Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball VBM 063 (Pb-free solder balls) 11.0x 9.0 mm 159 mg 260°C 3 BKK Product is RoHS Compliant CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 12.2778 subtotal 12.2778 #1 Copper 7440-50-8 0.0765 #2 Palladium (Pd) 7440-05-3 0.0013 0.0778 subtotal #1 Epoxy resins Trade secret 0.0042 #2 Acrylic resin Trade secret 0.0318 #3 Polybutadiene deriative Trade secret 0.0169 #4 Butadiene copolymer Trade secret 0.0021 #5 Acrylate Trade secret 0.0254 #6 Peroxide Trade secret 0.0042 #7 Additive Trade secret 0.0042 #8 Boron compound Trade secret 0.0085 #9 SiO2 Filler 68611-44-9 0.0085 0.1059 subtotal #1 Copper 7440-50-8 17.7408 #2 Gold 7440-57-5 0.1892 #3 Nickel 7440 02 0 7440-02-0 1 5860 1.5860 #4 Cured thermosetting resin Trade Secret 19.5766 #5 Continuous Filament Fiber Glass 65997-17-3 15.1470 54.2396 subtotal #1 SiO2 Filler 60676-86-0 63.2609 #2 Carbon Black 1333-86-4 0.1861 #3 Epoxy resin Trade secret 10.3078 #4 Phosphoric organic catalyst Trade secret 0.4465 #5 Metal Oxides Trade secret 0.2233 74.4246 subtotal #1 Tin 7440-31-5 17.3913 #2 Silver 7440-22-4 0.5407 #3 Copper 7440-50-8 0.0901 18.0221 subtotal 159.1477 TOTAL PACKAGE unit weight/package (%) 7.7147 7.7147 0.0481 0.0008 0.0489 0.0027 0.0200 0.0106 0.0013 0.0160 0.0027 0.0027 0.0053 0.0053 0.0665 11.1474 0.1189 0 9965 0.9965 12.3009 9.5176 34.0813 39.7498 0.1169 6.4769 0.2806 0.1403 46.7645 10.9278 0.3397 0.0566 11.3241 100.0000 Amount (ppm) 77,147 77,147 481 8 489 27 200 106 13 160 27 27 53 53 665 111,474 1,189 9 965 9,965 123,009 95,176 340,813 397,498 1,169 64,769 2,806 1,403 467,645 109,278 3,397 566 113,241 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. ument No. 002-12922 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA063 (VBM063) - BKK - CuPd Wire Document Number: 002-12922 Rev. ** ECN No. Orig. of Description of Change Change 5266728 AAC Initial Release. Document No. 002-12922 Rev. ** Page 2 of 2