Package Chemistry Substances Analysis Table VLD 063 (Pb-free solder balls) 11.0x 9.0 mm 162 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball Chemicals Present #1 Silicon subtotal #1 Copper #2 Palladium (Pd) subtotal #1 Epoxy resins #9 SiO2 Filler subtotal #1 Aluminum Hydroxide #2 Copper #3 Gold #4 Nickel #5 Epoxy resin #6 SiO2 Glass Cloth subtotal #1 SiO2 Filler #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst #5 Metal Oxides subtotal #1 Tin #2 Silver #3 Copper subtotal CAS Number 7440-21-3 unit weight(mg) 34.2391 34.2391 7440-50-8 0.0016 7440-05-3 0.0000 0.0016 Trade secret 0.0235 68611-44-9 0.0059 0.0294 21645-51-2 5.7915 7440-50-8 14.1926 7440 57 5 0 1892 7440-57-5 0.1892 7440-02-0 1.5860 9003-36-5 8.8171 65997-17-3 11.3603 41.9366 60676-86-0 57.7868 1333-86-4 0.1700 Trade secret 9.4159 Trade secret 0.4079 Trade secret 0.2040 67.9845 7440-31-5 17.3913 7440-22-4 0.5407 7440-50-8 0.0901 18.0221 162.2133 TOTAL PACKAGE unit weight/package (%) 21.1075 21.1075 0.0010 0.0000 0.0010 0.0145 0.0036 0.0181 3.5703 8.7494 0 1166 0.1166 0.9777 5.4355 7.0033 25.8527 35.6240 0.1048 5.8046 0.2515 0.1257 41.9106 10.7213 0.3333 0.0556 11.1101 100.0000 Amount (ppm) 211,075 211,075 10 0 10 145 36 181 35,703 87,494 1 166 1,166 9,777 54,355 70,033 258,527 356,240 1,048 58,046 2,515 1,257 419,106 107,213 3,333 556 111,101 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12925 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA063 (VLD063) - BKK - CuPd Wire Document Number: 002-12925 Rev. ** ECN No. Orig. of Description of Change Change 5266940 AAC Initial Release. Document No. 002-12925 Rev. ** Page 2 of 2