461 0.2013 0.4474 3.8287 4.2681 0.0228 0.1208 8.8413 7.5102 24.5921 36.2924 0.1067 5.9135 0.1281 0.2562 42.6970 27.1429 0.8438 0.1406 28.1273 100.0000 Amount (ppm) 40,326 40,326 1,018 18 1,036 2,461 2,013 4,474 38,287 42,681 228 1,208 88,413 75,102 245,921 362,924 1,067 59,135 1,281 2,562 426,970 271,429 8,438 1,406 281,273 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12945 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (LAE064) - BKK - CuPd Wire Document Number: 002-12945 Rev. ** ECN No. Orig. of Description of Change Change 5268370 AAC Initial Release. Document No. 002-12945 Rev. ** Page 2 of 2