Package Chemistry Substances Analysis Table VBT 067 (Pb-free solder balls) 8 x 6.5 x1 mm 93.1 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball Chemicals Present #1 Silicon subtotal #1 Copper #2 Palladium subtotal #1 Silica #2 Organic filler #3 Acrylic resin #4 Diluent #5 Elastomer #6 Organic peroxide g p subtotal #1 Copper #2 Gold #3 Nickel #4 Epoxy resin #5 Aluminum Hydroxide #6 SiO2 Glass Cloth subtotal #1 Silica (fused) #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst #5 Metal Oxides subtotal #1 Tin #2 Silver #3 Copper subtotal CAS Number 7440-21-3 unit weight(mg) 8.8360 8.8360 7440-50-8 0.1086 7440-05-3 0.0019 0.1105 Trade secret 0.0127 Trade secret 0.0634 Trade secret 0.1427 Trade secret 0.0793 Trade secret 0.0159 Trade secret 0.0032 0.3171 7440-50-8 12.6730 7440-57-5 0.0512 7440-02-0 0.7868 9003-36-5 5.7584 21645-51-2 3.2890 65997-17-3 6.4515 29.0099 60676-86-0 32.5646 1333-86-4 0.0958 Trade secret 5.3061 Trade secret 0.2299 Trade secret 0.1149 38.3113 7440-31-5 15.9771 7440-22-4 0.4967 7440-50-8 0.0828 16.5566 93.1414 TOTAL PACKAGE unit weight/package (%) 9.4867 9.4867 0.1166 0.0020 0.0020 0.0136 0.0681 0.1532 0.0851 0.0170 0.0034 0.3404 13.6062 0.0550 0.8447 6.1824 3.5312 6.9266 31.1461 34.9625 0.1028 5.6968 0.2468 0.1234 41.1324 17.1536 0.5333 0.0889 17.7758 100.0000 Amount (ppm) 94,867 94,867 1,166 20 20 136 681 1,532 851 170 34 3,404 136,062 550 8,447 61,824 35,312 69,266 311,461 349,625 1,028 56,968 2,468 1,234 411,324 171,536 5,333 889 177,758 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12956 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA067 (VBT067) - BKK - CuPd Wire Document Number: 002-12956 Rev. ** ECN No. Orig. of Description of Change Change 5268695 AAC Initial Release. Document No. 002-12956 Rev. ** Page 2 of 2