Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball LAA 064 (SnPb solder balls) 13 x 11 mm 268.7mg 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present #1 Silicon subtotal #1 Copper #2 Palladium (Pd) subtotal #1 Epoxy resin #2 Polytetrafluoroethylene subtotal #1 Brominated Epoxy Resins #2 Copper #3 Gold #4 Nickel #5 Epoxy resin #6 Silica #7 SiO2 Glass Cloth subtotal #1 Silica (fused) #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst #5 Metal Oxide subtotal #1 Tin #2 Lead subtotal CAS Number unit weight(mg) 7440-21-3 7.6527 7.6527 7440-50-8 0.3121 7440-05-3 0.0041 0.3162 Trade Secret 0.1331 9002-84-0 0.1089 0.2419 Trade Secret 5.5580 7440-50-8 22.3279 7440-57-5 0.3395 7440-02-0 1.5655 Trade Secret 23.9026 14808-60-7 4.7029 65997-17-3 20.5219 78.9184 60676-86-0 110.0787 1333-86-4 0.3238 Trade Secret 17.9364 Trade Secret 0.3885 Trade Secret 0.7770 129.5044 7440-31-5 32.7762 7439-92-1 19.2495 52.0256 268.6593 TOTAL PACKAGE unit weight/package (%) 2.8485 2.8485 0.1162 0.0015 0.1177 0.0495 0.0405 0.0901 2.0688 8.3108 0.1264 0.5827 8.8970 1.7505 7.6386 29.3749 40.9734 0.1205 6.6762 0.1446 0.2892 48.2040 12.1999 7.1650 19.3649 100.0000 Amount (ppm) 28,485 28,485 1,162 15 1,177 495 405 901 20,688 83,108 1,264 , 5,827 88,970 17,505 76,386 293,749 409,734 1,205 66,762 1,446 2,892 482,040 121,999 71,650 193,649 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12941 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (LAA064) - BKK - CuPd Wire - Non Pb Free Document Number: 002-12941 Rev. ** ECN No. Orig. of Description of Change Change 5268282 AAC Initial Release. Document No. 002-12941 Rev. ** Page 2 of 2